EP2501842A2 - Verfahren zur räumlich aufgelösten vergrösserung von nanopartikeln auf einer substratoberfläche - Google Patents
Verfahren zur räumlich aufgelösten vergrösserung von nanopartikeln auf einer substratoberflächeInfo
- Publication number
- EP2501842A2 EP2501842A2 EP10778575A EP10778575A EP2501842A2 EP 2501842 A2 EP2501842 A2 EP 2501842A2 EP 10778575 A EP10778575 A EP 10778575A EP 10778575 A EP10778575 A EP 10778575A EP 2501842 A2 EP2501842 A2 EP 2501842A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- substrate
- noble metal
- metal nanoparticles
- nanoparticles
- substrate surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1605—Process or apparatus coating on selected surface areas by masking
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1612—Process or apparatus coating on selected surface areas by direct patterning through irradiation means
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
- C23C18/1664—Process features with additional means during the plating process
- C23C18/1667—Radiant energy, e.g. laser
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
- C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
- C23C18/1837—Multistep pretreatment
- C23C18/1841—Multistep pretreatment with use of metal first
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1886—Multistep pretreatment
- C23C18/1889—Multistep pretreatment with use of metal first
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C23C18/44—Coating with noble metals using reducing agents
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
- Y10T428/24612—Composite web or sheet
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24893—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including particulate material
- Y10T428/24909—Free metal or mineral containing
Definitions
- the present invention relates to methods for the spatially resolved enlargement and size fine adjustment of noble metal nanoparticles on a substrate surface and the nanoparticle assemblies and nanostructured substrate surfaces thus prepared and their use.
- nanostructures in particular ordered structures of noble metal nanoparticles on substrate surfaces, have found great interest in a variety of applications in various fields.
- gold nanoparticles can be used in biochemical sensors (Dyckman and Bogatyrev (2007), Russian Chemical Reviews 76 (2), 181-194) and used as etching masks for the production of biomimetic surfaces and interfaces (Lohmüller et al ), NANO LETTERS 8 (5): 1429-1433).
- the size of noble metal nanoparticles may generally be prior to application to the substrate surface, e.g. when using metal colloids (Kimling et al., (2006) J. Phys. Chem. B., 110, 15700-15707), or after application, e.g. by electroless deposition using a reducing agent (Hrapovic et al. (2007) Langmuir 19: 3958-3965).
- metal colloids Karl et al., (2006) J. Phys. Chem. B., 110, 15700-15707
- a reducing agent Hrapovic et al. (2007) Langmuir 19: 3958-3965
- German patent application DE 10 2007 017 032 and the corresponding international application PCT / EP2008 / 0071981 describe processes for the production of interparticle distance and particle size gradients in gold nanoparticle assemblies prepared by micellar block copolymer nanolithography (BCML).
- particle size gradients are generated either by electroless deposition from a solution containing elemental gold as above, but varying the rate at which a nanoparticle-coated substrate surface is withdrawn from this solution or by irradiation with a laterally intensity-modulated light field.
- a main object of the present invention was therefore the provision of improved processes for the spatially resolved magnification and size standard fine adjustment of noble metal nanoparticles on a substrate surface with which particle arrangements also very sharp Pelleierngradienten or nano-, the plurality of regions with greatly different mean diameters' of the Containing nanoparticles and high spatial resolution side by side, can be produced in a simple and efficient way.
- a related task was the provision of the corresponding nanoparticle arrays and nanostructured substrate surfaces.
- a further object was the provision of the nanoparticle arrangements and nanostructured substrate surfaces prepared according to the invention for various uses which were hitherto unsuitable for such noble metal nanoparticle arrangements owing to the inadequate or insufficiently large size precision of noble metal nanoparticles on a substrate surface ,
- the above-called te main object can be achieved by providing the method of claim 1, wherein a substrate coated with (preferably fixed) noble metal nanoparticles substrate with a noble metal salt solution 'is kontak advantage and by UV irradiation of certain predetermined localized and controlled enlargement of the nanoparticles in these areas.
- a substrate coated with (preferably fixed) noble metal nanoparticles substrate with a noble metal salt solution 'is kontak advantage and by UV irradiation of certain predetermined localized and controlled enlargement of the nanoparticles in these areas are provided. More specific embodiments and other aspects of the present invention are the subject of the further claims. Description of the invention
- the present invention relates to a method for spatially resolved magnification of noble metal nanoparticles present on a substrate, comprising the following steps:
- a substrate coated with noble metal nanoparticles in the above step a) can in principle be carried out by all methods known in the prior art.
