EP2586278A1 - Composition isolante pour électronique imprimée dans un point de jonction de conducteur - Google Patents

Composition isolante pour électronique imprimée dans un point de jonction de conducteur

Info

Publication number
EP2586278A1
EP2586278A1 EP11725778.2A EP11725778A EP2586278A1 EP 2586278 A1 EP2586278 A1 EP 2586278A1 EP 11725778 A EP11725778 A EP 11725778A EP 2586278 A1 EP2586278 A1 EP 2586278A1
Authority
EP
European Patent Office
Prior art keywords
insulation
insulation composition
resins
composition according
spacer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP11725778.2A
Other languages
German (de)
English (en)
Inventor
Thomas Bernert
Helmut MÄUSER
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bayer Intellectual Property GmbH
Original Assignee
Bayer Intellectual Property GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bayer Intellectual Property GmbH filed Critical Bayer Intellectual Property GmbH
Priority to EP11725778.2A priority Critical patent/EP2586278A1/fr
Publication of EP2586278A1 publication Critical patent/EP2586278A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4685—Manufacturing of cross-over conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing

Definitions

  • the present invention relates to an insulation composition, in particular for printed electronics in a conductor crossing point. Furthermore, the present invention relates to a method for producing such an insulation composition. Another object of the present invention is the use of a composition according to the invention for the purpose of isolating superimposed conductor tracks of a printed circuit. Moreover, the present invention relates to the use of spacers in insulation compositions, wherein the insulation compositions are used in particular for the purpose of insulating superposed printed circuit board tracks.
  • the present invention thus relates to the technical field of printed circuits.
  • the degree of complexity of the conductor structures largely depends on whether or not intersection possibilities of different conductor tracks can be provided for in the design of the printed circuit. These crossing possibilities are always realized by an insulating layer and a conductive connection as a bridge over the insulating layer.
  • Applications of complex conductor structures can be found in many areas of printed electronics, but also in the RF design of coplanar antenna structures and in the manufacture of RFID antennas and displays.
  • DE 43 32 282 AI The production of printed circuits is known for example from DE 43 32 282 AI.
  • This document describes a method for producing printed conductor patterns on substrates by means of screen printing and subsequent heat treatment for converting the printed printed conductors into adhesive, metallic printed conductors.
  • DE 43 32 282 AI often the problem of insufficient adhesion to the substrate.
  • DE 43 32 282 AI proposes to solve this problem, applied to the first printed circuit configuration produced by screen printing and subsequent heat treatment at least on a part of the configuration at least a second conductor layer by means of screen printing and subsequent heat treatment.
  • the problem of crossing interconnects and the question of isolation between these interconnects is not addressed.
  • the method according to DE 43 32 282 AI has the disadvantage that for the respective sintering of the two successively applied printed conductors temperatures above 800 ° C are required, so that only appropriate substrate materials can be used which survive these temperatures, in particular without deformation.
  • the document DE 298 24 033 Ul relates to a carrier for semiconductor chips, which is formed flat and consists of a flexible, dielectric material on which at least one semiconductor chip is applied with a Leitbahn für for contactless data transmission.
  • the interconnect structure formed from an electrically conductive polymer or adhesive is printed directly on carrier consisting of paper, cardboard, cardboard or a textile material. Also in this document, the problem of crossing interconnects and the question of isolation between these interconnects is not addressed.
  • Document DE 10 2007 028 357 A1 relates to a transponder card, comprising a carrier substrate arranged without intermediate layers between two protective plastic plates, on which a flat loop antenna with two feed terminals and a conductor track connecting the feed terminals and an integrated circuit with two antenna connections are arranged the antenna terminals are electrically connected to the two supply terminals and the integrated circuit is arranged relative to the loop antenna so that the track does not pass between the antenna terminals of the integrated circuit.
  • the interconnects intersect and are electrically isolated by a non-conductive separation element.
  • the separation element may be formed by an additional non-conductive layer. This non-conductive layer is not described in detail in DE 10 2007 028 357 AI.
  • the document EP 1 535 957 A relates to a thermal insulation panel for external insulation of tools on the basis of fillers containing thermostable plastics.
  • the thermostable plastic is polytetrafluoroethylene (PTFE) and the fillers are hollow spheres with an average diameter of 0.01 to 300 ⁇ m.
  • the proportion of hollow glass spheres in the Thermoisolierplatte is 5 to 70 wt .-%.
  • the hollow spheres can consist of chemically resistant glass, of ceramic or of high-temperature-resistant thermoplastic plastics. The use of compositions for the isolation of printed conductors is not addressed in the document.
