Classifications

• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
  • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
  • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
  • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
  • B32B17/10009—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets
  • B32B17/10036—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets comprising two outer glass sheets
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
  • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
  • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
  • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
  • B32B17/10009—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets
  • B32B17/10018—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets comprising only one glass sheet
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
  • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
  • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
  • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
  • B32B17/10165—Functional features of the laminated safety glass or glazing
  • B32B17/10293—Edge features, e.g. inserts or holes
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
  • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
  • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
  • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
  • B32B17/10165—Functional features of the laminated safety glass or glazing
  • B32B17/10541—Functional features of the laminated safety glass or glazing comprising a light source or a light guide
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
  • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
  • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
  • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
  • B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
  • B32B17/10761—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer containing vinyl acetal
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
  • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
  • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
  • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
  • B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
  • B32B17/1077—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer containing polyurethane
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
  • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
  • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
  • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
  • B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
  • B32B17/10788—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer containing ethylene vinylacetate
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B60—VEHICLES IN GENERAL
  • B60Q—ARRANGEMENT OF SIGNALLING OR LIGHTING DEVICES, THE MOUNTING OR SUPPORTING THEREOF OR CIRCUITS THEREFOR, FOR VEHICLES IN GENERAL
  • B60Q3/00—Arrangement of lighting devices for vehicle interiors; Lighting devices specially adapted for vehicle interiors
  • B60Q3/20—Arrangement of lighting devices for vehicle interiors; Lighting devices specially adapted for vehicle interiors for lighting specific fittings of passenger or driving compartments; mounted on specific fittings of passenger or driving compartments
  • B60Q3/208—Sun roofs; Windows
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
  • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
  • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
  • G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
  • G02B6/0015—Means for improving the coupling-in of light from the light source into the light guide provided on the surface of the light guide or in the bulk of it
  • G02B6/002—Means for improving the coupling-in of light from the light source into the light guide provided on the surface of the light guide or in the bulk of it by shaping at least a portion of the light guide, e.g. with collimating, focussing or diverging surfaces
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
  • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
  • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
  • G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
  • G02B6/0068—Arrangements of plural sources, e.g. multi-colour light sources
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
  • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
  • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
  • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
  • G02B6/0086—Positioning aspects
  • G02B6/0091—Positioning aspects of the light source relative to the light guide
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B2369/00—Polycarbonates
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
  • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
  • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
  • G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
  • G02B6/0015—Means for improving the coupling-in of light from the light source into the light guide provided on the surface of the light guide or in the bulk of it
  • G02B6/002—Means for improving the coupling-in of light from the light source into the light guide provided on the surface of the light guide or in the bulk of it by shaping at least a portion of the light guide, e.g. with collimating, focussing or diverging surfaces
  • G02B6/0021—Means for improving the coupling-in of light from the light source into the light guide provided on the surface of the light guide or in the bulk of it by shaping at least a portion of the light guide, e.g. with collimating, focussing or diverging surfaces for housing at least a part of the light source, e.g. by forming holes or recesses

Definitions

• the present invention relates to vehicle glazings, and in particular to light-emitting diode glazings.
• LEDs in English or LEDs in French More and more vehicles use light emitting diodes (LEDs in English or LEDs in French).
• WO2006128941 proposes for example a panoramic roof with homogeneous illumination on the surface by diode (s) electroluminescent (s).
• This roof has a laminated structure which is composed of an outer sheet extracting light, a transparent central light guiding sheet, and an inner sheet of light diffusion.
• a support of a light guide is a C-section profile on the perimeter of the laminated structure, the light guide being connected to a diode at its end.
• This structure is complex and lacks compactness.
• the light-emitting diodes are mounted on a lateral support which is a section of rectangular section fixed to the edge of the inner and outer leaves while a hole is made in the central sheet to house the diodes.
• the invention proposes to design an alternating light emitting diode module which is reliable, at least with a controlled light injection, which is robust and compact while remaining simple to achieve and mount.
• the present invention also aims a diode module satisfying the industrial requirements (in terms of efficiency, so cost, cadence, automation %), thus making a production "low cost” without sacrificing performance.
• the present invention proposes a light-emitting diode module for a vehicle comprising:
• a glazing unit with main faces comprising at least a first curved transparent sheet having a first main face and a second main face and a wafer, light-emitting diodes each comprising an emitter chip capable of emitting one or more visible and guided radiation (s) in the first sheet after injection by the wafer (perforated or not) or by the lateral face opposite hole (s) in one of the first or second main faces and housing the diodes, guidance before extraction via at least one of the first and / or second faces,
• a support section for the diodes at the edge of the glazing unit comprising a glass fixing clip with a so-called median part, a first discontinuous wing and a second discontinuous wing,
• the first wing having a first series of tabs for fixing and / or centering the clip spaced apart from each other
• the second wing having a second series of tabs for fixing the clip (or even centering as well) spaced apart from one another, the first and / or second series of tabs thus forming means for holding the diodes in vertical positions (ie position according to FIG. vertical axis at the mean plane of the glazing) predetermined with respect to the first sheet, this independently of the curve and any curve variations.
