CA2688245A1 - Method of forming connection between electrode and actuator in an inkjet nozzle assembly - Google Patents
Method of forming connection between electrode and actuator in an inkjet nozzle assembly Download PDFInfo
- Publication number
- CA2688245A1 CA2688245A1 CA002688245A CA2688245A CA2688245A1 CA 2688245 A1 CA2688245 A1 CA 2688245A1 CA 002688245 A CA002688245 A CA 002688245A CA 2688245 A CA2688245 A CA 2688245A CA 2688245 A1 CA2688245 A1 CA 2688245A1
- Authority
- CA
- Canada
- Prior art keywords
- actuator
- electrode
- connector post
- active beam
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract 24
- 239000004020 conductor Substances 0.000 claims abstract 5
- 239000011810 insulating material Substances 0.000 claims abstract 4
- 239000000758 substrate Substances 0.000 claims abstract 4
- 238000007772 electroless plating Methods 0.000 claims abstract 3
- 238000000151 deposition Methods 0.000 claims 6
- 239000000463 material Substances 0.000 claims 6
- 229910052751 metal Inorganic materials 0.000 claims 5
- 239000002184 metal Substances 0.000 claims 5
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical group [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 2
- 239000003054 catalyst Substances 0.000 claims 2
- 230000008021 deposition Effects 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 229910052763 palladium Inorganic materials 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 235000012239 silicon dioxide Nutrition 0.000 claims 1
- 239000000377 silicon dioxide Substances 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1648—Production of print heads with thermal bend detached actuators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1628—Manufacturing processes etching dry etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1635—Manufacturing processes dividing the wafer into individual chips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1642—Manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1643—Manufacturing processes thin film formation thin film formation by plating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1645—Manufacturing processes thin film formation thin film formation by spincoating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14427—Structure of ink jet print heads with thermal bend detached actuators
- B41J2002/14435—Moving nozzle made of thermal bend detached actuator
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/18—Electrical connection established using vias
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Abstract
A method of forming an electrical connection between an electrode and an actuator in an inkjet nozzle assembly is provided. The method comprises the steps of: (a) providing a substrate having a layer of drive circuitry, the drive circuitry including the electrode for connection to the actuator; (b) forming a wall of insulating material over the electrode; (c) defining a via in the wall, the via revealing the electrode; (d) filling the via with a conductive material using electroless plating to provide a connector post; (e) forming at least part of the actuator over the connector post, thereby providing electrical connection between the actuator and the electrode.
Claims (20)
1. A method of forming an electrical connection between an electrode and an actuator in an inkjet nozzle assembly, said method comprising the steps of:
(a) providing a substrate having a layer of drive circuitry, said drive circuitry including the electrode for connection to the actuator;
(b) forming a wall of insulating material over said electrode;
(c) defining a via in at least said wall, said via revealing said electrode;
(d) filling said via with a conductive material using electroless plating to provide a connector post;
(e) forming at least part of the actuator over said connector post, thereby providing electrical connection between the actuator and the electrode.
(a) providing a substrate having a layer of drive circuitry, said drive circuitry including the electrode for connection to the actuator;
(b) forming a wall of insulating material over said electrode;
(c) defining a via in at least said wall, said via revealing said electrode;
(d) filling said via with a conductive material using electroless plating to provide a connector post;
(e) forming at least part of the actuator over said connector post, thereby providing electrical connection between the actuator and the electrode.
2. The method of claim 1, wherein a distance between said actuator and said electrode is at least 5 microns.
3. The method of claim 1, wherein said layer of drive circuitry is a CMOS
layer of a silicon substrate.
layer of a silicon substrate.
4. The method of claim 1, wherein said drive circuitry includes a pair of electrodes for each inkjet nozzle assembly, each of said electrodes being connected to said actuator with a respective connector post.
