EP2682702B1 - Plaque pour échangeur de chaleur, échangeur de chaleur et refroidisseur d'air comprenant un échangeur de chaleur - Google Patents

Plaque pour échangeur de chaleur, échangeur de chaleur et refroidisseur d'air comprenant un échangeur de chaleur Download PDF

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Publication number
EP2682702B1
EP2682702B1 EP12175135.8A EP12175135A EP2682702B1 EP 2682702 B1 EP2682702 B1 EP 2682702B1 EP 12175135 A EP12175135 A EP 12175135A EP 2682702 B1 EP2682702 B1 EP 2682702B1
Authority
EP
European Patent Office
Prior art keywords
plate
heat
medium
heat transferring
elevation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Not-in-force
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EP12175135.8A
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German (de)
English (en)
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EP2682702A1 (fr
Inventor
Sven Persson
Marcello Masgrau
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AIREC AB
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AIREC AB
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Filing date
Publication date
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Priority to EP12175135.8A priority Critical patent/EP2682702B1/fr
Priority to US13/934,514 priority patent/US20140158328A1/en
Priority to EP13175040.8A priority patent/EP2682703B1/fr
Priority to JP2013141166A priority patent/JP2014016144A/ja
Priority to KR1020130078221A priority patent/KR20140005795A/ko
Priority to CN201310280264.2A priority patent/CN103528419B/zh
Publication of EP2682702A1 publication Critical patent/EP2682702A1/fr
Application granted granted Critical
Publication of EP2682702B1 publication Critical patent/EP2682702B1/fr
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • F28F3/042—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of local deformations of the element
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D9/00—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
    • F28D9/0031—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits for one heat-exchange medium being formed by paired plates touching each other
    • F28D9/0043—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits for one heat-exchange medium being formed by paired plates touching each other the plates having openings therein for circulation of at least one heat-exchange medium from one conduit to another
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D9/00—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
    • F28D9/0031—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits for one heat-exchange medium being formed by paired plates touching each other
    • F28D9/0043—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits for one heat-exchange medium being formed by paired plates touching each other the plates having openings therein for circulation of at least one heat-exchange medium from one conduit to another
    • F28D9/0056—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits for one heat-exchange medium being formed by paired plates touching each other the plates having openings therein for circulation of at least one heat-exchange medium from one conduit to another with U-flow or serpentine-flow inside conduits; with centrally arranged openings on the plates
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • F28F3/042—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of local deformations of the element
    • F28F3/044—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of local deformations of the element the deformations being pontual, e.g. dimples
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2240/00—Spacing means