  • US 2002/0058137 Al discloses an insulation composition comprising at least one insulating spacer having a particle size of 5 to 20 ⁇ m, although it is not disclosed whether the stated particle size, the particle diameter d 50 or the particle diameter dgo or another Size acts.
  • the proportion of spacers in the insulation composition is 5 to 15%, although it is not disclosed whether it is a weight or volume fraction or another proportion. Regardless of this, however, it can be assumed with such a small proportion that with such a low proportion of spacers, the layer thickness between the spacers becomes too strong because the spacers are not packed tight enough. In this case, you would have a principle for isolation However, it can be seen in the microscope that the distance of the balls from one another is very large and only a few ⁇ m of layer thickness remain between the balls.
  • the layer thickness between the spacers is too low, there is a risk of inhomogeneities and Kapilaren. If the insulation is overprinted with a solvent-based silver-conductive paste, the solvent on the one hand and the mobility of the silver on the other hand can lead to low-strength compounds in the z-direction, i. perpendicular to the substrate, come.
  • the small proportion of spacers causes a high proportion of binder, whereby the total amount of solvents contained in the binders is high.
  • the solvents can be evaporated only with great effort and / or high temperatures. This leads to stresses on the substrate on which the insulation composition is applied. Many plastics that would be economically and technically advantageous can therefore not be used as a substrate.
  • insulation bridges are in principle suitable for the production of insulation bridges.
  • the drying of these pastes usually takes place at high temperatures, for example above 80 ° C or even above 100 ° C, which limits the choice of materials for substrates.
  • substrate materials can be used which remain distortion-free at the temperatures mentioned, for example polycarbonate (PC) or polyethylene terephthalate (PET).
  • the insulation bridge must have a certain height or thickness between the strip conductors in order to have sufficient insulating properties.
  • the insulation bridge must be applied by multiple printing, which should also reduce the burden on the film by energy input during drying.
  • the insulation bridge can also be formed by an insulating protective film with clearances in the contact area and the second conductor printed over it.
  • this requires a precise alignment of the protective film. The problem here is the temperature sensitivity of the laminate and the resulting lack of dimensional stability.
  • An interesting substrate material for this purpose is, for example, polyvinyl chloride (PVC).
  • PVC polyvinyl chloride
  • T g glass transition temperature
  • this material has a low glass transition temperature T g of 80 ° C, so that usual temperatures at which the drying of insulation compositions, can not be applied and there is a deformation of the substrate at normal drying temperatures.
  • T g glass transition temperature
  • commercially available pastes for the production of insulation bridges are generally not suitable for thermal drying at low temperatures at which substrates, such as substrates made of polyvinyl chloride, remain distortion-free.
  • UV-drying paints leads to an energy input, which can lead to the delay, for example, a film of polyvinyl chloride.
  • a first object of the present invention is to provide an insulation composition that can be dried after application to a patterned substrate at low temperatures, particularly at temperatures below 70 ° C.
  • Another object of the present invention is to provide an insulating composition which can be dried at low temperatures, particularly at temperatures below 70 ° C, at layer thicknesses required to achieve a sufficient insulating effect.
  • Corresponding layer thicknesses which are necessary in order to effect a sufficient insulation are usually in a range from 3 to 40 ⁇ m.
  • Another object of the present invention is to provide an insulating composition which can be applied in a preferably simple printing process, more preferably a single wet printing step or a single wet-on-wet printing step, in a sufficient thickness to effect insulation Stress of the substrate is reduced by energy input during drying after application of the insulating composition.
  • a spacer is understood to mean a constituent of the insulation composition which, on the one hand, has insulating properties and, on the other hand, results in a compactly filled and therefore reliably thick insulating layer due to particle size and particle shape.
  • the spacers have a substantially spherical shape and, when applied as an insulating composition, give a substantially densest spherical packing. Suitable spacers are therefore components which on the one hand have sufficient insulating properties and on the other hand have a sufficient particle size and particle shape.
  • the insulating properties of the spacers ensure that in circuits in the region of the intersection points of interconnects there are no inadmissible capacitive loads.
  • the particle size of the spacer further ensures a sufficient height of the insulating material.
  • spacers can be used which have light-converting properties, allowing visual control of the embedding of the spacers in the insulation composition.
  • the spacers may have IR-absorbing properties, so that the heat input preferably takes place in the insulating layer and not in the substrate.
  • the capacitive load is influenced by two parameters, namely the per- mittivity and the distance between the tracks.
  • the average particle diameter d 50 from 3 to 40 ⁇ have.
