EP2553733A2 - Cellules solaires et procédé de fabrication de celles-ci - Google Patents
Cellules solaires et procédé de fabrication de celles-ciInfo
- Publication number
- EP2553733A2 EP2553733A2 EP11712182A EP11712182A EP2553733A2 EP 2553733 A2 EP2553733 A2 EP 2553733A2 EP 11712182 A EP11712182 A EP 11712182A EP 11712182 A EP11712182 A EP 11712182A EP 2553733 A2 EP2553733 A2 EP 2553733A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- conductor
- solar cell
- busbar
- conductive
- conductors
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 20
- 239000004020 conductor Substances 0.000 claims abstract description 350
- 239000003792 electrolyte Substances 0.000 claims abstract description 62
- 238000000034 method Methods 0.000 claims abstract description 57
- 238000000151 deposition Methods 0.000 claims abstract description 31
- 238000007750 plasma spraying Methods 0.000 claims abstract description 13
- 239000010410 layer Substances 0.000 claims description 86
- 238000000576 coating method Methods 0.000 claims description 62
- 239000011248 coating agent Substances 0.000 claims description 50
- 238000009713 electroplating Methods 0.000 claims description 42
- 239000000463 material Substances 0.000 claims description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 16
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 16
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 12
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 12
- 229910052802 copper Inorganic materials 0.000 claims description 12
- 239000010949 copper Substances 0.000 claims description 12
- 229910052709 silver Inorganic materials 0.000 claims description 12
- 239000004332 silver Substances 0.000 claims description 12
- 238000005246 galvanizing Methods 0.000 claims description 9
- 239000004065 semiconductor Substances 0.000 claims description 9
- 229910052710 silicon Inorganic materials 0.000 claims description 9
- 239000010703 silicon Substances 0.000 claims description 9
- 229910001092 metal group alloy Inorganic materials 0.000 claims description 8
- 150000002739 metals Chemical class 0.000 claims description 8
- 239000006228 supernatant Substances 0.000 claims description 8
- 238000007639 printing Methods 0.000 claims description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- 238000003825 pressing Methods 0.000 claims description 6
- 239000011247 coating layer Substances 0.000 claims description 5
- 239000002245 particle Substances 0.000 claims description 5
- 229930195733 hydrocarbon Natural products 0.000 claims description 4
- 150000002430 hydrocarbons Chemical class 0.000 claims description 4
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 239000000969 carrier Substances 0.000 claims description 3
- 239000012530 fluid Substances 0.000 claims description 3
- 238000012545 processing Methods 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 239000012799 electrically-conductive coating Substances 0.000 claims description 2
- 238000009795 derivation Methods 0.000 claims 2
- 238000007654 immersion Methods 0.000 claims 1
- 238000005253 cladding Methods 0.000 abstract 4
- 210000004027 cell Anatomy 0.000 description 280
- 230000008021 deposition Effects 0.000 description 18
- 230000008569 process Effects 0.000 description 18
- 235000012431 wafers Nutrition 0.000 description 15
- 238000007747 plating Methods 0.000 description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 8
- 238000005476 soldering Methods 0.000 description 8
- 239000007789 gas Substances 0.000 description 7
- 238000001465 metallisation Methods 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 230000008901 benefit Effects 0.000 description 6
- 238000013461 design Methods 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 238000010304 firing Methods 0.000 description 4
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 3
- 241000196324 Embryophyta Species 0.000 description 3
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 3
- 239000002826 coolant Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 230000035882 stress Effects 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 210000003850 cellular structure Anatomy 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000012777 electrically insulating material Substances 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 238000011068 loading method Methods 0.000 description 2
- 230000005499 meniscus Effects 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 230000000284 resting effect Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- XMWRBQBLMFGWIX-UHFFFAOYSA-N C60 fullerene Chemical class C12=C3C(C4=C56)=C7C8=C5C5=C9C%10=C6C6=C4C1=C1C4=C6C6=C%10C%10=C9C9=C%11C5=C8C5=C8C7=C3C3=C7C2=C1C1=C2C4=C6C4=C%10C6=C9C9=C%11C5=C5C8=C3C3=C7C1=C1C2=C4C6=C2C9=C5C3=C12 XMWRBQBLMFGWIX-UHFFFAOYSA-N 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 241000530268 Lycaena heteronea Species 0.000 description 1
- 241001632422 Radiola linoides Species 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011530 conductive current collector Substances 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 229910003472 fullerene Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 239000002071 nanotube Substances 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 230000006911 nucleation Effects 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000009718 spray deposition Methods 0.000 description 1
- 238000005382 thermal cycling Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/028—Electroplating of selected surface areas one side electroplating, e.g. substrate conveyed in a bath with inhibited background plating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
- H01L31/0508—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module the interconnection means having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/052—Cooling means directly associated or integrated with the PV cell, e.g. integrated Peltier elements for active cooling or heat sinks directly associated with the PV cells
- H01L31/0521—Cooling means directly associated or integrated with the PV cell, e.g. integrated Peltier elements for active cooling or heat sinks directly associated with the PV cells using a gaseous or a liquid coolant, e.g. air flow ventilation, water circulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
- H01L31/188—Apparatus specially adapted for automatic interconnection of solar cells in a module
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- the present invention relates to solar cells in which at least one conductor is mechanically and electrically conductively connected to the solar cell and / or other conductors, by a conductive coating, wherein the conductive coating is preferably electrolytically or galvanically deposited from a solution or produced by plasma spraying. Furthermore, the invention is directed to a method for connecting solar cells with at least one conductor and / or conductors to solar cells with each other, wherein at least one electrically conductive conductor by the deposition of a conductive coating of solution on the solar cell and / or on at least one another conductor is mechanically and electrically connected.
- the invention also relates to a device for depositing a mechanically connecting and electrically conductive coating from solution onto solar cells in electrolytic cells, comprising means for accommodating at least one conductor, preferably bus bar conductor, in the electrolyte of the electrolytic cell at the surface to be deposited, preferably a seed layer of the solar cell at least partially preferably electrically abutting contact and preferably at the same time is the carrier of the solar cell.
- a conductor preferably bus bar conductor
- Solar cells made of semiconductor materials, in particular of silicon are produced in several steps.
- the solar side of the solar cells also called the front side
- electrically conductive current collectors which usually consists of an electrically conductive grid structure, the so-called front contacts.