Definitions

  • the present invention relates to a plate for a heat exchanger for heat exchange between a first and a second medium according to the preamble of claim 1.
  • a plate is known from US 3,845,814 .
  • the plate has a first side and an opposing second side.
  • the first side of said plate is configured with at least one heat transferring elevation and is also configured to permit provision of a through-flow duct for the first medium.
  • the second side of said plate is configured with at least one heat transferring depression corresponding with the elevation on said first side to define a part of a through-flow duct for the second medium.
  • the present invention further relates to a heat exchanger, wherein the heat exchanger comprises a stack of the above-mentioned plates.
  • the plates are arranged such that the first side of each plate is abutting and assembled with the first side of an adjacent plate in the stack, thereby defining the through-flow duct for the first medium between said first sides of said plates. Consequently, the plates are also arranged such that the second side of each plate is abutting and assembled with the second side of an adjacent plate in the stack, thereby defining at least one through-flow duct for the second medium between said second sides of said plates.
  • the present invention also relates to an air cooler comprising the above-mentioned heat exchanger.
  • Heat exchangers are used in many different areas, e.g. in the food processing industry, in buildings for use in heating and cooling systems, in gas turbines, boilers and many more. Attempts to improve the heat exchanging capacity of a heat exchanger is always interesting and even small improvements are highly appreciated.
  • An object of the present invention is to provide a plate for a heat exchanger and a heat exchanger for improved primary as well as secondary heat exchange.
  • the first side of said plate is configured not only with at least one heat transferring elevation, but also with at least one heat transfer surface which surrounds said elevation and where dimples are provided at either or both of the heat transfer surface and the heat transferring elevation to permit provision of the through-flow duct for the first medium
  • the second side of the plate is configured not only with at least one heat transferring depression, but also with at least one bonding surface which corresponds to said heat transfer surface and which surrounds said depression.
  • the heat transferring elevation on the first side of the plate defines a primary heat transfer area for the first medium and the heat transfer surface surrounding said elevation a secondary heat transfer area for the first medium and the heat transferring depression on the second side of the plate defines a primary heat transfer area for the second medium.
  • a plate for a heat exchanger is provided, by means of which a larger heat transfer area for said first medium, which is the medium having the smallest coefficient of heat transmission, e.g. air in relation to water, which shall flow at a smaller speed/pressure, is defined.
  • the primary heat transfer areas for the first and the second medium respectively are enlarged.
  • the through-flow duct for the first medium is provided by means of opposing dimples on the heat transfer surfaces on the first sides of two adjacent plates in the stack
  • the through-flow duct for the second medium is defined by opposing heat transferring depressions on the second sides of two adjacent plates in the stack
  • a heat exchanger is provided, by means of which a larger volume of the through-flow duct for said first medium is defined.
  • the through-flow duct for the second medium is defined by opposing heat transferring depressions having a width which is many times larger than their depth, i.e. the heat transferring surface of the through-flow duct is large in relation to its volume, and having an extension with two or more straight, parallel or substantially parallel portions, the primary heat transferring capacity of the heat exchanger is improved.
  • a heat exchanger is provided, the total heat-exchanging capacity of which is improved and the costs for its manufacture are reduced.
  • the heat exchanger may be used to provide e.g. an improved air cooler, i.e. one medium is air and the other a liquid.
  • the present invention relates to a plate for a heat exchanger for heat exchange between a first and a second medium.
  • the first and second medium referred to for heat exchange may be the same, e.g. gas/ /gas (such as air) or liquid/liquid (such as water).
  • the first and second medium referred to may also be two different media, e.g. gas/liquid or two different gases or liquids.
  • the plate 1 has a first side A and a second side B.
  • the first side A of the plate 1 is configured with at least one heat transferring elevation 2.
  • the first side A of the plate 1 is also configured to permit provision of a through-flow duct X (see fig. 8 ) for the first medium.
  • the second side B of the plate 1 is configured with at least one heat transferring depression 3 substantially corresponding to the elevation 2 on the first side A, i.e. the depression defines the elevation 2 on said first side of the plate, with substantially the same length and width and with a depth corresponding to the height of said elevation.
  • the heat transferring depression 3 is configured to define a part of a through-flow duct Y (see figs.
  • the heat transferring elevation 2 and the heat transferring depression 3 are brought to correspond to each other by subjecting the plate 1 to e.g. a stamping or punching process. If desired, more than one elevation 2 and corresponding depression 3 may be provided on the first side A and the second side B respectively, of the plate 1.
  • the first side A of the plate 1 is further configured with at least one heat transfer surface 4 which surrounds the heat transferring elevation 2.
  • the heat transfer surface 4 is provided with dimples 5 which permit provision of the through-flow duct X for the first medium.
  • the elevation 2 on the first side A of the plate 1 defines a primary heat transfer area for the first medium and the heat transfer surface 4 surrounding said elevation a secondary heat transfer area for the first medium.
  • the second side B of the plate 1 is further configured with at least one bonding surface 6 which corresponds to, i.e. has the same extension as the heat transfer surface 4 on the first side A, and which accordingly surrounds the heat transferring depression 3.
  • the depression 3 defines a primary heat transfer area for the second medium.
  • This primary heat transfer area i.e. the area of the depression 3, is substantially equal to the entire area of said second side of the plate minus the area of the bonding surface 6. From the above, it is apparent that the combined heat transfer areas for the first medium are larger than the heat transfer area for the second medium.
  • a heat exchanger comprising plates constructed as described above, will have an improved heat-exchanging capacity.
  • a primary heat transfer area as defined above is provided by a surface on a member of the plate which is in direct contact with one medium and where the opposite surface on said member is in direct contact with the other medium