• the injection of the light emitted by all the diodes is perfectly controlled thanks to the adapted mounting bracket.
• the chips are not necessarily aligned with each other. It suffices (at least) that they remain in front of the optical coupling zone with the first sheet, which is therefore the slice or the lateral face of hole (s).
• the radii of curvature can be very varied. For roofs, they vary for example between 2000 and 6000 mm. For glasses, they can be very variable, for example from 200 to 6000 mm. On smaller panes of the quarter panel type, the radius of curvature can vary from 150 mm locally to 2000 mm.
• the radii of curvature may be of the same order or less than the radii of curvature of the mineral glass.
• the radius of curvature is for example of the order of 100 mm with abrupt variations of radii of curvature.
• Shape tolerances vary depending on the size and manufacturing process of the glazing. For example, on a side glass of mineral glass, the curve tolerances at 5 mm from the edge of the glass are generally of the order of +/- 0.5 to +/- 1.5 mm. In the case of roofs, the tolerances oscillate between +/- 0.5 and +/- 2.5 mm depending on size and process.
• the curve tolerances may be of the same order as the mineral glass or slightly lower depending on glazing control methods taking into account the flexibility of the plastic (depending on the number of reference points and / or clamping, the vertical or horizontal orientation of the glazing during the inspection, ..)
• the number and position of the legs of the first series and / or the second series will depend on the number of diodes, the space between each diode and the curve.
• At least one fixing lug and / or centering is in a plane transverse to the glazing, in particular, as a function of the mounting of the diodes, transverse plane to the mean plane of the glazing or the edge of the glazing and / or to the lateral face facing said housing hole of the diodes, said plane passing through said diode or the diode group, in particular by a diode of said group (center of the group for example).
• the total number of diodes is defined by the size and location of the areas to be illuminated, by the desired light intensity and the required light homogeneity.
• the spacing between the legs of the same series is a function of the number and size of diodes and the curve and the fact that the legs of the two series are opposite or offset (larger spacing then possible). It can therefore vary typically between 20 mm and 250 mm.
• the length of the fixing and / or centering lugs may vary from 3 to 30 mm.
• the width of the fixing and / or centering lugs may vary from 2 to 30 mm.
• the legs of the same series can be identical.
• the legs of the same series can be aligned with each other.
• the legs of the two series may be identical.
• the legs of two series can be opposite or staggered.
• the cross section of the fastening clip is variable and for example:
• the fixing lugs have, preferably at their ends, clipping portions.
• the longitudinal section of the clipping ends can be relatively free: for example rectangular, trapezoidal, triangular, T ...
• the cross section of the clipping ends can be preferably curved.
• the module comprises a polymeric encapsulation, particularly thick from 0.5 mm to several cm, located at the edge of the glazing and covering all or part of the diode support profile, and preferably sealing means to the material. liquid encapsulation injected at a given temperature and pressure.
• the encapsulating material is black or colored (for aesthetic and / or masking purposes). Since the material is not sufficiently transparent to the visible radiation (s), sealing is necessary to ensure a good injection of light into the first sheet.
• the encapsulation may be polyurethane, especially PU-RIM (reaction in mold in English), the crosslinking of the two-component PU operating in the mold, once the two components injected simultaneously.
• This material is typically injected up to 130 0 C and a few tens of bars.
• encapsulating materials are: preferably thermoplastic elastomeric thermoplastic (TPE), polyvinyl chlorine (PVC), ethylene-propylene-diene terpolymer (EPDM), typically injected between 160 ° C. and 240 ° C. and at 100 bars,
• TPE thermoplastic elastomeric thermoplastic
• PVC polyvinyl chlorine
• EPDM ethylene-propylene-diene terpolymer
• PC polycarbonate
• PMMA polymethylmethacrylate
• PE polyethylene
• PP polypropylene
• PA66 polyamide
• ABSPC acrylonitrile butadiene styrene
• PU internal or external
• silicone silicone
• acrylic acrylic
• thermoplastic resin PVB, EVA ... (internal or external).
• the encapsulation may form additional sealing means, for example more effective in the long term possibly via a layer of primer, mono, bi or tri-components, for example based on polyurethane, polyester, polyvinyl acetate, isocyanate
• silicone adhesives in the case of encapsulation on mineral glass, it may be preferable to prohibit silicone adhesives as an external adhesive, because they adhere very well to the glass but will prevent the adhesion of the encapsulated material to the glass.
• Encapsulation also brings a good aesthetic finish and allows to integrate other elements or functions:
• the encapsulation can be of any form, with or without lip, biface, triface.