- rear contacts usually, a plurality of metallic conductors with a very small cross-section, hereinafter referred to as contact fingers, runs parallel over the contact side of the solar cell.
- contact fingers intersect electrically connecting and usually at right angles so-called bus bars, in particular bus bars, ie long contact-type bus bars for discharging the current supplied by many contact fingers and generated by the solar cell to the load. Because the short-circuit current of a solar cell, for example, with the usual dimensions of 156 x 156 mm 2 to more than 12 amps
- CONFIRMATION COPY can, the busbars compared to the contact fingers have a much larger cross-section. This is achieved by a broad and thus shadowing construction, usually with a width of 2 mm.
- metallic ribbon as busbar (s) contact surface soldered This results in a not insignificant shading surface on the solar cell, which reduces the efficiency of the solar cell. In a conventional solar cell shading by front contacts is about 7% of the geometric area. Therefore, attempts are made in various ways to reduce this shadowing.
- DE 10 2008 030 262 A1 describes that a solar cell is initially completed only with the contact fingers and short hunt groups, ie without contact-type busbars, and then the short hunt groups are electrically conductively connected by means of lead wires of different lengths and thicknesses of different thicknesses to an external terminal become.
- the connection device is connected according to a specific scheme with the contact fingers or short hunt groups that results in a minimal shadowing.
- DE 10 2005 039 100 A1 discloses a galvanizing device for metallizing the grid structure of fracture-sensitive solar cells.
- a frame is used that can accommodate several solar cells and transport them through a continuous flow system.
- the frame is equipped with seals so that the backs of the solar cells are not wetted with electrolyte.
- At protrusions contacts are arranged, which direct the Galvanisierstrom directly to the surface to be metallized. Since the contacts as well as the electroplated to be metallized in the electrolyte, they must be cleaned at intervals or stripped free.
- DE 10 2005 038 450 A1 relates to a further contact production method for solar cells in a continuous-flow system.
- the electrical contacting takes place outside the electrolyte on the dry and non-to-be-plated back of the solar cell, which is the top side here.
- intensive illumination of the solar side of the solar cell takes place during the galvanizing.
- a solar cell in which at least one conductor is mechanically and electrically conductively connected to the solar cell and / or further conductors by a conductive coating.
- the conductive coating which mechanically and electrically conductively interconnects the conductor and solar cell or conductor on the solar cell is preferably the result of an electrolytic, i. Galvanic (electroconductive) or electrochemical (electroless) deposition from solution or formed by plasma spraying the conductor.
- an arc between the anode and cathode is usually generated by a DC voltage, which passes through the plasma torch flowing gas or gas mixture through the arc and thereby ionized.
- the ionization generates a highly heated (up to 20000 K) electrically conductive gas of positive ions and
- Electrons In this Plasmajet produced powder (usual particle size distribution: 5- 120 ⁇ , in certain devices is also a grain size of down to 100 nm possible) injected, which is melted by the high plasma temperature.
- the plasma stream entrains the powder particles and hurls them at the workpiece to be coated, here solar cell and conductor.
- the gas molecules return to a stable state after only a short time and so the plasma temperature drops again after a short distance.
- the plasma coating is carried out in normal atmosphere, inert atmosphere (under inert gas such as argon), in vacuum or under water.
- the Speed temperature and the composition of the plasma gas of importance.
- the mechanical and electrically conductive connection of the conductor to the solar cell or conductors to one another is characterized in that in the deposition of the coating conductor / solar cell and / or conductor / conductor and / or solar cell / solar cell in contact or at such a small distance from each other are arranged that during the electrolytic or plasma deposition of the conductive precipitate, that is, the conductive coating, the mechanically and electrically conductively connects respective components.
- This joint deposition by co-deposition occurs precisely where the conductor and the solar cell or the two conductors are electrically conductive and in contact or alternatively in a small spatial proximity. The method is therefore particularly well suited for both small-area and large-area connections.
- the components can be partially surface-insulated to avoid the mechanical connection and of a conductive coating
- the conductive coating there is the possibility of precise conductive surface design of non-conductive materials such as silicon wafers with a conductive seed layer.
- the compound formed by the conductive coating also has the advantage that the conductive coating is uniform in composition, thickness and expansion, whereby the conductive properties as well as the mechanical strength are uniform and controllable.
- the light-induced or laser-induced electroplating is used.
- the deposition in the area provided for this purpose is controlled by local temperature increase and / or light-induced chemical excitation.
- seed layers and also insulation prints can be partially or completely replaced.
- the laser can be moved along the area to be galvanized (conductor / solar cell) and thus activate a deposition with pinpoint accuracy.
- the term conductor in connection with solar cells generally means any form of electrically conductive connection which dissipates the electricity produced by the solar cell to the consumer. Usual conductors are wires and printed, soldered or surface-mounted on the solar cell printed circuit traces.
- the solar cell according to the invention relates to those solar cells in which the conductor is selected from among
- contact fingers preferably contact fingers, busbars, preferably busbars, more preferably ladder busbars (to be discussed below) and solar cell connection conductors.
- These conductors can tap as a contact finger, the current at the solar cell, directly or preferably via bus bars or Forward busbars / conductor busbars to the consumer, while the connecting conductors electrically connect individual solar cells together.
- the conductors such as contact fingers, bus bars, preferably busbars, more preferably ladder busbar and / or solar cell connection conductors, preferably all these connection conductors are designed as conductor wires. That is not necessary.
- contact-type conductors can also be provided with further conductors, in particular wire conductors, by electrolytic deposition or plasma spraying of conductive conductors Coverings are connected.
- Contact paths with the solar cell can be connected, for example, by depositing conductive coatings with wire conductors (vertical connection, one above the other) or by applying an electrically conductive seed layer on the solar cell between two contact-surface wire conductors (horizontal connection, adjacent) electrolytically or by plasma spraying.
- solar cells and conductors or conductors and conductors can be connected in a mechanically and electrically conductive manner by superimposing (vertically) and depositing / spraying on the conductive coating or even horizontally adjacent conductors.
- Particularly preferred is the vertical, ie superposed connection of solar cell with conductor (s) and / or conductors with each other by means of conductive coatings.
- a distinction must be made between the already customary galvanic contact-type production of contact fingers or busbars and the connection according to the invention of two existing components such as conductor / solar cell or conductor / conductor through a common and electrolytically deposited or plasma sprayed coating according to the invention.
