EP2502470A1 - Cavité hf et accélérateur pourvu d'une telle cavité - Google Patents
Cavité hf et accélérateur pourvu d'une telle cavitéInfo
- Publication number
- EP2502470A1 EP2502470A1 EP10784723A EP10784723A EP2502470A1 EP 2502470 A1 EP2502470 A1 EP 2502470A1 EP 10784723 A EP10784723 A EP 10784723A EP 10784723 A EP10784723 A EP 10784723A EP 2502470 A1 EP2502470 A1 EP 2502470A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- cavity
- wall
- conductive wall
- cavity according
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000007787 solid Substances 0.000 claims abstract description 13
- 230000004913 activation Effects 0.000 claims abstract description 3
- 230000001681 protective effect Effects 0.000 claims description 20
- 229910000859 α-Fe Inorganic materials 0.000 claims description 8
- 230000001133 acceleration Effects 0.000 claims description 3
- 238000009413 insulation Methods 0.000 claims description 3
- 239000002245 particle Substances 0.000 claims description 3
- 238000012216 screening Methods 0.000 claims 1
- 239000006185 dispersion Substances 0.000 abstract 1
- 230000008878 coupling Effects 0.000 description 17
- 238000010168 coupling process Methods 0.000 description 17
- 238000005859 coupling reaction Methods 0.000 description 17
- 230000005670 electromagnetic radiation Effects 0.000 description 3
- 230000001902 propagating effect Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H7/00—Details of devices of the types covered by groups H05H9/00, H05H11/00, H05H13/00
- H05H7/14—Vacuum chambers
- H05H7/18—Cavities; Resonators
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H7/00—Details of devices of the types covered by groups H05H9/00, H05H11/00, H05H13/00
- H05H7/02—Circuits or systems for supplying or feeding radio-frequency energy
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H7/00—Details of devices of the types covered by groups H05H9/00, H05H11/00, H05H13/00
- H05H7/22—Details of linear accelerators, e.g. drift tubes
Definitions
- the invention relates to an RF cavity, in which RF power for generating an electromagnetic field in the interior of the RF cavity can be coupled. Furthermore, the invention relates to an accelerator with such an RF cavity. Such accelerators or such HF
- Cavities are commonly used to accelerate charged particles.
- RF cavities are known that can be excited to RF resonance by coupling RF power into the RF cavity.
- the RF power in turn, is generated remotely from the RF cavity, for example, using a klystron, and transported to the RF cavity by means of a waveguide.
- US 5,497,050 discloses another structure for coupling RF power into an RF cavity. This is done via a plurality of solid-state power transistors, which are integrated in a conductive wall of the RF cavity.
- the RF cavity according to the invention comprises
- a suffering wall surrounding the chamber which has an inner side and an outer side
- a switching arrangement having a plurality of solid-state switches arranged along a circumference of the wall around the chamber
- solid state switches are in communication with the conductive wall such that upon activation of the switching device
- RF currents are induced in the conductive wall, whereby RF power is coupled into the chamber of the RF cavity, wherein on the outside of the conductive wall along a circumference of the RF cavity, a shielding device is provided, which has the impedance of a propagation path increased from RF currents along the outside of the wall, so that the coupled-in into the wall RF currents are suppresses on the outer side of the wall un ⁇ .
- the invention is based on the realization that a is advantageous Be ⁇ locher inconvenience, as is described in US 5,497,050, in order to couple high RF services in a RF cavity.
- the area over which the RF power can be injected is larger in comparison to structures with a coupling only in one place, since the transistors extend over the entire circumference.
- the generation of the RF power to be injected takes place in the immediate vicinity of the RF cavity, whereby losses are avoided.
- this structure can be also ⁇ table.
- the RF power coupled into the wall of the RF cavity generates strong RF currents on the outside of the conductive wall. These high-frequency currents represent a problem during operation when the power requirement is high.
- a shielding device is provided, with which the impedance is increased at the outer side of the conductive wall, reduce the RF currents that would otherwise ent ⁇ long spread of a propagation path to the outer wall, visible and at best, even completely suppressed .
- the impedance increase on the outside of the conductive wall causes the RF currents, which are introduced via the direct connection of the solid-state switch with the conductive wall, to spread predominantly or entirely to the inside of the conductive wall.
- the outside of the conductive wall can now be set at ground potential so that the RF cavity can be more easily connected or coupled with other devices and used together.
- An outside of the conductive wall at ground potential increases safety during operation.