  • a secondary heat transfer area is provided by a surface on a member of the plate which is in direct contact with one medium and where the opposite surface on said member is not in direct contact with the other medium.
  • the heat transferring elevation 2 on the first side A of the plate 1 is configured with a first height h1 and the dimples 5 on the heat transfer surface 4 on said first side has a second height h2 which is larger than said first height (see particularly fig. 5 ). Thereby, the dimples 5 protrude up above the elevation 2.
  • the heat transferring depression 3 on the second side B of the plate 1, corresponding to the elevation 2, is consequently configured with a depth corresponding substantially to said first height h1.
  • the heat transferring elevation 2 on the first side A of the plate 1 is in the illustrated embodiment of the plate provided with additional dimples 7 to permit provision of the through-flow duct X for the first medium.
  • these additional dimples 7 have a height which together with the (first) height h1 of the elevation 2 is larger than said first height.
  • the height of the dimples 7 and the height h1 of the elevation 2 corresponds substantially to said second height h2, i.e. to the height of the dimples 5 on the heat transfer surface 4.
  • the height of the dimples 7 is h2 minus h1.
  • the heat transferring elevation 2 on the first side A of the plate has a first height h1 from the heat transfer surface 4 of about 0,5-1 millimeter and the corresponding heat transferring depression 3 on the second side B of the plate a depth from the bonding surface 6 corresponding substantially to said first height
  • the dimples 5 on the heat transfer surface of side A has a second height h2 from said heat transfer surface of about 2-2,5 millimeters. These heights however, may vary in view of the intended application and size of the heat exchanger in which the plate shall be used.
  • the dimples 5 and 7 on the first side A of the plate 1 can be made in any suitable manner, e.g.
  • the size, shape and number of the dimples 5, 7 may also vary in view of the intended application and size of the heat exchanger and so may the patterns in which they are arranged. The larger the plate 1, the more dimples 5, 7 providing distances and supporting points to permit provision of the through-flow duct X for the first medium will be required.
  • the through-flow duct X for the first medium also by means of the dimples 5 on the heat transfer surface 4 only or by means of the dimples 7 on the heat transferring elevation 2 only.
  • the dimples 5, 7 are substantially round.
  • the dimples 5, 7 on the first side A of the plate 1 are suitable for abutment against and assembly in any suitable manner with corresponding dimples on the first side of another plate such that said dimples thereby permit provision of the through-flow duct X for the first medium ( fig. 8 ).
  • the bonding surface 6 on the second side B of the plate 1 is in the same way suitable for abutment against and leak-free assembly in any suitable manner with a corresponding bonding surface on the second side of another plate such that the heat transferring depressions 3 on said plates thereby define the through-flow duct Y for the second medium ( figs. 7 and 8 ).
  • the dimples 5, 7 on the first side A of the plate 1 may also be located such that abutment against and assembly with corresponding dimples on the first side of another plate is avoided, i.e. the dimples on the two plates are in some way located offset relative to each other.
  • the heat transferring depression 3 defining a part of the through-flow duct Y for the second medium on the second side B of the plate and the corresponding heat transferring elevation 2 on the first side A of the plate may vary in shape, size, number and location. Accordingly, the depression 3 and the corresponding elevation 2 may e.g. be U-shaped, comprising two straight, parallel or substantially parallel portions. However, in order to prolong the time for heat exchange between the first and second media, the depression 3 and the corresponding elevation 2 may alternatively have a substantially sinusoidal shape with three or more straight, parallel or substantially parallel portions, i.e. an uneven (see fig. 10 ) or (as in figs. 1-8 ) an even number of straight, parallel or substantially parallel portions.
  • the heat transfer area of the depression 3 and of the corresponding elevation 2 is as large as possible relative to the volume of the through-flow duct Y for the second medium. Therefore, the width w of the depression 3 and of the corresponding elevation 2 is in the illustrated embodiments substantially larger than the depth of said depression and the corresponding height of the elevation, e.g. at least about 5 times larger and preferably, as in the illustrated embodiments, about 50-70 times larger.
  • the width w of the elevation and the corresponding depression will be at least about 2,5 mm and preferably about 25-70 mm.
  • the width w of the depression 3 and the corresponding elevation 2 may be constant or may also vary along its length, as illustrated in particularly figs. 1-4 , 6 and 10 . In figs. 1-4 , 6 and 10 it is shown how the width w of the straight parallel portions first decrease and then increase back to the original width.
  • the width w of the heat transferring elevation 2 and the corresponding heat transferring depression 3 may decrease from about 35 mm to about 25 mm and then again increase to about 35 mm.
  • the width w is much smaller than at said straight portions, in the illustrated embodiments about 20 times larger than the first height h1 and the depth corresponding thereto.
  • the depression 3 and the corresponding elevation 2 may, as in the illustrated embodiments with a rectangular plate 1, be provided with the straight parallel portions thereof running in a direction transverse to the longitudinal direction of the plate or substantially transverse thereto. If desired, said straight parallel portions may alternatively run in the longitudinal direction of the plate 1 or in any other desired direction.
  • the heat transferring depression 3 on the second side B of the plate 1 is configured with pressure resisting dimples 8.
  • These pressure resisting dimples 8 have in the illustrated embodiment a height corresponding substantially to said first height h1, i.e. the height of the heat transferring elevation 2 and consequently, the depth of the corresponding heat transferring depression, such that these dimples 8 end substantially at the same level from which the depression protrude.
  • said dimples 8 may engage the corresponding dimples on the second side of another plate to prevent compression of the through-flow duct Y for the second medium, and may also contribute to safe and effective assembly of said second side with the second side of said other plate.
  • the dimples 8 also promote the flow of the second medium through the through-flow duct Y therefore, by creating turbulence in said flow such that the heat exchanging effect is improved.
  • the height of the dimples 8 may be less than said first height h1.
  • the dimples 8 have a round as well as an elongated shape. Some of the elongated dimples are also curved.
  • the dimples 8 may also be arranged in any suitable pattern for optimizing the heat exchanging effect.
  • the heat transfer surface 4 on the first side A of the plate 1 is in a similar way provided with reinforcing dimples 9.