5. The method of claim 1, wherein said wall of insulating material is comprised of silicon dioxide.
6. The method of claim 1, wherein said via has sidewalls perpendicular to a face of said substrate.
7. The method of claim 1, wherein said via has a minimum cross-sectional dimension of 1 micron or greater.
8. The method of claim 1, wherein said conductive material is a metal.
9. The method of claim 1, wherein said conductive material is copper.
10. The method of claim 1, comprising the further step of:
depositing a catalyst layer on a base of said via prior to said electroless plating.
depositing a catalyst layer on a base of said via prior to said electroless plating.
11. The method of claim 10, wherein said catalyst is palladium.
12. The method of claim 1, wherein said conductive material is planarized by chemical mechanical planarization prior to forming said actuator.
13. The method of claim 1, wherein said actuator is a thermal bend actuator comprising a planar active beam member mechanically cooperating with a planar passive beam member.
14. The method of claim 13, wherein said thermal bend actuator defines, at least partially, a roof of a nozzle chamber for said inkjet nozzle assembly.
15. The method of claim 14, wherein said wall of insulating material defines a sidewall of said nozzle chamber.
16. The method of claim 13, wherein step (e) comprises depositing an active beam material onto a passive beam material.
17. The method of claim 16, wherein said active beam member, comprised of said active beam material, extends from a top of said connector post in a plane perpendicular to said post.
18. The method of claim 17, further comprising the step of:
depositing a first metal pad over a top of said connector post prior to deposition of said active beam material, said first metal pad being configured to facilitate current flow from the connector post to the active beam member.
depositing a first metal pad over a top of said connector post prior to deposition of said active beam material, said first metal pad being configured to facilitate current flow from the connector post to the active beam member.
19. The method of claim 17, wherein said planar active beam member comprises a bent or serpentine beam element, said beam element having a first end positioned over a first connector post and a second end positioned over a second connector post, said first and second connector posts being adjacent each other.
20. The method of claim 19, further comprising the step of:
depositing one or more second metal pads onto said passive beam material prior to deposition of said active beam material, said second metal pad being positioned to facilitate current flow in bend regions of said beam element.
depositing one or more second metal pads onto said passive beam material prior to deposition of said active beam material, said second metal pad being positioned to facilitate current flow in bend regions of said beam element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CA2795383A CA2795383C (en) | 2007-06-15 | 2007-06-15 | Printhead integrated circuit comprising nozzle assemblies with connector posts defined in chamber sidewalls |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/AU2007/000846 WO2008151351A1 (en) | 2007-06-15 | 2007-06-15 | Method of forming connection between electrode and actuator in an inkjet nozzle assembly |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA2795383A Division CA2795383C (en) | 2007-06-15 | 2007-06-15 | Printhead integrated circuit comprising nozzle assemblies with connector posts defined in chamber sidewalls |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CA2688245A1 true CA2688245A1 (en) | 2008-12-18 |
| CA2688245C CA2688245C (en) | 2012-12-18 |
Family
ID=40129117
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA2688245A Active CA2688245C (en) | 2007-06-15 | 2007-06-15 | Method of forming connection between electrode and actuator in an inkjet nozzle assembly |
