EP2160296B1 - Verfahren zur herstellung einer verbindung zwischen einer elektrode und einem stellglied in einer tintenstrahldüsenanordnung - Google Patents

Verfahren zur herstellung einer verbindung zwischen einer elektrode und einem stellglied in einer tintenstrahldüsenanordnung Download PDF

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Publication number
EP2160296B1
EP2160296B1 EP07870177A EP07870177A EP2160296B1 EP 2160296 B1 EP2160296 B1 EP 2160296B1 EP 07870177 A EP07870177 A EP 07870177A EP 07870177 A EP07870177 A EP 07870177A EP 2160296 B1 EP2160296 B1 EP 2160296B1
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EP
European Patent Office
Prior art keywords
actuator
electrode
nozzle
nozzle assembly
active beam
Prior art date
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Active
Application number
EP07870177A
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English (en)
French (fr)
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EP2160296A4 (de
EP2160296A1 (de
Inventor
Gregory John Mcavoy
Kia Silverbrook
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zamtec Ltd
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Silverbrook Research Pty Ltd
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Priority to EP12174685.3A priority Critical patent/EP2527152B1/de
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Publication of EP2160296A4 publication Critical patent/EP2160296A4/de
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1648—Production of print heads with thermal bend detached actuators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1628—Manufacturing processes etching dry etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1631—Manufacturing processes photolithography
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1635—Manufacturing processes dividing the wafer into individual chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1642—Manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1643—Manufacturing processes thin film formation thin film formation by plating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1645—Manufacturing processes thin film formation thin film formation by spincoating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14427—Structure of ink jet print heads with thermal bend detached actuators
    • B41J2002/14435—Moving nozzle made of thermal bend detached actuator
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
    • B41J2202/01—Embodiments of or processes related to ink-jet heads
    • B41J2202/18—Electrical connection established using vias

Definitions

  • Thermal bend actuation generally means bend movement generated by thermal expansion of one material, having a current passing therethough, relative to another material. The resulting bend movement may be used to eject ink from a nozzle opening, optionally via movement of a paddle or vane, which creates a pressure wave in a nozzle chamber.
  • said layer of drive circuitry is a CMOS layer of a silicon substrate.
  • said via has sidewalls perpendicular to a face of said substrate.
  • said via has a minimum cross-sectional dimension of 1 micron or greater.
  • said conductive material is copper.
  • step (e) comprises depositing an active beam material onto a passive beam material.
  • a wall of insulating material defines sidewalls of said nozzle chamber.
  • said active beam member is comprised of an active beam material selected from the group comprising: aluminium alloys; titanium nitride and titanium aluminium nitride.
  • said planar active beam member comprises a bent or serpentine beam element, said beam element having a first end positioned over a first connector post and a second end positioned over a second connector post, said first and second connector posts being adjacent each other.
  • Another unclaimed example provides a printhead integrated circuit further comprising an exterior surface layer of hydrophobic polymer on said roof.
  • said exterior surface layer defines a planar ink ejection face of said printhead integrated cicuit, said planar ink ejection face having no substantial contours apart from said nozzle openings.
  • MEMS fabrication of inkjet nozzles relied primarily on standard PECVD (plasma-enhanced chemical vapor deposition) and mask/etch steps to build up a nozzle structure.
  • PECVD plasma-enhanced chemical vapor deposition
  • the use of PECVD to deposit simultaneously the active beam 411 and a connection to the electrode 416 has advantages from a MEMS fabrication standpoint, but inevitably leads to a thin, tortuous connection which is disadvantageous in terms of current losses. The current losses are exacerbated further when the beam material does not have optimal conductivity.
  • a vanadium-aluminium alloy has excellent thermoelastic properties, but poorer electrical conductivity compared to, for example, aluminium.
  • the present Applicants have developed a new method for fabricating a mechanical thermal bend inkjet nozzle assembly, which does not rely on PECVD for forming connections from CMOS contacts to the actuator.
  • the resultant inkjet nozzle assembly has minimal electrical losses and has an additional structural advantage of a planar ink ejection face.
  • the invention is exemplified with reference to a mechanical thermal bend inkjet nozzle assembly, it will readily appreciated that it may be applied to any type of inkjet nozzle fabricated by MEMS techniques.
  • the other electrode 3 shown in Figures 4 and 5 is for supplying power to an adjacent inkjet nozzle.
  • the drawings shows MEMS fabrication steps for a nozzle assembly, which is one of an array of nozzle assemblies. The following description focuses on fabrication steps for one of these nozzle assemblies. However, it will of course be appreciated that corresponding steps are being performed simultaneously for all nozzle assemblies that are being formed on the wafer. Where an adjacent nozzle assembly is partially shown in the drawings, this can be ignored for the present purposes. Accordingly, the electrode 3 and all features of the adjacent nozzle assembly will not be described in detail herein. Indeed, in the interests of clarity, some MEMS fabrication steps will not be shown on adjacent nozzle assemblies.
  • the resultant nozzle assembly 100 shown in Figures 25 and 26 has several additional advantages over the nozzle assembly 400 shown in Figures 1 and 2 .
  • the nozzle assembly 100 has minimal electrical losses in the connection between the active beam 10 of the actuator and the electrodes 2.
  • the copper connector posts 8 have excellent conductivity. This is due to their relatively large cross-sectional dimension (> 1.5 microns); the inherent high conductivity of copper; and the absence of any bends in the connection. Accordingly, the copper connector posts 8 maximizes power transfer from the drive circuitry to the actuator.
  • the corresponding connection in the nozzle assembly 400, shown in Figures 1 and 2 is relatively thin, tortuous and generally formed of the same material as the active beam 411.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)

