EP2383808A3 - Light emitting device package having leads with a recess for the chip mount area - Google Patents
Light emitting device package having leads with a recess for the chip mount area Download PDFInfo
- Publication number
- EP2383808A3 EP2383808A3 EP11164125.4A EP11164125A EP2383808A3 EP 2383808 A3 EP2383808 A3 EP 2383808A3 EP 11164125 A EP11164125 A EP 11164125A EP 2383808 A3 EP2383808 A3 EP 2383808A3
- Authority
- EP
- European Patent Office
- Prior art keywords
- leads
- light emitting
- recess
- emitting device
- recess portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 abstract 4
- 229920005989 resin Polymers 0.000 abstract 4
- 230000002093 peripheral effect Effects 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48095—Kinked
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8538—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/85385—Shape, e.g. interlocking features
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12035—Zener diode
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010105093A JP5533203B2 (en) | 2010-04-30 | 2010-04-30 | Light emitting device and method for manufacturing light emitting device |
Publications (3)
Publication Number | Publication Date |
---|---|
EP2383808A2 EP2383808A2 (en) | 2011-11-02 |
EP2383808A3 true EP2383808A3 (en) | 2014-08-27 |
EP2383808B1 EP2383808B1 (en) | 2018-08-29 |
Family
ID=44310901
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP11164125.4A Active EP2383808B1 (en) | 2010-04-30 | 2011-04-28 | Light emitting device package having leads with a recess for the chip mount area, and corresponding manufacturing methods |
Country Status (2)
Country | Link |
---|---|
EP (1) | EP2383808B1 (en) |
JP (1) | JP5533203B2 (en) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5554691B2 (en) * | 2010-11-26 | 2014-07-23 | アピックヤマダ株式会社 | LED chip mounting substrate mold, and LED chip mounting substrate manufacturing method |
JP5505735B2 (en) * | 2011-09-22 | 2014-05-28 | 復盛精密工業股▲ふん▼有限公司 | Light-emitting diode support frame structure and manufacturing method thereof (2) |
JP5083472B1 (en) * | 2012-01-25 | 2012-11-28 | パナソニック株式会社 | LED package manufacturing method |
WO2013111253A1 (en) * | 2012-01-25 | 2013-08-01 | パナソニック株式会社 | Led package, led light-emitting element, and method of manufacturing same |
US9627583B2 (en) | 2012-02-15 | 2017-04-18 | Panasonic Intellectual Property Management Co., Ltd. | Light-emitting device and method for manufacturing the same |
JP5710554B2 (en) * | 2012-07-30 | 2015-04-30 | 株式会社マイゾックス | Surveying pole |
WO2014030530A1 (en) * | 2012-08-23 | 2014-02-27 | 三菱樹脂株式会社 | Package for light-emitting device, and light-emitting device |
JP6107136B2 (en) | 2012-12-29 | 2017-04-05 | 日亜化学工業株式会社 | LIGHT EMITTING DEVICE PACKAGE, LIGHT EMITTING DEVICE INCLUDING THE SAME, AND LIGHTING DEVICE EQUIPPED WITH THE LIGHT EMITTING DEVICE |
EP2957818B1 (en) * | 2013-02-18 | 2020-01-01 | Koito Manufacturing Co., Ltd. | Vehicle light fitting |
JP6484396B2 (en) | 2013-06-28 | 2019-03-13 | 日亜化学工業株式会社 | Light emitting device package and light emitting device using the same |
JP6610703B2 (en) * | 2013-06-28 | 2019-11-27 | 日亜化学工業株式会社 | Light emitting device package |
JP2015126091A (en) * | 2013-12-26 | 2015-07-06 | 大日本印刷株式会社 | Manufacturing method of lead frame with resin, manufacturing method of semiconductor device, injection molding die device, and lead frame with resin |
JP6214431B2 (en) * | 2014-02-28 | 2017-10-18 | Shマテリアル株式会社 | LED lead frame |
US9799812B2 (en) | 2014-05-09 | 2017-10-24 | Kyocera Corporation | Light emitting element mounting substrate and light emitting device |
JP6413412B2 (en) * | 2014-07-11 | 2018-10-31 | 日亜化学工業株式会社 | Semiconductor light emitting device and manufacturing method thereof |
JP2015159324A (en) * | 2015-04-30 | 2015-09-03 | 大日本印刷株式会社 | Lead frame for led with reflector, and manufacturing method of semiconductor apparatus employing the same |
JP6468601B2 (en) * | 2015-11-30 | 2019-02-13 | 大口マテリアル株式会社 | Multi-row LED lead frame, manufacturing method thereof, and manufacturing method of LED package |
