Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
  • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
  • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
  • B65G59/00—De-stacking of articles
  • B65G59/02—De-stacking from the top of the stack
  • B65G59/04—De-stacking from the top of the stack by suction or magnetic devices
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B28—WORKING CEMENT, CLAY, OR STONE
  • B28D—WORKING STONE OR STONE-LIKE MATERIALS
  • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
  • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
  • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
  • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
  • B65G59/00—De-stacking of articles
  • B65G59/02—De-stacking from the top of the stack
  • B65G59/023—De-stacking from the top of the stack by means insertable between the stacked articles or layers
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
  • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
  • B65G59/00—De-stacking of articles
  • B65G59/02—De-stacking from the top of the stack
  • B65G59/04—De-stacking from the top of the stack by suction or magnetic devices
  • B65G59/045—De-stacking from the top of the stack by suction or magnetic devices with a stepwise upward movement of the stack
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
  • H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
  • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
  • H01L21/67766—Mechanical parts of transfer devices
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
  • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
  • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
  • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
  • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
  • H01L21/67781—Batch transfer of wafers
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
  • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
  • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
  • H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
  • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
  • B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
  • B65G2201/02—Articles
  • B65G2201/0297—Wafer cassette

Definitions

• the invention relates to a device for stacking or transporting a plurality of flat substrates, in particular silicon wafers for solar cell production, according to the preamble of claim 1. Furthermore, the invention relates to a method for introducing a total of many flat substrates into such a device.
• silicon wafers for solar cell fabrication after being detached from a support after being diced from a silicon ingot are kept in a bath of water or process solution. Then they are taken out by hand, for example, in subsets of about 50 to 100 pieces, and used in a machine carrier. They are introduced in a horizontal position. The machine carrier is then lowered vertically into a water bath vertically standing down and by means of an automatic removal means such as a belt individual substrates are then removed from the machine carrier and further processing, in particular a final cleaning supplied. In this case as complete as possible separation of the substrates from each other. A problem is considered that the wafers are grasped by hand and used in the machine carrier. Here, the risk of damage to the very sensitive wafer is given.
• the invention has for its object to provide a device mentioned above and a corresponding method with which Disadvantages of the prior art can be avoided and in particular a useable, material-friendly and safe introduction of the substrates in the machine carrier is possible.
• the apparatus comprises an upright machine carrier for receiving a plurality of the flat substrates as a whole. This can be, for example, up to 1000 such substrates. The substrates are then in the machine carrier in a horizontal position.
• the device has at least one loading cassette or advantageously two loading cassettes, in particular similar or identical, into which a subset of the total amount of the substrates can be introduced. This can be, for example, about a quarter or a third of the total.
• the machine carrier has receiving devices for the loading cassette to secure it with the substrates therein in the machine carrier.
• a loading cassette is formed to have a lower support device onto which the substrates can be laid or stacked thereon. Furthermore, it has a substantially perpendicular thereto extending back, which holds the substrates in this direction as a kind of vertical stack.
• the loading cassette is designed so that the backside te opposite side and the top are freely accessible, so in particular no walls, supports or the like. exhibit.
• the device according to the invention a smaller number of substrates, for example, the said 100 pieces to introduce into the loading cassette, for example, three times 100 pieces can be inserted into the loading cassette.
• the loading cassette may even be immersed in the bath, in which the substrates are located, so that their mechanical stress and handling besondert is advantageous.
• After filling the corresponding amount of the loading cassette it is introduced into the machine carrier, so that ultimately the substrates are in a precisely predetermined orientation or position in the machine carrier. This can advantageously be done in such a way that the loading cassettes are first introduced from bottom to top. It is therefore not necessary to handle an entire machine carrier by hand or to put it in a bath with the substrates in it.
• the base of the loading cassette or the support device to which the substrates are placed not much larger than the surface of the substrates themselves.
• the loading cassettes can be used not only with slightly modified, already existing machine carriers, but they also cause the machine carrier no too much effort with the exception of the recording devices.
