EP2527152B1 - Integrierte Schaltung für einen Druckkopf - Google Patents

Integrierte Schaltung für einen Druckkopf Download PDF

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Publication number
EP2527152B1
EP2527152B1 EP12174685.3A EP12174685A EP2527152B1 EP 2527152 B1 EP2527152 B1 EP 2527152B1 EP 12174685 A EP12174685 A EP 12174685A EP 2527152 B1 EP2527152 B1 EP 2527152B1
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EP
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Prior art keywords
nozzle
actuator
integrated circuit
printhead integrated
active beam
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Active
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EP12174685.3A
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English (en)
French (fr)
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EP2527152A1 (de
Inventor
Gregory Mcavoy
Kia Silverbrook
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Memjet Technology Ltd
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Zamtec Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1648—Production of print heads with thermal bend detached actuators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1628—Manufacturing processes etching dry etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1631—Manufacturing processes photolithography
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1635—Manufacturing processes dividing the wafer into individual chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1642—Manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1643—Manufacturing processes thin film formation thin film formation by plating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1645—Manufacturing processes thin film formation thin film formation by spincoating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14427—Structure of ink jet print heads with thermal bend detached actuators
    • B41J2002/14435—Moving nozzle made of thermal bend detached actuator
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
    • B41J2202/01—Embodiments of or processes related to ink-jet heads
    • B41J2202/18—Electrical connection established using vias

Definitions

  • This invention relates to inkjet nozzle assemblies and methods of fabricating inkjet nozzle assemblies. It has been developed primarily to reduce electrical losses in supplying power to inkjet actuators.
  • Thermal bend actuation generally means bend movement generated by thermal expansion of one material, having a current passing therethough, relative to another material. The resulting bend movement may be used to eject ink from a nozzle opening, optionally via movement of a paddle or vane, which creates a pressure wave in a nozzle chamber.
  • thermal bend inkjet nozzles Some representative types of thermal bend inkjet nozzles are exemplified in the patents and patent applications listed in the cross reference section above.
  • the Applicant's US Patent No. 6,416,167 describes an inkjet nozzle having a paddle positioned in a nozzle chamber and a thermal bend actuator positioned externally of the nozzle chamber.
  • the actuator takes the form of a lower active beam of conductive material (e.g. titanium nitride) fused to an upper passive beam of non-conductive material (e.g. silicon dioxide).
  • the actuator is connected to the paddle via an arm received through a slot in the wall of the nozzle chamber.
  • the actuator bends upwards and, consequently, the paddle moves towards a nozzle opening defined in a roof of the nozzle chamber, thereby ejecting a droplet of ink.
  • An advantage of this design is its simplicity of construction.
  • a drawback of this design is that both faces of the paddle work against the relatively viscous ink inside the nozzle chamber.
  • the Applicant's US Patent No. 6,260,953 describes an inkjet nozzle in which the actuator forms a moving roof portion of the nozzle chamber.
  • the actuator takes the form of a serpentine core of conductive material encased by a polymeric material.
  • the actuator bends towards a floor of the nozzle chamber, increasing the pressure within the chamber and forcing a droplet of ink from a nozzle opening defined in the roof of the chamber.
  • the nozzle opening is defined in a non-moving portion of the roof.
  • An advantage of this design is that only one face of the moving roof portion has to work against the relatively viscous ink inside the nozzle chamber.
  • a drawback of this design is that construction of the actuator from a serpentine conductive element encased by polymeric material is difficult to achieve in a MEMS fabrication process.'
  • the Applicant's US Patent No. 6,623,101 describes an inkjet nozzle comprising a nozzle chamber with a moveable roof portion having a nozzle opening defined therein.
  • the moveable roof portion is connected via an arm to a thermal bend actuator positioned externally of the nozzle chamber.
  • the actuator takes the form of an upper active beam spaced apart from a lower passive beam. By spacing the active and passive beams apart, thermal bend efficiency is maximized since the passive beam cannot act as heat sink for the active beam.
  • the moveable roof portion, having the nozzle opening defined therein is caused to rotate towards a floor of the nozzle chamber, thereby ejecting through the nozzle opening.
  • drop flight direction may be controlled by suitable modification of the shape of the nozzle rim.
  • An advantage of this design is that only one face of the moving roof portion has to work against the relatively viscous ink inside the nozzle chamber.
  • a further advantage is the minimal thermal losses achieved by spacing apart the active and passive beam members.
