EP1602144B1 - Connexion haute frequence ou reseau de distribution haute frequence - Google Patents

Connexion haute frequence ou reseau de distribution haute frequence Download PDF

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Publication number
EP1602144B1
EP1602144B1 EP04712537A EP04712537A EP1602144B1 EP 1602144 B1 EP1602144 B1 EP 1602144B1 EP 04712537 A EP04712537 A EP 04712537A EP 04712537 A EP04712537 A EP 04712537A EP 1602144 B1 EP1602144 B1 EP 1602144B1
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EP
European Patent Office
Prior art keywords
network
base
coupling surface
module
signal coupling
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Expired - Lifetime
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EP04712537A
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German (de)
English (en)
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EP1602144A1 (fr
Inventor
Roland Gabriel
Jürgen RUMOLD
Stefan Berger
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Kathrein SE
Original Assignee
Kathrein Werke KG
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/12—Coupling devices having more than two ports
    • H01P5/16—Conjugate devices, i.e. devices having at least one port decoupled from one other port
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/04—Fixed joints
    • H01P1/047—Strip line joints

Definitions

  • the invention relates to a high-frequency or network connection according to the preamble of claim 1.
  • a generic high-frequency connection is from the US 5 986 519 A , as the closest prior art, become known. It is an arrangement for transmitting high frequency microwave signals between a cable and a printed microstrip circuit feed network disposed on a dielectric substrate in a microwave antenna structure. So there is a solid structure in the manner of a triplate structure that includes two parallel ground planes.
  • this multilayer structure also has at least one so-called transition printed circuit board, on which a connecting line structure is formed which ends in so-called coupling surfaces.
  • a connecting line structure is formed which ends in so-called coupling surfaces.
  • a divided dielectric is arranged, on each of which a coupling surface is formed, which is connected to a line structure.
  • These coupling surfaces come parallel and adjacent to the interconnected on the transition board coupling surfaces to lie.
  • the coupling surfaces on the transition printed circuit board can also be formed from the metallized line itself, said electrical line is at least indirectly electrically-galvanically connected to the inner conductor of a coaxial cable.
  • This two-layered structure with a printed circuit board structure and a dielectric that builds up thereon is sandwiched between a lower so-called first ground plane and an upper so-called second ground plane, wherein the lower ground plane is electrically-galvanically connected to the outer conductor of the coaxial cable and the second ground plane is reactively coupled to the first ground plane is.
  • Such a triplate design thus comprises a microstrip circuit arrangement on a first dielectric substrate and a second microstrip circuit formed on an intermediate dielectric substrate, whereby all microwave signals from a coaxial cable connection via the printed interposer circuit to the microstrip circuit on the first coupled dielectric substrate.
  • a PCMCIA signal connector as it is usually used in notebooks, is basically from the U.S. Patent 5,936,841 known.
  • the PCMCIA plug-in card usually has on its one end face a connector strip, which interacts with a built-in notebook power strip when the corresponding PCMCIA card is inserted into a receiving slot in the notebook.
  • On one of the large side surfaces is then parallel to this side surface a first electrically provided conductive layer, which represents one half of the RF coupling device.
  • the second parallel electrically conductive layer is housed with lateral offset in the interior of the device.
  • an air gap generated by the side clearance between PCMCIA card and adjacent inner boundary surface of the insertion slot of the electrical device, for example in the form of the notebook
  • a dielectric interlayer the part of the wall of the Notbooks is.
  • the object of the present invention is therefore to provide a high-frequency connection and in particular a high-frequency distribution network, which can be used as needed on a designated interface, with intermodulation should be largely avoided or excluded.
  • an RF network is coupled to a base module in such a way that at least one first signal path from the base module leads to the network and at least one second signal path originates from the network to the base module, in such a way that not only a capacitive coupling between the ground potential areas, but above all between the signal coupling surfaces of the base module and the network module is formed both in the at least first as well as the at least second signal path.
  • This also offers the possibility of inserting such a network module, for example into slot openings in an antenna, so that the corresponding capacitive signal paths are provided in the finally inserted position.
  • the construction is such that an intermodulation-free modular connection, for example an RF network to a base module, is made possible by the production of a potential-free, ie a capacitive high-frequency connection at a corresponding interface.
  • a potential-free, ie a capacitive high-frequency connection at a corresponding interface.
  • not only the signal leading signal lines, but also the outer conductor or grounds are coupled to avoid potential galvanic contact floating to each other at the corresponding contact devices.