Claims (14)

  1. Verfahren zu Herstellen ein elektrischen Verbindung zwischen einer Elektrode un einen Aktuator in einem Tintenstrahl-Düsenanordnung, wobei as Verfahren die folgenden Schritte:
    (A) Bereitstellen eines Substrats (1) mit einer Schicht aus Treiberschaltung, wobei die Treiberschaltung einschließlich der Elektrode (2) zur Verbindung mit dem Antrieb;
    (B) Bilden einer Wand (4) aus Isoliermaterial über der Elektrode (2);
    (C) eine über mindestens die Wand (4), wobei über enthüllt der Elektrode (2);
    (D) Füllen des Durchgangslochs mit einem leitfähigen Material, um eine Verbindungsbrücke (8) zu liefern,
    (E) mindestens einen Teil des Aktors (10) über der Verbindungsbrücke, wodurch eine elektrische Verbindung zwischen dem Aktor (10) und der Elektrode,
    dadurch gekennzeichnet, daß:
    die an (4) aus isolierendem Werkstoff eine Seitenwand eines Düsenkammer und
    die Füllung der Schrift (d) verwendet stromlose Abscheidung.
  2. Verfahren nach Anspruch 1, wobei ein Abstand zwischen dem Stellglied (10) und der Elektrode mindestens 5 Mikrometer.
  3. Verfahren nach Anspruch 1, wobei die Schicht aus Treiberschaltung ein CMOS-Schicht aus einem Silizium-Substrat.
  4. Verfahren nach Anspruch 1, wobei die Treiberschaltung ein Paar von Elektroden für jeden Tintenstrahldüse Anordnung, wobei jede der Elektroden verbunden ist, um den Aktuator mit einem entsprechenden Anschluss nach.
  5. Verfahren nach Anspruch 1, wobei die Wand aus isolierendem Material aus Siliziumdioxid besteht.
  6. Verfahren nach Anspruch 1, wobei über hat Seitenwände an einer Fläche des Substrats senkrecht.
  7. Verfahren nach Anspruch 1, wobei das leitfähige Material Kupfer ist.
  8. Verfahren nach Anspruch 1, umfassend den weiteren Schritt:
    Aufbringen einer Katalysatorschicht auf einer Basis des über vor dem stromlosen Plattieren.
  9. Verfahren nach Anspruch 8, wobei der Katalysator Palladium ist.
  10. Verfahren nach Anspruch 1, wobei das leitfähige Material durch chemischmechanisches Polieren vor dem Bilden der Aktuator planarisiert.
  11. Verfahren nach Anspruch 1, wobei der Aktuator ein Thermobiegebetätigungselement, umfassend eine ebene aktive Balkenelement mechanisch, die mit einer ebenen passiven Trägerelement.
  12. Verfahren nach Anspruch 11, wobei die Thermobiegebetätigungselement definiert, zumindest teilweise, ein Dach der Düsenkammer.
  13. Verfahren nach Anspruch 11, wobei Schritt (e) das Ausbringen eines aktiven Materials auf einen Träger passiven Flankenschutzmaterial.
  14. Verfahren nach Anspruch 14, wobei die aktive Balkenelement, bestehend aus dem aktiven Strahl Material, erstreckt sich von einer Oberseite des Verbinders Beitrag in einer Ebene senkrecht zu der Post.
EP07870177A 2007-06-15 2007-06-15 Verfahren zur herstellung einer verbindung zwischen einer elektrode und einem stellglied in einer tintenstrahldüsenanordnung Active EP2160296B1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP12174685.3A EP2527152B1 (de) 2007-06-15 2007-06-15 Integrierte Schaltung für einen Druckkopf