  • a drawback of this design is the loss of structural rigidity in spacing apart the active and passive beam members.
  • JP2000-289201 describes a piezo inkjet nozzle device having electrical connector posts terminating at different heights in a sidewall of a nozzle chamber.
  • a lower surface of the actuator is connected to a lower connector post via a TiN layer; and an upper surface of the actuator is connected to an upper connector post via a Pt wiring layer.
  • the actuator material in inkjet nozzles is selected from a material which fulfils a number of criteria.
  • these criteria include electrical conductivity, coefficient of thermal expansion, Young's modulus etc.
  • thermal bubble-forming inkjet nozzles these criteria include electrical conductivity, resistance to oxidation, resistance to cracking etc.
  • the choice of actuator material is usually a compromise of various properties, and that the actuator material may not necessarily have optimal electrical conductivity. In cases where the actuator material itself has sub-optimal electrical conductivity, it is particularly important to minimize electrical losses elsewhere in the nozzle assembly.
  • any improvements in nozzle design should be compatible with standard MEMS fabrication processes. For example, some materials are incompatible with MEMS processing since they lead to contamination of the fab.
  • the present invention provides a circuit in accordance with claim 1.
  • a distance between said actuator and said electrode is at least 5 microns.
  • said layer of drive circuitry is a CMOS layer of a silicon substrate.
  • said drive circuitry includes a pair of electrodes for each inkjet nozzle assembly, each of said electrodes being connected to said actuator with a respective connector post.
  • said wall of insulating material is comprised of silicon dioxide.
  • said via has sidewalls perpendicular to a face of said substrate.
  • said via has a minimum cross-sectional dimension of 1 micron or greater.
  • said conductive material is a metal.
  • said conductive material is copper.
  • said catalyst is palladium.
  • said conductive material is planarized by chemical mechanical planarization prior to forming said actuator.
  • said actuator is a thermal bend actuator comprising a planar active beam member mechanically cooperating with a planar passive beam member.
  • said thermal bend actuator defines, at least partially, a roof of a nozzle chamber for said inkjet nozzle assembly.
  • said wall of insulating material defines a sidewall of said nozzle chamber.
  • said active beam member comprised of said active beam material, extends from a top of said connector post in a plane perpendicular to said post.
  • each connector post is perpendicular with respect to said surface of said substrate.
  • a shortest distance between said actuator and said electrodes is at least 5 microns.
  • a minimum cross-sectional dimension of said connector posts is 2 microns or greater.
  • said nozzle assemblies are arranged in a plurality of nozzle rows, said nozzle rows extending longitudinally along said substrate.
  • a distance between adjacent nozzle openings within one nozzle row is less than 50 microns.
  • said actuator is a thermal bend actuator comprising a planar active beam member mechanically cooperating with a planar passive beam member.
  • said thermal bend actuator defines, at least partially, a roof of said nozzle chamber, said nozzle opening being defined in said roof.
  • a wall of insulating material defines sidewalls of said nozzle chamber.
  • said active beam member is electrically connected to a top of said connector posts.
  • part of said active beam member is positioned over a top of said connector posts.
  • said active beam member is comprised of an active beam material selected from the group comprising: aluminium alloys; titanium nitride and titanium aluminium nitride.
  • said active beam member is comprised of vanadium-aluminium alloy.
  • said planar active beam member comprises a bent or serpentine beam element, said beam element having a first end positioned over a first connector post and a second end positioned over a second connector post, said first and second connector posts being adjacent each other.
  • said exterior surface layer defines a planar ink ejection face of said printhead integrated cicuit, said planar ink ejection face having no substantial contours apart from said nozzle openings.
  • said hydrophobic polymer mechanically seals a gap between said thermal bend actuator and said nozzle chamber.
  • FIGS. 1 and 2 show a nozzle assembly, as described in the Applicant's earlier filed US Application No. 11/607,976 filed on 4 December 2002 (Attorney Docket No. IJ70US), .
  • the nozzle assembly 400 comprises a nozzle chamber 401 formed on a passivated CMOS layer 402 of a silicon substrate 403.
  • the nozzle chamber is defined by a roof 404 and sidewalls 405 extending from the roof to the passivated CMOS layer 402.
  • Ink is supplied to the nozzle chamber 401 by means of an ink inlet 406 in fluid communication with an ink supply channel 407, which receives ink from backside of the silicon substrate 403.
