TW200500292A - Method of fabricating multi layer MENs and microfluidic devices - Google Patents
Method of fabricating multi layer MENs and microfluidic devicesInfo
- Publication number
- TW200500292A TW200500292A TW092132579A TW92132579A TW200500292A TW 200500292 A TW200500292 A TW 200500292A TW 092132579 A TW092132579 A TW 092132579A TW 92132579 A TW92132579 A TW 92132579A TW 200500292 A TW200500292 A TW 200500292A
- Authority
- TW
- Taiwan
- Prior art keywords
- layers
- multi layer
- microfluidic devices
- devices
- microelectromechanical
- Prior art date
Links
Abstract
A method for fabricating multi layer microelectromechanical and microfluidic devices is disclosed. Multi layer microelectromechanical and microfluidic devices are fabricated on a substrate with layers of predetermined weak and strong bond regions where deconstructed layers of devices at or on the weak bond regions. The layers are then peeled and subsequently bonded to produce a multi layer microelectromechanical and microfluidic devices. An arbitrary number of layers can be bonded and stacked to create either microelectromechanical or microfluidic device or a hybrid type of device. Also disclosed are methods of creating edge interconnects and vias through the substrate to form interconnections between layers and devices thereon.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US42812502P | 2002-11-20 | 2002-11-20 | |
US43923203P | 2003-01-10 | 2003-01-10 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200500292A true TW200500292A (en) | 2005-01-01 |
Family
ID=57797933
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW092132579A TW200500292A (en) | 2002-11-20 | 2003-11-20 | Method of fabricating multi layer MENs and microfluidic devices |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW200500292A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI409175B (en) * | 2007-06-15 | 2013-09-21 | Silverbrook Res Pty Ltd | Printhead integrated circuit comprising inkjet nozzle assemblies having connector posts |
TWI458641B (en) * | 2010-05-27 | 2014-11-01 | Hewlett Packard Development Co | Printhead and related methods and systems |
TWI567023B (en) * | 2012-05-14 | 2017-01-21 | 羅伯特博斯奇股份有限公司 | Sensor component |
TWI742099B (en) * | 2016-06-29 | 2021-10-11 | 美商通用電機股份有限公司 | System and method for fault interruption with mems switches |
-
2003
- 2003-11-20 TW TW092132579A patent/TW200500292A/en unknown
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI409175B (en) * | 2007-06-15 | 2013-09-21 | Silverbrook Res Pty Ltd | Printhead integrated circuit comprising inkjet nozzle assemblies having connector posts |
TWI458641B (en) * | 2010-05-27 | 2014-11-01 | Hewlett Packard Development Co | Printhead and related methods and systems |
TWI567023B (en) * | 2012-05-14 | 2017-01-21 | 羅伯特博斯奇股份有限公司 | Sensor component |
TWI742099B (en) * | 2016-06-29 | 2021-10-11 | 美商通用電機股份有限公司 | System and method for fault interruption with mems switches |
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