EP3961129A1 - Pompe à chaleur et procédé de fonctionnement d'une pompe à chaleur - Google Patents

Pompe à chaleur et procédé de fonctionnement d'une pompe à chaleur Download PDF

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Publication number
EP3961129A1
EP3961129A1 EP21190743.1A EP21190743A EP3961129A1 EP 3961129 A1 EP3961129 A1 EP 3961129A1 EP 21190743 A EP21190743 A EP 21190743A EP 3961129 A1 EP3961129 A1 EP 3961129A1
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EP
European Patent Office
Prior art keywords
temperature
pressure
heat pump
hot gas
refrigerant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP21190743.1A
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German (de)
English (en)
Inventor
Andreas Bangheri
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Individual
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Individual
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Publication of EP3961129A1 publication Critical patent/EP3961129A1/fr
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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B40/00—Subcoolers, desuperheaters or superheaters
    • F25B40/02—Subcoolers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B25/00—Machines, plants or systems, using a combination of modes of operation covered by two or more of the groups F25B1/00 - F25B23/00
    • F25B25/005—Machines, plants or systems, using a combination of modes of operation covered by two or more of the groups F25B1/00 - F25B23/00 using primary and secondary systems
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B40/00—Subcoolers, desuperheaters or superheaters
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B41/00—Fluid-circulation arrangements
    • F25B41/20—Disposition of valves, e.g. of on-off valves or flow control valves
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B49/00—Arrangement or mounting of control or safety devices
    • F25B49/02—Arrangement or mounting of control or safety devices for compression type machines, plants or systems
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2339/00—Details of evaporators; Details of condensers
    • F25B2339/04—Details of condensers
    • F25B2339/047—Water-cooled condensers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2341/00—Details of ejectors not being used as compression device; Details of flow restrictors or expansion valves
    • F25B2341/001—Ejectors not being used as compression device
    • F25B2341/0011—Ejectors with the cooled primary flow at reduced or low pressure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2700/00—Sensing or detecting of parameters; Sensors therefor
    • F25B2700/19—Pressures
    • F25B2700/193—Pressures of the compressor
    • F25B2700/1933—Suction pressures
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2700/00—Sensing or detecting of parameters; Sensors therefor
    • F25B2700/19—Pressures
    • F25B2700/195—Pressures of the condenser
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2700/00—Sensing or detecting of parameters; Sensors therefor
    • F25B2700/21—Temperatures
    • F25B2700/2115—Temperatures of a compressor or the drive means therefor
    • F25B2700/21151—Temperatures of a compressor or the drive means therefor at the suction side of the compressor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2700/00—Sensing or detecting of parameters; Sensors therefor
    • F25B2700/21—Temperatures
    • F25B2700/2115—Temperatures of a compressor or the drive means therefor
    • F25B2700/21152—Temperatures of a compressor or the drive means therefor at the discharge side of the compressor

Definitions

  • the present invention relates to a compression heat pump or a refrigerating machine according to claim 1 and a method for operating such according to claim 9.
  • compression heat pump In a compression heat pump, a refrigerant is compressed using a mechanical compressor (preferably driven by an electric motor) and moved through a cyclic process.
  • a compression heat pump can also be operated as a refrigeration machine, but in the following, for the sake of simplification, the term “compression heat pump” or just “heat pump” is usually used, without this being understood as a limitation.
  • a compression heat pump has a refrigerant circuit which includes an evaporator, a compressor, a condenser and a controllable expansion valve.
  • the controllable expansion valve is controlled by a control device.
  • a first pressure sensor is provided for detecting a pressure in a high pressure or hot gas section of the refrigerant circuit.
  • a generic compression heat pump is from EP 0 866 291 B1 famous.
  • a second sensor is provided to regulate the expansion valve in addition to a temperature sensor arranged in a first area between the compressor and condenser, which sensor detects a pressure that represents a direct measure of the condensation pressure and the condensation temperature.
  • a direct measure of the condensation temperature is understood below to mean that, with a given operational arrangement, at least an approximate condensation temperature can be determined from a value detected by a sensor without the use of other measured variables reflecting the current state of the system.
  • the high-pressure section of the refrigerant cycle also called the hot-gas section of the refrigerant cycle, is the area of a compression heat pump where the refrigerant (a refrigerant vapor or a mixture of liquid refrigerant and refrigerant vapor, or generally a refrigerant fluid) resides in an area between the compressor and the expansion valve , i.e. in an area of increased pressure.
  • the term "hot gas section” follows from the increased temperature of the refrigerant after compression by the compressor.
  • a low-pressure section or suction gas section of the refrigerant circuit is the remaining section of the refrigerant circuit between the expansion valve and the compressor, since the refrigerant is moved here under reduced pressure and reduced temperature after expansion through the expansion valve.