  • These reinforcing dimples 9 have in the illustrated embodiments a height corresponding substantially to said first height h1, i.e. the height of the heat transferring elevation 2, such that the dimples end substantially at the same level as the elevation 2.
  • the height of the dimples 9 is less than said first height h1 and preferably as small as possible in order to minimize the pressure drop in the flow of the first medium in the through-flow duct X and yet maintain the reinforcing capacity of the dimples.
  • the height of the dimples 9 can also be larger than said first height as long as it does not exceed the (second) height h2 of the dimples 5.
  • the dimples 9 have an elongated shape.
  • the dimples 9 may also be arranged in any suitable pattern for optimizing the heat exchanging effect.
  • the dimples 8 and 9 can be made e.g. by a stamping or punching process or in any other suitable manner, and simultaneously with said elevation/depression and said above-mentioned dimples 5, 7. Corresponding depressions are thereby formed on the respective opposite side A, B of the plate 1, i.e. in the elevation 2 on side A and in the bonding surface 6 on side B respectively.
  • the plate 1 may be rectangular in shape, with two opposing long sides 1 a and 1 b and two opposing short sides 1 c and 1 d, and with first and second portholes 10 and 11 for the second medium close to one of or both long sides and/or close to one of or both short sides.
  • the location of the portholes 10, 11 is depending on the shape of the plate 1 as well as on the shape and location of the heat transferring elevation 2 and the corresponding heat transferring depression 3 on the plate.
  • each of the portholes 10, 11 is located close to the same long side 1 a and one of the short sides 1 c, 1 d, in the corner defined by said long side and the respective short side (see figs. 1-4 ).
  • each of the portholes 10, 11 is e.g. located close to one of the long sides 1 a, 1 b and one of the short sides 1 c, 1 d, in the corner defined by the respective long side and the respective short side, i.e. diagonally opposite each other on the plate 1 (see fig. 10 ).
  • Each of said portholes 10, 11 is on said first side A of the plate configured with an edge 10a and 11a respectively, which surrounds said porthole.
  • Each edge 10a, 11 a forms a part of the elevation 2 and has in the illustrated embodiment a height corresponding to the second height h2, i.e. to the height of the dimples 5 and to the combined height of the elevation 2 (h1) and the dimples 7 (h2-h1) respectively, and may have the same function as said dimples, i.e. to permit provision of the through-flow duct X for the first medium, as well as to pre-vent leakage of the second medium into the through-flow duct X for the first medium.
  • the plate 1 may alternatively have a square shape, with four equally long sides, or any other suitable four-sided, triangular, multi-sided, round, rhombic, elliptic or other shape for the intended application or use.
  • the plate 1 may have a length of about 270 millimeters and a width of about 150 millimeters.
  • the plate 1 may have any other size optimized for its intended application. Accordingly, the length of the plate 1 may e.g. exceed 1 meter and the width thereof may exceed 0,5 meter.
  • the size of the plate 1 may also be smaller than the plate in the illustrated embodiment and what is regarded as the width of the plate may be larger than what is regarded as the length thereof, based e.g. on how the plate is located in the heat exchanger and/or how the through-flow ducts X, Y for the first and second media are oriented.
  • the present invention also relates to a heat exchanger for heat exchange between a first and a second medium, wherein said heat exchanger comprises a stack of plates 1 of the above-mentioned configuration.
  • the stack of plates 1 may thereby be located in a more or less open frame work 12 as illustrated in fig. 9a with opposing plate elements 13 and 14, wherein at least one of the opposing plate elements (in fig. 9a plate element 13) is provided with pipe connections 15 and 16 for the second medium, and with a top panel 17 and a partially open bottom panel 18.
  • the stack of plates 1 which may be located in the illustrated framework 12 may comprise 360 plates, having a total height of about 900 millimeters if each plate has a total height of about 2,5 millimeters. However, the number of plates 1 in the stack thereof may vary and so may the size of the heat exchanger, depending on its intended application or use.
  • the heat exchanger is located in a refrigerated display case as illustrated in fig. 9b with the bottom panel 18 of the frame work 12 facing downwards, the top panel 17 of the frame work facing upwards and the opposing plate elements 13, 14 of the frame work facing to the sides, the plates 1 in the stack thereof will then in turn extend in substantially parallel vertical planes and the first medium (e.g. air to be chilled) will flow substantially horizontally into and through the heat exchanger.
  • the first medium may flow into the heat exchanger e.g. from the left side thereof and then substantially horizontally to the right through the heat exchanger and leave the heat exchanger at its right side or, as is illustrated in fig.
  • the second medium flows into the heat exchanger through the left pipe connection 15 of the plate element 13 and leaves the heat exchanger through the right pipe connection 16.
  • the first medium flows in a substantially horizontal direction through the heat exchanger and the second medium in an opposite horizontal direction along a substantially vertical and substantially sinusoidal path through the heat exchanger, such that the first medium to be chilled meets the second medium for chilling in a heat transferring or heat exchanging manner when both media have the highest temperature and such that said first medium is gradually chilled by the gradually colder second medium.
  • a multi-step counter flow is achieved, in which the first medium to be chilled repeatedly is brought in contact with the second medium for chilling which flows in the opposite horizontal direction along a substantially vertical and substantially sinusoidal path through the heat exchanger.
  • Condensate from the chilled first medium will leave the heat exchanger at the bottom thereof, through the partially open bottom panel 18.
  • a drain (not shown) may be provided at the bottom of the heat exchanger for collecting the condensate.
  • the frame work 12 of the heat exchanger facilitates drainage of condensate from the heat exchanger. Also, inspection, cleaning and maintenance of the heat exchanger as shown, is facilitated by the illustrated frame work 12 thereof.
  • the plates 1 in the stack thereof in the heat exchanger are arranged such that the first side A of each plate is abutting the first side A of an adjacent plate in the stack, thereby providing, by means of the dimples 5 on the heat transfer surfaces 4 and/or by means of the dimples 7 on the heat transferring elevations 2 on the first sides of two adjacent plates in the stack, the through-flow duct X for the first medium between said first sides of said plates.
  • the plates 1 are arranged such that the second side B of each plate is abutting the second side B of an adjacent plate in the stack, thereby defining, by means of the heat transferring depressions 3 on the second sides of two adjacent plates in the stack, at least one through-flow duct Y for the second medium between said second sides of said plates.