- the solar cell according to the invention is suitable for any geometric shape, size and technology of solar cells, in particular for crystalline and
- Thin-film solar cells preferably those based on semiconductor materials such as silicon and gallium arsenide.
- solar cells can be prepared on an organic basis according to the invention.
- the present invention also generally relates to a solar cell, preferably of semiconductor material, particularly preferably based on silicon or gallium arsenide, with front and / or rear contacts for discharging the generated current with many contact fingers and with at least one busbar the at least one bus bar is designed as a conductor busbar whose conductor is mechanically and electrically conductively connected to the contact fingers.
- the bus bar conductor is a conductor other than the deposition coating described above, preferably a conductive solid such as a metal wire or a (preferably flexible) conductor plate with a conductor usually made of metal (particularly suitable for back contact cells), the conductor being co-located with the deposited one conductive coating generally forms the conductive conductor busbar and the coating also ensures the desired mechanical and electrically conductive contact to the solar cell and / or other conductors.
- the busbar is the electrodeposited mass itself (a conductive substance component); in the case of a conductor busbar, it consists of at least two components, a pure conductor, eg metal wire and a contact material such as the galvanization coating, electrochemical coating, plasma spray coating or Solders.
- the front contacts are solar side, ie the contact fingers and / or the conductor busbar are arranged on the sun side.
- the conductor busbar according to the invention is a non-contact-surface design of a busbar which, in the
- busbars preferably as a wire-shaped conductor, that is designed wire-shaped conductor bus bar.
- the novel ladder busbars consist of a non-insulated electrical conductor.
- This conductor is preferably electrically conductively connected to the start layer or seed layer of the grid structure of the solar cell.
- This compound is preferably carried out by the advantageous galvanic, electrochemical or plasma spray deposition methods already described above.
- this ladder-busbar solar cell also has the possibility of conventional embedded in the electrically conductive paste applied by printing process with subsequent firing or firing.
- the electroplating of the conductors, for example, to the electrically conductive seed layer of the solar cell is technically easier to implement and less expensive.
- the invention accordingly relates to a solar cell with a conductor busbar, in which at least one conductor busbar is mechanically and electrically conductively connected to the solar cell by a galvanization coating, in which the busbar conductor is preferably configured as a wire.
- the invention relates to an o.g. Solar cell, wherein at least one busbar seed layer, which is electrically conductively connected to a contact finger seed layer, has a mechanical (preferably solid) and electrically conductive connection with at least one conductor busbar, this connection of busbar seed layer and busbar preferably by (i) electroplating or (ii) embedding and baking in a conductive paste.
- the conductive coating of the solar cell according to the invention is made of electrolytic, i. Electrochemically or galvanically selected from solution or by plasma spraying coatings.
- the conductive coating for the solar cells according to the invention preferably consists of conductive metals or metal alloys, preferably metals and metal alloys based on copper, silver, nickel and / or tin, conductive hydrocarbons and / or carbons, for example nanotubes and fullerenes.
- the conductive coating used according to the invention may preferably consist of one or more identical or different coating layers, preferably of different conductive materials.
- a layer of nickel or other conductive coating compatible with the base material may be deposited first to avoid direct contact of the solar cell with copper, and then copper or a cheaper conductive one Coating, which produces the desired compound of the solar cell components in volume, are deposited to a good connection with the conductor, eg
- Coating layer are deposited against the oxidation of the copper.
- each layer is applied with separate devices.
- An embodiment of the solar cell according to the invention with a conductor, preferably bus bar or conductor bus bar, which protrudes in its length at least on one side over the surface of the solar cell, has the further advantage that the outstanding free conductor end to the solar cell remaining later to the electrical interconnection of the individual solar cells usual solar cell assemblies / modules can be used. That according to the state of
- the at least one conductor preferably a bus bar, more preferably a conductor bus bar, preferably for the electrical connection of the solar cell, protrude over at least one side of the solar cell over the surface thereof as a conductor supernatant.
- the inventive preferably wire-shaped conductor of the busbar is freely selectable in shape and in cross section.
- the cross-sectional shape of the busbar conductor may preferably be round, oval, or polygonal, preferably with a conductor cross-section (preferably, depending on the area of the solar cell and the material of the conductor) of 0.0002 mm 2 to 10 mm 2 , preferably 0.001 mm 2 to 1 mm 2 , more preferably with a conductor cross section of 0.02 mm 2 to 10 mm 2 , preferably 0.1 mm 2 to 1 mm 2 , and wherein the busbar conductor is preferably flexible deformable.
- the busbar conductor can be made larger and therefore lower-impedance than the usual printed ones and / or galvanized busbars.
- a round copper wire with the diameter of eg 0.4 mm has a much lower line resistance than eg a 2 mm wide busbar consisting of a silver conductive paste, which is also more expensive than the copper wire.
- Solar cell of the conductor preferably bus or busbar conductor by a (naturally reliable) electrical contact of the conductor, preferably
- the seed layer is usually a thin electrically conductive layer on the solar cell, which preferably consists of an electrically conductive paste printing or of sprayed, electrically conductive particles, conductive ink or a conductive (eg a region of the TCO (transparent conductive oxide) layer) or nucleating Area on the solar cell exists.
- Non-conductive seed layers having a nucleating function for example of palladium, titanium, titanium / tungsten, etc., are also suitable for activating the surface of solar cells and conductors prior to deposition.
- the nucleation causes the preferential deposition of the conductive coating at the thus activated sites, so that over the seed seed layers full surface conductive seed layers are formed at which conductors / solar cells / other solar cell components can be electrically connected by means of the deposition of conductive coatings.
- one or more conductors of the solar cell can be embodied as a thin electrically conductive tube.
- a liquid or gaseous cooling medium can be promoted, which is a cooling of the / the electrical conductor (s), preferably of the / the bus bar (s), more preferably the / the conductor bus bar (s) and the entire environment in one Solar cell or solar module offers.
- At least one of the conductors preferably a busbar conductor, more preferably a busbar conductor of the solar cell according to the invention, is designed to be tubular for the passage of a cooling medium.
- the conductor in the simplest embodiment is a stretched bare wire, e.g. made of or based on copper or silver.
- Copper core with a copper diffusion barrier layer such as nickel or tin. With lower conductivity requirements, iron-nickel alloys can also be used.
- the conductor can also, as described, be carried out wavy, to compensate for larger temperature differences, the mechanical stresses between the silicon and the metal.