• a machine carrier can be designed, for example, for receiving two or advantageously three loading cassettes one above the other, possibly also four to six such loading cassettes. This also depends on the total amount of substrates or their total weight. A subdivision should be done so that a loading cassette with the number of substrates intended for them can still be easily moved by an operator by hand for insertion into the machine carrier.
• the loading cassettes in the machine carrier should occupy only so much space that acceptance means for separating or removing the uppermost substrates of the substrate stack can engage or move into the uppermost loading cassette.
• Such removal means are advantageously designed as usual or as known, in particular as bands for removing the substrates by suction.
• the carrying device on the loading cassette can be designed so that it forms a surface in one embodiment of the invention, in particular a substantially continuous surface. This surface can be profiled for better stability.
• the carrying device may have two support surfaces extending on the left and right sides with a continuous recess therebetween. The support surfaces are each provided on side supports, which then cause the substantial stability of the carrying device or the loading cassette in this area.
• Said recess may have at least 35% of the width of the loading cassette, preferably a little more, for example 50% to 70%. Furthermore, it may have a depth of at least the depth of a substrate, advantageously even slightly more.
• the recess has the advantage that later when removing individual substrates from above from the machine carrier said removal means can be fixed and, so to speak intervene in the machine carrier, and this is driven slowly up to each of the substrates to the bottom of the removal means bring. In this case, the removal means can then pass through the recesses through the loading cassettes in the machine carrier, so that they, when empty, do not have to be removed.
• it may be profiled in its longitudinal direction. For this purpose, it can be angled one or more times as a single or multiple U-profile.
• a named support surface may be formed, for example, on an upwardly pointing or upper intermediate leg, which extends between two U-legs and connects them.
• side supports may be provided on the loading cassette, which connect the rear side thereof with the outer sides of the carrying device. They may be formed, for example, as side walls, which advantageously have the entire height of the back, but not necessarily are led to the very front, so are slightly set back. Such side supports can improve the stability of the loading cassette or stabilize the angular arrangement between the support surface and the back. Furthermore, they can cause a laterally exact positioning of the substrates in the loading cassette.
• a stop is advantageously also provided which, for example, can be arranged directly on the rear side, in particular close to the outer side.
• Such a side wall may be continuous or have recesses.
• the rear side of the carrying device or the substrates stacked thereon is bent away or arched.
• This curvature can be relatively strong and, for example, a quarter to a third of the width of Beladekasset- te have.
• the curvature towards the rear on the one hand, as described above, it can be achieved that the decrease can extend beyond the substrates into the loading cassette.
• the area of this camber is open backwards downwards, it can be achieved that broken substrates can fall down and be separated from the singulated substrates.
• the rear side has at least one opening, particularly advantageously several horizontal slot-like openings. These can advantageously extend over their essential width, possibly even be divided once. Several such slot-like openings may be provided substantially over the entire height of the rear side. These openings serve to remove broken substrates or their individual parts to the rear from the loading cassette and thus the machine carrier.
• a loading cassette on at least one side on the back, preferably on the left and right near the outsides, have gripping devices. These may be formed, for example, as vertically extending handle bars, which is particularly good for holding or handling heavy loading cassettes.
• locking devices can be provided in order to fasten or lock a loading cassette after insertion into the machine carrier.
• Such locking devices are advantageously designed so that they can be operated with a finger without great effort, in particular for locking.
• they can be provided, for example, close to a previously described grip device, for example in the case of vertical grip rods in their upper region.
• the receiving devices on the machine carrier can advantageously be designed to be adjustable or height-displaceable. This way, a machine carrier can be adapted to different sized or high loading cassettes.
• At least one retaining element is provided on the side of the machine carrier, which is opposite to the insertion side of the loading cassette, that is on the open side.
• the retaining element is used to prevent the insertion of a loading cassette with substrates from falling out to the front, ie in the insertion direction.