  • Ink is ejected from the nozzle chamber 401 by means of a nozzle opening 408 defined in the roof 404.
  • the nozzle opening 408 is offset from the ink inlet 406.
  • the roof 404 has a moving portion 409, which defines a substantial part of the total area of the roof.
  • the nozzle opening 408 and nozzle rim 415 are defined in the moving portion 409, such that the nozzle opening and nozzle rim move with the moving portion.
  • the moving portion 409 is defined by a thermal bend actuator 410 having a planar upper active beam 411 and a planar lower passive beam 412.
  • the active beam 411 is connected to a pair of electrode contacts 416 (positive and ground).
  • the electrodes 416 connect with drive circuitry in the CMOS layers.
  • a current flows through the active beam 411 between the two contacts 416.
  • the active beam 411 is rapidly heated by the current and expands relative to the passive beam 412, thereby causing the actuator 410 (which defines the moving portion 409 of the roof 404) to bend downwards towards the substrate 403.
  • This movement of the actuator 410 causes ejection of ink from the nozzle opening 408 by a rapid increase of pressure inside the nozzle chamber 401.
  • the moving portion 409 of the roof 404 is allowed to return to its quiescent position, which sucks ink from the inlet 406 into the nozzle chamber 401, in readiness for the next ejection.
  • the actuator 410 it is advantageous for the actuator 410 to define at least part of the roof 404 of the nozzle chamber 401. This not only simplifies the overall design and fabrication of the nozzle assembly 400, but also provides higher ejection efficiency because only one face of the actuator 410 has to do work against the relatively viscous ink. By comparison, nozzle assemblies having an actuator paddle positioned inside the nozzle chamber are less efficient, because both faces of the actuator have to do work against the ink inside the chamber.
  • the actuator 410 defining, at least partially, the roof 404 of the chamber 401
  • the actuator 410 defining, at least partially, the roof 404 of the chamber 401
  • the current path between the electrode 416 and the active beam 411 is tortuous with a number of turns in the relatively thin layer of beam material.
  • the combination of a relatively large distance between electrode 416 and actuator 410, a tortuous current path, and the thinness of the beam material results in appreciable electrical losses.
  • MEMS fabrication of inkjet nozzles relied primarily on standard PECVD (plasma-enhanced chemical vapor deposition) and mask/etch steps to build up a nozzle structure.
  • PECVD plasma-enhanced chemical vapor deposition
  • the use of PECVD to deposit simultaneously the active beam 411 and a connection to the electrode 416 has advantages from a MEMS fabrication standpoint, but inevitably leads to a thin, tortuous connection which is disadvantageous in terms of current losses. The current losses are exacerbated further when the beam material does not have optimal conductivity.
  • a vanadium-aluminium alloy has excellent thermoelastic properties, but poorer electrical conductivity compared to, for example, aluminium.
  • a further disadvantage of PECVD is that a via 418 having sloped sidewalls is required for effective deposition onto the sidewalls. Material cannot be deposited onto vertical sidewalls by PECVD due to the directionality of the plasma.
  • sloped via sidewalls There are several problems associated with sloped via sidewalls. Firstly, a photoresist scaffold having sloped sidewalls is required - this is typically achieved using out-of-focus photoresist exposure, which inevitably leads to some loss of accuracy.
  • the total footprint area of the nozzle assembly is increased, thereby reducing nozzle packing density - this increase in area is significantly worsened if the height of the nozzle chamber is increased.
  • One attempt to alleviate the problem of current losses in the nozzle assembly 400 is to introduce a highly conductive intermediate layer 417, such as titanium or aluminium, between the electrode contact 416 and the active beam material 411 (see Figure 1 ).
  • This intermediate layer 417 helps reduce some current losses, but significant current losses still remain.
  • a further disadvantage of the nozzle assembly shown in Figures 1 and 2 is that the ink ejection face of the printhead is non-planar due to the electrode vias 418. Non-planarity of the ink ejection face may lead to structural weaknesses and problems during printhead maintenance.
  • the present Applicants have developed a new method for fabricating a mechanical thermal bend inkjet nozzle assembly, which does not rely on PECVD for forming connections from CMOS contacts to the actuator.
  • the resultant inkjet nozzle assembly has minimal electrical losses and has an additional structural advantage of a planar ink ejection face.
  • the invention is exemplified with reference to a mechanical thermal bend inkjet nozzle assembly, it will readily appreciated that it may be applied to any type of inkjet nozzle fabricated by MEMS techniques.
