EP2577064B1 - Kryopumpe mit einer vorrichtung zur verhinderung des memory-effekts - Google Patents

Kryopumpe mit einer vorrichtung zur verhinderung des memory-effekts Download PDF

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Publication number
EP2577064B1
EP2577064B1 EP11722718.1A EP11722718A EP2577064B1 EP 2577064 B1 EP2577064 B1 EP 2577064B1 EP 11722718 A EP11722718 A EP 11722718A EP 2577064 B1 EP2577064 B1 EP 2577064B1
Authority
EP
European Patent Office
Prior art keywords
shield
cooling stage
cooling
stage
flange
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Not-in-force
Application number
EP11722718.1A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP2577064A1 (de
Inventor
Marcel Kohler
Herbert Vogt
Urs Frick
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HSR AG
Original Assignee
HSR AG
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Filing date
Publication date
Application filed by HSR AG filed Critical HSR AG
Publication of EP2577064A1 publication Critical patent/EP2577064A1/de
Application granted granted Critical
Publication of EP2577064B1 publication Critical patent/EP2577064B1/de
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B37/00—Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00
    • F04B37/06—Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00 for evacuating by thermal means
    • F04B37/08—Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00 for evacuating by thermal means by condensing or freezing, e.g. cryogenic pumps

Definitions

  • the invention relates to a device for preventing the memory effect in cryopumps according to the preamble of claim 1. Furthermore, the invention relates to a cryopump according to claim 11.
  • Cryopumps operated with a two-stage cooling head are characterized by their high pumping speed and are used to generate an ultrahigh vacuum (p ⁇ 10 -7 mbar). Such pumps have been on the market for over 30 years.
  • the pumping surfaces of the first stage are usually designed as cup-shaped shielding and baffle shaped in the region of the pot opening.
  • the pumping surfaces of the first stage should be kept at about 80 Kelvin and serve to freeze out water vapor and gases with similar resublimation points.
  • cryopumps with a two-stage cooling head there are gases which liquefy at the temperature zones of about 30 K described above.
  • the liquefied gases have a vapor pressure which counteracts the ultrahigh vacuum produced.
  • a negative pressure is established, which is no longer undershot during the continuous operation of the cryopump.
  • concentration of such at about 30 K liquefiable gases in the atmosphere to be extracted the more serious the memory effect on the vacuum to be achieved.
  • cryopumps in the case of cryopumps, a heat bar is known, which conducts heat from the cryopump housing to the temperature zones of the bottom of the shield, which also prevents the memory effect.
  • the DE 2912 856 is a cryopump with a built-in multi-stage cryogenerator disclosed.
  • the lowest temperature stage is thermally conductively connected to the condensation surface for the permanent gases to be pumped.
  • the higher temperature stage is thermally conductively connected to a radiation shield for the condensing surface.
  • the heat-conducting bridge for radiation shielding is designed to be as short as possible, whereas the heat-conducting bridge between the stage of the lowest temperature and the condensation surface is carried out relatively long compared to current practice. This change in the thermal bridge lengths leads to a shortened cooling time of the cryopump. However, this cryopump can not prevent the memory effect.
  • the object of the invention is to propose a cryopump which does not have the disadvantage described above.
  • the object of the invention is to provide a cryopump which does not have the memory effect.
  • the object is achieved in a device according to the preamble of claim 1, characterized in that the thermal bridge between the shield and the first cooling stage is provided at a distance from the end face.
  • the thermal bridge is in communication with a temperature zone of the first cooling stage, which has a higher temperature than the temperature which prevails on the end face of the first cooling stage.
  • the apparatus according to the invention is preferably equipped with new cryopumps. However, it is also conceivable to retrofit cryopumps already in use with the device.
  • the position of the thermal bridge at the first cooling stage is set such that a temperature between 70 and 90 K and preferably approximately 80 K is established during operation of a cryopump on the shield. If this temperature range prevails on the entire surface of the shield, then the above Memory effect can be prevented.
  • the fact that the heat is provided for transmission via the thermal bridge of the first cooling stage, can be dispensed with external heat sources, whereby the efficiency of the cryopump at the second stage is not reduced.
  • a neck is provided at the bottom of the shield, which neck is connected only with its distal end heat-conducting with the first cooling stage. This ensures that cold is taken only from a temperature range of the first cold stage, which corresponds to the optimum operating temperature at the shield.
  • the inner diameter of the nozzle is greater than the outer diameter of the first cooling stage.
  • the nozzle is at no other point except its distal end with the first cooling stage in heat-conducting connection, which allows accurate compliance with the desired operating temperature of the cryopump.
  • the nozzle, on which the shield facing side has a flange which serves as a thermal bridge between the nozzle and the shield. This ensures a good heat transfer, due to an enlarged surface of the nozzle, between the nozzle and the shield.
  • the flange is spaced from the second cooling stage.
  • an undesirable cold transfer from the second cooling stage is prevented on the flange and the distance is additionally used as insulation between the flange and the second cooling stage.
  • a gap is provided between the flange and the first cooling stage, so that not even the end face of the first cooling stage, at which temperatures of about 30 K prevail, come into contact with the flange.
  • the desired temperature is advantageously passed directly from the web lossless to the lid and thus also to the baffle and the shield.