  • the type of interface in the form of capacitive coupling via an interface with contacts has the significant advantage of low intermodulation, which is just of great importance in mobile phone applications such as mobile radio antennas. If very high intermodulation products in the transmission frequency range, whose frequency in the reception frequency range rich, could be received at these reception frequencies no weak signals from mobile devices such as mobile phones more.
  • the geometry of the coupling surfaces determines the electrical parameters of the signal transmission, such as the adaptation to the characteristic impedance (VSWR), the insertion loss and the broadband frequency range.
  • VSWR characteristic impedance
  • extension surfaces are provided. These flags or extension surfaces cause parallel to the coupling between the coupling surfaces an additional low coupling between the coupling surfaces on a circuit board and a mass surface.
  • the network module which can be coupled to a base module, furthermore has capacitively coupled mass areas in addition to the coupling surfaces effecting a capacitive RF coupling in order to suppress the intermodulation-free modular connection.
  • the metal structure covering this circuit board is formed on the side on which the corresponding electrical mass areas of the base module lie.
  • an insulating film with a predefined thickness is preferably used for the isolation between the two mass coupling causing electrical ground surfaces.
  • the coupling surfaces of the electrical ground planes effecting the signal transmission which are sometimes also referred to as coupling fingers, are preferably formed on the opposite side of the board of the network module, so that the substrate of the board is insulated from the corresponding signal coupling surface at the base. Module works.
  • At least one signal path from a base module is fed back via the capacitive coupling to a network module and from this network module via at least one further signal path to the antenna or, for example, the base module.
  • This can be done by plugging different network cards a closed signal path can be realized via the network card, wherein at the input and the output of the network card, the signal path is designed capacitively.
  • the high-frequency network can be embodied on the mentioned circuit board, for example in stripline technology (microstrip).
  • FIG. 1 is a schematic excerpt perspective view of a mobile radio antenna 1, a base station shown.
  • the housing cover of the antenna device namely the so-called radome 3, can be seen in part.
  • the antenna is held and positioned overall via an antenna mast 5.
  • network modules 11 specific, formed for example in stripline technology network components and network circuits are provided so that by using a correspondingly adapted network module 11, a specific beam characteristic of the antenna is generated.
  • the explained network modules 11 thus serve to generate a specific beam characteristic a so-called smart antenna, such as in the US Pat. No. 6,463,303 B1 or in the PCT publication WO 01/59 876 A1 is described. Accordingly, in an antenna therefore also several base and associated network modules can be provided.
  • FIG. 2 Based on FIG. 2 the schematic structure with respect to a cooperating module pair is shown, with a base module 9 and a network module 11. Only with reference to two signal lines 13 and two ground lines 15 is shown that the respective network module 11 completely potential-free via a corresponding HF connection 17 is coupled to the relevant base module 9.
  • the respective ground potential GND1 lies only on the base module 9 and the ground potential GND2 is applied only to the network module. In this case, corresponding potential-free connections between the base module 9 and the network module 11 via one or more signal paths 14 and 16 are provided.
  • the base module 9 comprises an electrically shielded base plate or base 21, which is generally made entirely of metal.
  • base plate 21 is frequently used.
  • This electrically conductive base or base plate 21 is provided with recesses or windows 23, in which electrically conductive base signal coupling surfaces 25 are formed. These base signal coupling surfaces 25 are separated from the electrically conductive base 21 by a respective circumferential gap 26 or other insulation, which forms a base mass coupling surface 27 adjacent to the base signal coupling surface 25.
  • a respective circumferential gap 26 or other insulation which forms a base mass coupling surface 27 adjacent to the base signal coupling surface 25.
  • connection points 29 are shown at the base, to each of which a coaxial conductor 31 leads, wherein the inner conductor 31a of each coaxial conductor 31 is soldered to the base signal coupling surface 25 and to a stripped outer peripheral region of the associated outer conductor 31b via a corresponding solder joint 31c with the base Mass coupling surface 27 is electrically connected.
  • the corresponding network module 11 has a circuit board 35 with associated substrate 35 'on which connection points 129 on the base module corresponding to the connection points 29 are formed on the network module 11. Often it is spoken by a network board 35 instead of board 35.
  • connection points 129 on the network module 11 comprise network signal coupling surfaces 125 which, in the exemplary embodiment shown, are also rectangular in shape from the basic shape, ie comparable to the respective shape of the base signal coupling surfaces 25.
  • each stripline 37 is the network signal coupling surface 125 with an in FIG. 3 only schematically indicated network 39 is connected, which represents an RF module.
  • This is preferably provided and formed on the upper side 35a of the circuit board 35, that is to say on the side of the circuit board 35 which is opposite to the cooperating base, that is to say the so-called network board 35.
  • the network module 11 also includes a large-area designed mass coupling surface, namely a network mass coupling surface 127, which in the embodiment shown but not on the same side of the board 35, on which the connection points 129 are provided, but on the bottom is formed ,