- the shielding comprises a first part and a second part, the first part being associated with the first Ab ⁇ section of the conductive wall and the second part the second part of the conductive wall.
- the solid state transistor switching circuitry provides the RF power through a slot between the first portion and the second portion of the conductive wall.
- the insulation between the first portion and the second portion of the conductive wall can simultaneously perform the function of a vacuum seal.
- the shielding device can realize the impedance increase in various ways.
- the shielding device may comprise a ribbed conductive structure, a ferrite ring and / or ⁇ / 4 stub.
- the conductive wall on the outside has a recess into which the shielding device is at least partially recessed.
- a ⁇ / 4 stub can be formed by the recess in the conductive wall. In this way, no additional material is necessary to achieve the impedance increase. Filling the recess with a dielectric makes it possible to adapt the stub line to the frequency of the HF currents.
- the stub can be arranged in a space-saving manner, when the stub is folded in, for example in the manner of a spiral.
- the solid state switches may additionally be surrounded by a conductive protective cage which communicates with the outside of the conductive wall. This makes it possible to shield the solid ⁇ body switch of electromagnetic radiation.
- the location where the guard cage communicates with the conductive wall may be selected such that the shielding device is between that location and the location where the RF currents are coupled from the solid state switches to the conductive wall. In this way, the part of the conductive wall at which RF currents can flow on the outside is inside the protective cage.
- the shielding device should not be placed in an off ⁇ saving the conductive wall inevitably. It can also be wholly or partially applied to the outside of the conductive wall.
- the shielding device can also be formed by the conductive protective cage surrounding the solid state switches and which communicates with the conductive wall.
- the protective cage communicates with both the first and second portions of the conductive wall. Without ribs for impedance increase on the inside of the protective cage, the protective cage would constitute a short circuit between the first section and the second section of the conductive wall without further measures, such as a further shielding device from the protective cage.
- the ribs however, an impedance increase in the RF range is achieved, which prevents this.
- suppression of the RF currents is achieved on the outside of the wall through the conductive protective cage, as an off ⁇ spread the RF currents is suppressed at the outside of the conductive wall through the contact points of the protective cage with the conductive wall.
- the RF cavity can be an RF resonator, which can be used in particular to accelerate particles.
- a plurality of such RF resonators can be connected in series and, in particular, controlled independently of one another.
- HF cavities Because no HF currents flow on the outside of the HF cavity, several of these HF cavities can be connected one after the other to form an accelerator unit.
- the RF cavities are then decoupled from each other in the high frequency range despite coupling.
- the coupling refers only to a direct current component (DC component).
- DC component direct current component
- the adaptation is more flexible than with an accelerator, in which the RF cavities are coupled together in the RF range, so that the control of one RF cavity simultaneously influences the RF fields in the adjacent RF cavity.
- the structure according to the invention for coupling RF power and shielding with respect to the outside world can also be used with other RF cavities, for example, the RF cavity can be designed as a coaxial electrical line or arranged in a re-entrant resonator structure.
- FIG. 2 shows a schematic overview of a cylindrical RF cavity with a coupling device arranged along its circumference for coupling RF power
- FIG. 3 shows a longitudinal section through an RF cavity with detail ⁇ lierterer representation of the coupling device, which comprises a designed as a ferrite shielding device,
- FIG. 4 shows a cross section through the RF cavity shown in FIG. 3 along the line III-III, FIG.
- FIG. 5 shows an enlargement of a part of a longitudinal section through a wall of an HF cavity to illustrate a shielding device designed as a ⁇ / 4 stub
- FIG. 6 and FIG. 7 each show another embodiment of the ⁇ / 4 stub shown in FIG. 5,
- FIG. 8 shows a longitudinal section through an HF cavity, in which the protective cage with inner ribs arranged around the power transistors serves as the shielding device
- FIG. 9 shows an HF cavity designed as a coaxial line.
- FIG. 1 shows a Seitansicht an RF cavity 11.
- a coupling device 13 arranged for coupling RF power, the RF cavity 11.
- FIG. 2 shows a front view of the HF cavity 11 shown in FIG. 1. The coupling device 13 will be described with reference to the longitudinal section in FIG. 3 and the cross section in FIG. 4 through the RF cavity 11 shown in FIG. 1 and FIG shown in more detail.
- Fig. 3 shows a longitudinal section 11.
- ⁇ provided Dar by the RF cavity is merely a wall side of the RF cavity 11 in the region in which the coupling device 13 is located.
