BR112012032822A2 - composição de isolamento para eletrônica impressa em um ponto de cruzamento condutor. - Google Patents
composição de isolamento para eletrônica impressa em um ponto de cruzamento condutor.Info
- Publication number
- BR112012032822A2 BR112012032822A2 BR112012032822A BR112012032822A BR112012032822A2 BR 112012032822 A2 BR112012032822 A2 BR 112012032822A2 BR 112012032822 A BR112012032822 A BR 112012032822A BR 112012032822 A BR112012032822 A BR 112012032822A BR 112012032822 A2 BR112012032822 A2 BR 112012032822A2
- Authority
- BR
- Brazil
- Prior art keywords
- crossing point
- insulation composition
- printed electronics
- conductive crossing
- conductive
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4685—Manufacturing of cross-over conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Inorganic Insulating Materials (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
composição de isolamento para eletrônica impressa em um ponto de cruzamento condutor. a presente invenção se refere a uma composição de isolamento compreendendo pelo menos um adesivo e pelo menos um espaçador. além disso, descreve-se um processo para a preparação de uma composição de isolamento, bem como o uso de espaçadores em composições de isolamento.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP10167011A EP2400825A1 (de) | 2010-06-23 | 2010-06-23 | Isolationszusammensetzung für gedruckte Elektronik in einem Leiterkreuzungspunkt |
PCT/EP2011/060221 WO2011161050A1 (de) | 2010-06-23 | 2011-06-20 | Isolationszusammensetzung für gedruckte elektronik in einem leiterkreuzungspunkt |
Publications (1)
Publication Number | Publication Date |
---|---|
BR112012032822A2 true BR112012032822A2 (pt) | 2016-11-08 |
Family
ID=42780054
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR112012032822A BR112012032822A2 (pt) | 2010-06-23 | 2011-06-20 | composição de isolamento para eletrônica impressa em um ponto de cruzamento condutor. |
Country Status (4)
Country | Link |
---|---|
EP (2) | EP2400825A1 (pt) |
CN (1) | CN103098566A (pt) |
BR (1) | BR112012032822A2 (pt) |
WO (1) | WO2011161050A1 (pt) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110636708B (zh) * | 2019-09-27 | 2022-05-03 | 江西省科学院应用物理研究所 | 单层电路板的交叉轨绝缘子反应材料及印刷技术 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0737466A (ja) * | 1993-07-26 | 1995-02-07 | Gunze Ltd | 透明タッチパネル及びその製造法 |
DE4332282A1 (de) | 1993-09-23 | 1995-03-30 | Sel Alcatel Ag | Verfahren zur Herstellung von gedruckten Schaltungen |
WO1997025845A1 (en) * | 1996-01-05 | 1997-07-17 | Sheldahl, Inc. | Printed circuit assembly and method of manufacture therefor |
DE29824033U1 (de) | 1998-10-13 | 2000-03-30 | Ksw Microtec Ges Fuer Angewand | Flächig ausgebildeter Träger für Halbleiter-Chips |
SE0004125L (sv) * | 2000-11-10 | 2002-05-11 | Ericsson Telefon Ab L M | Distanshållande dielektriskt skikt |
JP3960850B2 (ja) * | 2002-04-26 | 2007-08-15 | ホシデン株式会社 | タッチパネル |
DE20318330U1 (de) | 2003-11-25 | 2005-04-14 | Brandenburger Isoliertechnik Gmbh & Co | Thermoisolierplatte |
US20050154105A1 (en) * | 2004-01-09 | 2005-07-14 | Summers John D. | Compositions with polymers for advanced materials |
DE102004058335A1 (de) * | 2004-11-29 | 2006-06-14 | Schulz-Harder, Jürgen, Dr.-Ing. | Substrat |
DE102007028357A1 (de) | 2007-06-15 | 2008-12-24 | Ksw Microtec Ag | Transponderkarte |