  • each plate 1 By e.g. configuring each plate 1 such that the dimples 5 on the first side A of the plate have a second height h2 which is larger than the depth (corresponding to the first height h1 of the heat transferring elevation) of the heat transferring depression 3 on the second side B of the plate and such that the area of the heat transferring elevation 2 and of the heat transfer surface 4 on said first side of the plate is larger than the area of the heat transferring depression on the second side of the plate, as indicated above, the volume of the through-flow duct X for the first medium can be made larger than the volume of the through-flow duct Y for the second medium when the first sides A of two adjacent plates 1 and the second sides B of two adjacent plates respectively, are brought to abut each other.
  • the volume of the through-flow duct X for said first medium relative to the volume of the through-flow duct Y for said second medium is further increased when the through-flow duct for the first medium is provided by means of opposing dimples 5 on the heat transfer surfaces 4 and/or by means of opposing dimples 7 on the elevations 2 on the first sides A of two adjacent plates in the stack, and when the through--flow duct for the second medium is defined by opposing depressions 3 on the second sides B of two adjacent plates in the stack.
  • the first sides A of two adjacent plates in the stack are assembled at the dimples 5, offset or not, on the heat transfer surfaces 4 on said first sides and the second sides B of two adjacent plates in the stack are assembled at the bonding surfaces 6 on said second sides.
  • the first sides A of two adjacent plates 1 in the stack may also or alternatively be assembled at the dimples 7 on the heat transferring elevations 2 if such dimples are present.
  • Adjacent plates 1 may be assembled by means of e.g.
  • Leak-free assembly is required at least of the opposing bonding surfaces 6 on the second sides B of respectively two adjacent plates 1 in the stack, and of the opposing edges 10a, 11 a of the portholes 10, 11 on the first sides A of respectively two adjacent plates in the stack.
  • the different heights of the dimples 5 and of the heat transferring elevation 2/depression 3 will provide for a through-flow duct X for the first medium which is configured with an alternating height, i.e. when said first medium flows from left to right or from right to left in fig. 8 and from right to left as in fig. 9b .
  • This alternating height will alter the speed/ /pressure of the first medium during the flow thereof through said through-flow duct X.
  • the through-flow duct X for the first medium is configured with a third height h3 between the heat transferring elevations 2 on the first sides A of two adjacent plates 1 and a fourth height h4, which is larger than said third height, between the heat transfer surfaces 4, surrounding said elevations, on said first sides of said two adjacent plates.
  • the fourth height h4 is thereby substantially equal to twice the (second) height h2 of the dimples 5 on the heat transfer surface 4 on the first side A of each plate 1 and the third height h3 is substantially equal to said fourth height minus twice the (first) height h1 of the elevation 2 on the first side of each plate (see particularly fig. 8 ).
  • the through-flow duct Y for the second medium is configured with a fifth height h5 which is substantially equal to twice the depth (corresponding to the (first) height h1 of the heat transferring elevation 2) of the heat transferring depression 3 on the second side B of each plate 1 (see particularly fig. 7 ).
  • the stack of plates 1 in the heat exchanger may comprise plates of one type. This may be the case when e.g. the heat transferring elevation 2 on the first side A of each plate and the corresponding heat transferring depression 3 on the second side B of each plate have a substantially sinusoidal shape with an even number of straight, parallel or substantially parallel portions (as in the embodiment of a plate according to figs. 1-8 ).
  • the stack of plates 1 may comprise plates of two types. This may be the case when e.g. the elevation 2 on the first side A of each plate and the corresponding depression 3 on the second side B of each plate have a substantially sinusoidal shape with an uneven number of straight, parallel or substantially parallel portions (as in the embodiment of a plate according to fig. 10 ).
  • Two types of plates 1 will also be required if e.g. the dimples 5 and/or the heat transferring elevations 2/depressions 3 on two adjacent plates are offset relative to each other and if the height of said elevation and/or said dimples on the first side A of one plate differs from the height of said elevation and/or said dimples on the first side A of another plate.
  • the heights of the dimples 5 and/ /or of the elevations 2/depressions 3 may vary widely, but it is of course important in said latter embodiment with two types of plates that at least the total height of opposing dimples always is larger than the total height of opposing elevations for providing the through-duct X for the first medium between the first sides A of two adjacent plates.
  • the heat exchanger according to the present invention may be of the cross-flow type, wherein the straight, substantially parallel portions of the heat transferring depressions 3 on the second sides B of two adjacent plates 1 defining the through-flow duct Y for the second medium extend in a first direction D1 of the plate, and wherein the through-flow duct X for the first medium provided between the first sides A of two adjacent plates extends in a second direction D2 of the plate which is substantially perpendicular to said first direction.
  • the heat exchanger outlined above is, as indicated, primarily a heat exchanger of this type.
  • the heat exchanger according to the present invention may alternatively be of another type than said cross-flow type.
  • a heat exchanger as defined above, comprising, inter alia, a stack of plates as defined above, it is in fact possible to reduce the energy consumption for chilling by about 20 % when e.g. water is used to chill air from a refrigerated display case.
  • the primary reason for this positive result is that the temperature of the chilling water must not be reduced as much as in prior art constructions to provide for efficient chilling of the air. This is in turn the result of the prolonged, more extensive direct and indirect contact of the air with the water.
  • the plate and the heat exchanger according to the present invention can be modified and altered within the scope of the subsequent claims without departing from the idea and purpose of the invention.
  • the plate 1 is made preferably of aluminum, it can also be made of any other suitable material.
  • the stack of plates in the heat exchanger can be located in a frame work which is more open as in the illustrated embodiment according to fig. 9a and the frame work can also be made of any suitable material.
  • the heat exchanger in its intended application can be located in any suitable position, i.e. horizontally as in the illustrated embodiment or vertically or obliquely if that is required or desired.
  • a heat exchanger as defined is suitable for use as an air cooler, since the first medium, the medium to be chilled, may be air.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)