  • the electrically conductive network mass surface 127 is at least approximately rectangular in shape and extends with its peripheral boundary line 129 'to the immediate vicinity of the connection points 129.
  • the board 35 is moved to the base and positioned according to the arrow 41, namely with the interposition of an electrically insulating intermediate layer, preferably in the form of an insulating film 43, the size and shape of which corresponds to the network mass coupling surface 127 or is slightly larger.
  • FIG. 4 Based on FIG. 4 is shown in a schematic plan view corresponding to the layers of the mass coupling surfaces and the insulating film and the network mass coupling surface 127 in relation to the underlying base mass coupling surface 27. It can also be seen that the base mass coupling surface 27 can be dimensioned larger, for example, in the longitudinal as well as in the transverse direction than in the network mass coupling surface 127. For fine tuning, it is further provided that the network coupling surfaces 127 project laterally Flag or extension sections 127 'may be provided, resulting in the embodiment shown, a cross structure, but this is not absolutely necessary.
  • FIG. 5 is merely shown that, for example instead of a sliding mechanism (which includes, for example, two laterally opposite groove receiving, in which the board 35 can be inserted) may also be provided a kind of tilting mechanism.
  • a sliding mechanism which includes, for example, two laterally opposite groove receiving, in which the board 35 can be inserted
  • a kind of tilting mechanism in the embodiment according to FIG. 5 is a schematically designed as a U-shaped recess tilt bracket 45 is used, in which the one boundary edge 35 "of the board 35 inserted and then the board 35 can be pivoted about the tilting axis formed on the base 21 until the board 35 with intermediate positioning of said Insulating film 43 rests on the base 21.
  • the base 21 is formed in cross-sectional view in the form of a low-height U-shaped electrically conductive sheet, which is provided with laterally opposite flanges 21 '.
  • a plurality of coaxial cables 31 are supplied to the base module 9 from each side, wherein the individual coaxial conductor sections or coaxial conductors 31, as already explained, are led to the base signal coupling surfaces 25.
  • the outer conductor 31b of the respective coaxial conductor 31 is contacted on the side legs of the U-shaped base 21, for example, by an electrical solder connection electrically to the electrically conductive base 21, said through these side portions 21 ", the inner conductor 31a of the coaxial 31 are passed and soldered via an electrical solder connection to the respective base signal coupling surfaces 25.
  • These basic signal coupling surfaces 25 are electrically insulated from the base mass coupling surface 27 by a circumferential insulating gap 26.
  • the base signal coupling surfaces 25 lie in a corresponding larger-dimensioned window 23, so that the insulating gap 26 is formed between the base signal coupling surfaces 25 and the base mass coupling surfaces 27.
  • a shielding wall 49 is ultimately provided to produce a total shielding.
  • Another Schirmungswand 50 is placed from above on the base module 9 thus formed as part of this base module 9 and can then be screwed together by using screws to holes 51.
  • the upper Schirmungswand 50 is also formed in cross section U-shaped with outboard flange portions 50 'and side legs 50 ", wherein in the region of the supplied coaxial cables and coaxial 31 corresponding slot recesses 52 are incorporated in the vertical leg portion 50'.
  • the explained base module 9 thus serves to accommodate a network module 11, which in FIG. 6 is shown in exploded view.
  • the network module 11 comprises, in addition to the already explained board 35 and the network 39 thereon, a surrounding housing 53, which is seated with its wall sections 53 'on the outer circumference of the board 35 or connected thereto is, to form an interior space 55, in which, as explained on the board 35, the corresponding assemblies and lines for generating the network 39 are formed and provided.
  • the network signal coupling surfaces 125 come to lie directly above the base signal coupling surfaces 25, wherein the material of the printed circuit board, ie the substrate 35 'forms the insulation between the network signal coupling surface 125 and the base signal coupling surface 25.
  • the base signal coupling surfaces 25 are electrically conductively connected via a downwardly extending connection section 25 'to the inner conductor 31a of an associated coaxial conductor 31 projecting thereon, for example via a solder connection.
  • FIGS. 7 and 8th reproduced electrically insulating support 59 provided in the form of a spacer, on which on the one hand, the electrical ground, ie the base-mass coupling surface 27 and on the other hand, the base signal coupling surface 25 rests. Since the signal coupling surface 25 has a thinner material cross-section than the base-mass coupling surface 27, therefore, the aforementioned spacer 59 is formed stepped.
  • recesses or, for example, bores 61 are immediately offset inwardly lying to the boundary edge of the window-shaped recesses or the Isolierspaltes 26 is provided, in which the spacer 59 with a slightly further upwardly projecting portion 59 'in this recess or bore 61 protrudes.
  • a network module 11 formed in this way can thus be pushed without problems into the associated base module 9, for example, with the network module 11 at an asymmetrical location, for example at the.,
  • the network module 11 (housing cover 50) Has an elevation 163, which cooperates with a corresponding elevation or recess - 63 on the inside of the housing cover of the base module 9 ( FIG. 6 ).