• a tubing in other words a closed cell sealing profile, can also be attached to the encapsulation.
• Sealing means can be useful at several levels: o at the time of manufacture of the module, as described previously o in the long term, for example 5 years, especially for a protection against the humidity of chips (liquid water, steam), to avoid pollution of space emitted radiation
• the standard D47 1165-H7 used in the automobile describes the test of wet poultice H7.
• This test involves drowning the test piece in cotton soaked in demineralised water and enclosing it in an airtight bag, then placing it in an oven at 65 ° C for 7 days. Then the pieces are removed, stripped cotton soaked and placed at 20 0 C for 2 hours. Parts can finally be observed and tested mechanically or functionally to evaluate the effect of moisture on the system.
• This test corresponds to several years of natural aging in a humid and hot environment.
• a high-pressure water jet cleaning test such as the washing resistance test using a D25 5376 high pressure washer used in the automobile: pressure up to 100 bar with a nozzle / box distance up to 100 mm.
• Sealing means for the fluid (s) may be chosen from: an adhesive, said external placed on the surface of the support of the diodes, opposite the surface facing the glazing, and protruding on the periphery of the glazing, possibly forming all or part of the means for fixing the support to the glazing,
• Adhesive tape optionally an enveloping strip with a covering portion on the support extended by the projecting parts
• an adhesive material for filling the radiation space emitted transparent to said radiation preferably an adhesive, a thermoplastic resin, a double-sided adhesive,
• the external adhesive may be an adhesive tape: - monolithic, common to all the diodes, - or in pieces, by diodes or group (s) of diodes.
• the strip is fixed at the periphery of the glazing, by the edge of the glazing and / or by one or more main faces of the glazing.
• the so-called band then enveloping, can completely cover the support by lower and upper parts and side parts.
• the band is of dimensions (width and length) greater than the dimensions of the emergent portion of the diode support.
• the strip may also cover only the support with lower and upper parts and not the side parts (or sides) of the support profile. To facilitate the passage of the connectors, we can make through holes in the band.
• the lateral parts (or sides) of the support profile are sealed to the (s) (encapsulation and / or long-term) fluid (s) by "localized” adhesive means such as those already described. : glue, resin etc.
• connection passes between the support and the glazing, we can make through holes in the adhesive.
• the adhesive strip may comprise a rigid core (metal %) protruding from the edge of the strip and not covered, to facilitate tearing the tape at the time of repairing the vehicle or changing diodes ...
• the adhesive material for protecting the chips transparent to said radiation (s) is identical to the filling material and is chosen from:
• the space of the emitted radiation varies naturally according to the radiation pattern of the chips, defined by a main direction of emission and a cone of emission.
• the complete space between the wafer and the chips (pre-encapsulated or not), and possibly bounded by one or more wings of the support, is filled by the adhesive material.
• the module comprises a pre-assembled polymeric seal, for example made of elastomer, especially TPE (for thermoplastic elastomer), or EPDM, a few mm thick (typically between 2 and 15 mm).
• the seal may possibly form the mounting support section to the glazing (the diodes may be on a base added and fixed to the support, for example of rectangular cross section), or the seal covering all or part of the support profile of the diodes.
• the seal can be adhesive for its maintenance.
• the U-shaped seal can more preferably simply hold by pinching or donning the two main faces of the glazing.
• the seal can be of any form: in L, in U ...
• the seal can carry the diodes and the base or strip carrying the diodes (of rectangular section for example).
• the seal (associated with the base) can form here the mounting bracket to the glazing.
• the seal may comprise a metal core.
• the seal can be dismountable at any time. It can nevertheless form additional sealing means, for example (more) effective in the long term possibly by one or more of the lips of the elastomer seal stressed after fixing.
• the elastomer in particular EPDM, has a sealing function and good properties of compression remanence.
• the sealing means used are preferably between the seal and the periphery of the glazing.
• the support can be attached to the glazing before mounting the seal, the seal is then mounted by all existing means (clamping the U-shaped support, gluing by means of a double-sided adhesive ).
• the seal with the diodes can be preferably mounted in an assembly operation, with a single translational movement (by pinching, shoes ).
• EVA ethylene / vinyl acetate copolymer
• PVB polyvinyl butyral
• a double-sided adhesive transparent internally
• single-sided externally
• an adhesive transparent if in-house
• the middle part is extended on either side by the first and second wings which are on the side of the second main face, the profile comprising a carrier portion of the diodes separate and secured to the fastening clip, the second face is coated (at least) at the edge of a so-called holding layer with at least one recess for fixing and / or centering the fastening clip.
• the holding layer preferably rigid or semi-rigid (for better centering and / or fixing accuracy) can be:
• a masking layer black or colored, for example a polymeric layer, in particular a polycarbonate layer on a first polycarbonate sheet, an overmolded layer, for example a layer of encapsulation material (such as that already described above, and possibly incorporating one or more module attachment inserts and / or reinforcement as already described above).
