Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/42—Wire connectors; Manufacturing methods related thereto
  • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
  • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
  • H01L2224/4805—Shape
  • H01L2224/4809—Loop shape
  • H01L2224/48091—Arched
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/30—Technical effects
  • H01L2924/301—Electrical effects
  • H01L2924/3025—Electromagnetic shielding
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/09—Shape and layout
  • H05K2201/09009—Substrate related
  • H05K2201/091—Locally and permanently deformed areas including dielectric material
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/09—Shape and layout
  • H05K2201/09209—Shape and layout details of conductors
  • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
  • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/09—Shape and layout
  • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
  • H05K2201/09909—Special local insulating pattern, e.g. as dam around component
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
  • H05K2201/10007—Types of components
  • H05K2201/10106—Light emitting diode [LED]
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
  • H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/01—Tools for processing; Objects used during processing
  • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
  • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/14—Related to the order of processing steps
  • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
  • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
  • H10H20/80—Constructional details
  • H10H20/85—Packages
  • H10H20/855—Optical field-shaping means, e.g. lenses
  • H10H20/856—Reflecting means
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T29/00—Metal working
  • Y10T29/49—Method of mechanical manufacture
  • Y10T29/49002—Electrical device making
  • Y10T29/49117—Conductor or circuit manufacturing
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T29/00—Metal working
  • Y10T29/49—Method of mechanical manufacture
  • Y10T29/49002—Electrical device making
  • Y10T29/49117—Conductor or circuit manufacturing
  • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T29/00—Metal working
  • Y10T29/49—Method of mechanical manufacture
  • Y10T29/49002—Electrical device making
  • Y10T29/49117—Conductor or circuit manufacturing
  • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
  • Y10T29/49155—Manufacturing circuit on or in base

Definitions

• Simple printed circuit boards consist of an electrically insulating carrier material (base material) on which one or two copper layers are applied.
• the layer thickness is typically 35 ⁇ m and for applications with higher currents between 70 ⁇ m and 140 ⁇ m.
• Some printed circuit board applications require mirrors as reflectors or for directing the light.
• it is sometimes desirable to emit certain radiation from a printed circuit board for example in the visible range.
• a reflector surface of LED-printed circuit boards of white color for example solder-solder paste.
• solder-solder paste has poor reflectivity and is difficult to mold when curved mirror geometry is desired to produce directed or focused light.
• the spectral response is not optimal and the reflectivity in the UV band is poor.
• the invention is therefore based on the object to arrange a reflector on a printed circuit board, which is able to produce directed light with high efficiency.
• the invention has the object to propose a novel method for producing a printed circuit board with reflector layer.
• the invention is characterized by the technical teaching of claim 1.
• a printed layer is arranged, which reflects light.
• a base layer on the substrate of the printed circuit board.
• Such a base layer can also be formed in three dimensions, for example to obtain a parabolic mirror.
• a transparent protective layer To protect the reflective layer, it is further provided to cover the reflective layer with a transparent protective layer.
• embossings are formed in the copper surface by specially designed press plates, that is, with corresponding 3D elevations. Subsequently, the copper surface can be galvanically and / or electrochemically provided with the corresponding surface.
• the passivation by means of a transparent polymer is provided.
• a noble metal surface with an oxide layer and / or a nitride layer may be used. This can then be protected with a so-called “blue 1 stripping paint (commonly used for gold contacts) and removed after the assembly process.
• Figure 1 section through a first embodiment of a fitted with a reflector circuit board
• Figure 3 A modified embodiment with a reflector and an opening for receiving an LED
• Figure 4 a sectional view through the basic structure of the circuit board
• Figure 5 Longitudinal section through an electrically finished printed circuit board before further processing for receiving LEDs and
• FIG. 6 top view of the arrangement according to FIG. 5
• Figure 7 the same view as Figure 5 showing the printing process with a reflective layer is applied
• FIG. 8 shows the plan view of the arrangement according to FIG. 8
• FIG. 9 an embodiment modified from FIG. 7, in which the printed reflection layer is on. a layer of insulating and dielectric ink is applied
• FIG. 10 shows the top view of the arrangement according to FIG. 9
• FIG. 11 shows a further processing step, which follows the processing step according to FIG
• FIG. 12 the top view of the arrangement according to FIG. 11
• Figure 13 the final processing step following the processing step of Figure 11
• FIG. 14 the top view of the arrangement according to FIG. 13
• Figure 15 a comparison with the figures 5 to 14 same processing, but in which oblique reflecting surfaces are made
• FIG. 16 the top view of the illustration according to FIG. 15
• Figure 19 the final processing step showing the finishing of the printed circuit board as a result of the processing step of Figure 17
• FIG. 20 the top view of the arrangement according to FIG. 19
• FIG. 21 the assembly of a printed circuit board finished according to FIG. 19 with an LED
• FIG. 22 the plan view of the arrangement according to FIG. 21
• FIG. 23 shows the illustration of the radiation directions of the LED according to FIG. 21
• FIG. 24 shows the plan view of the arrangement according to FIG. 23 FIG. 25: an embodiment modified from the previous embodiments, in which the base pressure which carries the specular reflecting surfaces is printed several times and with a thicker layer thickness
• FIG. 26 the plan view of the arrangement according to FIG. 25
• FIG. 27 shows the mounting of an LED in the arrangement according to FIG. 25
• FIG. 28 the plan view of the arrangement according to FIG. 27
• FIG. 29 shows the light guide of the LED mounted according to FIG.