KR101151196B1 (ko) * | 2007-07-18 | 2012-06-08 | 쇼와 덴코 가부시키가이샤 | 열경화성 수지 조성물 |
-
2010
- 2010-06-23 EP EP10167011A patent/EP2400825A1/de not_active Withdrawn
-
2011
- 2011-06-20 CN CN2011800409041A patent/CN103098566A/zh active Pending
- 2011-06-20 WO PCT/EP2011/060221 patent/WO2011161050A1/de active Application Filing
- 2011-06-20 BR BR112012032822A patent/BR112012032822A2/pt not_active IP Right Cessation
- 2011-06-20 EP EP11725778.2A patent/EP2586278A1/de not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
WO2011161050A1 (de) | 2011-12-29 |
EP2400825A1 (de) | 2011-12-28 |
CN103098566A (zh) | 2013-05-08 |
EP2586278A1 (de) | 2013-05-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
BR112012025245A2 (pt) | composição de poliolefina semicondutora compreendendo carga condutiva | |
BRPI1015324A2 (pt) | sistema curável, método para a fabricação de um produto curado, produto curado, e, usos do produto curado e do sistema curável | |
MX2013002774A (es) | Vidrio y fibra de vidrio con constante dielectrica baja. | |
BR112015023320A2 (pt) | lignina técnica; lignina técnica que tem um espectro de rmn de hsqc de 1h-13c; e lignina técnica que tem um espectro de rmn de 13c | |
CR20190269A (es) | COMPOSICIONES Y MÉTODOS PARA MODULAR LA EXPRESIÓN DE TTR Y VHB (Divisonal 2015-0612) | |
DK2688853T4 (da) | Isolerende flerlagsrude omfattende to stakninger med lav emission | |
PH12014502350A1 (en) | Mixtures, methods and compositions pertaining to conductive materials | |
UA113742C2 (xx) | Зв'язувальна система на основі вуглеводів та спосіб її виготовлення | |
BR112012027747A2 (pt) | método e composição imunogênica para tratamento de neoplásia | |
IN2014DN09891A (pt) | ||
BRPI1010285A2 (pt) | anel do mancal com um isolamento eleétrico, bem como processo para sua fabricação | |
BR112012031508A2 (pt) | composição e uso da mesma | |
BR112012020628A2 (pt) | fotoiniciador de éter polialquílico, uso de um fotoiniciador de éter polialquílico, método para curar uma composição de matriz, e, composição de matriz | |
DK2409959T3 (da) | Panel eller plade dannet af stenagglomerat indeholdende et organisk bindemiddel af vegetabilsk oprindelse | |
EP2752462A4 (en) | RESIN COMPOSITION HAVING HIGH DIELECTRIC INSULATION PROPERTIES | |
BRPI1015480B8 (pt) | composição curável, produto curado, e, método para a fabricação de um componente de equipamento de isolamento elétrico | |
CY1118593T1 (el) | Πρωτοτυπα παραγωγα πυραζινης | |
BR112013001109A2 (pt) | composição que contém galacto-oligossacarídeos e método para produzi-la | |
UA116239C2 (uk) | Нові похідні піридину | |
FR2992388B1 (fr) | Servofrein electrique a compensation de jeu de transmission | |
BR112014008770A2 (pt) | folha condutora térmica autossustentável | |
BR112016012627A2 (pt) | composições compreendendo um polipeptídeo de beta-glicosidase e métodos de uso | |
SG190738A1 (en) | Non-linear acene derivatives and their use as organic semiconductors | |
BR302012004266S1 (pt) | Configuracao aplicada em conector eletrico | |
BR112013002793A2 (pt) | processo e composição submetida ao envelhecimento térmico |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
B08F | Application fees: dismissal - article 86 of industrial property law | ||
B08K | Lapse as no evidence of payment of the annual fee has been furnished to inpi (acc. art. 87) |