• the retaining layer may be of minimum thickness equal to 1 mm to 20 mm.
• the retaining layer may be bonded to the first sheet by an adhesive.
• the support can be thus defined:
• the first and second wings are longitudinal, that is to say extending substantially parallel to the mean plane of the first leaf, the first wing being closer to the second face than the second wing,
• each leg of the second series carries a so-called clipping end (preferably rounded) housed in a recess of the free main surface, said clipping recess, wider than the width of the end clipping,
• the length of the clipping lugs is greater than the length of the centering lugs
• the legs of the second wing are spaced from the free surface, or housed in one or more (s) of the main free surface.
• the clipping ends may be aligned or staggered, with each other and with the centering tabs.
• the centering recess can be individual (specific to each leg) or common to several (all) centering tabs. This obviously centering can be:
• the centering and / or clipping lugs may be of preferably straight cross section, in particular rectangular (excluding clipping ends).
• the centering and / or clipping lugs may be substantially planar (excluding clipping ends).
• the medial portion may be preferably spaced apart from the holding layer and substantially flat or curved.
• the carrying part of the diodes can be substantially flat.
• the profile can be of constant thickness.
• the middle portion (and the integral carrier portion) of the diode support is preformed with a curvature substantially equal to the nominal curvature of the glazing.
• the centering tabs can then be based on:
• the curve is greater than the nominal curve.
• the median part of the support (and the solidarity carrier part) is flat and flexible before mounting on the glazing and elastically deformed during its assembly, thus becoming curved according to the curve of the glazing (at least) at the level of the fixing zones by the legs.
• the centering tabs rest on the longitudinal face of the recess furthest from the second face. On the sides of the support, the centering tabs rest on the longitudinal face of the recess closest to the second face (or even on the second face if necessary).
• the centering (and clipping) recesses can be on the outside of the holding layer (the side farthest from the center of the glazing), the carrying part of the diodes being opposite the the first leaf.
• the centering recesses (and clipping) are on the inner side of the holding layer (side closer to the center of the glazing).
• at least one or each diode (chip (pre) encapsulated or not) is in a hole (a groove for all the diodes if the carrier part is continuous, or a plurality of holes), the carrier part opening into the hole or holes.
• the centering recess (s) are preferably of depth (longitudinal dimension) less than or equal to the width of the hole (s) for the installation of the support, otherwise a groove opening is used for a mounting by the side.
• a conventional (pre) encapsulation of the chips may suffice and the tightness of the emitted radiation space may not be essential if the risk of fouling, pollution of any kind in this area are limited.
• the middle part being on or above the holding layer, the middle part being extended on both sides by the first and second wings which are transverse, that is to say in the plane perpendicular to the mean plane of the first sheet, the first and second series of fastening tabs used for clipping, (at least) one or each leg of the first and second series (Aligned or not) carries a so-called clipping end (preferably substantially rounded) housed in a recess of the so-called clipping layer, the carrying part of the diodes being substantially transverse and between the first and second flanges and partly in a hole or said holes for diode (s) of the holding layer.
• the hole or holes for diode (s) are through and the carrier portion opens into one or more housing holes of the diodes in the second face.
• the clipping recess (s) may be on the free main surface, or on the sides of the retaining layer.
• the retaining layer may have a local extra thickness in the clipping zone.
• the tabs adjust the vertical position of the diodes.
• the diodes are in front of the optical coupling zone with the first element, namely the lateral face of the housing hole.
• each diode that is to say the distance between the chip and the lateral coupling face is dictated by the centering tabs. This distance is for example of the order of 0.5 mm.
• the hole or holes for diodes and / or housing are then preferably of slightly greater width than the cumulative width of the diode and the carrier part.
• the carrier part of the diodes may be of constant cross section, constant, for example rectangular.
• the carrier portion of the diodes may also be discontinuous, of local cross section (at the level of the diodes) straight, constant, for example rectangular and with recessed areas (preferably up to the middle part, between the diode areas.
• additional longitudinal clamping tabs of length (slightly) greater than the thickness of the diode, of the holding layer, with tabs possibly against the recess in case of inclination of the receiving part, to prevent the chip from touching the side face.
• additional horizontal centering lugs short, that is to say of length less than the thickness of the holding layer, lugs that are housed in recesses. additional layers of the holding layer.
• the carrier part is sufficiently recessed between the diode zones, the latter can be reported on the median part and fixed by any means.
• the middle part and the carrier part are preferably in one piece.
• the middle portion carries diodes and legs, the local legs of the first and second series are fixing lugs for internal clipping, said lugs being longitudinal, in contact with opposite longitudinal faces of one or more holes made in the edge of the first sheet.