- Shown is a conductive wall 15 having a first portion 21 and a second portion 23 which are isolated from each other.
- the annular insulation 27 simultaneously forms a vacuum seal.
- the conductive wall 15 has an inner surface 19 which is directed into the cavity of the RF cavity 11, and an outwardly Au ⁇ chseite 17.
- On the outer side 17 is the on ⁇ coupling device 13 for RF power.
- This comprises a plurality of solid-state transistors 29, which are in direct contact with a slot-like flange 25, which is formed by the first portion 21 and the second portion 23 of the lei ⁇ border wall 15.
- the solid-state transistors 29 are connected via leads 31 to a DC power source, not shown here.
- the solid-state transistors 29 in the conductive wall 15 induce RF currents propagating along the conductive wall 15.
- Wanted is a propagation along the inside 19 of the conductive wall.
- a shielding device is provided which, in the case shown here, is incorporated in a recess of the conductive wall 15.
- the recesses are filled in the embodiment shown here with a ferrite ring 33.
- the shielding device or the ferrite ring 33 is located both in the first portion 21 of the conductive wall 15 and in the second portion 23.
- the ferrite ring 33 increases the impedance on the outer side 17 of the electrically conductive wall 15, whereby a spread of HF currents along the outside 17 is prevented and is directed to the inside 19.
- the solid-state transistors 29 and the coupling point on the flange 25 are protected by a metallic protective cage 35, for example made of copper, from external electromagnetic radiation.
- the protective cage 35 contacts the electrically conductive wall 15 at a location on the outside 17, which is already protected by the shielding device from propagating RF currents.
- Fig. 4 shows a cross section along the line IV - IV in Fig. 3. To see the outer protective cage 35, some solid-state transistors 29 and the contact point with the flange 25 forming part of the conductive wall 15th
- the shielding device is shown as a ferrite ring 33 extending along the periphery of the RF cavity. Further embodiments are shown with reference to the following FIGS. 5 to 9.
- Fig. 5 shows a longitudinal section of the conductive wall 15, at a position which corresponds in Fig. 3 to the point at which the ferrite ring 33 is located.
- a recess 37 is incorporated, which is shaped so that it forms a ⁇ / 4 -Stichtechnisch.
- the ⁇ / 4 stub is tuned to the operating frequency of the RF cavity 11 such that propagation of RF currents along the outside 17 of the wall 15 is prevented by the ⁇ / 4 stub.
- the recess can be filled with a dielectric 39 according to FIG. 6, or else folded inwardly as shown in FIG. 7 (convolution 41).
- Fig. 8 shows a further embodiment of the shielding device.
- the shielding device is realized in that the protective cage 35, the conductive Contacted wall 15 and the solid state transistors 29 surrounds, is formed in a special way.
- Guard cage 35 has on its inside a plurality of ribs 43. On the basis of these ribs 43, the impedance of the path, which leads from the outside 17 of the conductive wall 15 along the inside of the protective cage 29, and thereby prevents HF currents along the outside 17 of the wall 15 from the injection site on the protective cage 29th would spread out.
- FIG. 9 shows an RF cavity, which is designed as a coaxial conductive connection 47.
- RF power can be fed into the coaxial connection via the coupling device 13 arranged on the outer conductor.
- FIG. 10 shows an accelerator unit, along which a plurality of RF cavities 11... II 1 ' 1 , as shown, for example, in FIG. 1 in FIG. 2, are arranged one behind the other. Since HF currents propagate only on the inside of the HF cavities 11... II 1 ' 1 , the HF cavities 11... 11''' are decoupled from one another in the high-frequency range and can therefore be individually controlled by a control device 45 can be controlled, whereby a flexible tuning of the RF cavities 11 ... 11 1 1 1 can be achieved to a desired acceleration.