- a noble metal colloid layer can be applied to the substrate surface (see Hrapovic et al., Supra).
- micellar block copolymer nanolithography a micellar solution of a block copolymer is deposited on a substrate, e.g. by dip coating, and forms, under suitable conditions on the surface, an ordered film structure of chemically distinct polymer domains, which depends, inter alia, on the type, molecular weight and concentration of the block copolymer.
- the micelles in the solution can be loaded with inorganic salts, which can be reduced to inorganic nanoparticles after deposition with the polymer film.
- a plasma treatment e.g. with hydrogen plasma.
- the substrate material used according to the invention is generally not particularly limited and may comprise any material as long as it is stable under the conditions of the process according to the invention and does not impair or interfere with the reactions taking place.
- the substrate may for example consist of glass, SiO 2 , silicon, metals (with or without passivated surfaces), semiconductor materials, eg GaAs, GaP, GalnP, AlGaAs, (optionally doped) metal oxides, eg ZnO, TiO 2 , carbon (graphite , Diamond), polymers, etc., and composite materials thereof.
- transparent substrates such as glass or ITO on glass are preferred.
- the precious metal of the nanoparticles is not particularly limited and may be any in the state of 'art for such nanoparticles known precious metal or mixtures or composites of several precious metals (hybrid particles) or blends of one precious metal with another metal.
- the noble metal is selected from the group consisting of Au, Pt, Pd, Ag or mixtures / composites of these metals, and is more preferably gold.
- the original nanoparticles typically have diameters in the range of 1 nm to 100 nm, preferably 4 nm to 30 nm.
- the interparticle distances can be varied over a wide range, for example, in a range of 20 to 1000 nm, typically in the range of 30 up to 250 nm.
- the substrate may, if necessary, after the application of the nanoparticles, but before their enlargement, be treated with an agent which supports the adhesion of the nanoparticles.
- an agent which supports the adhesion of the nanoparticles In particular when using a substrate surface of glass or silicon dioxide coated with gold nanoparticles, but also with Si, ZnO, TiO 2 , GaAs surfaces and similar surfaces, it is preferable to treat the substrate with an agent which comprises the Liability of the gold nanoparticles supported.
- silane in particular selected from the group consisting of 3-aminopropyltriethoxysilane (APS), 3-mercaptopropyltriethoxysilane (MPS), N- [3- (trimethoxysilyl) propyl) ethylenediamine, 3- [2- (2-aminoethylamino) ethylamino] propyltrimethoxysilane, 3-aminopropyldimethylmethoxysilane, 3-aminopropyl) tris (trimethylsiloxy) silane and 3-mercaptopropyltrimethoxysilane.
- APS 3-aminopropyltriethoxysilane
- MPS 3-mercaptopropyltriethoxysilane
- N- [3- (trimethoxysilyl) propyl) ethylenediamine 3- [2- (2-aminoethylamino) ethylamino] propyltrimethoxysilane
- the noble metal salt solution which is brought into contact with the substrate surface in step c) may in principle be any metal salt solution which is suitable for the UV-induced electroless deposition of the desired precious metal on the noble metal nanoparticles.
- this is an aqueous metal salt solution, to which an organic compound has been added which forms organic radicals during or after UV irradiation, which serve as a reducing agent for the noble metal ions.
- this organic compound is selected from the group of aldehydes, ketones or alcohols, in particular Cx-Cio-alcohols.
- the C 1 -C 10 alcohol is particularly preferably selected from methanol, ethanol, propanol, butanol and ethylene glycol.
- the proportion of organic compound can be readily adjusted by a person skilled in the art to vary the rate and extent of reduction by routine experimentation.
- the volume ratio of aqueous metal salt solution to organic compound will range from 100: 1 to 1: 2, more preferably 10: 1 to 1: 1, eg 3: 1 or 1: 1.
- the noble metal salt solution is a gold salt solution, preferably a HAUCI 4 solution.
- the duration of UV irradiation may vary depending on the extent of nanoparticle enlargement desired and the particular substrate parameters, and a suitable irradiation time may readily be set by a person skilled in the art with routine experimentation.
- the UV irradiation is carried out for a duration in the range of 1 to 60 minutes, preferably 1 to 15 minutes, and at a wavelength in the range of 200 to 600 nm, preferably 200 to 400 nm.