• a machine carrier can advantageously be designed as known, ie essentially consist of a lower plate and an upper plate, which are connected by side walls and lateral support rods. Said insertion side for introducing the loading cassette into the machine carrier as well as the opposite side, on which the substrates are removed, are advantageously substantially free.
• a loading cassette can advantageously consist of fiber-reinforced plastic. This may also facilitate the manufacture.
• a multi-part loading cassette can be made by gluing or screwing several parts together.
• FIG. 1 is an oblique view of a loading cassette shown in simplified form
• FIG. 2 shows a side view of the insertion of several loading cassettes into a machine carrier
• FIG. 3 is a view obliquely from above of a specially designed loading cassette
• FIG. 4 is a view of the loading cassette of FIG. 3 obliquely from behind and above,
• FIG. 5 is a view from obliquely behind a device according to the invention with a machine carrier, in the similar to FIG. 2, three loading cassettes are used,
• FIG. 6 shows the arrangement of FIG. 5 obliquely from the front, each with a deposited on the loading cassettes substrate and
• Fig. 7 shows a slightly modified loading cassette in a loading device.
• a loading cassette 11 is shown in a simple form, which is constructed substantially angularly. It has a lower support surface 13, which, as shown here, in the simplest case is simply continuous. It is formed in the shape of the male substrates according to rectangular or square.
• the loading cassette 1 1 has a right-angled and extending back 15, which is formed as a kind of continuous wall. Furthermore, two short side walls 16a and 16b are provided which additionally on the one hand cause a better and more stable connection of support surface 13 and back 15. Furthermore, they serve as lateral stops for inserted into the loading cassette 11 substrates, which has substantially the area or at least the width of the support surface 13. The rear stop is formed by the back 15 itself.
• the side walls 16a and 16b could be pulled further forward, possibly up to the front of the support surface 13. This would result in an improvement of the stabilizing effect. Furthermore, this would also improve the effect of the lateral stops for the substrates. It is also possible to form such side walls obliquely.
• FIG. 2 shows how a loading cassette 11 according to FIG. 1 is loaded with a multiplicity of flat substrates 20.
• the substrates 20 actually lie directly on top of one another and are advantageously silicon wafers for the production of solar cells, for example with a dimension of 156 mm ⁇ 156 mm.
• an aforementioned subset of these substrates 20 is introduced or the substrates 20 are stacked on the support surface 13. It can be seen that the stack of substrates 20 occupies approximately only half the height of the loading cassette 11 or up to twice as many substrates 20 could be introduced. Usually, however, as explained above, even for reasons of the total weight of loading cassette 11 and substrates 20 such complete filling should be omitted.
• a machine carrier 22 is shown, as it is basically known per se.
• a lower support plate 24a and an upper support plate 24b are connected by side members 26a and 26b to form a kind of frame which is fully open to the left and right in FIG.
• Two loading cassettes 11 are already introduced into the lower area of the machine carrier 22 and are held therein. Can do this For example, on the inner sides of the side parts 26a and 26b projecting lugs, guides, slides or the like. be provided. The insertion of the loading cassettes 11 takes place so far that they rest on the left with the side walls 16 at the rear side edge of the side parts 26. To the right, both the support surfaces 13 and above all the substrates 20 via.
• the machine carrier 22 After being loaded with the loading cassettes 11 and thus with the substrates 20, the machine carrier 22 can be moved to a separating device which individually removes the substrates 20 and further transports them individually for further processing. In a simple case, this may be a lowering in the vertical direction downwards, advantageously in a water bath. Then, a removal means shown schematically here in the form of a suction conveyor belt 28 can be used. This is narrower than the distance between the two side parts 26a and 26b to each other and thus extends into the machine carrier 22 inside. It can be lowered down to the substrates 20 zoom, alternatively, the machine carrier 22 can be moved with the substrates according to the suction conveyor belt 28 zoom.
• a central recess can be provided in the support surface 13 corresponding to FIG. 1, which is shown and described in the other embodiment according to FIGS. 3 and 4.
• the suction conveyor belt 28 removes the substrates 20 individually and then places them on a singling belt 29 running underneath.