  • Figures 3 to 26 shows a sequence of MEMS fabrication steps for an inkjet nozzle assembly 100 shown in Figures 25 and 26 .
  • the starting point for MEMS fabrication is a standard CMOS wafer having CMOS drive circuitry formed in an upper portion of a silicon wafer.
  • this wafer is diced into individual printhead integrated circuits (ICs), with each IC comprising drive circuitry and plurality of nozzle assemblies.
  • ICs printhead integrated circuits
  • a substrate 1 has an electrode 2 formed in an upper portion thereof.
  • the electrode 2 is one of a pair of adjacent electrodes (positive and earth) for supplying power to an actuator of the inkjet nozzle 100.
  • the electrodes receive power from CMOS drive circuitry (not shown) in upper layers of the substrate 1.
  • the other electrode 3 shown in Figures 4 and 5 is for supplying power to an adjacent inkjet nozzle.
  • the drawings shows MEMS fabrication steps for a nozzle assembly, which is one of an array of nozzle assemblies. The following description focuses on fabrication steps for one of these nozzle assemblies. However, it will of course be appreciated that corresponding steps are being performed simultaneously for all nozzle assemblies that are being formed on the wafer. Where an adjacent nozzle assembly is partially shown in the drawings, this can be ignored for the present purposes. Accordingly, the electrode 3 and all features of the adjacent nozzle assembly will not be described in detail herein. Indeed, in the interests of clarity, some MEMS fabrication steps will not be shown on adjacent nozzle assemblies.
  • FIG. 3 to 5 there is illustrated a first sequence of MEMS fabrication steps starting from a CMOS wafer.
  • An 8 micron layer of silicon dioxide is initially deposited onto the substrate 1.
  • the depth of silicon dioxide defines the depth of a nozzle chamber 5 for the inkjet nozzle.
  • the layer of silicon dioxide may have a depth of from 4 to 20 microns, or from 6 to 12 microns. It is an advantage of the present invention that it may be used to fabricate nozzle assemblies having relatively deep nozzle chambers ( e.g. > 6 microns).
  • FIG. 4 After deposition of the SiO 2 layer, it is etched to define the wall 4, which will become a sidewall of the nozzle chamber 5, shown most clearly in Figure 5 .
  • the dark tone mask shown in Figure 3 is used to pattern photoresist (not shown), which defines this etch. Any standard anisotropic DRIE suitable for SiO 2 (e.g. C 4 F 8 /O 2 plasma) may be used for this etch step.
  • any depositable insulating material e.g. silicon nitride, silicon oxynitride, aluminium oxide
  • Figures 4 and 5 show the wafer after the first sequence of SiO 2 deposition and etch steps.
  • the nozzle chamber 5 is filled with photoresist or polyimide 6, which acts as a sacrificial scaffold for subsequent deposition steps.
  • the polyimide 6 is spun onto the wafer using standard techniques, UV cured and/or hardbaked, and then subjected to chemical mechanical planarization (CMP) stopping at the top surface of the SiO 2 wall 4.
  • CMP chemical mechanical planarization
  • Figures 6 and 7 show the nozzle assembly after the second sequence of steps.
  • a roof member 7 of the nozzle chamber 5 is formed as well as highly conductive connector posts 8 down to the electrodes 2.
  • a 1.7 micron layer of SiO 2 is deposited onto the polyimide 6 and wall 4. This layer of SiO 2 defines a roof member 7 of the nozzle chamber 5.
  • a pair of vias are formed in the wall 4 down to the electrodes 2 using a standard anisotropic DRIE.
  • the dark tone mask shown in Figure 8 is used to pattern photoresist (not shown), which defines this etch.
  • the etch is highly anisotropic such that the via sidewalls are preferably perpendicular to the surface of the substrate 1. This means that any depth of nozzle chamber may be accommodated without affecting the overall footprint area of the nozzle assembly on the wafer. This etch exposes the pair of electrodes 2 through respective vias.
  • the vias are filled with a highly conductive metal, such as copper, using electroless plating.
  • Copper electroless plating methods are well known in the art and may be readily incorporated into a fab.
  • an electrolyte comprising a copper complex, an aldehyde (e.g. formaldehyde) and a hydroxide base deposits a coating of copper onto exposed surfaces of a substrate.
  • Electroless plating is usually preceded by a very thin coating (e.g. 0.3 microns or less) of a seed metal (e.g. palladium), which catalyses the plating process.