  • suction gas section results from the fact that the refrigerant, which is located in this section of the refrigerant circuit, is sucked in by the compressor and compressed towards the high-pressure or hot gas section.
  • condensation heat is extracted from the refrigerant by the heat exchanger function of the condenser and fed to a consumer.
  • a disadvantage of known compression heat pumps and methods for operating such compression heat pumps is the fact that the compression heat pumps are only optimally regulated with regard to certain operating points.
  • a geothermal heat pump in which an evaporator is positioned at a depth of 30 cm below the frost level, ie typically 1.20 m deep in the ground, an evaporation temperature of 3°C is assumed, for example.
  • a compression heat pump with a geothermal probe in which is typically drilled to a depth of 100 m, an evaporation temperature of +5°C can be assumed, for example.
  • Corresponding geothermal heat pumps have a brine circuit, by means of which the heat is absorbed from the ground and released into the evaporator to the refrigerant circuit by evaporating the expanded refrigerant.
  • the efficiency of the compression heat pump can be reduced if there is a deviation from this assumed temperature, since its control is then not only optimal.
  • a seasonal fluctuation in the ambient temperature also means that known compression heat pumps are often no longer optimally controlled. Since, when outside temperatures are cold, significantly more energy is required to heat radiators or underfloor heating in addition to the energy required to prepare hot water, a comparatively high flow temperature is required at which the water from the condenser (heated by this in the heat exchange with the refrigerant) is fed to a consumer will. Correspondingly required flow temperatures can therefore lie in a wide range of, for example, 25°C to 65°C (higher when using radiators than with underfloor heating).
  • the problem is even greater with air heat pumps, in which heat is extracted from the ambient air and fed to the consumer.
  • the evaporation temperatures can vary within a range of -30°C to +25°C.
  • evaporation temperatures corresponding approximately to the temperature of the heat source
  • condensation temperatures corresponding approximately to the flow temperatures
  • this object is achieved by a compression heat pump according to the characterizing part of claim 1 and by a method for operating a compression heat pump according to claim 11.
  • a second pressure sensor is provided for detecting a pressure P1 in a low pressure - or suction gas section of the refrigerant circuit.
  • This pressure P1 is a direct measure of the evaporation pressure and the evaporation temperature.
  • a compression heat pump according to the invention offers the advantage that the control device can take into account not only the pressure P2 in the high-pressure section of the refrigerant circuit, but also this pressure P1 in the low-pressure section of the refrigerant circuit.
  • a target value for optimized hot gas overheating is set depending on the heat source temperature or the evaporation temperature and the required flow temperature or the condensation temperature.
  • the instantaneous hot gas overheating can then be calculated from the difference between a temperature determined from the pressure (P2) or a measured temperature (T1) in the high-pressure or hot gas section of the refrigerant circuit and a temperature determined from the pressure (P1) or a measured temperature (T2) in the Low-pressure or suction gas section of the refrigerant circuit can be determined (the temperatures T1 and T2 can thus be determined from the pressures P2 and P1 or measured using separate temperature sensors).
  • the expansion valve is controlled in such a way that the hot gas overheating approaches the target value.
  • Hot gas overheating is the temperature increase that occurs as a result of the compression of the refrigerant, i.e. the temperature difference between the refrigerant before and after the compressor.
  • the outside temperature it can be assumed that this also approximately corresponds to the evaporation temperature of the refrigerant in the evaporator.
  • This evaporation temperature can be measured directly by a temperature sensor or calculated using a determined pressure (pressure sensor).
  • the measurement with a temperature sensor is more cost-effective, since temperature sensors are cheaper to manufacture and install than pressure sensors.
  • pressure sensors offer the advantage that their measurements are less error-prone. In the case of temperature sensors in particular, it is problematic that the thermal contact with the refrigerant is not always so reliable that precise measurements are possible.
  • the outside temperatures can be simulated by specifying the appropriate temperature on the evaporator using a heating and/or cooling element.
  • the hot gas overheating was varied through different settings of the expansion valve.
  • the efficiency of the heat pump was then determined for various hot gas overheating conditions.
  • the efficiency of a heat pump is the ratio of heat energy obtained to the energy supplied to the heat pump.
  • the energy supplied to the heat pump is essentially the electrical energy that has to be supplied to the compressor in order to maintain the refrigerant cycle.
  • Table 1 shows the increase in efficiency for various hot gas overheating conditions at an outside temperature of -7°C and a flow temperature of 35°C.
  • Table 2 shows the increase in efficiency for an outside temperature of 0°C and a desired flow temperature of 30°C as a function of various hot gas overheatings. Both tables make it clear that there is an optimal operating point for the heat pump at which the increase in efficiency is maximum.