• FIG. 31 shows the light guide of an LED mounted according to FIG. 29 with a modified mirror surface
• FIG. 32 the plan view of the arrangement according to FIG. 31
• FIG. 33 shows a modified embodiment of a first processing step of an electrically conductive printed circuit board with respect to FIG. 5 with a base layer applied in the dipping process
• FIG. 34 shows the top view of the arrangement according to FIG. 33
• FIG. 35 shows the further processing step following FIG. 33
• FIG. 36 the plan view of the arrangement according to FIG. 35
• FIG. 37 the processing step subsequent to FIG. 35 with exposure of the photo film
• FIG. 38 the plan view of the arrangement according to FIG. 37
• FIG. 39 shows the further processing step following FIG. 37
• FIG. 40 shows the plan view of the arrangement according to FIG. 39
• FIG. 41 the processing step subsequent to FIG. 39 with a processing step in FIG
• FIG. 42 shows the top view of the arrangement according to FIG. 41
• FIG. 43 the further processing step subsequent to FIG. 41 with the
• FIG. 44 shows the plan view of the arrangement according to FIG. 43
• FIG. 45 shows a processing step subsequent to the processing according to FIG. 43 with the overlap of the LED with a color conversion layer
• FIG. 46 the plan view of the arrangement according to FIG. 45
• FIG. 47 shows the radiation path of the LED resulting from FIG.
• FIG. 48 the plan view of the arrangement according to FIG. 47
• FIG. 49 shows a modified version of FIG. 47
• FIG. 50 the plan view of the arrangement according to FIG. 49
• FIG. 51 the section through a printed circuit board with reflector surface for mounting a plurality of LEDs
• FIG. 52 the plan view of the arrangement according to FIG. 51
• FIG. 53 the processing step subsequent to FIG. 51, which shows the assembly of two LEDs
• FIG. 54 the plan view of the arrangement according to FIG. 53
• FIG. 55 shows an embodiment which has been extended compared to FIG. 53 and which shows the arrangement according to FIG. 53 with an additional color conversion layer
• FIG. 56 the plan view of the arrangement according to FIG. 55
• FIG. 57 is a schematic representation of the process flow for producing the circuit board according to the invention with mirror surfaces
• the base layer 2 can be applied to the top of a circuit board 1, regardless of whether the top carries a structure or not.
• a bottom solder mask or other layer may be used as a support for the reflector layer 3.
• the base layer 2 can also be omitted.
• the layer carrying the reflecting surface (base layer 2) forms a smooth surface and / or forms good adhesion for the three-dimensionally shaped reflector layer 3 arranged above it.
• the base layer 2 can be applied by various printing techniques, in particular by ink jet printing, screen printing and all other printing methods, such as pad printing, gravure or gravure printing and the like.
• ink jet printing screen printing
• all other printing methods such as pad printing, gravure or gravure printing and the like.
• curtain coating, roll casting and lamination methods are known in particular create a corresponding structure, including a photographic exposure method. All these methods are used according to the invention in isolation or in combination with one another for the production of the shaped base layer and claimed as essential to the invention.
• the reflector surface 3 is preferably printed for the generation of visible light.
• a reflection layer preferably consists of a metallic, fast-drying ink composition, in particular silver, gold, aluminum and all other suitable metals:
• non-metallic materials are used, which are suitable to reflect light in a certain wavelength range, including wavelength ranges in the non visible area are applicable.
• printing methods such as ink-jet printing, screen printing, pad printing and other applied printing methods are used for the application.