  • electroless plating of the vias may be preceded by deposition of a suitable catalyst seed layer, such as palladium, by CVD.
  • the deposited copper is subjected to CMP, stopping on the SiO 2 roof member 7 to provide a planar structure.
  • Figures 9 and 10 show the nozzle assembly following this third sequence of steps. It can be seen that copper connector posts 8, formed during the electroless copper plating, meet with respective electrodes 2 to provide a linear conductive path up to the roof member 7. This conductive path contains no bends or kinks and has a minimum cross-sectional dimension of at least 1 micron, at least 1.5 microns, at least 2 microns, at least 2.5 microns, or at least 3 microns. Accordingly, the copper connector posts 8 exhibit minimal current losses when supplying power for an actuator in the inkjet nozzle assembly.
  • conductive metal pads 9 are formed, which are configured to minimize power losses in any regions of potentially high resistance. These regions are typically at the junction of the connector posts 8 with a thermoelastic element, and at any bends in the thermoelastic element.
  • the thermoelastic element is formed in subsequent steps and the function of the metal pads 9 will be understood more readily once the nozzle assembly is described in its fully formed state.
  • the metal pads 9 are formed by initially depositing a 0.3 micron layer of aluminium onto the roof member 7 and connector posts 8. Any highly conductive metal (e.g. aluminium, titanium etc.) may be used and should be deposited with a thickness of about 0.5 microns or less so as not to impact too severely on the overall planarity of the nozzle assembly. Following deposition of the aluminium layer, a standard metal etch (e.g. Cl 2 /BCl 3 ) is used to define the metal pads 9. The clear tone mask shown in Figure 11 is used to pattern photoresist (not shown) which defines this etch.
  • Any highly conductive metal e.g. aluminium, titanium etc.
  • a standard metal etch e.g. Cl 2 /BCl 3
  • Figures 12 and 13 show the nozzle assembly after the fourth sequence of steps, with the metal pads 9 formed over the connector posts 8 and on the roof member 7 in predetermined 'bend regions' of the thermoelastic active beam member, which is to be formed subsequently.
  • the metal pads 9 are not shown on transversely adjacent nozzle assemblies in Figure 13 .
  • all nozzle assemblies in the array are fabricated simultaneously and in accordance with the fabrication steps described herein.
  • thermoelastic active beam member 10 is formed over the SiO 2 roof member 7.
  • part of the SiO 2 roof member 7 functions as a lower passive beam member 16 of a mechanical thermal bend actuator, which is defined by the active beam 10 and the passive beam 16.
  • the thermoelastic active beam member 10 may be comprised of any suitable thermoelastic material, such as titanium nitride, titanium aluminium nitride and aluminium alloys.
  • vanadium-aluminium alloys are a preferred material, because they combine the advantageous properties of high thermal expansion, low density and high Young's modulus.
  • a 1.5 micron layer of active beam material is initially deposited by standard PECVD.
  • the beam material is then etched using a standard metal etch to define the active beam member 10.
  • the clear tone mask shown in Figure 14 is used to pattern photoresist (not shown) which defines this etch.
  • the active beam member 10 comprises a partial nozzle opening 11 and a beam element 12, which is electrically connected at each end thereof to positive and ground electrodes 2 via the connector posts 8.
  • the planar beam element 12 extends from a top of a first (positive) connector post and bends around 180 degrees to return to a top of a second (ground) connector post.
  • Serpentine beam element configurations as described in Applicant's copending US Application No. 11/607,976 are, of course, also within the ambit of the present invention.
  • the metal pads 9 are positioned to facilitate current flow in regions of potentially higher resistance.
  • One metal pad 9 is positioned at a bend region of the beam element 12, and is sandwiched between the active beam member 10 and the passive beam member 16.
  • the other metal pads 9 are positioned between the top of the connector posts 8 and the ends of the beam element 12. It will appreciated that the metal pads 9 reduce resistance in these regions.
  • the SiO 2 roof member 7 is etched to define fully a nozzle opening 13 and a moving portion 14 of the roof.
  • the dark tone mask shown in Figure 17 is used to pattern photoresist (not shown) which defines this etch.
  • the moving portion 14 of the roof comprises a thermal bend actuator 15, which is itself comprised of the active beam member 10 and the underlying passive beam member 16.