- the method according to the invention is preferably carried out such that the conditions of the UV irradiation are varied for at least two different regions of the substrate so that at least two different regions having different average diameters of the noble metal nanoparticles are produced on the substrate.
- This variation of the conditions of UV irradiation is or includes, for example, a variation of the irradiation time.
- the method of the invention is performed using a mask (step e)) to cause localized growth of the noble metal nanoparticles in predetermined regions of the substrate.
- the mask has structures which allow diffraction of the irradiated UV light under suitable irradiation conditions, and the method is carried out under such conditions, in particular a suitable wavelength, that a diffraction pattern or pattern of brightness is formed on the substrate surface during the irradiation and the growth of the noble metal nanoparticles is selectively induced in the more irradiated areas of the diffraction pattern or pattern of brightness.
- These structures may comprise, for example, one or more pinhole apertures with a small hole diameter, preferably ⁇ 100 ⁇ m, more preferably ⁇ 10 ⁇ m, other diffraction gratings, diffraction edges, periodic patterns or gradients such as gradual gray filters.
- the pinhole diaphragms may, for example, have a circular, elliptical, rectangular or triangular shape. According to the invention, it is particularly preferred for the pinhole diaphragm (s) to have a circular diameter, so that upon irradiation a diffraction pattern of concentric rings is formed on the substrate surface and the different regions produced with different mean diameters of the noble metal nanoparticles as well form a pattern of concentric rings.
- the present invention also relates to a method for producing a nanostructured substrate surface, comprising the steps a) -e) according to any one of claims 1-12 and also:
- etching step in which the noble metal nanoparticles act as an etching mask, thus by selective etching in predetermined areas of the substrate Maintaining the pattern of the noble metal nanoparticle arrangement a desired relief design of the substrate surface is generated.
- a dry etching method adapted to the substrate is preferably used.
- a "Reactive Ion" etching step using a fluorine-containing etching gas Suitable methods are described, for example, in Lohmüller et al., (2008) NANO LETTERS, Vol. 8, No. 5, 1429-1433 other known in the art and suitable for the respective substrate etching process can be applied.
- this method comprises steps a) -e) according to claim 13 and further:
- step f) subjecting the substrate to the noble metal nanoparticle arrangement produced in steps a) -e) according to claim 13, in which different areas are distinguished by At least one etch step, in which the noble metal nanoparticles act as an etching mask, thus producing a relief design of the substrate surface by selective etching in predetermined areas of the substrate while maintaining the pattern of concentric circles which corresponds to that of a Fresnel lens.
- These arrangements typically comprise two or more distinct regions of noble metal nanoparticles having a mean diameter in the range of 5-200 nm, preferably 5-20 nm, and an average spacing in the range of less than 1 pm, preferably 30 to 250 nm, wherein in each of the different regions noble metal nanoparticles having a predetermined different average diameter are present.
- the arrangements are characterized in that the different regions with different mean diameters of the noble metal nanoparticles form one or more geometric patterns which are formed by diffraction of radiation at circular, elliptical, rectangular, triangular apertures, edges or other periodically arranged patterns as well as gradients such as gradual gray filters resulting diffraction patterns or brightness patterns corresponds / correspond.
- the various regions form a pattern of concentric rings.
- nanostructured substrate surfaces and arrangements of noble metal nanoparticles obtainable on a substrate with the above inventive methods form advantageous application possibilities on a wide variety of substrates due to the possibility of fine adjustment of the particle size with high spatial resolution and precise representation of geometric patterns with several sharply separated regions of different particle size fields.
- a further aspect of the present invention also relates to the use of these nanostructured substrate surfaces and arrangements in the fields of biochip technology, imaging technology, electronics, information processing, spectroscopy, sensor technology, optics, lithography.
- the devices are selected from the group consisting of a mask, in particular a lithographic or photomask, a biochip, a sensor, an optical device, in particular a Fresnel lens, an optical grating, a microlens array or a transistor.
- a further subject of the invention also relates to the devices themselves, which comprise such nanostructured substrate surfaces or arrangements.
- these devices are a mask, in particular a lithographic or photomask, a biochip, a sensor, an optical device, in particular a Fresnel lens, an optical grating, a microlens array or a transistor.
- FIG. 1 shows a schematic diagram for carrying out the method according to the invention with a gold nanoparticle arrangement provided by micellar nano-lithography (BCML).