- the conductor can also be made by other means, for. B. by punching, etching and cutting from corresponding semi-finished products such. B. sheets. This allows particularly versatile designs of the forms with respect to the compensation of temperature differences. For stretched conductors with a larger cross section, alloys whose thermal expansion coefficient is adapted to those of silicon or to the semiconductor material are also suitable. An example of this is that available under the trade name Kovar
- the electrical conductance is considerably lower than that of z. B. copper.
- the at least one conductor of the solar cell, in particular the bus bar or busbar conductor of a solar cell according to the invention (elongated) is stretched, meandering, triangular or sinusoidal, wherein the mold is preferably formed by a wire, stamped part, etched part or cut part ,
- the material of the conductor is reduced in its strength by soft annealing, so that the conductor can better adapt to the thermomechanical loads of the solar cell.
- the solar cell according to the invention is preferably made of semiconductor material or thin-film material, more preferably based on silicon or gallium arsenide or other semiconductors, wherein the thermal expansion coefficient of the conductor, preferably Busbar conductor or adapted, for example, by an alloy or physical processing to the thermal expansion coefficient of the solar cell wafer.
- the electrolytic deposition time, in particular the plating time in the solar cell according to the invention can be significantly reduced, because the conductor, preferably busbar or busbar conductor only with a small layer thickness, for example, the seed layer on the solar cell is to galvanize.
- Previously used galvanized busbars have layer thicknesses of 20 ⁇ and more.
- conductor busbars with a layer thickness of, for example, 5 ⁇ are sufficient.
- the layer thickness at the thin contact fingers is larger because of the local field line concentration with their larger current density than the 5 ⁇ in the region of a busbar, eg 10 ⁇ .
- the conductor according to the invention as a busbar has a further very great advantage if it protrudes in its length at least on one side over the surface of the solar cell.
- This at least one free conductor end per busbar, remaining at the solar cell, can later be used for the electrical connection of the individual solar cells to conventional solar modules.
- the required prior art soldering of metallic tape for these electrical connections is completely eliminated. This is not only a cost reduction, but it also eliminates the risk of breakage of individual solar cells in otherwise required soldering the connection ribbon.
- the solar cell connection conductors extend at least over 50%, preferably 60%, more preferably 70%, most preferably 80% of one dimension, ie length or width of the solar cell, preferably in the direction of current flow.
- Another advantage of producing a conductive coating by plating is that the contacts to the power source used for electroplating do not become galvanized and therefore do not need to be periodically cleaned or even replaced.
- the present invention relates to a method for connecting solar cells with at least one conductor and / or conductors to each other with solar cells, in which at least one electrically conductive conductor by depositing a conductive coating of solution on the solar cell and / or on at least another conductor is mechanically and electrically connected.
- the conductive coating is selected from coatings produced electrolytically, galvanically or by plasma spraying. It is further preferred that the conductive coating is selected from conductive metals or metal alloys, preferably metals and metal alloys based on copper, silver, nickel and / or tin, aluminum, conductive hydrocarbons and / or carbons.
- the conductive coating preferably consists of one or more coating layers, preferably of different conductive materials.
- the conductor is selected from the group consisting of contact fingers, bus bars, conductor busbars and solar cell connection conductors.
- the invention relates to a
- At least one electrically conductive conductor preferably a busbar or busbar conductor, for supplying the electroplating current so as to at least partially electrically contact the surface of the solar cell to be electroplated. Bend rests that this conductor is permanently mechanically and electrically connected by electroplating with the solar cell.
- the at least one conductor preferably busbar or busbar conductor, extends to transducers or carriers extending beyond the length of the solar cell during electroplating of the solar cell Carry in the electrolytic cell and preferably position in the altitude and preferably transport that only the underside of the solar cell to be plated is in the electrolyte.
- the at least one conductor preferably a collecting or busbar conductor, is preferably provided on one side of the solar cell and by means of an abutment (s)
- the inventive method are particularly efficient and therefore preferably carried out in continuous systems, dip baths or Cup Platern so that the at the solar cell angalvanis elected or electrochemically or by plasma spraying deposited conductors, preferably collector or busbar conductor, remain on this and without subsequent demetallization for further Processing of the finished solar cell can be used.
- the method according to the invention is used to connect conductors such as contact fingers, busbars and / or busbars to the solar cell or to one another.
- the process is suitable for the production of solar cells, preferably the abovementioned solar cells according to the invention.
- the coating deposition method according to the invention is fundamentally suitable for mechanically and electrically conductively connecting any form of electrical conductor, in particular in the form of wires and printed conductors, as a substrate by means of a conductive coating to an electrically conductive or electrically conductive material.
- the present invention relates
- An additional preferred embodiment is directed to solar cells according to the invention and processes for their production in which the solar cells are designed and / or manufactured without bus bar conductors and also without contact fingers, and the wires to be connected by conductive coating to deposition-active areas of the solar cells Solar cell, such as seed layers, seed layers are.
- An additional preferred embodiment is directed to solar cells according to the invention and processes for their production, in which the solar cells are preferably designed and / or manufactured without bus bar conductors and also without contact fingers, and the current is dissipated through many small conductive coatings the solar cell and / or interconnected - wires takes place.
- the total conductor cross-section can be distributed over many wires and thus the ohmic losses are minimized.
- the solar cell can be completely dispensed busbars and fingers.
- the deposition-active areas during the electroplating, electrochemical and plasma spraying processes may be part of or an entire cell side of the solar cell.
- the deposition-active region can also comprise both polarities of the solar cell on one side, in particular solar cells with both polarities on one side, in which one wire serves one polarity, but in the deposition of the conductive coating both polarities are simultaneously amplified.
- the wires of the solar cell does not have to be continuously conductive: such as a printed circuit board with leads, as an insulating core, which is rendered partially conductive (eg by metallization).
- the inventive method can be used not only for the mechanical and electrically conductive connection of solar cells and conductors with each other, but also for the mechanical and electrically conductive connection of solar cells and / or conductors with special elements such as non-solar active components with bypass, protection and / or connection function become.
- solar cells can also be connected directly to other solar cells by means of the conductive coating according to the invention, if they can be brought so close in space that a conductive compound can be formed by depositing the coating.
- the present invention is directed to an apparatus for electroplating solar cells in electrolytic cells, comprising means for accommodating at least one conductor, preferably bus bar conductor, in the electrolyte of the electrolytic cell at the surface to be plated, preferably a seed layer Solar cell at least partially, preferably electrically abutting contact and preferably at the same time carrier of the solar cell, wherein the conductor projections for connecting the Galvano Eisenrichters preferably extend beyond the level of the electrolyte.