  • the nozzle and the flange connected to the nozzle are made of copper has the advantage that copper has excellent heat conduction properties and heat is transferred with low losses. Other materials with similarly good thermal conductivity values as copper would be possible.
  • Another object of the present invention is also a cryopump according to claim 11 with a device described above according to one of claims 1 to 10.
  • the cryopump which receives the inventive cooling head, has the advantage that their dimensions are adapted exactly to the performance of the cooling head.
  • the housing 12 is equipped at its first end with a first flange 13, which forms the inlet opening 15 of the cryopump 11 and with which the cryopump 11 to a recipient, not shown, preferably with the interposition of a valve, connected.
  • a second flange 17 is provided, which surrounds a receiving opening 19.
  • a two-stage cooling head 21 Housed in the housing 12 is a two-stage cooling head 21, which has a first, warmer cooling stage 23 (held at about 30 K) and a second, colder cooling stage 25 (held at about 10 K) axially adjoining the first stage 21.
  • the first cooling stage 23 is attached centrally to a cooling head flange 27, which in turn is connected to the second flange 17.
  • connecting flanges 29 are arranged concentrically on the cooling head flange 27.
  • the connecting flanges 29 are used to connect monitoring instruments, such as pressure and temperature measuring instruments, which monitor the state of the pump during operation.
  • the thermal bridge is preferably made of copper. Between the shield 31 and the end face 55 of the first cooling stage 23 so a gap 34 is formed, which is bridged by the thermal bridge 33.
  • the thermal bridge 33 is not directly connected to the second cooling stage 25 at the transition of the first to the second cooling stage, but a part of the intermediate space 34 remains free in the form of a circular ring.
  • the shield 31 has the shape of a cylinder, on which on the first cooling stage 23 side facing a bottom 35 is provided. On the side facing away from the first cooling stage 23, an opening 37 is provided.
  • an interior 41 is formed.
  • the baffle 37 is supported by the shield 31 and the webs 59 and serves for the freezing of vapors, such.
  • cooling elements 43 which serve as a second pumping surface.
  • the cooling elements have the form of cups of different diameters, which are partially shifted in one another.
  • the cooling elements 43 are connected to the second cooling stage 25 via fixing elements 45 good heat conducting.
  • the bottom 35 of the shield 31 is centrally penetrated by the cooling head 21 in such a way that the first cooling stage outside the interior 41 and the second cooling stage 25 is located in the interior 41.
  • the temperature is determined by the thermal bridge 33, which transmits the temperature of about 30 K prevailing on the end face 55 of the first cooling stage 23 to the bottom 35, the shield 31 and the baffle 39. This results in cryopumps according to the prior art, temperature zones on the bottom 35, which have a temperature of about 30 K.
  • cryopumps During the vacuuming process, gases also enter the interior 41, which condense out at 30 K and do not freeze out.
  • a typical gas with these properties is argon, for example.
  • gases After these gases are present as liquids at the 30 K zones, they also have a corresponding vapor pressure. Since with cryopumps an ultra-high vacuum should be achievable, any slight increase in pressure, which arises for example as a result of the vapor pressure of liquefied gases, has a negative effect on the vacuum to be achieved. This reduced vacuum power, which caused by liquefied gases in the interior 41, is referred to in cryopumps of the prior art as a memory effect.
  • one aspect of the invention is not to cause 30 K zones on the entire shield.
  • the thermal bridge 33 is thermally conductively connected to the temperature zone of the first cooling stage 23, which has a temperature of about 80 K, for example. This temperature is transmitted from the thermal bridge 33 to the floor 35. It is important that the thermal bridge 33 is formed in such a way that it is brought as close as possible to the second cooling stage 25. In the exemplary embodiment, this requirement is solved in that the thermal bridge 33 has the shape of a nozzle 33.
  • a flange 46 is provided, which serves the well heat-conducting connection of the thermal bridge 33 to the bottom 35.
  • a clamping connection in the form of a clamp 47 is provided, which is pressed with two screws to the first cooling stage 23. Also conceivable are other non-destructive detachable connections.
  • a gap 49 is provided between the thermal bridge 33 and the first cooling head.
  • the gap 49 results from the fact that the outer diameter 51 of the first cooling stage 23 is smaller than the inner diameter 53 of the thermal bridge 33.
  • the height of the thermal bridge is dimensioned such that also between the end face 55 of the first cooling stage 23 and the flange 46, a gap 49 is provided.
  • baffle 39 and the lid 57 are brought to the temperature level of the shield.
  • the baffle 39 and the lid 57 also serve to shield the cooling elements 43 from gases and vapors that should freeze at 80K. So that the temperature of the baffle 39 and the lid 57 substantially have the temperature of the thermal bridge 33, they are held by webs 59, which are directly in thermal communication with the thermal bridge 33.
  • the thermal bridge 33 receives the heat for heating the bottom 35 from the first cooling head 23 and not from external heat sources recognizes the skilled person that the overall efficiency of the cryopump improves, although the cooling time of the cryopump must inevitably deteriorate slightly.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Compressors, Vaccum Pumps And Other Relevant Systems (AREA)
  • Structures Of Non-Positive Displacement Pumps (AREA)
EP11722718.1A 2010-05-27 2011-05-25 Kryopumpe mit einer vorrichtung zur verhinderung des memory-effekts Not-in-force EP2577064B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH00833/10A CH703216A1 (de) 2010-05-27 2010-05-27 Vorrichtung zur Verhinderung des Memory-Effekts bei Kryopumpen.
PCT/CH2011/000122 WO2011147042A1 (de) 2010-05-27 2011-05-25 Kryopumpe mit einer vorrichtung zur verhinderung des memory - effekts