• the module is compact. The tabs adjust the vertical position of the diodes
• the spacing between the brackets of the first series and those of the second series is greater than the thickness of the hole or holes in the wafer to have a better clipping effect.
• the median portion is preformed with a curve substantially equal to the nominal curvature of the glazing.
• the middle part tends to be shifted vertically in one direction.
• One of the series of legs therefore presses more on the glazing.
• the middle part tends to be shifted vertically in the other direction.
• the median portion is flat and flexible before mounting on the glazing and elastically deformed during its assembly, thus becoming curved according to the curve of the glazing (at least) at the fixing zones by the legs .
• the middle part tends to be vertically offset in one direction.
• One of the series of legs therefore presses more on the glazing.
• the middle part tends to be vertically offset in the other direction.
• the other series of legs therefore presses more on the glazing.
• the middle portion carries diodes and tabs
• the local tabs of the first and second series are fastening tabs for internal clipping, said tabs being transverse, in contact with opposite transverse faces d one or more holes made in the second main face of the first sheet.
• diodes on a base fixed on the median and protruding part of the legs diodes with emission (s) oblique (s) in a zone without leg impeding the emission,
• the middle part carries the diodes, facing the edge of the glazing (for example of the first sheet) and prolonged from side to side.
• the first wing is associated with one of the main faces of the glazing
• the second wing is associated with another of the main faces of the glazing
• the local legs of the first and second series being legs of fastening for clipping and centering.
• the term of clip is taken in the broad sense (fixation possible by pinching or donnage).
• the length of the support varies according to the number of diodes and the extent of the surface to be illuminated, in particular 25 mm to the length of an edge of the glazing (for example 1 m).
• the support can be perforated for an external adhesive glue to flood the chips and / or the optical coupling space.
• the support may be of flexible material, dielectric or electroconductive, for example metal (aluminum etc), be composite.
• the support can be if necessary in sealing material to the fluid (s) (injection material and / or long-term), unless this function can be performed by another external element wrapping (external adhesive, seal preassembled ).
• the support can be monolithic or in several pieces.
• the support can be made by folding.
• the support may furthermore have one or the following characteristics: - be deformable,
• - be thin (sufficiently to be deformable), in particular of thickness less than or equal to 0.2 mm, in particular of thickness less than or equal to 3 mm, for example between 0.1 and 3 mm,
• the invention also covers the diode support profile (with the diodes preferably) for attachment to a vehicle module as described in the previous embodiments.
• the diodes can be (pre) assembled on a base or bases (with power supply leads) preferably thin, in particular of thickness less than or equal to 1 mm, or even 0.1 mm, which are fixed to the supports (metal for example).
• the support itself can directly carry chips and power supply tracks.
• the distance between the carrying portion of the chips and the first sheet is preferably less than or equal to 5 mm, and preferably the distance between the chips and the first sheet is less than or equal to 2 mm. In particular one can use chips of width 1 mm, length 2.8 mm, height 1.5 mm.
• the materials with an absorption coefficient less than or equal to 25 m -1 , even more preferably 5 m -1 .
• an optical index closest to that of the first sheet for example a delta of index less than or equal to 0.3, or even 0.1.
• the coupling edge or edges of the first sheet it is possible to provide rounded edges. Particularly in the case where the emitted radiation space is air, it is possible to take advantage of the refraction at the air interface / first sheet of appropriate geometry (rounded edge, or even beveled ..) allowing to focus the rays in the first sheet.
• the coupling edge or edges of the first sheet it is preferable to provide frosted (scattering) edges. In this case, the losses by diffusion are limited thanks to internal adhesive sealing because the adhesive is integrated into the infractuosities of the frosted edge.
• the transmission factor of the first sheet around the peak of the visible radiation of the chips is greater than or equal to 50%, even more preferably greater than or equal to 70%, and even greater than or equal to at 80%.
• the glazing can be simple (a single sheet), the first sheet being made of glass or plastic, in particular PC, etc ...
• the glazing can be laminated (several sheets) formed:
• a first transparent sheet mineral glass (floated, etc.) or organic (PC, PMMA, PU, ionomer resin, polyolefin), thick or thin,
• lamination interlayer made of laminating material
• second sheet opaque or not, transparent, tinted, mineral glass, or organic with various features: solar control coating ..
• thermoplastic without plasticizer such as ethylene / vinyl acetate copolymer (EVA), polyvinyl butyral (PVB).
• EVA ethylene / vinyl acetate copolymer
• PVB polyvinyl butyral
• first sheet / interlayer / second sheet - mineral glass / interlayer / mineral glass
• glass in the absence of precision, glass is understood to mean a mineral glass.
• the edge of the first sheet (before soaking) can be cut from single or laminated glazing to house the diodes.
• the structure may comprise a laminated glazing unit formed of the first glass sheet, a selected laminating interlayer, for example a translucent PVB for distributing the light, and a second glass sheet optionally with a diffusing main external surface.