- such devices include transducers as means for
- the device according to the invention also comprises means which exert an attractive or pressing force between the conductor and the solar cell, with or without abutments, preferably as pressing pressure, weight force, dynamic pressure, magnetic force, spring force or suction.
- the device according to the invention comprises means for positioning the solar cell in a working container such that the level of the electrolyte only reaches as far as the underside of the solar cell.
- the inventive method is suitable for the electrolytic and plasma spray treatment of solar cells on the sunny side or the front, the back or both sides.
- the to be treated are suitable for the electrolytic and plasma spray treatment of solar cells on the sunny side or the front, the back or both sides.
- the untreated sides pointing upwards preferably remain dry.
- the electrical contacting takes place in the electrolyte directly on the structured and usually provided with an electrically conductive seed layer surface.
- the cathodic contact means are also galvanically metallized, which are located within the electrolytic cell in the electrolyte. This metallization is used according to the invention, whereby the otherwise usual demetallization completely eliminated.
- the contact means according to the invention consists of at least one preferably wire-shaped, non-insulated electrical conductor.
- the solar cells to be coated by electroplating are placed on the at least one preferably (preferably long) elongated conductor during the charging of the electroplating plant.
- the positioning takes place in such a way that the course of the conductor or conductors provided, preferably collecting or busbars of the solar cell, coincides with the wire-shaped contact means.
- the solar cell thus rests on the preferably two (long) elongated conductors.
- These conductors are located on an electrically insulated support or a pick-up, which positions the solar cells lying on the ladders in the vertical position so that only the conductors and the surface to be treated, preferably the front of the solar cell are below the level of the electrolyte.
- the carrier or pickup can also be used to transport the solar cell through the continuous system.
- the carrier is preferably an integral part of this cup.
- the preferably projecting beyond the edges of the solar cell conductor ends are deflected upward, whereby they protrude above the level of the electrolyte as a conductor projections. They thus remain dry and can not be metallized in this area.
- the conductors along the collecting or busbars provided on the solar cells are, according to the invention, galvanized onto the preferably present seed layer. So they are mechanically fixed and electrically connected to each other. They form together with the preferably projecting conductor ends a permanent unit. Thus, no Entmetallmaschine the contact means is required.
- the projecting conductor ends or conductor projections can later advantageously be used for the electrical connection of the solar cells to the solar modules. The previously required soldering of connecting conductors or reinforcing conductors is completely eliminated in the inventive method. Because the fracture-sensitive solar cells in the inventive
- Plating on the ladders galvanically grow on these conductors, they can very safely and gently, i. be transported through a continuous system without breakage.
- the direct electrical contacting of the surface of the grid structure to be plated also does not require the illumination of the known LIP method (light-induced galvanization) by means of intense light sources in the electrolyte in order to make the solar cells for the galvanizing current low-resistance. This saves considerable energy in the production of solar cells according to the invention.
- bus bars and busbars preferably ladder busbars, can be used in the
- the galvanic method according to the invention also allows a shorter exposure time in comparison to a previously usual complete galvanization of the front contacts.
- a layer thickness of about 5 ⁇ is required for the inventive mechanical and electrical connection of conductors as a bus bar or busbar with the preferred seed layer. This is about 20% of the layer thickness of the known galvanic methods. The exposure time is correspondingly shorter.
- FIG. 1 shows in the upper part of a conventional solar cell 1 with a view of the front (sun) side.
- the current collecting contact fingers 2 of the grid structure extend across the entire solar cell 1. They consist of electrically conductive material, eg. As printed silver conductive paste or electrodeposited silver.
- the contact fingers 2 are electrically connected to the recognizable wider busbars 3. These are usually made at the same time as well as the contact fingers 2.
- the contact fingers 2 are usually about 0.15 mm wide. Their height is production-dependent.
- the height is approx. 5 to 25 ⁇ m.
- the height of the hotmelt process reaches up to 40 pm.
- the still less common plating of the grid structure allows the adjustment of the height also in these orders of magnitude.
- the specific conductivity of electrodeposited layers is very high.
- FIG. 1 shows an enlargement in the region of the busbar 3 in cross-section A-B.
- the doped layers on the wafer 4 for forming the solar cell 1 are not shown in this figure.
- the busbar 3 usually has an uneven surface.
- the width b 1 is for example 2 mm.
- the height h 1 corresponds approximately to the height of the contact fingers 2.
- the cross section is approximately 0.06 mm 2 . If at each end of the two busbars the generated power is halfway out, then for a current at the maximum power point of the 7-ampere solar cell, the current density at the ends of the busbars is about 30 A per mm 2 .
- FIG. 2 shows an exemplary embodiment of a solar cell 1 according to the invention.
- the scales of the lower parts of FIGS. 1 and 2 are chosen to be different in size, which would have to be taken into account when comparing the two figures.
- the cut-out wafer 4 carries an electrically conductive seed layer 5 of the layout of the grid structure, i. the contact fingers 2 and the areas used for the busbars according to the invention, i. the conductor busbars 9 are provided.
- This seed layer 5 consists e.g. from a thin electrically conductive paste printing or sprayed on electrically conductive particles or conductive ink.
- the dimension b 2 again indicates the width of the seed layer 5 or the busbar seed layer (5) and the electroplating layer (7) or the conductive paste layer in the region of a busbar, which is substantially smaller than the width b 1 in the prior art.
- the seed layer 5 must be switched cathodically for electroplating.
- the electrode 6 it is very advantageous to use the electrode 6 to be electroplated itself, e.g. made of copper. It lies completely or partially along the busbar route on the seed layer 5.
- the metal to be deposited e.g. Copper or silver, when electroplating from the cathodic conductor 6 to the seed layer 5 and in the presence of at least one initial contact point of the conductor 6 at the seed layer 5 of this also to the conductor 6.
- the cross section of the conductor 6 in shape and size as a conductor busbar 9 can be selected within wide limits. Nevertheless, the shading remains small in the case of vertical solar irradiation on the solar cell in comparison to the prior art. This is only if the measure b 2 and the diameter of a round conductor 6 are selected, for example, with 0.5 mm. The dimension b 2 of the electroplating layer 7 can be selected even smaller. It is determined only by the achievable accuracy of the positioning or placement of the seed layer 5 of the wafer 4 on the conductor 6 at the loading of the system.