• a base layer 2 as a carrier layer for a subsequent
• Reflector layer 3 serve.
• a silver layer may be used as the seed layer for the subsequent application of a copper plating.
• the application of the three-dimensionally shaped reflector layer 3 is provided by a structuring photo exposure.
• the reflector layer 3 consists of several layers. In another embodiment of the invention, it is provided prefabricate the three-dimensionally shaped mirror and then stick it to the surface of the circuit board.
• the mentioned cover layer 4 over the reflector layer 3 is optional.
• the base layer 2 and the cover layer 4 may be made of the same material, but this is not mandatory.
• the cover layer 4 may be light-transparent or light-colored and serve as a color filter.
• the cover layer 4 can be applied by applying processes, as preferably by ink jet printing, screen printing, application printing and all other printing methods. Likewise, an applied photographic exposure can be used.
• the cover layer 4 may cover only the reflector layer 3 or it may also cover the reflector layer 3 and additionally the base layer 2 or only a part of the reflector layer 3.
• FIG. 2 shows a modification of the construction according to FIG. 1. All variants described with reference to FIG. 1 also apply here.
• the curvature of the reflector layer 3 can be positive or negative (convex or concave).
• the curvature can be produced by forming a base layer.
• the circuit board 1 itself can be arched. Such a curvature can be done by a Formdschreib- or deep drawing.
• FIG. 3 shows a further embodiment of a printed circuit board 1 provided with a reflective surface and equipped with an LED chip in a recess 6 in the reflector layer 3.
• the curvature can either by mechanical deformation, z. B. by compression molding, stamping, milling or other machining processes.
• the curvature can be carried out by applying methods, such as ink jet printing or pad printing.
• the base layers 2a, 2b, 2c may be stacked on each other to obtain the desired curvature (see FIG. 4).
• FIG 3 not only a single recess 6 can be arranged for receiving the LED chip. In another embodiment, a plurality of recesses 6 for receiving LED chips or connecting wires or other compounds may be provided.
• Figures 5 and 6 show an electrically finished multilayer printed circuit board, which consists of a layered structure of a printed circuit board substrate 1, which is usually made of an insulating plastic material, in particular a resin material.
• a plurality of conductor tracks 5 are arranged made of copper, which establish the conductive connections between the electrical components, which are mounted on the circuit board.
• the uppermost conductor track or interconnect layer 5 carries recesses 6 at specific locations, so that the insulating printed circuit board substrate 1 appears underneath. According to FIG. 6, a printed conductor surface is thus created which is separated from the rest of the conductor track 5 on all sides and on which the later LED chip 8 is mounted.
• a further interconnect surface is formed as a bonding surface 9 in the immediate vicinity of this interconnect surface, which is exempted by the exemption in the upper interconnect layer 5 of the surrounding conductor tracks.
• This bonding surface 9 is electrically conductively connected to a conductor track 5a, which is electrically insulated from the remaining conductor track layer 5.
• the ink jet print head 10 is guided in the direction of arrow 12 over the solder mask 7 and sprayed in register the ink droplets 11 in the edge region to the later mounting surface for the LED chip 8 and the bonding surface 9 around.
• the print head 10 is guided so precisely with its longitudinal guide and with its digitally controlled pressure that it is avoided that possibly electrically conductive ink 11 reaches the region of the insulating recesses 6 which surround the two surfaces 8, 9 ,
• the reflection layer 3 only reaches the surrounding area around the surfaces 8, 9, but without bridging the electrically insulating recesses 6 which extend around the surfaces 8, 9.
• FIGS. 9 and 10 show as a deviating exemplary embodiment that it is not necessary to print on a solder mask 7. Instead, a separate insulation layer 13 can first be printed by the inkjet method.
• the insulating layer 13 can also be applied using a different coating method. Again, the same explanations as given with reference to FIGS 7 and 8 apply.
• solder mask 7 under the insulation layer 13, which preferably consists of an insulating and dielectric ink.
• FIG. 11 shows the processing step following FIGS. 9 and 10, where it can be seen that an additional protective layer 14, which can also be printed several times, is applied to the upper reflection layer 3 applied in the inkjet printing process.
• the upper, possibly conductive reflective layer 3 is protected against environmental influences and covered.
• the protective layer 14 applied above is used for electrical insulation of the reflection layer 3. It is usually transparent.
• this protective layer 14 may also be translucent or else formed in a different color in order to provide the light reflected at the reflection layer 3 with a color component.