• a laminated glazing unit formed of the first glass sheet, a selected laminating interlayer, for example a translucent PVB for distributing the light, and a second glass sheet optionally with a diffusing main external surface.
• the glazing is simple, or even plastic, to gain compactness and / or lightness.
• the first and / or second sheets may be of any shape (rectangular, square, round, oval, etc.).
• the first sheet may preferably be made of soda-lime glass, for example made of PLANILUX glass from SAINT GOBAIN GLASS.
• the second sheet may be colored, for example, with VENUS glass from SAINT GOBAIN GLASS.
• the glass may have optionally previously undergone a heat treatment of the type hardening, annealing, quenching, bending.
• the extraction face of the glass can also be mate, sandblasted, screen printed, etc.
• the module is intended to equip any vehicle: - side windows, roof, rear window, windshield of a land vehicle: automobile, commercial vehicle, truck, train,
• the invention widens the range of illuminating roofs available. Indeed, the light emitting diode module is suitable for any roof configuration, particularly the roofs mounted from the outside to the roof of the body, fixed roofs like the sunroofs.
• Radiation extraction (the type and / or the position of chips) is adjusted for: - ambient lighting, reading, especially visible inside the vehicle,
• remote control detection of the vehicle in a parking lot or other, indicator of (un) locking of doors, or - safety signaling, for example as stop lamps on the rear, a substantially homogeneous illumination over the entire extraction surface (one or more extraction zones, common or distinct function).
• the light can be: - continuous and / or intermittently,
• Visible inside the vehicle it can have a function of night lighting or display information of any kind, such as drawing, logo, alphanumeric signage or other signs.
• display information of any kind, such as drawing, logo, alphanumeric signage or other signs.
• decorative patterns one can form one or more light strips, a peripheral light frame.
• warning lights for persons outside the vehicle (example: warning lamp for activating the vehicle alarm in the side windows),
• the module may comprise a receiving diode of control signals, in particular in the infrared, for remotely controlling the diodes.
• the invention also relates to a vehicle incorporating the module defined above.
• the diodes may be simple semiconductor chips for example of the order of a hundred microns or mm.
• the diodes may, however, comprise a protective envelope (temporary or not) to protect the chip during handling or for improve compatibility between chip materials and other materials.
• the diodes may be encapsulated, that is to say comprising a semiconductor chip and an envelope, for example epoxy resin or PMMA, encapsulating the chip and whose functions are multiple: protection of oxidation and Moisture, scattering or focusing element, wavelength conversion, ....
• the diode may be chosen in particular from at least one of the following light-emitting diodes: a diode with electrical contacts on the opposite faces of the chip or on the same face of the chip,
• a diode having two main directions of emission oblique with respect to the emitting face of the chip giving a bat wing shape, the two directions being for example centered on angles between 20 ° and 40 ° and between -20 ° and -40 ° with half-angles at the top of the order of 10 ° to 20 °,
• a diode having (only) two main directions of emission oblique with respect to the emitting surface of the diode, centered for example on angles between 60 ° and 85 ° and between -60 ° and -85 ° with half-angles at the top of the order of 10 ° to
• a diode arranged for guiding in the wafer or for emitting directly by one or both faces, or by the hole (so-called inverted diode).
• the emission diagram of a source can be lambertian.
• a collimated diode has a half-angle at the summit down to 2 or 3 °.
• the module can thus integrate all known features in the field of glazing.
• functionalities added to the glazing mention may be made of: hydrophobic / oleophobic, hydrophilic / oleophilic layer, photocatalytic anti-fouling, stack reflecting heat radiation (solar control) or infrared (low-emissive), antireflection.
• the structure may advantageously comprise a mineral diffusing layer associated with one of the main faces which is a light face (by radiation extraction).
• the diffusing layer may be composed of elements containing particles and a binder, the binder making it possible to agglomerate the particles together.
• the particles may be metallic or metal oxides, the particle size may be between 50 nm and 1 ⁇ m, preferably the binder may be inorganic for heat resistance.
• the diffusing layer consists of particles agglomerated in a binder, said particles having a mean diameter of between 0.3 and 2 microns, said binder being in a proportion of between 10 and 40% by volume and the aggregates forming particles having a size of 0.5 to 5 microns.
• This preferred diffusing layer is particularly described in application WO0190787.
• the particles may be chosen from semi-transparent particles and preferably inorganic particles such as oxides, nitrides, carbides.
• the particles will preferably be chosen from oxides of silica, alumina, zirconia, titanium, cerium, or a mixture of at least two of these oxides.
• a diffusing mineral layer of about 10 ⁇ m is chosen.