- the conductor 6 does not rest against the seed layer 5.
- the slight gap is filled with metal during electroplating. This filling is supported by a well scattering electrolyte.
- the aim of the plant of the conductor 6 at the seed layer 5 from the beginning to achieve an even larger cross-section of the current transition.
- the round cross section of the conductor 6 is advantageous. It can be processed and processed cost-effectively, for example bending. Other forms of cross-section, for example, oval or polygonal and in the longitudinal extent without and with waveform are also possible.
- its cross section may be, for example, in the range of 0.02 mm 2 to 10 mm 2 .
- the conductor 6 can preferably be flattened in order to adapt it to the currently practiced electrical interconnection to solar modules by means of thin strips.
- the conductor supernatant 8 according to the invention assumes the function of the necessary according to the prior art Leitb. Via this conductor 6 or conductor projections 8, the cathodic galvanizing current is very advantageously introduced in the electrolytic metallization of the solar cells. Because, in one embodiment, the rear side of the solar cell, not shown in FIG. 2, is not intended to come into contact with the electrolyte during electroplating, this electroplating process takes place upside down, as shown below in this figure.
- the conductor 6 can be designed as a thin electrically conductive tube.
- a liquid or gaseous cooling medium can be promoted, which causes cooling of the electrical conductors, namely the busbars and the entire environment in a sealed solar module and thus contributes to increasing the efficiency of the solar cell and the solar module, without increasing the shading.
- FIG. 3 shows a working container 10 with at least one anode 11, which is located in the electrolyte 12.
- This may be a dip bath or a continuous flow system.
- the solar cell 1 is galvanized. Their underside to be electroplated is in the structured seed layer 5 in the electrolyte 12. The upper surface, which is above the level 13, is free in this embodiment of electrolyte, which could otherwise chemically attack and damage this side of the solar cell. She stays dry.
- the solar cell 1 is supported by at least one rectilinear, preferably slightly tensioned conductor 6 and positioned in height in the electrolyte 12 so that the top remains dry. This requires a precise transport of the solar cell 1 by the system partially shown here, in particular with respect to the altitude.
- the back sides of the substrates 1 which are not to be electroplated can or should be wetted with electrolyte, these can also be arranged completely below the level 13 by means of a corresponding height position of the conductors 6.
- the conductor 6 has a round cross-section in the example of FIG. Other cross sections, z. B. oval or polygonal, are also possible.
- the solar cell 1 or its seed layer 5 rests as possible on the entire length of the conductor 6, this must be stretched, i. be at least slightly tensioned.
- the required pickups for the conductors 6 are not shown in FIG.
- the conductor 6 is deflected upward by the sensors and led out of the electrolyte 12.
- a mechanically mechanically stable conductor as a stamped part, etched part, cut part or the like can also be carried in a preformed manner by a pickup.
- the at least one free end of the conductor projection 8 protrudes beyond the level 13 of the electrolyte 12. There it can, without being galvanized, be electrically connected to the Galvano rectifier.
- the conductor 6 as a contact means according to the invention is electroplated in the electrolyte 12 and outside the electrolyte 12, it is not metallized. This avoids very advantageous demetallization of the contact means.
- the conductor 6 acts as a conductor bus bar 9. It remains as well as the conductor projections 8 on the finished solar cell 1.
- the sensors are made of an electrically insulating material, so that these surfaces are not metallized, even if they are the bare cathodic conductor 6 in the electrolyte record and redirect.
- the transducers are transported on a carrier or conveyor through the conveyor system. They are designed so that a free space 14 remains on top of the solar cell 1, which, as will be shown, can be used to support the electroplating of the solar cell 1.
- FIG. 2 shows the top view of a corner of a solar cell 1.
- the rectilinear round conductor 6 carries the solar cell 1, wherein also here the sensors are not shown. In the region of the transducer, the conductor supernatant 8 is formed.
- FIG. 4 shows an example of a device according to the invention in a continuous-flow system, wherein the conductors 6 are arranged stretched or not tensioned on a receiver 15. Above is the side view and shown below the top view in section A - B.
- the pickup 15 are here U-shaped formed so that the space 14 is formed over the solar cell 1.
- the free space 14 allows, inter alia, the loading and unloading of the conveyor 19 with the solar substrates 1.
- the conductor 6 is bent in this embodiment, over the legs of the transducer 15 and deflected upwards.
- the conductor 6 is clamped by two terminals 16 to the transducer 15 and thus fixed.
- the clamps 16 are pressed manually in this example by means of a clamping screw 17 with associated wing nut to the transducer 15.
- this handling and picking up of the conductors 6 will advantageously take place automatically. This also guarantees a reproducibility of the processes.
- At the free ends of the conductors 6, and to the conductor supernatant 8 of the Galvano rectifier is connected with its negative pole. In this case, there is no undesirable metallization of the contact means, because they are outside of the electrolyte 12. Only a small part of the cathodic wire projection 8 is galvanized, which has no disadvantageous effect on the method according to the invention.
- the positive pole of the Galvano Eisenrichters is electrically connected to the soluble or insoluble anode 11, which is located in the lower region of the working container 10.
- the invention also enables the use of unipolar and bipolar pulse rectifiers.
- the receivers 15 together with the clamping members 16, 17 form conveying means 19, for example, which transport the solar cells 1 through the conveyor system.
- the conveyor 19 is conveyed in the direction of the transport arrow 21. In this case, for example, the altitude of the conveyor 19 is adjusted so that the bottom of the substrate or the solar cell 1 is below the level 13 of the electrolyte 12 and the top outside of it.
- the solar cell 1 to be electroplated is preferably placed automatically on the stretched conductor (s) 6.
- the altitude of most two conductors 6 is set with respect to the level 13 of the electrolyte 12 so that forms a liquid meniscus. This pulls the solar cell 1 downwards in the direction of the conductor 6. This force fixes the solar cell 1 at the beginning of the electroplating process on the conductors.
- the counter-layers 22, 23 are set at the level to the galvanizing and the level 13 so that only the bottom of the solar cell 1, ie the sunny side, is wetted by the electrolyte 12. Downpipes in the region of the counter-layers 22, 23 and close to the conductors 6 allow the circulated through the working container 10 promoted electrolyte 12 to flow out. The resulting suction pulls the solar cell 1 very gently against the respective conductor 6, which is supported by the counter-layers 22, 23.
