EP2345858A2 - Dispositif de pompes à chaleur - Google Patents

Dispositif de pompes à chaleur Download PDF

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Publication number
EP2345858A2
EP2345858A2 EP10015257A EP10015257A EP2345858A2 EP 2345858 A2 EP2345858 A2 EP 2345858A2 EP 10015257 A EP10015257 A EP 10015257A EP 10015257 A EP10015257 A EP 10015257A EP 2345858 A2 EP2345858 A2 EP 2345858A2
Authority
EP
European Patent Office
Prior art keywords
refrigerant
expansion valve
compressor
heat pump
electronic expansion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP10015257A
Other languages
German (de)
English (en)
Other versions
EP2345858A3 (fr
Inventor
Steffen Smollich
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Stiebel Eltron GmbH and Co KG
Original Assignee
Stiebel Eltron GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=39465958&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=EP2345858(A2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Stiebel Eltron GmbH and Co KG filed Critical Stiebel Eltron GmbH and Co KG
Publication of EP2345858A2 publication Critical patent/EP2345858A2/fr
Publication of EP2345858A3 publication Critical patent/EP2345858A3/fr
Withdrawn legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B30/00—Heat pumps
    • F25B30/02—Heat pumps of the compression type
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2400/00—General features or devices for refrigeration machines, plants or systems, combined heating and refrigeration systems or heat-pump systems, i.e. not limited to a particular subgroup of F25B
    • F25B2400/13—Economisers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2600/00—Control issues
    • F25B2600/21—Refrigerant outlet evaporator temperature
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2600/00—Control issues
    • F25B2600/25—Control of valves
    • F25B2600/2509—Economiser valves

Definitions

  • the present invention relates to a heat pump device.
  • Heat pumps are typically used to heat heating water or hot water.
  • the liquefied refrigerant is then expanded in a throttle body and evaporated while absorbing ambient heat in the evaporator.
  • the vaporized refrigerant is compressed by the compressor of the heat pump and liquefied in the condenser of the heat pump.
  • scroll compressors can be used with a steam injection in heat pumps.
  • the steam injection proves to be advantageous in that the heating power does not decrease as much as in a compressor without steam injection when the heat source temperature decreases.
  • Steam injection compressors are advantageous over liquid injection compressors because steam injection is more efficient than, for example, liquid injection.
  • the steam injection in a scroll compressor is performed such that the liquid refrigerant is throttled by an expansion valve and then evaporated in a heat exchanger or an economizer and overheated.
  • the superheated refrigerant is then injected into the compressor.
  • injection of slightly superheated refrigerant is more efficient than liquid refrigerant injection.
  • an additional solenoid valve must be placed in front of the expansion valve, which is closed at standstill to prevent liquid refrigerant from shifting in the compressors.
  • Fig. 2 shows a refrigerant circuit of a heat pump according to the prior art.
  • the refrigeration cycle includes a compressor 10, a condenser 20, an evaporator 30, a solenoid valve 40, a thermostatic expansion valve 50, an economizer 60 and an expansion valve 70.
  • the solenoid valve 40 is disposed in front of the expansion valve 50 and serves to prevent liquid refrigerant from entering the compressor 10 when the heat pump is at a standstill.
  • the thermostatic expansion valve 50, a solenoid valve 40 is connected upstream.
  • the solenoid valve 40 is closed at standstill to ensure that no liquid refrigerant enters the compressor during standstill.
  • refrigerant is evaporated in the evaporator 30; the vaporized refrigerant is compressed in the compressor 10 and thus heated.
  • the high-pressure refrigerant releases its heat in the condenser 20, for example, to heating water and condenses. Thereafter, the refrigerant is throttled into the expansion valve 50 and is then evaporated again in the evaporator 30.
  • the field of application of, for example, air / water heat pumps is limited, for example, by the hot gas temperature at low outside temperatures and high heating flow temperatures. If the hot gas temperature or the compression end temperature is too high (for example, greater than 120 ° C), thermal destruction of the oil in the compressor may occur, thereby reducing the lubrication of the compressor.
  • the invention relates to the idea of providing an electronic expansion valve for the steam injection in the refrigeration circuit instead of a thermostatic expansion valve.
  • the refrigerant flows to the condenser 20 and from the condenser to the economizer, which serves as a heat exchanger.
  • the economizer 60 By means of the economizer 60, a steam injection into the compressor 10 can be made possible.
  • vapor refrigerant is injected into the compressor, i. the refrigerant is slightly overheated.
  • the liquid refrigerant (which has been liquefied by the condenser 20) is supplied to the electronic expansion valve 80, then the thermal energy of the refrigerant is used by means in the economizer 60 to overheat the refrigerant to be injected.
  • Fig. 1 shows a refrigerant circuit of a heat pump device according to a first embodiment.
  • a compressor 10 In the refrigerant circuit is a compressor 10, a condenser 20, an economizer 60, an electronic expansion valve 80, a further expansion valve 70 and an evaporator 30 are provided.
  • the function of the compressor, the condenser, the economizer, the expansion valve 70 and the evaporator 30 corresponds to the arrangement and function of the compressor, condenser, economizer, expansion valve and evaporator according to Fig. 2 ,
  • the control required for the electronic expansion valve 80 may be based on measured values of an evaporator outlet pressure sensor and on measured values of a temperature sensor for detecting the suction gas temperature. With the help of the electronic expansion valve 80, the overheating of a refrigerant can thus be regulated accordingly. Since the steam injection takes place in an area with an average pressure, which is present between the high pressure and the low pressure, it can be assumed that the corresponding mean pressure should also be the same for the same high and low pressure and for the same overheating. Therefore, when the high and low pressures are measured by means of pressure sensors in the refrigerant circuit, the mean pressure of the steam injection for a defined superheat can also be calculated.
  • the overheating of the refrigerant can be detected by measuring the temperature of the injected refrigerant and the calculated mean pressure without another pressure sensor, especially if they are available for an electronic expansion valve 70.
  • the electronically controlled expansion valve 80 it is possible to regulate how much refrigerant flows through the economizer 60, for example, by opening the expansion valve beyond the calculated opening degree for a defined overheating, more refrigerant can flow through the economizer, so that the refrigerant is no longer sufficiently overheated and injected into the compressor 10 with portions of the liquid phase.
  • the hot gas temperature can be reduced.
  • the field of application of the heat pump can also be extended, especially at low evaporation and high condensation temperatures which typically exceeds the critical hot gas temperature. If the hot gas temperature is exceeded, the system switches over from an overheat control to a hot gas temperature control.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Compression-Type Refrigeration Machines With Reversible Cycles (AREA)
  • Heat-Pump Type And Storage Water Heaters (AREA)
  • Air Conditioning Control Device (AREA)
  • Central Heating Systems (AREA)
  • Applications Or Details Of Rotary Compressors (AREA)
  • Sorption Type Refrigeration Machines (AREA)
EP10015257.8A 2007-03-02 2008-02-23 Dispositif de pompes à chaleur Withdrawn EP2345858A3 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007010646.9A DE102007010646B4 (de) 2007-03-02 2007-03-02 Wärmepumpenvorrichtung
EP08003313A EP1965154B1 (fr) 2007-03-02 2008-02-23 Dispositif de pompes à chaleur