  • the spacers have an average particle diameter d 90 of 0.5 to 20 ⁇ m (also referred to below as mixture with other spacers as "first spacers").
  • the substantially spherical spacers have a narrow size distribution.
  • a narrow size distribution in the sense of the present invention is given, for example, if
  • the formulation contains fillers of different particle sizes. This allows a denser packing of the filler particles in the binder matrix to be achieved.
  • spacers of various specified particle sizes can be mixed to densify the particle packing in the print layer.
  • spacers having a mean diameter d 50 of from 12 to 26 ⁇ m can be added to particles of the size described above ("first spacers") . These particles furthermore preferably have an average particle diameter d 90 of from 0.5 to 70 ⁇ m
  • first spacers particles of the size described above
  • second spacers these spacers in mixture with other spacers.
  • Mixing spacers of two different particle sizes prevents the layer thickness between the spacers from becoming too strong because the spacers are packed closer than if there were only spacers of particle size in the insulation composition. If, as already explained above, the layer thickness between the spacers is too small, a usable insulation is no longer guaranteed, there is a short circuit.
  • the ratio by weight of these two different particles can be within a wide range, for example ⁇ 100: 0 first to second spacers to> 0: 100 first to second spacers.
  • the spacers do not exceed a predetermined size, since too large spacers generally can not pack tightly enough so that the layer thickness between the spacers also becomes too strong in this case.
  • the spacers to be used according to the invention preferably have an average particle diameter d 50 of less than 40 ⁇ m, particularly preferably less than 35 ⁇ m, in particular less than 30 ⁇ m.
  • the insulation composition according to the invention is furthermore preferably characterized in that the spacer is in a substantially spherical form.
  • the spacer is in a substantially spherical form.
  • FIG. 1 A corresponding representation of a shaped body according to the invention including the representation of two corresponding diameters LI and L2 is shown in FIG.
  • the spacer provided according to the invention may comprise glass, at least one ceramic material and / or at least one polymer and in particular embodiments of the present invention also consist of glass, a ceramic material and / or a polymer.
  • the spacer may also comprise mineral glass.
  • silica glass and / or quartz glass should be mentioned.
  • the ceramic material may for example be selected from the group consisting of titanium dioxide, calcium carbonate, zirconium dioxide, aluminum oxide, magnesium oxide, zinc oxide and mixtures thereof.
  • the polymer may be selected from the group consisting of divinylbenzene and mixtures of divinylbenzene and polystyrene.
  • the spacer comprises glass and is constructed in particular of glass hollow spheres.
  • suitable spacers can be applied to corresponding substrates or conductor structures by means of the following described coating methods:
  • suitable printing and / or coating methods for applying the insulation composition according to the invention and thus, for example, for the production of insulation bridges are in principle all coating and printing processes known to the person skilled in the art, for example doctoring, spin coating (spin coating), dipcoating, spray painting (Spray coating), curtain coating (curtain coating), coating by die application (slot dye coating), high pressure (eg flexographic printing), planographic printing (eg offset printing), throughprint (eg screen printing), gravure printing (eg gravure printing), pad printing and / or thermal transfer printing.
  • the isolation bridge can be applied by knife coating, spincoating, dipcoating, spraycoating and / or curtaincoating in combination with matrices, masks or stencils, the stencil covering the substrate (for example a PVC film) ), in particular at the places which are not to be coated.
  • coating by means of slot-dye coating high-pressure (eg flexographic printing), planographic printing (eg offset printing), throughprint (eg screen printing), gravure printing (eg gravure printing), pad printing and / or thermal transfer printing can be used be used.
  • high-pressure eg flexographic printing
  • planographic printing eg offset printing
  • throughprint eg screen printing
  • gravure printing eg gravure printing
  • pad printing eg / or thermal transfer printing
  • the application of the insulation composition according to the invention is carried out in particular by screen printing.
  • the claimed insulation composition can be dried at relatively low temperatures so that in combination with the insulation composition it is also possible to use substrates (for example for circuits) which have a low softening temperature.
  • the claimed insulation composition can be dried at temperatures below 70 ° C., particularly preferably below 65 ° C., in particular below 60 ° C.
  • dry insulation composition generally meaning insulation compositions in which, after drying, the insulation bridge layer At the indicated temperatures, a cross-cut test can be carried out to check the completeness of the drying. If the crosshatch test is evaluated with a cross hatch value (GT value) "0", the layer is dry in the sense of the invention, whereby a GT value of "0" means that after cutting with the crosshatching device (six parallel cuts at a distance of 1 mm and perpendicular to it also six parallel cuts at a distance of 1 mm) no detachment of the print layer after removal of the adhesive tape can be determined.
  • GT value cross hatch value