• This protective layer 14 is preferably applied by inkjet printing.
• FIGS. 11 and 13 show that the protective layer 14 preferably encompasses the reflection layer 3 over its entire circumference and forms corresponding edge seals 15 in order to achieve an airtight, protective connection to the surface of the printed circuit board.
• FIG. 15 shows, as an alternative to the embodiment according to FIG. 13, that initially a first layer of an insulation layer 13 having walls bounding the recess 6 at right angles is printed on the surface of the printed circuit board.
• the subsequent printed reflective layer 3 forms obliquely directed walls to the recess 6 and the further layer of the insulating layer 3 printed thereon in turn has a bevelled wall facing the recess 6, so that altogether inclined walls 16 of a mirror reflector are formed.
• the inclined walls 16 results in a focusing effect when in the region of the recess 6, the LED is mounted.
• FIGS. 17 and 18 show that the reflection layer 3 is now printed according to the invention in the oblique walls of the layers 5, 13, wherein the rapidly curable ink 11 flows in the region of the wall 16 and thus forms oblique reflector surfaces which have a focusing effect in the region reach the recess 6 mounted LED.
• FIGS. 19 and 20 show the finished reflector arrangement produced in this way, with a mirror reflector which has walls 16 extending from the light-emitting surface 8 and flared outwards.
• FIGS. 21 and 22 show that in the region of the recess 6, an LED chip 8 is now mounted, which is guided with its bonding wire 17 onto the bonding surface 9 and is electrically contacted there.
• FIG. 21 shows a completely populated printed circuit board with a single LED and a light-focusing reflection layer 3, as will be explained in more detail with reference to FIGS. 23 and 24.
• the light emitting LED 8 initially emits direct light in the direction of arrow 18 upwards and a part of the light passes laterally on the inclined walls 16 and is there as reflected light in the arrow direction
• the light-emitting LED is arranged below the obliquely inclined walls 16 of the mirror reflector in order to allow lateral light to strike the obliquely inclined walls 16 and to be emitted upward as reflected light.
• FIG. 25 shows an alternative embodiment to the embodiment according to FIGS. 23 and 24.
• a base layer 13 has been printed several times as an insulation layer, the printing processes always proceeding so that initially a first insulation layer 13 is printed which hardens quickly and on the cured layer is printed a further layer, so as to obtain the structure of Figure 25.
• the reflection layer 3 is then printed on the oblique walls 16 produced in this way in the previously described inkjet printing process.
• the reflection layer 3 in accordance with FIG. 26 surrounds the entire region 8, 9 so as to achieve the largest possible mirror surface.
• FIGS. 27 and 28 show a further processing step following the processing step 25, wherein an LED chip 8, which is electrically conductively connected to the adjacent bonding surface 9 with its bonding wire 17, is now mounted in the region of the recess 6.
• direct light is emitted directly upwards in the direction of the arrow 18, and likewise reflected light is emitted upward at the obliquely inclined walls 16 in the direction of the arrow 19.
• the walls 16 need not necessarily be linearly inclined. It can also be provided to form the walls 16 parabolic, so as to enable a parabolic reflector.
• any desired contour of a mirror wall can thus be achieved.
• FIG. 31 where, in comparison to FIG. 29, it can be seen that the right-side reflector surface is designed as a planar reflector surface, while the left-side reflector surface has the oblique wall 16 described above.
• FIGS. 33 and 34 unlike the previously mentioned embodiments, show that it is not necessary to print the insulating layer 13 in the ink-printing method.
• a base layer 22 is applied to the surface of the cover layer 4 of the printed circuit board in the dipping process. It is thus a curable plastic that surrounds the entire circuit board and forms the base layer 22 for the later reflector structure.
• a photo film 23 is glued onto this base layer 22, which is adhesively bonded in registration as a mask in such a way that the surfaces 8, 9 necessary for the subsequent assembly operations are left free.
• the photo film 23 is irradiated with a UV exposure 24 and chemically developed according to FIGS. 39 and 40.
• a photosubstrate 25 then forms, which precisely surrounds the surfaces 8, 9 in the region of the recess 6.
• this photosubstrate 25 is now printed with the reflection layer 3 by screen printing.
• the screen 26 is coated with a corresponding screen mask, which allows the screen is closed only in the surrounding area of the recesses 6 and surrounding area of the surfaces 8, 9, while it is open in the remaining edge area and is provided for the coating of a reflector color 28, which is pressed in squeegee direction 29 with a doctor blade 27 through the open area of the screen 26. In this way, only the surrounding area of the recess 6 and the surfaces 8, 9 is coated with the reflector layer 3 in the screen printing process.