• This is basically known from the prior art and therefore need not be explained in detail.
• a modified loading cassette 111 is shown, as it may be exemplified concretely.
• a support surface is now divided into two divided support surfaces 113a and 113b with a far reaching, central recess 114 in between.
• the support surfaces 113a and 113b are, so to speak, only wide strips, but are sufficient for sufficiently secure application of substrates, corresponding to FIG. 2.
• the support surfaces 113 are provided on side supports 117a and 117b, which are profiled or repeatedly corrugated in the longitudinal direction. As a result, their stability can be significantly improved. Laterally on the outside of the side supports 117 they are formed as longitudinal rails 118a and 118b, which extend in a single, horizontal plane and laterally project significantly beyond side walls 116a and 116b.
• the longitudinal rails 118 are used to insert the loading cassette 111 in corresponding grooves or on above-described guide rails or the like. in the machine carrier, which will be explained in more detail below.
• This back 115 is, as is particularly clear from Fig. 4, not flat and closed as shown in Fig. 1, but strongly curved backwards. This causes them always behind the recess 1 14 runs and thus a suction conveyor belt according to FIG. 2 can drive through. Furthermore, their stability can be improved even further. Down to the rear 1 15 goes smoothly and rounded in the side support 117 and the rear edge of the recess 114 via. It can also be seen in particular from FIG. 4 that slot-like openings 19 are provided on the rear side 115. These are divided in the middle or do not extend over the entire width of the back 115 in order to increase the stability. Nevertheless, the openings 119 in the back 115 take about half of the edge surface. Alternatively, they are consistent.
• the loading cassette 11 On the outsides of the back 115, two handles are provided. By means of these, the loading cassette 11, in particular when it is loaded with substrates, gripped and moved.
• Locking devices 135a and 135b are provided on the upper side of the rear side 115, which is pulled slightly forward and inward and is also connected to an upper edge of the side walls 116. Such a design is generally known and the locking devices 135 serve to secure the loading cassette 11 therein after insertion into a machine carrier. If the locking devices 135 pressed down, so a loading cassette 11 1 can also be removed again. It can be seen that by the arrangement of the locking devices 135 close to the handles 133, an operation with the thumb is easily possible, ie, at the same time secure holding the loading cassette 111th
• the openings 1 19 serve that broken substrates or their individual parts to the rear, so to speak, approximately in the horizontal direction, can fall out and not disturb.
• FIGS. 5 and 6 show how three loading cassettes 111 according to FIGS. 3 and 4 are introduced into a machine carrier 122.
• the machine carrier 122 has on the inner sides of the side parts 126a and 126b simple horizontal, slot-like grooves 137 which extend over the entire width of the side parts 126.
• Such grooves 137 may be provided at certain locations, which then allows the insertion of the loading cassette 11 exactly in this position. It can also be far more than the three grooves shown 137 may be provided, which then allows the insertion in different heights in principle.
• locking brackets 139 are provided, at least above the lowermost and above the second lowermost loading cassette 11 1. They are laterally outwardly attached to the side parts 126a and 126b and extend with a course corresponding to that of the back 115 in the loading cassette 111, via the Width. On them or their underside, the locking devices 135 of the loading cassettes 111 can engage or lock. For the sake of clarity, the illustration of such a locking bracket above the uppermost loading cassette 111 has been dispensed with. Such locking bracket 139 can also odgl at corresponding holes. be provided at different heights. Furthermore, it is shown how sliding layers 127a and 127b are provided on the inner sides of the side parts 126a and 126b. These consist, for example, of thin, ceramic inserts which are glued to the inside of the side parts 126 and prevent the possibly sharp side edges of inserted substrates from permanently damaging the material.