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Particle Accelerators (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102009053624A DE102009053624A1 (de) | 2009-11-17 | 2009-11-17 | HF-Kavität sowie Beschleuniger mit einer derartigen HF-Kavität |
PCT/EP2010/065595 WO2011061026A1 (fr) | 2009-11-17 | 2010-10-18 | Cavité hf et accélérateur pourvu d'une telle cavité |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2502470A1 true EP2502470A1 (fr) | 2012-09-26 |
EP2502470B1 EP2502470B1 (fr) | 2014-09-17 |
Family
ID=43759711
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP10784723.8A Not-in-force EP2502470B1 (fr) | 2009-11-17 | 2010-10-18 | Cavité hf et accélérateur pourvu d'une telle cavité |
Country Status (7)
Country | Link |
---|---|
US (1) | US8779697B2 (fr) |
EP (1) | EP2502470B1 (fr) |
JP (1) | JP5567143B2 (fr) |
CN (1) | CN102612865B (fr) |
DE (1) | DE102009053624A1 (fr) |
RU (1) | RU2559031C2 (fr) |
WO (1) | WO2011061026A1 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2684249B1 (fr) * | 2011-05-04 | 2018-11-28 | Siemens Aktiengesellschaft | Générateur haute fréquence |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102010032214A1 (de) | 2010-07-26 | 2012-01-26 | Siemens Aktiengesellschaft | Methode und Anordnung zur Kontrolle von Schall- und Stoßwellen in einem Target eines Teilchenbeschleunigers |
DE102010032216B4 (de) | 2010-07-26 | 2012-05-03 | Siemens Aktiengesellschaft | Gepulste Spallations-Neutronenquelle |
DE102010041758B4 (de) * | 2010-09-30 | 2015-04-23 | Siemens Aktiengesellschaft | HF-Kavität mit Sender |
DE102010042055A1 (de) * | 2010-10-06 | 2012-04-12 | Siemens Aktiengesellschaft | Ringbeschleuniger |
RU2579748C2 (ru) * | 2010-10-06 | 2016-04-10 | Сименс Акциенгезелльшафт | Коаксиальный волновод с вч передатчиком |
DE102010042149B4 (de) * | 2010-10-07 | 2016-04-07 | Siemens Aktiengesellschaft | HF-Vorrichtung und Beschleuniger mit einer solchen HF-Vorrichtung |
DE102010043774A1 (de) | 2010-11-11 | 2012-05-16 | Siemens Aktiengesellschaft | Teilchenbeschleuniger und Verfahren zum Betreiben eines Teilchenbeschleunigers |
DE102010044113A1 (de) * | 2010-11-18 | 2012-05-24 | Siemens Aktiengesellschaft | HF-Kavität und Teilchenbeschleuniger mit HF-Kavität |
DE102011004401A1 (de) * | 2011-02-18 | 2012-08-23 | Siemens Aktiengesellschaft | HF-Vorrichtung |
DE102011082580A1 (de) * | 2011-09-13 | 2013-03-14 | Siemens Aktiengesellschaft | HF-Resonator und Teilchenbeschleuniger mit HF-Resonator |
DE102011083668A1 (de) * | 2011-09-29 | 2013-04-04 | Siemens Aktiengesellschaft | HF-Resonator und Teilchenbeschleuniger mit HF-Resonator |
US10448496B2 (en) | 2015-09-28 | 2019-10-15 | Fermi Research Alliance, Llc | Superconducting cavity coupler |
US10070509B2 (en) | 2015-09-29 | 2018-09-04 | Fermi Research Alliance, Llc | Compact SRF based accelerator |
CN106211538B (zh) * | 2016-09-26 | 2018-02-09 | 合肥中科离子医学技术装备有限公司 | 一种回旋加速器谐振腔的自动调谐装置和方法 |
US10340600B2 (en) | 2016-10-18 | 2019-07-02 | At&T Intellectual Property I, L.P. | Apparatus and methods for launching guided waves via plural waveguide systems |
EP3536132B1 (fr) * | 2016-11-03 | 2022-03-16 | Starfire Industries LLC | Système compact de couplage direct de puissance radioélectrique dans un accélérateur |
CN106385758B (zh) * | 2016-11-11 | 2018-02-09 | 合肥中科离子医学技术装备有限公司 | 超导回旋加速器谐振腔容性耦合匹配方法 |
DE102017123377A1 (de) | 2017-10-09 | 2019-04-11 | Cryoelectra Gmbh | Hochfrequenz-Verstärker-Einheit mit auf Außenleiter angeordneten Verstärkermodulen |
CN107863597A (zh) * | 2017-12-12 | 2018-03-30 | 合肥中科离子医学技术装备有限公司 | 一种用于将高频功率耦合输入到谐振腔中的装置 |
US11224918B2 (en) | 2018-01-19 | 2022-01-18 | Fermi Research Alliance, Llc | SRF e-beam accelerator for metal additive manufacturing |