Publications (2)

Publication Number Publication Date
EP2577064A1 EP2577064A1 (de) 2013-04-10
EP2577064B1 true EP2577064B1 (de) 2014-03-19

Family

ID=43480880

Family Applications (1)

Application Number Title Priority Date Filing Date
EP11722718.1A Not-in-force EP2577064B1 (de) 2010-05-27 2011-05-25 Kryopumpe mit einer vorrichtung zur verhinderung des memory-effekts

Country Status (6)

Country Link
US (1) US8955339B2 (ru)
EP (1) EP2577064B1 (ru)
BR (1) BR112012029924A2 (ru)
CH (1) CH703216A1 (ru)
RU (1) RU2565477C2 (ru)
WO (1) WO2011147042A1 (ru)

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3131396A (en) * 1960-09-30 1964-04-28 Gen Electric Cryogenic pumping apparatus
CH628959A5 (en) * 1978-04-18 1982-03-31 Balzers Hochvakuum Cryopump with a fitted refrigerating machine
SU769080A1 (ru) * 1978-07-31 1980-10-07 Предприятие П/Я В-8851 Криогенный вакуумный насос
EP0155700B1 (en) * 1984-03-22 1990-01-31 Nippon Telegraph And Telephone Corporation Apparatus for quantitative secondary ion mass spectrometry
SU1250707A1 (ru) * 1985-03-15 1986-08-15 Организация П/Я М-5273 Криогенный насос
DE3512614A1 (de) * 1985-04-06 1986-10-16 Leybold-Heraeus GmbH, 5000 Köln Verfahren zur inbetriebnahme und/oder regenerierung einer kryopumpe und fuer dieses verfahren geeignete kryopumpe
SU1698481A1 (ru) * 1987-12-17 1991-12-15 Институт Аналитического Приборостроения Научно-Технического Объединения Ан Ссср Криогенный адсорбционный насос
US4873833A (en) * 1988-11-23 1989-10-17 American Telephone Telegraph Company, At&T Bell Laboratories Apparatus comprising a high-vacuum chamber
EP0384922B1 (de) * 1989-02-28 1993-07-14 Leybold Aktiengesellschaft Mit einem zweistufigen Refrigerator betriebene Kryopumpe
GB2234988B (en) * 1989-08-16 1993-12-08 Qpl Limited Improvements in vacuum deposition machines
JP2574586B2 (ja) * 1990-11-19 1997-01-22 ライボルト アクチエンゲゼルシヤフト クライオポンプを再生する方法及びこの方法を実施するのに適したクライオポンプ
US5231840A (en) * 1991-03-28 1993-08-03 Daikin Industries, Ltd. Cryopump
US5537833A (en) * 1995-05-02 1996-07-23 Helix Technology Corporation Shielded cryogenic trap
DE19632123A1 (de) * 1996-08-09 1998-02-12 Leybold Vakuum Gmbh Kryopumpe
US6122920A (en) * 1998-12-22 2000-09-26 The United States Of America As Represented By The United States Department Of Energy High specific surface area aerogel cryoadsorber for vacuum pumping applications
DE10331201A1 (de) * 2003-07-10 2005-01-27 Leybold Vakuum Gmbh Kryopumpe
US7594406B2 (en) * 2004-08-25 2009-09-29 Ulvac Cryogenics, Inc. Regenerator and cryogenics pump
US8291717B2 (en) * 2008-05-02 2012-10-23 Massachusetts Institute Of Technology Cryogenic vacuum break thermal coupler with cross-axial actuation
JP5184995B2 (ja) * 2008-07-04 2013-04-17 住友重機械工業株式会社 クライオポンプ
JP4843067B2 (ja) * 2009-04-08 2011-12-21 住友重機械工業株式会社 パルスチューブ冷凍機

Also Published As

Publication number Publication date
WO2011147042A1 (de) 2011-12-01
RU2565477C2 (ru) 2015-10-20
RU2012157281A (ru) 2014-07-10
CH703216A1 (de) 2011-11-30
BR112012029924A2 (pt) 2019-09-24
US20130104571A1 (en) 2013-05-02
EP2577064A1 (de) 2013-04-10
US8955339B2 (en) 2015-02-17

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