• FIGS. 1A, 2, 4A, 6, 11 show diagrammatic partial diagrammatic views of the diode modules in different embodiments of the invention
• FIGS. 1B and 1C each represent a partial diagrammatic view of the wafer of a diode module in one embodiment of the invention
• FIG. 3 is a partial diagrammatic view from below of a diode module in a diode module
• FIGS. 4B, 5B, 7 to 10 show partial diagrammatic top or side views of diode mounting brackets in embodiments of the invention.
• the curved glazings are represented as plans.
• FIG. 1 represents a partial diagrammatic sectional view of a diode module 100 in a first embodiment of the invention.
• This module 100 comprises a single glazing unit having a first curved transparent sheet 1, for example rectangular, having a first main face 11 and a second main face (12), and a wafer 10, for example a polycarbonate sheet, of equal thickness. at 5 mm.
• the second main face 12 is coated at the edge of a black masking layer 5, made of polycarbonate, with a thickness of 3 mm.
• the module comprises light-emitting diodes (2) each with a transmitting chip (2) able to emit one or more visible and guided radiation (s) in the first sheet after injection by the wafer (optionally perforated, for example in a corner ).
• it is a glass sheet with a thickness of 2.1 mm, preferably not perforated, or a laminated glazing unit with a second glass sheet, possibly for a tinted solar control function. (Glass VENUS ). and / or covered with a solar control coating (the second glass sheet is laminated by a lamination interlayer, for example a 0.76 mm thick PVB).
• a profile, support of the diodes 3, is at the edge of the glazing. It includes a fastening clip 30 to the glazing with a so-called median portion extended on either side by a first discontinuous wing 31 and a second discontinuous wing 32.
• This support is monolithic metal (stainless steel, aluminum %), thin, deformable, with a thickness of 0.2 mm.
• the first wing has a first series of centering tabs of the clip 31 spaced apart from one another and the second wing has a second series of tabs for fixing the clip 32 spaced apart from each other,
• the profile comprises a diode-carrying portion 33 distinct and secured to the fixing clip opposite the perforated slice of the first sheet, and is for example of rectangular cross-section.
• the second main face is coated at the edge of the masking layer, then forming a holding layer 5 with one of the recesses 51 to 52 for fixing and / or centering the fastening clip 30.
• first and second wings are longitudinal 31, 32, that is to say extending substantially parallel to the mean plane of the first sheet 1, the first wing being closer to the second face 12 that the second wing,
• each centering lug of the first series is housed in a so-called centering recess 51 on an outer side of the holding layer 5, of thickness greater than the thickness of the centering lug, for example a common groove
• the second series of fixing lugs serves for clipping on the free main surface of the holding layer (5) via rounded clipping ends housed in clipping recesses 52.
• the first and second series of tabs thus form means for holding the diodes 2 in predetermined vertical positions with respect to the coupling section of the first sheet.
• At least one tab for fixing and / or centering the clip is in a transverse plane (perpendicular) to the glazing and passing through said diode or said group of diodes, as shown in Figure IC.
• the diodes are small in size typically a few mm or less, without optics (lens) and preferably not pre-encapsulated.
• the distance between the chip and the slice with holes is 1 to 2 mm.
• the main direction of emission is perpendicular to the face of the semiconductor chip, for example with a quantum multiwell active layer, AIInGaP technology or other semiconductors.
• the cone of light can be a lambertian type cone, of +/- 60 °.
• the maximum rays are in direct striking on the faces 11 and 12 (for example part HA) of the sheet which reflect the light.
• the extraction can be done preferably by the inside of the vehicle, by any means: sandblasting, acid attack, diffusing layer, screen printing ...
• Each chip and the space of the emitted radiation must be protected from any pollution: water, chemical etc, this in the long term as during the manufacture of the module 100.
• the encapsulation 9 has a lip, and is biface.
• the encapsulation 9 is for example black polyurethane, especially PU-RIM (reaction in mold in English). This material is typically injected up to 130 0 C and a few tens of bars.
• the black encapsulation material is not transparent to the visible radiation (s) of the diodes. To ensure a good injection of light into the first sheet, so is used sealing means to the liquid encapsulation material. It is a glue 6 embedding the chips and the space of the emitted radiation.
• the module 100 can form, for example, a fixed panoramic roof of a land vehicle, or alternatively a boat ...
• the roof is mounted from the outside and the module is glued to the bodywork 8 by an adhesive 7.
• the module 100 may form for example a panoramic roof opening of a land vehicle, or alternatively a boat.
• the roof is mounted from the outside.
• the encapsulation of the module 100 is modified as follows:
• the multiple lip seal profile can also be an integral part of the encapsulation.
• the masking layer is replaced for an overmolded layer, for example identical to or compatible with the encapsulation material 9.
• the encapsulation 9 is replaced by a pre-assembled seal, for example made of elastomer, possibly with a face with the pre-assembled support and with the adhesive 6.
• the seal can even form the fixing support and a base is preferably inserted. for example a printed circuit board (PCB) with the diodes.