Landscapes

  • Transceivers (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Combinations Of Printed Boards (AREA)
  • Waveguide Connection Structure (AREA)
  • Microwave Amplifiers (AREA)
  • Input Circuits Of Receivers And Coupling Of Receivers And Audio Equipment (AREA)
  • Aerials With Secondary Devices (AREA)
  • Channel Selection Circuits, Automatic Tuning Circuits (AREA)

Claims (18)

  1. Connexion haute fréquence (HF) ou de réseau, présentant les éléments suivants :
    - il est prévu un module de base (9),
    - le module de base (9) comprend plusieurs surfaces de couplage de signal de base (25) sur un côté d'une plaque de base associée (21),
    - il est prévu un module de réseau (11),
    - le module de réseau (11) comprend plusieurs surfaces de couplage de signal de réseau (125) sur un côté d'une platine de réseau associée (35), qui sont couplées par voie capacitive aux surfaces de couplage de signal de base (25) associées,
    - le module de base (9) comprend une surface de couplage de masse de base (27),
    - le module de réseau (11) comprend une surface de couplage de masse de réseau (127),
    - dans l'état de fonctionnement, la surface de couplage de masse de base (27) est couplée par voie capacitive en orientation parallèle à la surface de couplage de masse de réseau (127),
    - le module de réseau (11) est positionné ou susceptible d'être positionné dans ou sur le module de base (9) de telle sorte qu'une connexion de signal HF capacitive est établie via ladite au moins une surface de couplage de signal de réseau (125) et via la surface de couplage de signal de base (25) positionnée parallèlement à la surface de couplage de signal de réseau (125),
    caractérisée par les autres éléments suivants :
    - au moins un premier trajet de signaux (14) depuis le module de base (9) vers le module de réseau (11) est réalisé via au moins une première surface de couplage de signal de base (25) et via une surface de couplage de signal de réseau (125) coopérant avec celle-ci, et au moins un second trajet de signaux (16) depuis le module de réseau (11) vers le module de base (9) est réalisé via au moins une autre surface de couplage de signal de réseau (125) et via une autre surface de couplage de signal de base (25) coopérant avec celle-ci,
    - les plusieurs surfaces de couplage de signal de base (25) du module de base (9) sont reliées chacune à un câble individuel (31),
    - les surfaces de couplage de signal de base (25) et les surfaces de couplage de masse de base (27) sont prévues sur le même côté de la plaque de base (21),
    - sur le côté de la platine de réseau (35) détourné des surfaces de couplage de signal de base, le module de réseau (11) comprend lesdites plusieurs surfaces de couplage de signal de réseau (125),
    - la surface de couplage de masse de réseau (127) est prévue sur le côté de la platine de réseau (35) du module de réseau (11), qui est opposé aux surfaces de couplage de signal de réseau (125).
  2. Connexion HF ou de réseau selon la revendication 1, caractérisée en ce que lorsque le module de réseau (11) est intégré ou rapporté dans le module de base (9), la surface de couplage de masse de réseau (127) repose directement au voisinage sur la surface de couplage de masse de base (27), et ceci avec interposition d'une isolation ou d'une feuille isolante (43).
  3. Connexion HF ou de réseau selon l'une des revendications 1 ou 2, caractérisée en ce que les surfaces de couplage de signal de base (25) sont agencées dans une fenêtre ou dans une échancrure (23) dans une plaque de base (21) électriquement conductrice, les fenêtres ou les échancrures (23) étant dimensionnées au moins légèrement plus grandes que les surfaces de couplage de signal de base (25) qui se trouvent dans celles-ci et qui sont ainsi isolées de la surface de couplage de masse de base (27) par un intervalle d'isolation périphérique (26).