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/AU2007/000846 WO2008151351A1 (en) 2007-06-15 2007-06-15 Method of forming connection between electrode and actuator in an inkjet nozzle assembly

Related Child Applications (1)

Application Number Title Priority Date Filing Date
EP12174685.3A Division-Into EP2527152B1 (de) 2007-06-15 2007-06-15 Integrierte Schaltung für einen Druckkopf

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EP2160296A1 EP2160296A1 (de) 2010-03-10
EP2160296A4 EP2160296A4 (de) 2010-09-08
EP2160296B1 true EP2160296B1 (de) 2012-08-15

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EP12174685.3A Active EP2527152B1 (de) 2007-06-15 2007-06-15 Integrierte Schaltung für einen Druckkopf

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EP (2) EP2160296B1 (de)
KR (1) KR101064043B1 (de)
CA (1) CA2688245C (de)
TW (2) TWI406772B (de)
WO (1) WO2008151351A1 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI495570B (zh) * 2009-07-27 2015-08-11 Memjet Technology Ltd 具背側電連接之噴墨列印頭組件
JP6575097B2 (ja) * 2015-03-24 2019-09-18 セイコーエプソン株式会社 ヘッドユニットおよび液体吐出装置

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Publication number Priority date Publication date Assignee Title
RU2165853C2 (ru) 1996-04-23 2001-04-27 Ксаар Текнолоджи Лимитед Устройство нанесения капель
JPH11320873A (ja) * 1997-06-05 1999-11-24 Ricoh Co Ltd インクジェットヘッド
US6648453B2 (en) * 1997-07-15 2003-11-18 Silverbrook Research Pty Ltd Ink jet printhead chip with predetermined micro-electromechanical systems height
US6416168B1 (en) * 1997-07-15 2002-07-09 Silverbrook Research Pty Ltd Pump action refill ink jet printing mechanism
US6260953B1 (en) 1997-07-15 2001-07-17 Silverbrook Research Pty Ltd Surface bend actuator vented ink supply ink jet printing mechanism
US6416167B1 (en) 1997-07-15 2002-07-09 Silverbrook Research Pty Ltd Thermally actuated ink jet printing mechanism having a series of thermal actuator units
US6682174B2 (en) * 1998-03-25 2004-01-27 Silverbrook Research Pty Ltd Ink jet nozzle arrangement configuration
JP4296361B2 (ja) * 1999-04-06 2009-07-15 富士フイルム株式会社 インクジェットヘッド、インクジェットプリンタ、及び、インクジェットヘッドの製造方法
US6265301B1 (en) * 1999-05-12 2001-07-24 Taiwan Semiconductor Manufacturing Company Method of forming metal interconnect structures and metal via structures using photolithographic and electroplating or electro-less plating procedures
JP4288399B2 (ja) * 2000-03-31 2009-07-01 富士フイルム株式会社 マルチノズルインクジェットヘッド及びその製造方法
DE60040622D1 (de) * 2000-05-24 2008-12-04 Silverbrook Res Pty Ltd Fluidische dichtung für tintenstrahldüsenanordung
US6623101B1 (en) 2000-10-20 2003-09-23 Silverbrook Research Pty Ltd Moving nozzle ink jet
KR100552660B1 (ko) * 2001-08-09 2006-02-20 삼성전자주식회사 버블 젯 방식의 잉크 젯 프린트 헤드
TW200500292A (en) * 2002-11-20 2005-01-01 Reveo Inc Method of fabricating multi layer MENs and microfluidic devices
US6755509B2 (en) * 2002-11-23 2004-06-29 Silverbrook Research Pty Ltd Thermal ink jet printhead with suspended beam heater
US7614727B2 (en) * 2004-09-30 2009-11-10 Fujifilm Corporation Liquid ejection head, manufacturing method thereof, and image forming apparatus
JP5008844B2 (ja) 2005-08-23 2012-08-22 株式会社リコー 液滴吐出ヘッド、インクジェット記録装置、及び液滴吐出ヘッドの製造方法

Also Published As

Publication number Publication date
TWI406772B (zh) 2013-09-01
TW200848271A (en) 2008-12-16
CA2688245A1 (en) 2008-12-18
EP2160296A4 (de) 2010-09-08
KR101064043B1 (ko) 2011-09-08
TW200848270A (en) 2008-12-16
CA2688245C (en) 2012-12-18
WO2008151351A1 (en) 2008-12-18
KR20100029187A (ko) 2010-03-16
EP2160296A1 (de) 2010-03-10
TWI409175B (zh) 2013-09-21
EP2527152B1 (de) 2013-12-11
EP2527152A1 (de) 2012-11-28

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