- FIG. 2 shows a gold nanoparticle arrangement directly after a BCML without further enlargement treatment of the particles (diameter of the nanoparticles: about 9 nm).
- Fig. 4 shows gold nanoparticles after silanization and 2.5 minutes UV irradiation (diameter of the nanoparticles: about 13 nm).
- Fig. 5 shows gold nanoparticles after silanization and 3 minutes UV irradiation (diameter of the nanoparticles: about 15 nm).
- Fig. 6 shows the localized growth of gold nanoparticles at 10 minutes UV irradiation using a mask with a circular pinhole (diameter about 1 mm);
- Fig. 6a overall view;
- 6b enlargement of the bright interior with strongly grown particles;
- 6c Enlargement of the boundary area of indoor and outdoor space.
- FIG. 7 shows the localized growth of gold nanoparticles at 30 minutes of UV irradiation using a hole mask.
- ke with a substantially smaller, circular aperture diameter than in FIG. 6 development of a diffraction pattern with concentric rings; 7a: overall view; 7b: enlarged ring structure of 7a.
- Fig. 8 shows the localized growth of gold nanoparticles at 30 minutes UV irradiation using another circular shadow mask; 8a: overall view; 8b-d; Magnifications of the area between the dark interior and the edge to the bright interior with greatly enlarged particles.
- Figure 9 shows the localized growth of gold nanoparticles with detectable diffraction patterns at 10 minutes UV irradiation using a slightly elliptical shadow mask; 9a: overall view; 9b-d: enlargements of a boundary area.
- the sample to be exposed consisting of S1O 2 whose surface had gold nanoparticles with an average diameter of about 9 nm (FIG. 2)
- silane gas phase deposition of 3-aminopropyltriethoxysilane (APS): sample + 30 ⁇ L) APS (in separate dish) in the desiccator for 30 minutes at 0.3 mbar, then in the oven for 1 h at 80 ° C) and placed in a small vessel for exposure.
- Into the vessel became a Add 1: 1 mixture of 0.25% gold salt solution (HAuCl 4 ) and ethanol. The amount of solution was measured so that the sample was covered by a liquid film about 1 mm high.
- UV-light commercial UV lamp, wavelength: 410 nm
- Exposure times of 2 30 ⁇ ⁇ gave particle diameters of about 13 nm (FIG. 4); Exposure times of 3 ⁇ diameter of about 15 nm (Fig. 5).
- the diffraction integral can not be solved analytically after application of the Fresnel approach, but only numerically.
- the resulting diffraction pattern reacts extremely sensitive to the smallest changes in the distance or the aperture diameter. Since a realization of constant conditions (completely planar sample, completely planar mask, no "wave formation" of the solution,) can be realized only with great effort, a simpler (qualitative) approach was chosen for the subsequent experimental arrangements and images.
- the sample to be exposed was placed in a small vessel. To the vessel was added a solution of 1.5 ml of 0.25% gold salt solution (HAUCI4) and 0.5 ml of ethanol. The amount of the solution was so dimensioned that the sample is covered by a ca. 1 mm high liquid film.
- As a mask aluminum foil perforated with holes between 0.6 mm and 2 mm was used. This mask was placed about 1.1 mm above the sample. It was then exposed to UV light for 10 or 30 minutes.
- Figure 6 shows the localized growth of gold nanoparticles at 10 minutes UV irradiation using a mask with a circular pinhole (approximate diameter: 1 mm).
- a circular pinhole approximately 1 mm.
- no (at least not clear) further diffraction rings can be seen. This could e.g. at an unfavorable exposure time for the mask size.
- Fig. 9 shows the results using a slightly elliptical shadow mask and an exposure time of 10 minutes. Diffraction structures are visible and these were recorded with increasing magnification. Again, the relatively sharp demarcation of the individual rings becomes clear.
- Fig. 8 shows the results using a circular shadow mask and an exposure time of 30 minutes.
- the longer exposure time leads to a very strong growth in the exposed areas. This can be seen in particular at the overview shot (very bright ring structure).
- the area between the dark interior and the edge has been enlarged to a greatly enlarged area.
- the gold particles in the highest magnification ( Figure 8d) form a clearly recognizable Edge.
- a purely qualitative determination of the size in the SEM leads to a radius of about 10 nm of the smaller (upper half of the picture) and about 17 nm of the larger particles (lower half of the picture).