• FIG. 6 shows how a substrate 120 rests on each of the support surfaces 113 of the loading cassette 111. These substrates 120 rest with their rear edge against the stop strip 131. It can also be seen from this illustration that fragments of such substrates are either removed in the horizontal direction to the rear through the openings 119 in the rear sides 15 or, since the machine carrier 122 is then in a water bath together with substrates 120 , Alternatively, they may fall downwardly through the rearwardly drawn rear portions of the recess 114 between the support surfaces 113a and 13b. In the process, the fragments fall from the uppermost loading cassette 111 into the underlying loading cassettes. In practice, however, they will simply fall through them, which is not a problem.
• the aforementioned retaining elements may be provided, for example, in the illustration of FIG. 6, in front of the machine-carrier 122 open side of the drawing plane, for example as elongated rods fixed to the support plates 124a and 124b at the top and bottom. You can, for example, according to the course of the stop strip 131 run, it is possible here only on one side such a retaining element.
• it can then be removed after successful insertion of the loading cassettes 111 into the machine carrier 122, either completely removed or, for example, pivoted to the side. This allows the removal of the individual substrates 120 with a suction conveyor belt as described above.
• Fig. 7 shows a somewhat different loading cassette 211.
• the rear side 215 has two large openings 219, which in turn are separated by a web for better stability. Since the side walls 216 adjoin the side supports 217 on the outside, the longitudinal rails 218a and 218b are provided here for the sake of simplicity as extended side walls at their upper region, namely by bending the side walls outward. In this case, receiving devices or the grooves in the machine carrier of FIG. 5 are provided at a correspondingly different location.
• the loading cassette 211 is inserted into a loading device 240.
• the loading device 240 is designed so that the loading cassette 21 1 can be obliquely inserted from above into a rail-like or U-like receptacle 241.
• the loading cassette 21 1 can be obliquely inserted from above into a rail-like or U-like receptacle 241.
• it is still easily accessible from above and inserted substrates slip through their own weight until not shown here stop strip, which are provided as well as in Fig. 3.
• the loading operation of the loading cassette 211 with substrates can be considerably simplified, both for an operator and for the substrates.
• it In order to remove a filled loading cassette 211, it can either move in the direction of the side support. ger 217 pulled out or lifted out or just vertically upwards.
• the goal of providing at least one loading cassette in the machine carrier is the reduction of mechanical stress on the substrates or wafers and also the reduction of a breakage risk. Among other things, this is achieved by reducing the total amount of substrates stacked on top of one another and / or reducing the stack height. For this purpose, depending on the circumstances, even more carrying devices may be provided in the manner of intermediate shelves per loading cassette. Also, a possible loading according to the invention is associated with a lower risk of breakage if the substrates can be reloaded with as few manual steps as possible and, above all, no longer have to be compressed.

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• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• General Physics & Mathematics (AREA)
• Manufacturing & Machinery (AREA)
• Computer Hardware Design (AREA)
• Physics & Mathematics (AREA)
• Power Engineering (AREA)
• Mechanical Engineering (AREA)
• Robotics (AREA)
• Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
• Warehouses Or Storage Devices (AREA)
• Sheets, Magazines, And Separation Thereof (AREA)
• Packages (AREA)

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• 2009
  • 2009-05-29 DE DE102009024239A patent/DE102009024239A1/de not_active Withdrawn
• 2010
  • 2010-05-28 SG SG2011086824A patent/SG176218A1/en unknown
  • 2010-05-28 TW TW099117277A patent/TW201108347A/zh unknown
  • 2010-05-28 EP EP10721807A patent/EP2435227A1/de not_active Withdrawn
  • 2010-05-28 KR KR1020117031240A patent/KR20120025556A/ko not_active Application Discontinuation
  • 2010-05-28 CN CN2010800337848A patent/CN102596522A/zh active Pending
  • 2010-05-28 JP JP2012512392A patent/JP2012528479A/ja active Pending
  • 2010-05-28 MX MX2011012709A patent/MX2011012709A/es not_active Application Discontinuation
  • 2010-05-28 WO PCT/EP2010/057428 patent/WO2010136568A1/de active Application Filing
• 2011
  • 2011-11-28 US US13/305,198 patent/US8337134B2/en not_active Expired - Fee Related

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