  4. Connexion HF ou de réseau selon l'une des revendications 1 à 3, caractérisée en ce que les surfaces de couplage de signal de base (25) sont reliées électriquement chacune à un conducteur intérieur (31a) d'un conducteur coaxial (31), de préférence par une jonction soudée (31c).
  5. Connexion HF ou de réseau selon la revendication 4, caractérisée en ce que les surfaces de couplage de signal de base (25) comprennent une portion de raccordement (25') qui mène vers un plan inférieur et qui s'étend au moins jusqu'à la hauteur d'un conducteur intérieur (31a) dépassant axialement d'un conducteur coaxial (31) en établissant une jonction soudée.
  6. Connexion HF ou de réseau selon l'une des revendications 1 à 5, caractérisée en ce que la surface de couplage de réseau (127) est dimensionnée plus petite que la surface de couplage de masse de base (27) coopérant avec celle-ci, le bord de délimitation (129') de la surface de couplage de masse de réseau (127) s'étendant en décalage par rapport aux surfaces de couplage de signal de réseau (125).
  7. Connexion HF ou de réseau selon la revendication 6, caractérisée en ce que les surfaces de couplage de signal de réseau (125) sont connectées au réseau (39), prévu sur la patine de réseau (35), via une microbande (37).
  8. Connexion HF ou de réseau selon l'une des revendications 1 à 7, caractérisée en ce qu'en vue de dessus, la structure de base de la surface de couplage de signal de base (25) et de la surface de couplage de signal de réseau (125) est telle que la surface de couplage de signal de base (25) est conçue plus longue et plus large que la surface de couplage de signal de réseau (125), et en ce qu'en vue de dessus la surface de couplage de signal de réseau (125) vient se placer en position en chevauchement.
  9. Connexion HF ou de réseau selon l'une des revendications 1 à 8, caractérisée en ce qu'au moins les surfaces de couplage de signal de réseau (125) sont pourvues de pattes ou de portions d'élargissement (125') dépassant latéralement plus loin, permettant d'obtenir un accord fin de l'effet de couplage ou de l'adaptation.
  10. Connexion HF ou de réseau selon la revendication 9, caractérisée en ce que les pattes ou les portions d'élargissement (125') dépassent latéralement des surfaces de couplage de signal de réseau (125) aussi loin qu'elles permettent d'obtenir un effet de couplage vers la surface de couplage de masse de base (27).
  11. Connexion HF ou de réseau selon l'une des revendications 1 à 10, caractérisée en ce que la plaque de base (21) du module de base (9) repose sur un support ou sur un élément écarteur (59) qui est prévu de préférence au moins dans la zone des surfaces de couplage de signal de base (25).
  12. Connexion HF ou de réseau selon l'une des revendications 1 à 11, caractérisée en ce que la plaque de base (21) est réalisée avec une section transversale au moins approximativement en forme de U, et ceci en réalisant des brides (21') faisant saillie latéralement qui se trouvent en décalage par rapport au plan de la plaque de base (21), et en ce que la plaque de base (21) est reliée aux brides (21') par des branches de liaison (21") qui s'étendent transversalement à la plaque de base (21) et dans lesquelles sont ménagés des évidements ou des perçages (52) à travers lesquels est passé un conducteur intérieur (31a) en étant isolé par rapport à la branche de liaison (21"), le conducteur extérieur (31 b) d'un conducteur coaxial à brancher (31) étant relié par voie électrique-galvanique à la bride (21') et/ou à la branche de liaison (21").