  • the optimum operating point also depends on the outside temperature and the flow temperature. While at an outside temperature of -7°C the maximum efficiency is at a hot gas overheating of approx. 37 K, at a At an outside temperature of 0°C, on the other hand, the optimum working point of the compression heat pump is reached at a hot gas overheating of approx. 22 K.
  • a second pressure sensor for detecting the pressure P1 in the low-pressure or suction gas section is provided in addition to the first pressure sensor for detecting the pressure P2 in the high-pressure or hot gas section of the refrigerant circuit means that the hot gas overheating can be determined and can also be determined more precisely than when using only two pure temperature sensors.
  • the method according to claim 9 according to the invention accordingly takes into account that a target value for the optimized hot gas overheating is defined for a specific heat source temperature, the hot gas overheating is measured and the expansion valve is readjusted so that the hot gas overheating approaches the target value.
  • the second pressure sensor is preferably arranged between the evaporator and the compressor.
  • a temperature sensor for detecting a temperature T2 can be provided in the low-pressure or suction gas section of the refrigerant circuit, in particular between the evaporator and the compressor.
  • the first pressure sensor is preferably arranged between the condenser and the expansion valve, particularly preferably between the condenser and a subcooler.
  • the first pressure sensor is arranged on a refrigerant collector.
  • a further temperature sensor can be provided for detecting a temperature T1 in the high-pressure or hot-gas section of the refrigerant circuit and can preferably be arranged between the compressor and the condenser.
  • the first pressure sensor is preferably arranged on a refrigerant collector.
  • a variant with an overheating heat exchanger between the condenser or a sub-cooler arranged downstream of the condenser and the expansion valve for heat exchange between the refrigerant flowing towards the evaporator and flowing away from it towards the compressor is particularly preferred.
  • the compression heat pump can in particular be an air heat pump that extracts heat from the ambient air and supplies it to a consumer.
  • the target value preferably represents the value of an optimized efficiency of the compression heat pump.
  • target values specified for different heat source temperatures and/or for different flow temperatures are stored in tabular form in a control device of the compression heat pump.
  • the target values for different heat source temperatures and/or for different flow temperatures are preferably determined before being stored in tabular form from measurements of the efficiency of the heat pump as a function of the hot gas overheating at the different heat source temperatures.
  • a target value for a heat source temperature can be determined from efficiency measurements measuring the hot gas superheat in increments of 5k to 15K over a range from a minimum hot gas superheat of 10K to 30K to a maximum hot gas superheat of 35K to 80K, and the hot gas superheat with maximum efficiency is stored as the target value for this heat source temperature.
  • the temperature determined from the pressure (P1) or the temperature measured (T2) in the low-pressure or suction gas section of the refrigerant circuit can be used as an approximate heat source temperature.
  • a target value for the hot gas superheat in a range from 32K to 42K, preferably from 35K to 40K is set.
  • a target value for the hot gas superheat can be set in a range from 17K to 27K, preferably from 19K to 25K.
  • a refrigerant fluid ie a vapor or a liquid or a vapor/liquid mixture of a fluid
  • a refrigerant fluid is conducted through a cyclic process by means of the compression heat pump shown.
  • the refrigerant is compressed by means of a compressor 6, thereby increasing its temperature and pressure.
  • a high-pressure section or hot-gas section of the refrigerant circuit is therefore formed downstream of the compressor.
  • a temperature sensor 20 is provided in this high-pressure section to measure the temperature T1 of the compressed refrigerant.
  • the refrigerant Downstream of the compressor 6, the refrigerant is then conducted into a condenser 1, which is a heat exchanger and serves to condense the compressed, vaporous refrigerant. Condensation heat is extracted from the refrigerant and fed to a consumer, not shown, via a partially shown consumer circuit 23 with a flow 21 and a return 23 .
  • a refrigerant collector 2 which temporarily stores refrigerant is arranged downstream of the condenser 1 .
  • the refrigerant collector 2 thus serves as a buffer for the refrigerant.
  • the pressure P2 of the refrigerant is measured via a first pressure sensor 19 determined in the refrigerant collector 2.
  • This pressure P2 also corresponds to the condensation pressure of the refrigerant in the condenser 1 and further reflects the condensation temperature in the condenser 1, which means that the condensation temperature in the condenser 1 can be calculated from the pressure P2.
  • a subcooler 3 is arranged downstream of the refrigerant collector 2 , through which refrigerant exiting from the refrigerant collector 2 flows to an expansion valve 4 .
  • the return flow 22 which flows in the opposite direction through the subcooler 3 to the condenser 1 , is guided through the subcooler 3 , which is designed as a heat exchanger.
  • the combination of refrigerant collector 2 and subcooler 3 improves the cooling capacity of the heat pump, ie increases the heat that the heat pump can transport to the consumer.