JP6468600B2 (en) * | 2015-11-30 | 2019-02-13 | 大口マテリアル株式会社 | LED package, multi-row LED lead frame, and manufacturing method thereof |
JP7353794B2 (en) * | 2019-05-13 | 2023-10-02 | ローム株式会社 | Semiconductor device, its manufacturing method, and module |
DE102020133755A1 (en) | 2020-12-16 | 2022-06-23 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | DEVICE WITH STRUCTURED LEAD FRAME AND METHOD OF MAKING DEVICE |
JP7460911B2 (en) * | 2020-12-21 | 2024-04-03 | 日亜化学工業株式会社 | Light emitting device and display using it |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040159850A1 (en) * | 2003-02-18 | 2004-08-19 | Sharp Kabushiki Kaisha | Semiconductor light-emitting device, manufacturing method thereof, and electronic image pickup device |
JP2005294736A (en) * | 2004-04-05 | 2005-10-20 | Stanley Electric Co Ltd | Manufacturing method for semiconductor light emitting device |
US20070145403A1 (en) * | 2005-12-27 | 2007-06-28 | Kabushiki Kaisha Toshiba | Luminescent device and method for manufacturing the same |
US20080224161A1 (en) * | 2007-03-13 | 2008-09-18 | Sharp Kabushiki Kaisha | Semiconductor Light Emitting Device and Multiple Lead Frame for Semiconductor Light Emitting Device |
JP2009295883A (en) * | 2008-06-06 | 2009-12-17 | Apic Yamada Corp | Method for manufacturing of led chip mounting board, molding die of led chip mounting board, led chip mounting lead frame, led chip mounting board, and led |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001297144A (en) | 2000-04-13 | 2001-10-26 | Pc Network Plaza:Kk | Method for managing execution verification picture of property under construction |
JP3660854B2 (en) * | 2000-04-13 | 2005-06-15 | 株式会社ルネサステクノロジ | Manufacturing method of semiconductor device |
JP2006313943A (en) * | 2003-02-18 | 2006-11-16 | Sharp Corp | Semiconductor light emitting device, manufacturing method thereof, and electronic imaging device |
JP2005317661A (en) * | 2004-04-27 | 2005-11-10 | Sharp Corp | Semiconductor light emitting device and its manufacturing method |
JP4359195B2 (en) * | 2004-06-11 | 2009-11-04 | 株式会社東芝 | Semiconductor light emitting device, manufacturing method thereof, and semiconductor light emitting unit |
JP6346724B2 (en) * | 2004-11-30 | 2018-06-20 | 日亜化学工業株式会社 | Surface mount type light emitting device and manufacturing method thereof |
JP5232369B2 (en) | 2006-02-03 | 2013-07-10 | 日立化成株式会社 | Manufacturing method of package substrate for mounting optical semiconductor element and manufacturing method of optical semiconductor device using the same |
JP5599561B2 (en) * | 2008-07-22 | 2014-10-01 | 日立化成株式会社 | Thermosetting resin composition, optical semiconductor element mounting substrate using the same, method for producing the same, and optical semiconductor device |
-
2010
- 2010-04-30 JP JP2010105093A patent/JP5533203B2/en active Active
-
2011
- 2011-04-28 EP EP11164125.4A patent/EP2383808B1/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040159850A1 (en) * | 2003-02-18 | 2004-08-19 | Sharp Kabushiki Kaisha | Semiconductor light-emitting device, manufacturing method thereof, and electronic image pickup device |
JP2005294736A (en) * | 2004-04-05 | 2005-10-20 | Stanley Electric Co Ltd | Manufacturing method for semiconductor light emitting device |
US20070145403A1 (en) * | 2005-12-27 | 2007-06-28 | Kabushiki Kaisha Toshiba | Luminescent device and method for manufacturing the same |
US20080224161A1 (en) * | 2007-03-13 | 2008-09-18 | Sharp Kabushiki Kaisha | Semiconductor Light Emitting Device and Multiple Lead Frame for Semiconductor Light Emitting Device |
JP2009295883A (en) * | 2008-06-06 | 2009-12-17 | Apic Yamada Corp | Method for manufacturing of led chip mounting board, molding die of led chip mounting board, led chip mounting lead frame, led chip mounting board, and led |
Also Published As
Publication number | Publication date |
---|---|
EP2383808B1 (en) | 2018-08-29 |
JP2011233821A (en) | 2011-11-17 |
JP5533203B2 (en) | 2014-06-25 |
EP2383808A2 (en) | 2011-11-02 |
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