  13. Connexion HF ou de réseau selon l'une des revendications 11 à 12, caractérisée en ce que la surface de couplage de signal de base (25) et la surface de couplage de masse de base (27) se trouvent au même niveau en hauteur.
  14. Connexion HF ou de réseau selon l'une des revendications 1 à 13, caractérisée en ce que l'épaisseur des surfaces de couplage de signal de base (25) est inférieure à l'épaisseur de la surface de couplage de masse de base (27).
  15. Connexion HF ou de réseau selon l'une des revendications 12 à 14, caractérisée en ce qu'il est prévu un dispositif de positionnement sous la forme d'échancrures et de saillies (61, 63) emboîtées les unes dans les autres, via lesquelles le support ou l'élément écarteur (59) est susceptible d'être positionné dans une position relative exacte par rapport à la surface de couplage de signal de base (25) ou à la surface de couplage de masse de base (27).
  16. Connexion HF ou de réseau selon l'une des revendications 1 à 15, caractérisée en ce que le module de base (9) comprend, outre un recouvrement isolant inférieur (49), un recouvrement de boîtier (50) qui s'élève à distance au-dessus de celui-ci et qui est pourvu de préférence de deux portions de bride opposées (50'), le recouvrement (49) au niveau de son bord et le recouvrement de boîtier (50) dans la zone de ses portions de bride (50') pouvant être reliés l'un à l'autre, de préférence en recevant une portion de bride interposée (21') de la plaque de base (21).
  17. Connexion HF ou de réseau selon l'une des revendications 1 à 16, caractérisée en ce que le module de réseau (11) comprend une enceinte ou un recouvrement d'enceinte (53) qui repose de préférence sur le bord de la platine de réseau (35) ou est relié(e) à celle-ci en formant un compartiment intérieur.
  18. Connexion HF ou de réseau selon l'une des revendications 1 à 17, caractérisée en ce que le module de réseau (11) est susceptible d'être introduit dans un espace de logement correspondant du module de base (9), l'espace de logement dans le module de base (9) ainsi que la section transversale du module de réseau à introduire (11) étant asymétrique, de telle sorte qu'une introduction du module de réseau (11) dans le module de base (9) n'est possible que dans une position relative prédéfinie.
EP04712537A 2003-03-13 2004-02-19 Connexion haute frequence ou reseau de distribution haute frequence Expired - Lifetime EP1602144B1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10311041A DE10311041A1 (de) 2003-03-13 2003-03-13 Hochfrequenz-Verbindung bzw. Hochfrequenz-Verteilnetzwerk
DE10311041 2003-03-13
PCT/EP2004/001613 WO2004082062A1 (fr) 2003-03-13 2004-02-19 Connexion haute frequence ou reseau de distribution haute frequence

Publications (2)

Publication Number Publication Date
EP1602144A1 EP1602144A1 (fr) 2005-12-07
EP1602144B1 true EP1602144B1 (fr) 2008-03-12

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EP04712537A Expired - Lifetime EP1602144B1 (fr) 2003-03-13 2004-02-19 Connexion haute frequence ou reseau de distribution haute frequence

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Country Link
US (1) US6917253B2 (fr)
EP (1) EP1602144B1 (fr)
CN (1) CN2672961Y (fr)
AT (1) ATE389244T1 (fr)
DE (2) DE10311041A1 (fr)
WO (1) WO2004082062A1 (fr)

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CN2672961Y (zh) 2005-01-19
US20040178860A1 (en) 2004-09-16
DE10311041A1 (de) 2004-10-07
EP1602144A1 (fr) 2005-12-07
ATE389244T1 (de) 2008-03-15
DE502004006492D1 (de) 2008-04-24
WO2004082062A1 (fr) 2004-09-23
US6917253B2 (en) 2005-07-12

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