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
EP08003313.7 Division 2008-02-23

Publications (2)

Publication Number Publication Date
EP2345858A2 true EP2345858A2 (fr) 2011-07-20
EP2345858A3 EP2345858A3 (fr) 2013-05-15

Family

ID=39465958

Family Applications (2)

Application Number Title Priority Date Filing Date
EP10015257.8A Withdrawn EP2345858A3 (fr) 2007-03-02 2008-02-23 Dispositif de pompes à chaleur
EP08003313A Active EP1965154B1 (fr) 2007-03-02 2008-02-23 Dispositif de pompes à chaleur

Family Applications After (1)

Application Number Title Priority Date Filing Date
EP08003313A Active EP1965154B1 (fr) 2007-03-02 2008-02-23 Dispositif de pompes à chaleur

Country Status (5)

Country Link
EP (2) EP2345858A3 (fr)
AT (1) ATE530864T1 (fr)
DE (2) DE202007019159U1 (fr)
ES (1) ES2374091T3 (fr)
PL (1) PL1965154T3 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101249898B1 (ko) * 2011-01-21 2013-04-09 엘지전자 주식회사 히트 펌프
DE102011086476A1 (de) 2011-09-30 2013-04-04 Siemens Aktiengesellschaft Hochtemperaturwärmepumpe und Verfahren zur Verwendung eines Arbeitsmediums in einer Hochtemperaturwärmepumpe
DE102012101041A1 (de) 2012-02-09 2013-08-14 Viessmann Werke Gmbh & Co Kg Wärmepumpenvorrichtung
DE102018105609A1 (de) 2018-03-12 2019-09-12 Ipetronik Gmbh & Co. Kg Verfahren zur Kühlung in einem Fahrzeug
CN113188269B (zh) * 2020-01-13 2022-08-09 上海海立电器有限公司 一种增焓热泵系统的关机控制方法与装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0237259A (ja) * 1988-07-26 1990-02-07 Toshiba Corp ２段圧縮冷凍サイクル
US5095712A (en) 1991-05-03 1992-03-17 Carrier Corporation Economizer control with variable capacity
JPH1089779A (ja) * 1996-09-11 1998-04-10 Daikin Ind Ltd 空気調和機
JP3484902B2 (ja) * 1996-11-20 2004-01-06 松下電器産業株式会社 冷凍装置の制御装置
US6374631B1 (en) 2000-03-27 2002-04-23 Carrier Corporation Economizer circuit enhancement
US6474087B1 (en) 2001-10-03 2002-11-05 Carrier Corporation Method and apparatus for the control of economizer circuit flow for optimum performance
US6655172B2 (en) 2002-01-24 2003-12-02 Copeland Corporation Scroll compressor with vapor injection
JP4614441B2 (ja) 2005-06-10 2011-01-19 日立アプライアンス株式会社 スクロール圧縮機

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
None

Also Published As

Publication number Publication date
EP1965154A2 (fr) 2008-09-03
ATE530864T1 (de) 2011-11-15
ES2374091T3 (es) 2012-02-13
DE202007019159U1 (de) 2010-10-28
PL1965154T3 (pl) 2012-03-30
EP1965154A3 (fr) 2009-07-08
EP1965154B1 (fr) 2011-10-26
DE102007010646B4 (de) 2022-01-05
EP2345858A3 (fr) 2013-05-15
DE102007010646A1 (de) 2008-09-04

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