  • the insulation composition of the invention may contain a binder.
  • a binder This is preferably selected from the group consisting of cellulose esters, cellulose ethers, rubber compounds, polyester resins, unsaturated polyesters, alkyd resins, phenolic resins, amino resins, amido resins, ketone resins, xylene-formaldehyde resins, epoxy resins, phenoxy resins, polyolefins, polyvinyl chloride, polyvinyl esters, polyvinyl alcohols, Polyvinyl acetals, polyvinyl ethers, polyacrylates, polymethacrylates, polystyrenes, polycarbonates, polyesters, copolyesters, polyamides, silicone resins, polyurethanes and mixtures thereof.
  • the binder comprises polyurethane.
  • the binder can be selected in detail from the group consisting of one-component polyurethanes, two-component polyurethanes, aqueous polyurethane dispersions and polyurethane hot melt adhesives.
  • the paste may comprise or be formed from one or more one-component polyurethanes comprising prepolymers preparable by reaction of alcohols with a stoichiometric excess of polyfunctional isocyanates having an average functionality greater than 2 and up to 4.
  • these prepolymers may further comprise additives and / or solvents.
  • the prepolymers can be obtained, for example, by reacting polyisocyanates with alcohols which are mixtures of polyols with on average monofunctional alcohols to form urethane groups and terminal isocyanate groups.
  • the paste contains as binder a polycarbonate or a mixture of different polycarbonates or plastic blends of polycarbonate and other plastics such as ABS.
  • the composition according to the invention generally contains at least one solvent.
  • the solvent is preferably selected so that the binder is dissolved and at the same time no damage to the substrate occurs.
  • the binder should completely wetting the substrate with the insulation composition according to the invention enable.
  • Suitable solvents are, for example, 2-methoxy-1-methylethyl acetate, 1,2,4-trimethylbenzene, ethyl-3-ethoxypropionate and naphtha and also any desired mixtures of the abovementioned solvents.
  • binders and solvents depends on the fact that the resulting insulating composition according to the invention can be dried at low temperatures of, for example, below 70 ° C.
  • solvents and binders must be coordinated so that when applying the insulation composition according to the invention by screen printing, there is no clogging of the screen.
  • layer thicknesses of the insulating layer of 10 to 70 ⁇ m, particularly preferably 20 to 50 ⁇ m, can be achieved in a single process step either in the wet process or in the wet-on-wet process.
  • the insulation composition of the invention may comprise at least one further component selected from the group consisting of additives, (further) fillers and mixtures thereof.
  • the additive may for example be selected from the group consisting of thickeners, rheology additives, adhesion promoters, defoamers, deaerators, leveling agents and mixtures thereof.
  • the individual constituents of the isolation composition of the invention may be included in the composition in wide ranges, as long as they can sufficiently perform their functional function in the composition. Corresponding salaries of the individual constituents can be determined by the skilled person by means of routine tests.
  • the proportion of spacer in each case based on the insulation composition, 1 to 90 wt .-%, preferably 20 to 90 wt.%, Preferably 10 to 80 wt .-%, in particular 20 to 80 wt .-%, particularly preferably 20 to 70 wt .-%, most preferably 30 to 60 wt .-%.
  • the layer thickness between the spacers is also prevented from becoming too strong because the spacers are densely packed because of their high content.
  • the proportion of binder in each case based on the isolation composition, 1 to 70 wt .-%, preferably 5 to 60 wt .-%, particularly preferably 10 to 50 wt .-%. Due to the high proportion of spacers, fewer binders are required, which also reduces the total amount of solvents contained in the binders. This allows the solvents to be evaporated faster. Therefore, the composition of the present invention may preferably be dried at low temperatures. In particular, in the context of the present invention, it is possible to efficiently dry the insulation composition according to the invention at a temperature lower than 70 ° C., particularly preferably lower than 65 ° C., particularly preferably lower than 60 ° C.
  • circuits on substrates which at higher temperatures, in particular at temperatures higher than 70 ° C., more preferably higher than 65 ° C., more preferably higher than 60 ° C. Deformed and therefore can not be used in combination with conventional insulation compositions of the prior art.
  • the high content of spacers compared to the prior art thus has two effects: the layer thickness between the spacers does not sag too much and the solvents in the binder can be vaporized at lower temperatures. An additional effect can be achieved if, as already described above, there is a mixture of spacers of two different particle sizes.
  • a preferred substrate which can be used in combination with the insulation composition of the invention is polyvinyl chloride (PVC). Since this material softens even at low temperatures above 60 ° C. with prolonged exposure to temperature and temperatures above 70 ° C. with short-term exposure to temperature, the print layers provided on this substrate must also be dried at these moderate temperatures.
  • the composition of the invention for the preparation of the isolation bridge accordingly contains solvents and binders which allow drying at temperatures below 70 ° C. Suitable solvents for this purpose are, for example, the already mentioned 2-methoxy-1-methylethyl acetate, 1, 2,4-trimethylbenzene, ethyl 3-ethoxypropionate, naphtha and any mixtures thereof. These solvents are used in particular in combination with a polycarbonate binder.