- Fig. 7 shows the results using another circular shadow mask and an exposure time of 30 minutes. Here again diffraction patterns can be seen. Again, the clearly demarcated ring structure is clearly visible.
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- Chemical Kinetics & Catalysis (AREA)
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- Organic Chemistry (AREA)
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Abstract
Description
Claims
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102009053406A DE102009053406A1 (de) | 2009-11-16 | 2009-11-16 | Verfahren zur räumlich aufgelösten Vergrößerung von Nanopartikeln auf einer Substratoberfläche |
| PCT/EP2010/006938 WO2011057816A2 (de) | 2009-11-16 | 2010-11-15 | Verfahren zur räumlich aufgelösten vergrösserung von nanopartikeln auf einer substratoberfläche |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP2501842A2 true EP2501842A2 (de) | 2012-09-26 |
| EP2501842B1 EP2501842B1 (de) | 2018-08-29 |
Family
ID=43877657
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP10778575.0A Active EP2501842B1 (de) | 2009-11-16 | 2010-11-15 | Verfahren zur räumlich aufgelösten vergrösserung von nanopartikeln auf einer substratoberfläche |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US9169566B2 (de) |
| EP (1) | EP2501842B1 (de) |
| DE (1) | DE102009053406A1 (de) |
| WO (1) | WO2011057816A2 (de) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102010023490A1 (de) | 2010-06-11 | 2011-12-15 | MAX-PLANCK-Gesellschaft zur Förderung der Wissenschaften e.V. | Dreidimensionale metallbedeckte Nanostrukturen auf Substratoberflächen,Verfahren zu deren Erzeugung sowie deren Verwendung |
| WO2015053828A2 (en) | 2013-06-15 | 2015-04-16 | Brookhaven Science Associates, Llc | Formation of antireflective surfaces |
| US10290507B2 (en) | 2013-06-15 | 2019-05-14 | Brookhaven Science Associates, Llc | Formation of antireflective surfaces |
| DE102013111785B4 (de) * | 2013-10-25 | 2025-12-24 | Pictiva Displays International Limited | Verfahren zum Herstellen eines optoelektronischen Bauelementes |
| US11135649B2 (en) * | 2018-02-27 | 2021-10-05 | Arizona Board Of Regents On Behalf Of Arizona State University | Direct metal printing with stereolithography |
| US12502823B2 (en) * | 2022-01-13 | 2025-12-23 | Arizona Board Of Regents On Behalf Of Arizona State University | Color image printing by polymer-assisted photochemical deposition |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ATE246542T1 (de) | 1997-10-29 | 2003-08-15 | Univ Ulm | Nanostrukturen |
| JP2006038999A (ja) * | 2004-07-23 | 2006-02-09 | Sumitomo Electric Ind Ltd | レーザ照射を用いた導電性回路形成方法と導電性回路 |
| US8361553B2 (en) * | 2004-07-30 | 2013-01-29 | Kimberly-Clark Worldwide, Inc. | Methods and compositions for metal nanoparticle treated surfaces |
| EP1760527B1 (de) * | 2005-09-05 | 2012-06-06 | DWI an der RWTH Aachen e.V. | Photochemische Methode für die Produktion von oberflächenverzierten Substraten im Nanometerbereich |
| DE102007014538A1 (de) * | 2007-03-27 | 2008-10-02 | Carl Zeiss Ag | Verfahren zur Erzeugung einer Antireflexionsoberfläche auf einem optischen Element sowie optische Elemente mit einer Antireflexionsoberfläche |
| DE102007017032B4 (de) | 2007-04-11 | 2011-09-22 | MAX-PLANCK-Gesellschaft zur Förderung der Wissenschaften e.V. | Verfahren zur Herstellung von flächigen Größen- oder Abstandsvariationen in Mustern von Nanostrukturen auf Oberflächen |
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- 2010-11-15 US US13/510,107 patent/US9169566B2/en active Active
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- 2010-11-15 EP EP10778575.0A patent/EP2501842B1/de active Active
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Also Published As
| Publication number | Publication date |
|---|---|
| US9169566B2 (en) | 2015-10-27 |
| DE102009053406A1 (de) | 2011-05-19 |
| US20120244322A1 (en) | 2012-09-27 |
| EP2501842B1 (de) | 2018-08-29 |
| WO2011057816A2 (de) | 2011-05-19 |
| WO2011057816A3 (de) | 2011-08-11 |
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