• PCB printed circuit board
• the first leaf is on the inside of the vehicle.
• the extraction is preferably by the face 12.
• the extraction can form a luminous design, for example a logo or a mark, an animated light (with music ).
• FIG. 2 is a diagrammatic, partial sectional view of a diode module 200 in a second embodiment of the invention. This module 200 differs from the module 100 mainly by the positioning of the mounting bracket profile.
• the centering groove 51 is on the inner side of the holding layer 5.
• Each diode is in a hole 12 ', for example a groove common to the diodes 12' at the edge of the second main face 12.
• the optical coupling zone is the lateral face of the groove facing the chips.
• the carrier portion 33 opens into the diode groove of depth greater than or equal to the width of the diode groove.
• the mounting brackets and clipping grooves are shown in Figure 3.
• the roof is mounted from the outside and the module is glued to the body
• FIG. 4A is a diagrammatic partial section view of a diode module 400 in an embodiment of the invention, respectively.
• This module 400 differs from the module 200 by the geometry of the mounting bracket.
• the middle part (30 ') is above the free main surface of the holding layer (5)
• the first and second wings are transverse 31 ', 32', that is to say in the plane perpendicular to the mean plane of the first sheet.
• the first and second series of fastening and centering tabs used for clipping, each leg of the first and second series have a so-called clipping end, rounded, housed in a recess of the so-called clipping layer, notch type.
• the masking layer is oversize in the clipping area.
• the carrier part of the diodes 33 is still substantially transverse (vertical) but between the first and second wings and partly in a single through hole 53 called diode (s) of the holding layer.
• the carrier portion opens into a housing groove of the diodes in the second face (one hole per diode or group of diodes close). As shown in Figure 4B, the carrier portion is of uniform cross section along the length.
• FIG. 5A represents respectively a schematic view, partial cutting of a diode module 500 in one embodiment of the invention.
• This module 500 differs from the module 100 in particular by the geometry of the mounting bracket and its attachment.
• the middle part carries diodes and legs.
• the legs of the first and second series are longitudinal fastening lugs 31 ", 32" for internal clipping and centering.
• the tabs are in contact with the longitudinal faces of one or more holes 10 'made in the edge of the first sheet
• FIG. 6 is a diagrammatic, partial sectional view of a diode module 600 in an embodiment of the invention.
• This module 600 differs from the module 100 in particular by the geometry of the mounting bracket and its attachment.
• the middle portion 30 carries the diodes, facing the edge of the first sheet, and extended on both sides by the first and second wings 310, 320.
• the first flange 310 is associated with the first main face 11 of the glazing 1
• the second flange 320 is associated with the second main face 12 of the glazing, the legs of the first and second series being fastening for clipping and centering.
• FIGS. 7 to 10 Various examples of this type of U-shaped or L-shaped local support are shown in FIGS. 7 to 10:
• the first and second series of tabs are face to face (see FIGS. 7, 8, 10) and preferably aligned with each diode or group of close diodes (see FIGS.
• the first and second series of tabs are staggered (see FIG. 9) and preferably aligned with each diode or group of close diodes,
• the first and second series of tabs are identical in shape (trapezoidal) (see FIGS. 8, 9),
• the first and second series of legs are of shape distinct: trapezoidal and triangular (see Figure 7), trapezoidal and U-shaped (see Figure 9).
• the middle part can be rigid, only the fixing lugs are flexible.
• the sectional view of the module 700 with the support of FIG. 10 is shown in FIG. 11.
• the second series may be identical to the first variant series.
• the modules described above are for example mounted on a side window 800 (shown in Figure 12 on the outside) with a window pane 12c or on a rear window 900 of a land vehicle (shown in Figure 13 on the outside).
• the extraction 12a (on the inside) is covered by a black masking zone 12c (on the inside). Encapsulation 9 surrounds the side window.
• the light is seen from the outside (means of marking the vehicle for the window or the window, stop lights for the telescope ).

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• 2008
  • 2008-10-27 FR FR0857299A patent/FR2937711B1/fr active Active
• 2009
  • 2009-10-27 US US13/125,879 patent/US20110273874A1/en not_active Abandoned
  • 2009-10-27 BR BRPI0920060A patent/BRPI0920060A2/pt not_active IP Right Cessation
  • 2009-10-27 WO PCT/FR2009/052065 patent/WO2010049639A1/fr active Application Filing
  • 2009-10-27 CN CN2009801500844A patent/CN102245432A/zh active Pending
  • 2009-10-27 EA EA201170612A patent/EA201170612A1/ru unknown
  • 2009-10-27 KR KR1020117011972A patent/KR20110081308A/ko not_active Application Discontinuation
  • 2009-10-27 EP EP09760222A patent/EP2349783A1/fr not_active Withdrawn
  • 2009-10-27 MX MX2011004386A patent/MX2011004386A/es active IP Right Grant
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