  • the nozzle opening 13 is also defined in the moving portion 14 of the roof so that the nozzle opening moves with the actuator during actuation. Configurations whereby the nozzle opening 13 is stationary with respect to the moving portion 14, as described in US Application No. 11/607,976 are, of course, also possible and within the ambit of the present invention.
  • a perimeter gap 17 around the moving portion 14 of the roof separates the moving portion from a stationary portion 18 of the roof. This gap 17 allows the moving portion 14 to bend into the nozzle chamber 5 and towards the substrate 1 upon actuation of the actuator 15.
  • a 3 micron layer of photopatternable hydrophobic polymer 19 is deposited over the entire nozzle assembly, and photopatterned to re-define the nozzle opening 13.
  • the dark tone mask shown in Figure 20 is used to pattern the hydrophobic polymer 19.
  • the hydrophobic polymer is polydimethylsiloxane (PDMS) or perfluorinated polyethylene (PFPE).
  • PDMS polydimethylsiloxane
  • PFPE perfluorinated polyethylene
  • the exact ordering of MEMS fabrication steps, incorporating the hydrophobic polymer is relatively flexible. For example, it is perfectly feasible to etch the nozzle opening 13 after deposition of the hydrophobic polymer 19, and use the polymer as a mask for the nozzle etch. It will appreciated that variations on the exact ordering of MEMS fabrication steps are well within the ambit of the skilled person, and, moreover, are included within the scope of the present invention.
  • the hydrophobic polymer layer 19 performs several functions. Firstly, it provides a mechanical seal for the perimeter gap 17 around the moving portion 14 of the roof.
  • the low Young's modulus of the polymer ( ⁇ 1000 MPa) means that it does not significantly inhibit bending of the actuator, whilst preventing ink from escaping through the gap 17 during actuation.
  • the polymer has a high hydrophobicity, which minimizes the propensity for ink to flood out of the relatively hydrophilic nozzle chambers and onto an ink ejection face 21 of the printhead.
  • the polymer functions as a protective layer, which facilitates printhead maintenance.
  • an ink supply channel 20 is etched through to the nozzle chamber 5 from a backside of the substrate 1.
  • the dark tone mask shown in Figure 24 is used to pattern backside photoresist (not shown) which defines this etch.
  • the ink supply channel 20 is shown aligned with the nozzle opening 13 in Figure 25 and 26 , it could, of course, be offset from the nozzle opening, as exemplified in the nozzle assembly 400 shown in Figure 1 .
  • the polyimide 6, which filled the nozzle chamber 5 is removed by ashing (either frontside ashing or backside ashing) using, for example, an O 2 plasma to provide the nozzle assembly 100.
  • the resultant nozzle assembly 100 shown in Figures 25 and 26 has several additional advantages over the nozzle assembly 400 shown in Figures 1 and 2 .
  • the nozzle assembly 100 has minimal electrical losses in the connection between the active beam 10 of the actuator and the electrodes 2.
  • the copper connector posts 8 have excellent conductivity. This is due to their relatively large cross-sectional dimension (> 1.5 microns); the inherent high conductivity of copper; and the absence of any bends in the connection. Accordingly, the copper connector posts 8 maximizes power transfer from the drive circuitry to the actuator.
  • the corresponding connection in the nozzle assembly 400, shown in Figures 1 and 2 is relatively thin, tortuous and generally formed of the same material as the active beam 411.
  • the connector posts 8 extend perpendicularly from the surface of the substrate 1, allowing the height of the nozzle chamber 5 to be increased without impacting on the overall footprint area of the nozzle assembly 100.
  • the nozzle assembly 400 requires sloped connections between the electrode 416 and the active beam member 411 so that the connections can be formed by PECVD. This slope inevitably impacts on the overall footprint area of the nozzle assembly 400, which is particularly disadvantageous if the height of the nozzle chamber 401 were to be increased (for example, to provide improved drop ejection characteristics).
  • nozzle assemblies having relatively large volume nozzle chambers can be arranged in rows with a nozzle pitch of, for example, less than 50 microns.
  • the nozzle assembly 100 has a highly planar ink ejection face 21, in the absence of any pit or via in the region of the electrodes 2.
  • the planarity of the ink ejection face is advantageous for printhead maintenance, because it presents a smooth wipeable surface for any maintenance device. Furthermore, there is no risk of particles becoming trapped permanently in electrode vias or other contoured features of the ink ejection face.