  • PETG polyethylene terephthalate with glycol
  • TPU thermoplastic polyurethane
  • PE polyethylene
  • olefin-based material marketed under the TESLIN brand of PPG Industries with 60% by weight non-abrasive filler and 65% by volume. % Air.
  • Another object of the present invention is an electrical circuit comprising a substrate and provided thereon at least one conductor track, wherein the conductor track is covered by a dried insulation composition according to the invention.
  • the substrate may preferably be a substrate which is particularly preferred at temperatures higher than 70 ° C higher than 65 ° C, particularly preferably higher than 60 ° C, suffers a deformation.
  • any other substrates in the context of the present invention for example polycarbonate-based substrates.
  • this circuit is carried out according to the skilled person known per se methods.
  • the individual strip paths and the insulation bridge of the circuit can be coated and pressure methods known to those skilled in the art, such as doctoring, spin coating (dipcoating), spray coating (spray coating), Curtaincoating, coating by nozzle application (slot dye coating ), High-pressure (eg flexographic printing), planographic printing (eg offset printing), through-printing (eg screen printing), gravure printing (eg gravure printing), pad printing and / or thermal transfer printing, are applied to the substrate.
  • the isolation bridge can be applied by knife coating, spincoating, dipcoating, spraycoating and / or curtaincoating in combination with matrices, masks or stencils, the stencil covering the substrate (for example a PVC film) ), in particular at the places which are not to be coated.
  • a coating method without matrices, masks or stencils in particular coating by means of slot-dye coating, high-pressure (eg flexographic printing), planographic printing (eg offset printing), through-printing (eg screen printing), gravure printing (eg gravure printing), pad printing, digital printing and / or or thermal transfer printing can be used.
  • high-pressure eg flexographic printing
  • planographic printing eg offset printing
  • through-printing eg screen printing
  • gravure printing eg gravure printing
  • pad printing digital printing and / or or thermal transfer printing
  • the insulation composition according to the invention may accordingly be present in particular in the form of an insulating layer, for example on an electrical circuit between two conductor tracks.
  • a further subject of the present invention is also a process for the production of corresponding insulation compositions according to the invention.
  • the individual components described above are mixed together in any order. It is also possible to admix the spacers provided according to the invention with commercially available insulation compositions.
  • a variety of commercially available products in particular as a binder, may be suitable, for example, under the trade names Noriphan HTR, Noriphan PCI, Noriphan N2K, Noricryl and NoriPET from Pröll KG, Weissenburg in Bavaria, Germany, or under the Trade name Maraflex FX from Marabu GmbH & Co.
  • the present invention therefore also relates in a further embodiment to the use of spacers of the type described above in insulation compositions.
  • the insulation composition according to the invention can be used in all areas of printed electronics, but also in the RF design of coplanar antenna structures and in the manufacture of RFID antennas and displays for isolation purposes.
  • FIG. 1 shows a printed electronics designed as an RFID antenna with a conductor crossing point.
  • two conductor tracks 1 and 2 are coplanar generated on a PVC substrate 3 by screen printing.
  • the two tracks 1 and 2 are connected together at their respective ends via a connection conductor 4 to provide an inductance.
  • an insulating overpressure (insulation bridge) 5 of the conductor tracks 1 and 2 below the connecting conductor 4 is required.
  • This insulating overpressure (isolation bridge) is formed by insulation composition according to the invention.
  • the present invention will be further described by the following examples, without being limited thereto.
  • the layer thicknesses were measured.
  • the thickness of the silver conductors was 28 to 32 ⁇ and the thickness of the insulating bridge and the silver conductors together was 60 to 67 ⁇ .
  • the thickness of the pure insulation bridge was thus about 30 to 35 ⁇ .
  • the thickness was measured with a digital probe GT-H10 from Keyence (Keyence Deutschland GmbH, 63263 Neu-Isenburg).
  • Example 3 As in Example 1, the layer thicknesses were measured after drying. The thickness of the isolation bridge was 30 to 35 ⁇ m. To determine the adhesive strength and thus the complete drying, a cross-cut test was carried out. At a temperature of 23 ° C and a relative humidity of 30%, a cross-cut cut-off value of "0" was determined with a Tesa 4104 adhesive tape. Example 3
  • the beaker was screwed and homo- genised in a Thinkymixer ARE-250 for two minutes. This mixture was then printed by means of printed conductors made of silver on a PVC film by screen printing. The drying took place in a drying oven at 55 ° C for 30 minutes. In a subsequent printing step, another silver trace was printed over the isolation bridge.
  • Example 2 As in Example 1, the layer thicknesses were measured after drying.
  • the thickness of the isolation bridge was 65 to 75 ⁇ m.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Inorganic Insulating Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