- weights in the free space 14 can be placed on the solar cells 1. These press the solar cells 1 in the direction of the counter-supported conductor 6. Furthermore, it is possible to direct a fluid (gas or liquid), preferably a gas stream, in the free space 14 against the solar cells 1. The flow or the back pressure meets there on the dry upper side of the solar cell 1, where in each case at the bottom of the supported by the counter-layers 22, 23 conductor 6 in the continuous system or Tauchbadstrom runs. Finally, the solar cell 1 to be electroplated can also be pressed against the respective supported conductor 6 by means of gentle spring forces emanating from the sensor 15. With increasing cross section of the conductor according to the invention is the line resistance is reduced. However, this also increases the absolute strength of the conductor.
- the difference of the thermal expansion coefficients of silicon and an electrically highly conductive metal such as copper, is about 15 * 10 "6 / K. At a temperature change of 100 K, the difference in linear expansion is approximately 0.2 mm.
- the seed layer for the conductor bus bar has a very good adhesion to the wafer, supporting the strength or elasticity of the conductor material can be reduced eg by soft annealing or by using multi-wire conductors as strands is very effective
- meander-shaped, triangular or sinusoidal curves are suitable for recording thermal expansion differences, whereby the amplitude of the respective waveform can be in the range of, for example, 0.1 mm to 5 mm can be as long as the distance from two parallel contact fingers connecting the conductor k The distance can be greater.
- the consequent conductor length increase and thus the increase of the line resistance and shading is low compared to a stretched conductor bus bar.
- the seed layer of the conductor bus bar can be rectilinear or even wave-shaped, as the conductor itself. Because such shaped conductors can only be slightly tensioned, the measures described above for contacting the conductor with the seed layer at the beginning of electroplating are particularly advantageous.
- FIG. 5 shows a top view of a carrier 24 which conveys four solar cells 1, for example, by means of a horizontal continuous system.
- the carrier 24 consists at least on the surface of an electrically insulating material.
- the conductors 6 are deflected in openings 25 from the wet area to the dry area.
- the associated transducers for the conductors 6 are not shown in this figure 5.
- the electrical connection of the carrier 24 for the galvanizing, for example, via a busbar 26 and, for example, sliding contacts 27, which slide along the grinding path 28.
- the carrier 24 provides space on the dry top for eg electrical equipment.
- These can be electronic Controllers or measuring devices for quality monitoring or alarm devices for breaking detection or, as shown, current distribution resistors 29. These match the in practice always slightly unequal Operanikwideriron the here eight times parallel electrical circuit to each other. Again, it is very advantageous that after passing through the continuous system neither the carrier 24 nor the contact means must be demetallised.
- FIG. 6 shows a longitudinal section of a cup plater for electroplating wafers and solar cells 1 according to the invention.
- the cup 30 has a cross-section which is adapted to the shape of the substrate or the solar cell 1.
- the electrolyte 12 flows from below. It flows through an anode 11 and reaches the underside of the solar cell 1 to be electroplated.
- the flow arrows 31 show the directions of the flows.
- At the upper edge of the cup 30 are resting stretched ladder 6 as busbars.
- the optionally required clamping force 32 acts in the illustrated arrow directions.
- the upper part 33 of the cup 30 can rest on the ladders 6. Through the gap formed, the electrolyte 12 flows out of the cup 30 on all sides.
- the conductors 6 When force is applied in the direction of the force arrows 34, the conductors 6 can be clamped by the upper part 33.
- the free space 14 again provides space for the means for approaching the solar cell 1 and conductor 6, as has been described using the example of FIG.
- counterparts (not shown) can be arranged on the underside in the region of the conductors 6 in the cup 30. Because the electrical connection of the galvanic rectifier, not shown, takes place outside the electrolyte 12 or the electrolytic cell, it is not necessary to demount the contact means.
- the conductor supernatant 8 can be used again for subsequent electrical interconnection of the individual solar cells 1 to solar modules. As a result, work steps that are required in the prior art can be saved. Because of the direct electrical contact see the surface to be plated is also here
- the conductors or conductor busbars are in the useful range, ie the few underlying circuits are not usable later. Especially with wafers with However, due to the large-area feed of the galvanizing current, a very good layer thickness distribution is achieved with a large diameter.
- Figure 7 shows a conventional vertically oriented electroplating apparatus with electrolyte (12), filled container (30), five longitudinally vertically stacked solar cells (1), which are connected to each other in the electroplating of solar cell connection conductors (6).
- This vertical electroplating plant is also suitable for producing galvanized solar cells according to the invention, but can realize higher current densities in comparison to the cup plater described in FIG. 6 and thus lead to faster deposition rates.
- Figure 8 shows a vertically oriented electroless plating apparatus for producing solar cells according to the invention, in which the mechanically and electrically conductive plating is electrochemically, i. produced by redox deposition on the solar cell and conductors.
- the mechanically and electrically conductive plating is electrochemically, i. produced by redox deposition on the solar cell and conductors.
- FIG. 9 schematically shows a solar cell arrangement according to the invention of three solar cells (1) in cross section.
- longitudinal conductors 6 ' are arranged above and below the cells (1) and transverse conductors 6 "in the interspace of adjacent cells .
- these conductors (6', 6") are mechanically and electrically electroplated by the resulting plating coating (7 ' ) conductively connected.
- these conductors (6 ', 6 ") are then partially separated so that the desired circuit, here a series connection of the cells results
- Processes can be easily and inexpensively produced solar cell strings or complete matrices of solar cells.
- FIG. 10 schematically shows two solar cells (1) resting on a flexible printed circuit board (6) with integrated lines.
- the solar cells (1) have vias (35) to guide the current from the sunny side (top) to the back (bottom).
- vias (35) to guide the current from the sunny side (top) to the back (bottom).
- an electrolyte supply (36) here as
- Electrolyte supply also be carried out by an electrolyte bath) - electrically conductive
- Electroplating is therefore only controlled on sites provided with electrolyte.