US11123921B2 (en) | 2018-11-02 | 2021-09-21 | Fermi Research Alliance, Llc | Method and system for in situ cross-linking of materials to produce three-dimensional features via electron beams from mobile accelerators |
US11639010B2 (en) | 2019-07-08 | 2023-05-02 | Fermi Research Alliance, Llc | Electron beam treatment for invasive pests |
US11465920B2 (en) * | 2019-07-09 | 2022-10-11 | Fermi Research Alliance, Llc | Water purification system |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2563585A (en) * | 1945-10-08 | 1951-08-07 | Dallenbach | |
US2860313A (en) * | 1953-09-04 | 1958-11-11 | Emerson Radio And Phonograph C | Inductive tuning device |
DE1739053U (de) * | 1956-06-28 | 1957-02-07 | Siemens Ag | Anordnung zur abschirmung hochfrequenter stoerfelder in einem sondenschlitz. |
US3495125A (en) * | 1968-03-05 | 1970-02-10 | Atomic Energy Commission | Quarter-wave transmission line radio frequency voltage step-up transformer |
JPH04268799A (ja) * | 1991-02-25 | 1992-09-24 | Nec Corp | 電磁遮へい室 |
US5497050A (en) * | 1993-01-11 | 1996-03-05 | Polytechnic University | Active RF cavity including a plurality of solid state transistors |
US5661366A (en) * | 1994-11-04 | 1997-08-26 | Hitachi, Ltd. | Ion beam accelerating device having separately excited magnetic cores |
JP2867933B2 (ja) * | 1995-12-14 | 1999-03-10 | 株式会社日立製作所 | 高周波加速装置及び環状加速器 |
JP3439901B2 (ja) * | 1996-02-07 | 2003-08-25 | 日本電信電話株式会社 | 超伝導薄膜の作製方法 |
US6724261B2 (en) | 2000-12-13 | 2004-04-20 | Aria Microwave Systems, Inc. | Active radio frequency cavity amplifier |
JP4268799B2 (ja) | 2002-12-26 | 2009-05-27 | 大和製罐株式会社 | 不良缶詰検出方法およびそれに用いられる示温インク印刷缶詰 |
JP4220316B2 (ja) * | 2003-06-24 | 2009-02-04 | 株式会社日立ハイテクノロジーズ | プラズマ処理装置 |
US20090224700A1 (en) * | 2004-01-15 | 2009-09-10 | Yu-Jiuan Chen | Beam Transport System and Method for Linear Accelerators |
US7710051B2 (en) * | 2004-01-15 | 2010-05-04 | Lawrence Livermore National Security, Llc | Compact accelerator for medical therapy |
EP4005610A1 (fr) * | 2005-12-14 | 2022-06-01 | Stryker Corporation | Système de collecte et d'élimination de déchets |
US8325463B2 (en) * | 2008-11-04 | 2012-12-04 | William Mehrkam Peterson | Dynamic capacitor energy system |
US8232747B2 (en) * | 2009-06-24 | 2012-07-31 | Scandinova Systems Ab | Particle accelerator and magnetic core arrangement for a particle accelerator |
-
2009
- 2009-11-17 DE DE102009053624A patent/DE102009053624A1/de not_active Ceased
-
2010
- 2010-10-18 WO PCT/EP2010/065595 patent/WO2011061026A1/fr active Application Filing
- 2010-10-18 CN CN201080051764.3A patent/CN102612865B/zh not_active Expired - Fee Related
- 2010-10-18 RU RU2012103491/07A patent/RU2559031C2/ru not_active IP Right Cessation
- 2010-10-18 EP EP10784723.8A patent/EP2502470B1/fr not_active Not-in-force
- 2010-10-18 US US13/510,120 patent/US8779697B2/en not_active Expired - Fee Related
- 2010-10-18 JP JP2012539250A patent/JP5567143B2/ja not_active Expired - Fee Related
Non-Patent Citations (1)
Title |
---|
See references of WO2011061026A1 * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2684249B1 (fr) * | 2011-05-04 | 2018-11-28 | Siemens Aktiengesellschaft | Générateur haute fréquence |
Also Published As
Publication number | Publication date |
---|---|
EP2502470B1 (fr) | 2014-09-17 |
WO2011061026A1 (fr) | 2011-05-26 |
JP2013511133A (ja) | 2013-03-28 |
RU2559031C2 (ru) | 2015-08-10 |
DE102009053624A1 (de) | 2011-05-19 |
JP5567143B2 (ja) | 2014-08-06 |
CN102612865B (zh) | 2015-06-24 |
US8779697B2 (en) | 2014-07-15 |
CN102612865A (zh) | 2012-07-25 |
RU2012103491A (ru) | 2013-12-27 |
US20120229054A1 (en) | 2012-09-13 |
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