Claims (14)

  1. Plaque pour un échangeur de chaleur pour l'échange de chaleur entre un premier et un deuxième milieu,
    dans laquelle la plaque (1) a un premier côté (A) et un deuxième côté opposé (B), dans laquelle le premier côté (A) de ladite plaque (1) est configuré avec au moins une élévation de transfert de chaleur (2) et avec au moins une surface de transfert de chaleur (4) entourant ladite élévation,
    dans laquelle des fossettes (5 ; 7) sont fournies au niveau de l'une ou des deux parmi l'élévation de transfert de chaleur (2) et la surface de transfert de chaleur (4) pour permettre la fourniture d'un conduit à écoulement traversant (X) pour le premier milieu,
    dans laquelle le deuxième côté (B) de ladite plaque (1) est configuré avec au moins une dépression de transfert de chaleur (3) correspondant à ladite élévation (2), ladite dépression étant configurée pour définir une partie d'un conduit à écoulement traversant (Y) pour le deuxième milieu, et avec au moins une surface de liaison (6) correspondant à ladite surface de transfert de chaleur (4) et entourant ladite dépression, et
    dans laquelle l'élévation de transfert de chaleur (2) sur le premier côté (A) de la plaque (1) a une première hauteur (h1) correspondant à une profondeur de la dépression de transfert de chaleur (3) sur le deuxième côté (B) de la plaque et une largeur (w) correspondant à une largeur de la dépression de transfert de chaleur (3),
    caractérisée en ce que
    la dépression de transfert de chaleur (3) sur le deuxième côté (B) de la plaque (1) est dotée de fossettes résistant à la pression (8) avec une hauteur correspondant à ladite première hauteur (h1) de l'élévation de transfert de chaleur (2) et à la profondeur de ladite dépression de transfert de chaleur correspondante.
  2. Plaque selon la revendication 1,
    dans laquelle les fossettes (5) fournies sur la surface de transfert de chaleur (4) sur le premier côté (A) de la plaque (1) ont une deuxième hauteur (h2) qui est supérieure à ladite première hauteur (h1), et/ou
    dans laquelle les fossettes (7) fournies sur l'élévation de transfert de chaleur (2) sur ledit premier côté (A) de la plaque (1) ont une hauteur (h2-h1) qui conjointement avec la hauteur (h1) de l'élévation est supérieure à ladite première hauteur (h1).
  3. Plaque selon la revendication 1 ou 2, dans laquelle la hauteur (w) de l'élévation de transfert de chaleur (2) et de la dépression de transfert de chaleur correspondante (3) est au moins 5 fois plus grande que ladite première hauteur (h1) de ladite élévation de transfert de chaleur et la profondeur de ladite dépression de transfert de chaleur correspondante.
  4. Plaque selon l'une quelconque des revendications 1-3, dans laquelle l'élévation de transfert de chaleur (2) sur le premier côté (A) de la plaque (1) et la dépression de transfert de chaleur correspondante (3) sur le deuxième côté (B) de la plaque sont configurées avec deux ou plusieurs portions rectilignes, parallèles ou sensiblement parallèles.
  5. Plaque selon l'une quelconque des revendications 1-4, dans laquelle la surface de transfert de chaleur (4) sur le premier côté (A) de la plaque (1) est dotée de fossettes de renfort (9).
  6. Plaque selon l'une quelconque des revendications 2-5, dans laquelle la plaque (1) est configurée avec des premiers et deuxièmes hublots (10 et 11) pour le deuxième milieu, chacun desdits hublots (10, 11) étant sur ledit premier côté (A) de la plaque (1) configuré avec un bord (10a, 11a) qui entoure ledit hublot, ledit bord faisant partie de ladite élévation de transfert de chaleur (2) et ayant une hauteur correspondant à ladite deuxième hauteur (h2) des fossettes (5) et/ou correspondant à la hauteur (h2-h1) des fossettes (7) fournies sur l'élévation de transfert de chaleur (2) conjointement avec la hauteur (h1) de ladite élévation de transfert de chaleur.
  7. Échangeur de chaleur pour l'échange de chaleur entre un premier et un deuxième milieu,
    dans lequel ledit échangeur de chaleur comprend une pile de plaques (1) selon l'une quelconque des revendications 1-6, et
    dans lequel lesdites plaques (1) sont agencées
    de sorte que le premier côté (A) de chaque plaque vienne en butée contre le premier côté (A) d'une plaque adjacente (1) dans la pile, fournissant ce faisant, au moyen des fossettes (5 ; 7) sur l'une ou les deux parmi les surfaces de transfert de chaleur (4) ou les élévations de transfert de chaleur (2) sur les premiers côtés (A) de deux plaques adjacentes dans la pile, le conduit à écoulement traversant (X) pour le premier milieu entre lesdits premiers côtés desdites plaques, et
    de telle que le deuxième côté (B) de chaque plaque (1) vienne en butée contre le deuxième côté (B) d'une plaque adjacente (1) dans la pile, définissant ce faisant, au moyen des dépressions de transfert de chaleur (3) sur les deuxièmes côtés (B) de deux plaques adjacentes dans la pile, au moins un conduit à écoulement traversant (Y) pour le deuxième milieu entre lesdits deuxièmes côtés desdites plaques.
  8. Échangeur de chaleur selon la revendication 7, dans lequel les premiers côtés (A) de deux plaques adjacentes (1) dans la pile sont assemblés à des fossettes opposées (5 ; 7) sur l'une ou les deux parmi les surfaces de transfert de chaleur (4) et les élévations de transfert de chaleur (2) sur lesdits premiers côtés, et assemblés à des bords opposés (10a, 11a) sur lesdits premiers côtés entourant des hublots (10, 11) pour le deuxième milieu dans les plaques par liaison sans fuite desdits bords les uns aux autres.
  9. Échangeur de chaleur selon la revendication 7 ou 8, dans lequel les fossettes résistant à la pression (8) dans les dépressions de transfert de chaleur (3) sur les deuxièmes côtés (B) de deux plaques adjacentes (1) dans la pile sont configurées pour la prise l'une avec l'autre lorsque lesdits deuxièmes côtés (B) desdites deux plaques adjacentes (1) dans la pile viennent en butée l'un contre l'autre.
  10. Échangeur de chaleur selon la revendication 9, dans lequel les deuxièmes côtés (B) de deux plaques adjacentes (1) dans la pile sont assemblés par liaison sans fuite de surfaces de liaison opposées (6) sur lesdits deuxièmes côtés l'un à l'autre et assemblés à des fossettes opposées (8) dans les dépressions de transfert de chaleur (3) sur lesdits deuxièmes côtés.
  11. Échangeur de chaleur selon l'une quelconque des revendications 7-10,
    dans lequel des portions rectilignes, parallèles ou sensiblement parallèles des dépressions de transfert de chaleur (3) sur les deuxièmes côtés (B) de deux plaques adjacentes (1) définissant le conduit à écoulement traversant (Y) pour le deuxième milieu s'étendent dans une première direction (D1) de la plaque, et
    dans lequel le conduit à écoulement traversant (X) pour le premier milieu fourni entre les premiers côtés (A) de deux plaques adjacentes (1) s'étend dans une deuxième direction (D2) de la plaque qui est sensiblement perpendiculaire à ladite première direction (D1).
  12. Échangeur de chaleur selon l'une quelconque des revendications 7-11, dans lequel la pile de plaques (1) de l'échangeur de chaleur est située dans un châssis (12) avec des éléments de plaque opposés (13 et 14).
  13. Échangeur de chaleur selon la revendication 12, dans lequel au moins un des éléments de plaque opposés (13, 14) est doté de raccords de tuyaux (15 et 16) pour le deuxième milieu.
  14. Refroidisseur d'air comprenant un échangeur de chaleur selon l'une quelconque des revendications 7-13, dans lequel le premier milieu est de l'air et le deuxième milieu est un liquide.
EP12175135.8A 2012-07-05 2012-07-05 Plaque pour échangeur de chaleur, échangeur de chaleur et refroidisseur d'air comprenant un échangeur de chaleur Not-in-force EP2682702B1 (fr)