• Figures 43 and 44 show that now the assembly of the LED 8 takes place and the bonding wire 17 is electrically conductively connected to the bonding surface 9.
• Figures 45 and 46 show as an extended embodiment with respect to FIG.
• the color conversion layer is arranged hemispherical over the structure of the LED, and also partially covers the specular reflection layer 3.
• FIGS. 47 and 48 Such a beam path is shown in FIGS. 47 and 48, where it can be seen that the light emitted by the LED 8 passes through the color conversion layer 30 both as direct light in the direction of the arrow 18 and is first reflected on the inside of the color conversion layer 30 as reflected light 19 , impinges again on the reflection layer 3 and passes through the color conversion layer as an indirect light in the direction of arrow 19.
• FIGS. 49 and 50 show that apart from the previously shown rectangular or square mirror surfaces, there is also every other possibility of changing the shape of the mirror surface.
• FIG. 50 shows that such a mirror surface (planar reflection surface 20) can also be elliptical.
• FIG. 51 and 52 relate to all previously mentioned embodiments and show in addition to all the aforementioned embodiments as an additional possibility that multiple LEDs can be mounted in such a recess or optionally in a plurality of recesses 6 on a finished printed circuit board. Accordingly, the type and arrangement of the reflection layer 3 is changed in order to be able to assign a bonding surface 9 to each LED surface 8.
• FIGS. 53 and 54 A total of two LEDs are provided, which are contacted separately with their bonding wires 17 on an adjacent bonding surface 9.
• all previously mentioned embodiments of reflection surfaces can be used.
• FIGS. 55 and 56 shows that even a plurality of LEDs can each be covered with a separate color conversion layer 30.
• a plurality of LEDs with optionally different light color are arranged on the reflection surface 20, which additionally each under a common or under a separate color conversion layer
• LEDs with additional color conversion layers a wide adjustment of a desired light color done.
• FIG. 57 schematically shows the process flow according to the invention
• the process step 38 may be followed by the process step 37 with application of the color conversion layer 30.
• the process steps 39, 40 serve the further processing of the circuit board at the customer.
• a photo diode can be used for light detection.
• the domed mirror can be used to focus the light on the photo diode.
• a highly effective mirror is applied directly to the surface of a conventional printed circuit board. Accordingly, according to the patterning of the base layer, a plane mirror or a curved mirror for directing or focusing the light can be created. By using a protective cover layer 4 environmental influences or the risk of efflorescence or decomposition of the reflector layer 3 can be avoided.
• the field of application of the invention accordingly relates to standard printed circuit boards and printed circuit boards, in which a sensor, for. B. a photodiode is mounted. Similarly, a laser diode can be used to direct or focus the emitted beam in a particular direction.
• the base layer 2 or the plurality of base layers 2a-2c for forming a three-dimensional reflector may also be an epoxy resin.
• the later mirror layer 3 can be germinated (palladium, etc.) and then electrochemically or galvanically mirrored. Then a cover layer 4 would be mandatory.
• This cover layer 4 must remain highly transparent despite soldering - of course this could be a transparent solder mask, e.g. Probimer
• the LED emitter should be positioned almost exactly at the focal point.
• a reflector material of the reflector layer 3 can also cause a color conversion or color change, since reflectors i. A. have a wavelength-specific reflection.
• the advantage of the present invention is that the reflectivity of a printed circuit board at the LED-surrounding areas is substantially improved. While with the conventional white solder masks only reflectivities of 20 to 60% could be achieved, resulting in the technical teaching of the invention r reflection degrees of 90 to 95%.
• the degree of reflection depends on the wavelength of the light emitted by the LED.

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• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Led Device Packages (AREA)
• Non-Metallic Protective Coatings For Printed Circuits (AREA)
• Structure Of Printed Boards (AREA)

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Publications (1)

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• 2009
  • 2009-04-29 DE DE102009019412A patent/DE102009019412A1/de not_active Withdrawn
• 2010
  • 2010-04-24 WO PCT/EP2010/002537 patent/WO2010124825A1/de active Application Filing
  • 2010-04-24 JP JP2012507627A patent/JP5889781B2/ja active Active
  • 2010-04-24 US US13/266,144 patent/US8887384B2/en not_active Expired - Fee Related
  • 2010-04-24 EP EP10719587A patent/EP2425688A1/de not_active Withdrawn

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