Claims (10)

  1. Integrierter Schaltkreis eines Druckkopfes aufweisend ein Substrat (1) mit einer Mehrzahl an Tintenstrahl-Düsen-Einrichtungen (100), die auf einer Fläche des Substrates ausgebildet sind, wobei das Substrat einen Antriebskreis zur Energieversorgung an die besagten Düsen-Einrichtungen hat, wobei jede Düsen-Einrichtung aufweist:
    eine Düsenkammer (5) zum Aufnehmen von Tinte, wobei die Düsenkammer eine Düsenöffnung (13) hat, die in einer Überdachung der Düsenkammer definiert ist, sowie eine Wand aus Isolationsmaterial, mit dem eine Seitenwand (4) der Düsenkammer definiert ist;
    ein Stellglied (10) zum Ausstoßen von Tinte durch die besagte DüsenÖffnung (13);
    ein Paar Elektroden (2), die an besagter Fläche des Substrates (1) positioniert sind, wobei die Elektroden elektrisch an dem Antriebkreis angeschlossen sind; und
    erste und zweite Anschlussstellen (8), wobei jede Anschlussstelle eine entsprechende Elektrode (2) an das Stellglied (8) elektrisch anschließt, wobei sich jede Anschlussstelle (8) linear von einer entsprechenden Elektrode (2) zu dem Stellglied (8) erstreckt, und wobei jede Anschlussstelle (8) einen in der Seitenwand (4) der Düsenkammer (5) definierten Kontaktdurchgang füllt, dadurch gekennzeichnet,
    dass das Stellglied ein thermisches Biege-Stellglied ist, das ein gekrümmtes oder serpentinenplanares, aktives Trägerelement aufweist, das mit einem planaren, passiven Trägerelement mechanisch zusammenwirkt;
    und das thermische Biege-Stellglied zumindest teilweise die Überdachung der besagten Düsenkammer definiert;
    und
    das planare Trägerelement ein erstes Ende hat, das über der besagten ersten Anschlussstelle positioniert ist, sowie ein zweites Ende, das über der besagten zweiten Anschlussstelle positioniert ist, wobei die erste und zweite Anschlussstelle angrenzend zueinander sind.
  2. Integrierter Schaltkreis eines Druckkopfes nach Anspruch 1, wobei jede Anschlussstelle (8) bezüglich der Fläche des besagten Substrates (1) rechtwinklig ist.
  3. Integrierter Schaltkreis eines Druckkopfes nach Anspruch 1 oder 2, wobei eine kürzeste Distanz zwischen dem Stellglied (10) und den Elektroden (2) mindestens 5 Mikrometer beträgt.
  4. Integrierter Schaltkreis eines Druckkopfes nach einem der vorangehenden Ansprüche, wobei eine minimale Querschnittsdimension der besagten Anschlussstellen (8) 2 Mikrometer oder größer ist.
  5. Integrierter Schaltkreis eines Druckkopfes nach einem der vorangehenden Ansprüche, wobei die besagten Düseneinrichtungen (100) in einer Mehrzahl von Düsenreihen angeordnet sind, welche Düsenreihen sich längsseits über das Substrat (1) erstrecken.
  6. Integrierter Schaltkreis eines Druckkopfes nach Anspruch 5, wobei eine Distanz zwischen angrenzenden Düsenöffnungen (13) innerhalb einer Düsenreihe weniger als 50 Mikrometer beträgt.
  7. Integrierter Schaltkreis eines Druckkopfes nach Anspruch 1, ferner aufweisend ein erstes interstitielles Metallkissen (9), das zwischen der Oberseite einer jeden Anschlussstelle (8) und dem besagten aktiven Trägerelement (10) positioniert ist, wobei jedes erste interstitielle Metallkissen dazu bestimmt ist, einen Stromfluss von einer entsprechenden Anschlussstelle zu dem aktiven Trägerelement zu erleichtern.
  8. Integrierter Schaltkreis eines Druckkopfes nach einem der vorangehenden Ansprüche, wobei das aktive Trägerelement (10) aus einem aktiven Trägermaterial ist, ausgewählt aus der Gruppe umfassend: Aluminiumlegierungen; Titannitrid; Titan-Aluminiumnitrid; Vanadium-Alumiumlegierung.
  9. Integrierter Schaltkreis eines Druckkopfes nach einem der vorangehenden Ansprüche, wobei die Seitenwand (4) aus einem Material ist, ausgewählt aus der Gruppe umfassend: Silikonoxid, Silikonnitrid, Silikon-Oxinitrid und Aluminiumoxid.