L'invention concerne une composition isolante comportant au moins un liant et au moins un agent d'espacement. L'invention porte également sur un procédé de production d'une composition isolante et sur l'utilisation d'agents d'espacement dans des compositions isolantes.
EP11725778.2A 2010-06-23 2011-06-20 Composition isolante pour électronique imprimée dans un point de jonction de conducteur Withdrawn EP2586278A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP11725778.2A EP2586278A1 (fr) 2010-06-23 2011-06-20 Composition isolante pour électronique imprimée dans un point de jonction de conducteur

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP10167011A EP2400825A1 (fr) 2010-06-23 2010-06-23 Composition d'isolation pour des dispositifs électroniques imprimés dans un point de croisement de conducteurs
EP11725778.2A EP2586278A1 (fr) 2010-06-23 2011-06-20 Composition isolante pour électronique imprimée dans un point de jonction de conducteur
PCT/EP2011/060221 WO2011161050A1 (fr) 2010-06-23 2011-06-20 Composition isolante pour électronique imprimée dans un point de jonction de conducteur

Publications (1)

Publication Number Publication Date
EP2586278A1 true EP2586278A1 (fr) 2013-05-01

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Family Applications (2)

Application Number Title Priority Date Filing Date
EP10167011A Withdrawn EP2400825A1 (fr) 2010-06-23 2010-06-23 Composition d'isolation pour des dispositifs électroniques imprimés dans un point de croisement de conducteurs
EP11725778.2A Withdrawn EP2586278A1 (fr) 2010-06-23 2011-06-20 Composition isolante pour électronique imprimée dans un point de jonction de conducteur

Family Applications Before (1)

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EP10167011A Withdrawn EP2400825A1 (fr) 2010-06-23 2010-06-23 Composition d'isolation pour des dispositifs électroniques imprimés dans un point de croisement de conducteurs

Country Status (4)

Country Link
EP (2) EP2400825A1 (fr)
CN (1) CN103098566A (fr)
BR (1) BR112012032822A2 (fr)
WO (1) WO2011161050A1 (fr)

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CN110636708B (zh) * 2019-09-27 2022-05-03 江西省科学院应用物理研究所 单层电路板的交叉轨绝缘子反应材料及印刷技术

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CN103098566A (zh) 2013-05-08
WO2011161050A1 (fr) 2011-12-29
EP2400825A1 (fr) 2011-12-28
BR112012032822A2 (pt) 2016-11-08

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