Priority Applications (6)

Application Number Priority Date Filing Date Title
EP12175135.8A EP2682702B1 (fr) 2012-07-05 2012-07-05 Plaque pour échangeur de chaleur, échangeur de chaleur et refroidisseur d'air comprenant un échangeur de chaleur
US13/934,514 US20140158328A1 (en) 2012-07-05 2013-07-03 Plate for heat exchanger, heat exchanger and air cooler comprising a heat exchanger
EP13175040.8A EP2682703B1 (fr) 2012-07-05 2013-07-04 Plaque pour échangeur de chaleur, échangeur de chaleur et refroidisseur d'air comprenant un échangeur de chaleur
JP2013141166A JP2014016144A (ja) 2012-07-05 2013-07-04 熱交換器用プレート、熱交換器、ならびに熱交換器を備えた空気冷却装置
KR1020130078221A KR20140005795A (ko) 2012-07-05 2013-07-04 열교환기용 플레이트, 열교환기 및 열교환기를 포함하는 에어 쿨러
CN201310280264.2A CN103528419B (zh) 2012-07-05 2013-07-05 用于热交换器的板、热交换器和包括热交换器的空气冷却器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP12175135.8A EP2682702B1 (fr) 2012-07-05 2012-07-05 Plaque pour échangeur de chaleur, échangeur de chaleur et refroidisseur d'air comprenant un échangeur de chaleur