  10. Seitenbreiter Tintenstrahl-Druckkopf aufweisend eine Mehrzahl an integrierten Schaltkreisen eines Druckkopfes gemäß einem der vorangehenden Ansprüche.
EP12174685.3A 2007-06-15 2007-06-15 Integrierte Schaltung für einen Druckkopf Active EP2527152B1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP12174685.3A EP2527152B1 (de) 2007-06-15 2007-06-15 Integrierte Schaltung für einen Druckkopf

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
PCT/AU2007/000846 WO2008151351A1 (en) 2007-06-15 2007-06-15 Method of forming connection between electrode and actuator in an inkjet nozzle assembly
EP07870177A EP2160296B1 (de) 2007-06-15 2007-06-15 Verfahren zur herstellung einer verbindung zwischen einer elektrode und einem stellglied in einer tintenstrahldüsenanordnung
EP12174685.3A EP2527152B1 (de) 2007-06-15 2007-06-15 Integrierte Schaltung für einen Druckkopf

Related Parent Applications (2)

Application Number Title Priority Date Filing Date
EP07870177.8 Division 2007-06-15
EP07870177A Division-Into EP2160296B1 (de) 2007-06-15 2007-06-15 Verfahren zur herstellung einer verbindung zwischen einer elektrode und einem stellglied in einer tintenstrahldüsenanordnung

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EP2527152A1 EP2527152A1 (de) 2012-11-28
EP2527152B1 true EP2527152B1 (de) 2013-12-11

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EP12174685.3A Active EP2527152B1 (de) 2007-06-15 2007-06-15 Integrierte Schaltung für einen Druckkopf
EP07870177A Active EP2160296B1 (de) 2007-06-15 2007-06-15 Verfahren zur herstellung einer verbindung zwischen einer elektrode und einem stellglied in einer tintenstrahldüsenanordnung

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KR (1) KR101064043B1 (de)
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TWI495570B (zh) * 2009-07-27 2015-08-11 Memjet Technology Ltd 具背側電連接之噴墨列印頭組件
JP6575097B2 (ja) * 2015-03-24 2019-09-18 セイコーエプソン株式会社 ヘッドユニットおよび液体吐出装置

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CN1191936C (zh) 1996-04-23 2005-03-09 萨尔技术有限公司 液滴沉积装置及其制造方法
JPH11320873A (ja) * 1997-06-05 1999-11-24 Ricoh Co Ltd インクジェットヘッド
US6416168B1 (en) * 1997-07-15 2002-07-09 Silverbrook Research Pty Ltd Pump action refill ink jet printing mechanism
US6648453B2 (en) * 1997-07-15 2003-11-18 Silverbrook Research Pty Ltd Ink jet printhead chip with predetermined micro-electromechanical systems height
US6682174B2 (en) * 1998-03-25 2004-01-27 Silverbrook Research Pty Ltd Ink jet nozzle arrangement configuration
US6416167B1 (en) 1997-07-15 2002-07-09 Silverbrook Research Pty Ltd Thermally actuated ink jet printing mechanism having a series of thermal actuator units
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JP4296361B2 (ja) * 1999-04-06 2009-07-15 富士フイルム株式会社 インクジェットヘッド、インクジェットプリンタ、及び、インクジェットヘッドの製造方法
US6265301B1 (en) * 1999-05-12 2001-07-24 Taiwan Semiconductor Manufacturing Company Method of forming metal interconnect structures and metal via structures using photolithographic and electroplating or electro-less plating procedures
JP4288399B2 (ja) * 2000-03-31 2009-07-01 富士フイルム株式会社 マルチノズルインクジェットヘッド及びその製造方法
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TW200500292A (en) * 2002-11-20 2005-01-01 Reveo Inc Method of fabricating multi layer MENs and microfluidic devices
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TW200848270A (en) 2008-12-16
EP2527152A1 (de) 2012-11-28
TWI409175B (zh) 2013-09-21
CA2688245C (en) 2012-12-18
TWI406772B (zh) 2013-09-01
CA2688245A1 (en) 2008-12-18
KR20100029187A (ko) 2010-03-16
EP2160296A1 (de) 2010-03-10
KR101064043B1 (ko) 2011-09-08
WO2008151351A1 (en) 2008-12-18
TW200848271A (en) 2008-12-16
EP2160296B1 (de) 2012-08-15
EP2160296A4 (de) 2010-09-08

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