- electrolyte supply orzugmik preferably produced electrochemically, galvanically or by plasma spraying
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- Electroplating Methods And Accessories (AREA)
- Electrodes Of Semiconductors (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Coating By Spraying Or Casting (AREA)
Abstract
L'invention concerne des cellules solaires, dans lesquelles au moins un conducteur est relié mécaniquement et électriquement à la cellule solaire et/ou à d'autres conducteurs par l'intermédiaire d'un revêtement conducteur. Ledit revêtement conducteur est déposé de préférence à partir d'une solution par électrolyse ou galvanoplastie ou réalisé par pulvérisation plasma. L'invention vise également un procédé pour relier les cellules solaires (1) à au moins un conducteur et/ou pour relier des conducteurs sur des cellules solaires (1) les uns aux autres. Par ledit procédé au moins un conducteur électroconducteur est relié mécaniquement et électriquement par le dépôt d'un revêtement (7) conducteur, formé sur la cellule solaire (1) et/ou sur au moins un autre conducteur à partir d'une solution. L'invention concerne également un dispositif pour déposer un revêtement (7) électroconducteur et constituant une liaison mécanique, formé à partir d'une solution, sur des cellules solaires (1) dans des cellules électrolytiques, comportant des moyens (15, 16, 30, 32, 33) destinés à recevoir au moins un conducteur, de préférence un conducteur collecteur ou conducteur bus (6), qui, dans l'électrolyte (12) de la cellule électrolytique, s'applique au moins partiellement, de préférence en établissant un contact électrique, sur la surface de dépose, de préférence une couche de germes (5) de la cellule solaire (1) et, de préférence, est en même temps un support de la cellule solaire (1).
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102010014555A DE102010014555A1 (de) | 2010-04-01 | 2010-04-01 | Verfahren und Vorrichtung zur elektrochemischen Metallisierung von flachem Gut |
DE201010014554 DE102010014554A1 (de) | 2010-04-01 | 2010-04-01 | Standardsolarzelle mit kleiner Abschattung |
PCT/EP2011/001652 WO2011120714A2 (fr) | 2010-04-01 | 2011-04-01 | Cellules solaires et procédé de fabrication de celles-ci |
Publications (1)
Publication Number | Publication Date |
---|---|
EP2553733A2 true EP2553733A2 (fr) | 2013-02-06 |
Family
ID=44712683
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP11712182A Withdrawn EP2553733A2 (fr) | 2010-04-01 | 2011-04-01 | Cellules solaires et procédé de fabrication de celles-ci |
Country Status (6)
Country | Link |
---|---|
US (1) | US20130025673A1 (fr) |
EP (1) | EP2553733A2 (fr) |
JP (3) | JP5992396B2 (fr) |
KR (1) | KR101384467B1 (fr) |
CN (1) | CN102947941A (fr) |
WO (1) | WO2011120714A2 (fr) |
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US9570206B2 (en) * | 2013-09-27 | 2017-02-14 | Sunpower Corporation | Firing metal with support |
US10170654B2 (en) * | 2014-06-25 | 2019-01-01 | Sage Electrochromics, Inc. | Solar powered device with scalable size and power capacity |
JP6505864B2 (ja) | 2015-01-06 | 2019-04-24 | セイジ・エレクトロクロミクス,インコーポレイテッド | 一式の窓アセンブリ及びその製作方法 |
US20160226439A1 (en) * | 2015-01-29 | 2016-08-04 | Solaria Corporation | Solar module with diode device for shading |
WO2016190602A1 (fr) * | 2015-05-22 | 2016-12-01 | 엘에스전선 주식회사 | Fil annulaire pour module de cellule solaire |
KR101708556B1 (ko) * | 2015-05-22 | 2017-02-20 | 엘에스전선 주식회사 | 태양전지 모듈용 환형 와이어 |
KR101739404B1 (ko) * | 2015-08-07 | 2017-06-08 | 엘지전자 주식회사 | 태양 전지 패널 |
US10840394B2 (en) * | 2015-09-25 | 2020-11-17 | Total Marketing Services | Conductive strip based mask for metallization of semiconductor devices |
CN106230306A (zh) * | 2016-08-09 | 2016-12-14 | 中山市天美能源科技有限公司 | 一种柔性发电薄膜及其制备方法 |
WO2018097576A1 (fr) * | 2016-11-22 | 2018-05-31 | 한화첨단소재 주식회사 | Substrat de protection intégré dans du verre destiné à une cellule solaire verre-verre, paire de substrats de protection destinée à une cellule solaire verre-verre, et module de cellule solaire et son procédé de fabrication |
WO2018103793A1 (fr) * | 2016-12-09 | 2018-06-14 | RENA Technologies GmbH | Installation de dépôt en continu et ensemble destiné à une telle installation |
NL2018395B1 (en) * | 2017-02-20 | 2018-09-21 | Eurotron B V | Apparatus, assembly method and assembly line |
KR102065170B1 (ko) | 2018-01-03 | 2020-01-10 | 엘지전자 주식회사 | 태양 전지 모듈 |
US11227962B2 (en) | 2018-03-29 | 2022-01-18 | Sunpower Corporation | Wire-based metallization and stringing for solar cells |
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JPWO2022186167A1 (fr) * | 2021-03-01 | 2022-09-09 | ||
CN115084312B (zh) * | 2022-03-11 | 2024-07-02 | 广东爱旭科技有限公司 | 太阳能电池的制备方法及太阳能电池组件、发电系统 |
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- 2011-04-01 EP EP11712182A patent/EP2553733A2/fr not_active Withdrawn
- 2011-04-01 US US13/638,491 patent/US20130025673A1/en not_active Abandoned
- 2011-04-01 CN CN2011800166919A patent/CN102947941A/zh active Pending
- 2011-04-01 JP JP2013501696A patent/JP5992396B2/ja not_active Expired - Fee Related
- 2011-04-01 WO PCT/EP2011/001652 patent/WO2011120714A2/fr active Application Filing
- 2011-04-01 KR KR1020127028044A patent/KR101384467B1/ko not_active IP Right Cessation
-
2014
- 2014-06-16 JP JP2014123345A patent/JP2014207467A/ja active Pending
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2016
- 2016-02-08 JP JP2016021626A patent/JP2016157929A/ja active Pending
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Also Published As
Publication number | Publication date |
---|---|
JP2013524495A (ja) | 2013-06-17 |
JP2014207467A (ja) | 2014-10-30 |
CN102947941A (zh) | 2013-02-27 |
KR20130021373A (ko) | 2013-03-05 |
US20130025673A1 (en) | 2013-01-31 |
WO2011120714A2 (fr) | 2011-10-06 |
WO2011120714A3 (fr) | 2012-03-08 |
KR101384467B1 (ko) | 2014-04-14 |
JP2016157929A (ja) | 2016-09-01 |
JP5992396B2 (ja) | 2016-09-14 |
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