Publications (2)

Publication Number Publication Date
EP2682702A1 EP2682702A1 (fr) 2014-01-08
EP2682702B1 true EP2682702B1 (fr) 2017-04-26

Family

ID=46420018

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Application Number Title Priority Date Filing Date
EP12175135.8A Not-in-force EP2682702B1 (fr) 2012-07-05 2012-07-05 Plaque pour échangeur de chaleur, échangeur de chaleur et refroidisseur d'air comprenant un échangeur de chaleur

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EP (1) EP2682702B1 (fr)

Cited By (4)

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EP3447427A1 (fr) 2017-08-22 2019-02-27 Airec AB Échangeur de chaleur
EP3447428A1 (fr) 2017-08-22 2019-02-27 Airec AB Plaque de transfert de chaleur et échangeur de chaleur
EP3447429A1 (fr) 2017-08-22 2019-02-27 Airec AB Plaque de transfert de chaleur et échangeur de chaleur
EP3671096A1 (fr) 2018-12-21 2020-06-24 InnoHeat Sweden AB Plaque de transfert de chaleur et échangeur de chaleur

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US10208621B2 (en) 2015-12-07 2019-02-19 General Electric Company Surface cooler and an associated method thereof
CN109736329B (zh) * 2019-02-18 2023-10-20 浙江大学城市学院 一种自动化防隆起的能源基坑围护结构及施工方法

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KR100353020B1 (ko) * 1993-12-28 2003-01-10 쇼와 덴코 가부시키가이샤 적층형열교환기
US7264045B2 (en) * 2005-08-23 2007-09-04 Delphi Technologies, Inc. Plate-type evaporator to suppress noise and maintain thermal performance
SE536042C2 (sv) * 2010-06-16 2013-04-09 Titanx Engine Cooling Holding Ab Värmeväxlare med utökad värmeöverföringsyta runt fästpunkter

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Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3447427A1 (fr) 2017-08-22 2019-02-27 Airec AB Échangeur de chaleur
EP3447428A1 (fr) 2017-08-22 2019-02-27 Airec AB Plaque de transfert de chaleur et échangeur de chaleur
EP3447429A1 (fr) 2017-08-22 2019-02-27 Airec AB Plaque de transfert de chaleur et échangeur de chaleur
WO2019038282A1 (fr) 2017-08-22 2019-02-28 Airec Ab Plaque d'échangeur de chaleur et échangeur de chaleur
WO2019038279A1 (fr) 2017-08-22 2019-02-28 Airec Ab Échangeur de chaleur
WO2019038281A1 (fr) 2017-08-22 2019-02-28 Airec Ab Plaque d'échangeur de chaleur et échangeur de chaleur
US11105560B2 (en) 2017-08-22 2021-08-31 Innoheat Sweden Ab Heat exchanger
US11105561B2 (en) 2017-08-22 2021-08-31 Innoheat Sweden Ab Heat exchanger plate and heat exchanger
EP3671096A1 (fr) 2018-12-21 2020-06-24 InnoHeat Sweden AB Plaque de transfert de chaleur et échangeur de chaleur
WO2020127081A1 (fr) 2018-12-21 2020-06-25 Innoheat Sweden Ab Plaque d'échangeur de chaleur et échangeur de chaleur
US11898805B2 (en) 2018-12-21 2024-02-13 Innoheat Sweden Ab Heat exchanger plate and heat exchanger

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