Country Status (5)
| Country | Link |
|---|---|
| EP (2) | EP2527152B1 (en) |
| KR (1) | KR101064043B1 (en) |
| CA (1) | CA2688245C (en) |
| TW (2) | TWI409175B (en) |
| WO (1) | WO2008151351A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI495570B (en) * | 2009-07-27 | 2015-08-11 | Memjet Technology Ltd | Inkjet printhead assembly having backside electrical connection |
| JP6575097B2 (en) * | 2015-03-24 | 2019-09-18 | セイコーエプソン株式会社 | Head unit and liquid ejection device |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3177897B2 (en) | 1996-04-23 | 2001-06-18 | ザール テクノロジー リミテッド | Droplet deposit device |
| JPH11320873A (en) * | 1997-06-05 | 1999-11-24 | Ricoh Co Ltd | Ink-jet head |
| US6648453B2 (en) * | 1997-07-15 | 2003-11-18 | Silverbrook Research Pty Ltd | Ink jet printhead chip with predetermined micro-electromechanical systems height |
| US6416167B1 (en) | 1997-07-15 | 2002-07-09 | Silverbrook Research Pty Ltd | Thermally actuated ink jet printing mechanism having a series of thermal actuator units |
| US6682174B2 (en) * | 1998-03-25 | 2004-01-27 | Silverbrook Research Pty Ltd | Ink jet nozzle arrangement configuration |
| US6260953B1 (en) | 1997-07-15 | 2001-07-17 | Silverbrook Research Pty Ltd | Surface bend actuator vented ink supply ink jet printing mechanism |
| US6416168B1 (en) * | 1997-07-15 | 2002-07-09 | Silverbrook Research Pty Ltd | Pump action refill ink jet printing mechanism |
| JP4296361B2 (en) * | 1999-04-06 | 2009-07-15 | 富士フイルム株式会社 | Inkjet head, inkjet printer, and inkjet head manufacturing method |
| US6265301B1 (en) * | 1999-05-12 | 2001-07-24 | Taiwan Semiconductor Manufacturing Company | Method of forming metal interconnect structures and metal via structures using photolithographic and electroplating or electro-less plating procedures |
| JP4288399B2 (en) * | 2000-03-31 | 2009-07-01 | 富士フイルム株式会社 | Multi-nozzle inkjet head and method for manufacturing the same |
| WO2001089842A1 (en) * | 2000-05-24 | 2001-11-29 | Silverbrook Research Pty. Ltd. | Fluidic seal for an ink jet nozzle assembly |
| US6623101B1 (en) | 2000-10-20 | 2003-09-23 | Silverbrook Research Pty Ltd | Moving nozzle ink jet |
| KR100552660B1 (en) * | 2001-08-09 | 2006-02-20 | 삼성전자주식회사 | Bubble-jet type ink-jet print head |
| TW200500292A (en) * | 2002-11-20 | 2005-01-01 | Reveo Inc | Method of fabricating multi layer MENs and microfluidic devices |
| US6755509B2 (en) * | 2002-11-23 | 2004-06-29 | Silverbrook Research Pty Ltd | Thermal ink jet printhead with suspended beam heater |
| US7614727B2 (en) * | 2004-09-30 | 2009-11-10 | Fujifilm Corporation | Liquid ejection head, manufacturing method thereof, and image forming apparatus |
| JP5008844B2 (en) | 2005-08-23 | 2012-08-22 | 株式会社リコー | Droplet discharge head, inkjet recording apparatus, and method of manufacturing droplet discharge head |
-
2007
- 2007-06-15 KR KR1020097025354A patent/KR101064043B1/en active IP Right Grant
- 2007-06-15 EP EP12174685.3A patent/EP2527152B1/en active Active
- 2007-06-15 CA CA2688245A patent/CA2688245C/en active Active
- 2007-06-15 WO PCT/AU2007/000846 patent/WO2008151351A1/en active Application Filing
- 2007-06-15 EP EP07870177A patent/EP2160296B1/en active Active
- 2007-10-09 TW TW096137839A patent/TWI409175B/en active
- 2007-10-09 TW TW096137838A patent/TWI406772B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| EP2527152B1 (en) | 2013-12-11 |
| CA2688245C (en) | 2012-12-18 |
| EP2160296A1 (en) | 2010-03-10 |
| EP2160296B1 (en) | 2012-08-15 |
| EP2160296A4 (en) | 2010-09-08 |
| KR101064043B1 (en) | 2011-09-08 |
| TW200848270A (en) | 2008-12-16 |
| WO2008151351A1 (en) | 2008-12-18 |
| TWI409175B (en) | 2013-09-21 |
| KR20100029187A (en) | 2010-03-16 |
| TWI406772B (en) | 2013-09-01 |
| EP2527152A1 (en) | 2012-11-28 |
| TW200848271A (en) | 2008-12-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EEER | Examination request |