  • the sub-cooler 3 serves to preheat the consumer circuit 23.
  • the sub-cooler 3 also leads to the fact that less gaseous refrigerant arrives at the expansion valve 4 as a result of further heat dissipation of the refrigerant.
  • the refrigerant is expanded and thus cooled by means of the expansion valve 4 .
  • the controlled expansion valve 4 is controlled by a control device, not shown.
  • the still liquid refrigerant is fed to an evaporator 5, which is designed as a heat exchanger and is in thermal contact with a heat source, for example with the ambient air or with the ground.
  • a heat source for example with the ambient air or with the ground.
  • the refrigerant evaporates or the remaining liquid components of the refrigerant evaporate and the refrigerant is fed out of the evaporator 5 to the compressor 6, as a result of which the refrigerant circuit is closed.
  • a second pressure sensor 17 is arranged between the evaporator 5 and the compressor 6 for detecting a pressure P1 in the low pressure or suction gas section of the refrigerant circuit, the pressure P1 corresponding to the evaporation pressure in the evaporator 5 and being able to be converted into a corresponding evaporation temperature.
  • Another optional temperature sensor 18 is provided for the direct detection of the temperature T2 of the low-pressure section.
  • the evaporation temperature is determined or (as an approximation) the temperature T2 in the low-pressure section of the refrigerant circuit. This can be done either via the temperature sensor 18 or alternatively and more precisely by means of the second pressure sensor 17 by detecting the pressure P1 in the low-pressure section of the refrigerant circuit and determining the temperature which corresponds to the temperature of the refrigerant at this pressure P1.
  • an optimized hot gas overheating is determined by determining the respective hot gas overheating with maximum efficiency from efficiency curves, as shown in Tables 1 and 2.
  • the actual instantaneous hot gas superheat is then determined from the difference between the temperature corresponding to pressure P2 (or measured temperature T1) in the high-pressure section of the refrigerant circuit and the temperature corresponding to pressure P1 (or measured temperature T2) in the low-pressure section of the refrigerant circuit.
  • the expansion valve 4 is then controlled in such a way that the hot gas overheating approaches the target value, with the expansion valve 4 being closed further if the hot gas overheating is too low compared to the target value and the expansion valve is opened further if the hot gas overheating is too high compared to the target value.
  • the use of pressure sensors 17 and 19 for regulation offers advantages over the use of temperature sensors 18 and 20, since the thermal coupling of a temperature sensor to the refrigerant circuit more problematic than the connection of a pressure sensor. It has been found that the use of pressure sensors is particularly stable over the long term. However, for operating a method according to the invention, it can also be advantageous, at least in certain method sections, to use the temperature sensor 18 to control the expansion valve 4 in order to determine the temperature T2 instead of determining this temperature using the pressure sensor 17 (pressure P1). In particular in a start-up phase of the heat pump, no stable pressure P1 forms in this start-up phase, which can be used for the regulation described.
  • FIG 2 an alternative embodiment of a compression heat pump according to the invention is shown.
  • the already based on the embodiment of figure 1 explained elements of the compression heat pump and the process steps discussed there are analogous to the embodiment of figure 2 used.
  • another heat exchanger is provided here in the form of the overheating heat exchanger 9 for the refrigerant.
  • the compressed and liquefied refrigerant from the sub-cooler 3 flows away from the sub-cooler 3 through the overheating heat exchanger 9 and then on to the expansion valve 4.
  • the refrigerant flows from the evaporator 5 in the embodiment of FIG figure 2 also on the way to the compressor 6 through the overheating heat exchanger 9 and is thus in heat exchange with the refrigerant flowing to the expansion valve 4 .
  • figure 3 shows a further embodiment of a heat pump according to the invention. Compared to the embodiments of figures 1 and 2 is the heat pump figure 3 supplemented with additional elements. Same elements as in the 1 and 2 are provided with the same reference numbers.
  • the refrigerant is first routed to a four-way switch valve 16 and, in a first position of the four-way switch valve 16, to the condenser 1 and further on through a check valve 13 to the refrigerant collector 2. After the refrigerant collector 2, the refrigerant continues through a subcooler 3 to a superheat heat exchanger 9 and through the expansion valve 4 into the evaporator 5.
  • the refrigerant is in turn fed from the evaporator 5 to the compressor 6 through the four-way switching valve 16 .
  • a gas/liquid separator 8 through which the refrigerant flows before it is conducted through the overheating heat exchanger 9 into a liquid separator 11 , is also arranged on this section between the four-way switching valve 16 and the compressor 6 .
  • the liquid separator 11 prevents liquid portions of the refrigerant from entering the compressor 6 .
  • Corresponding liquid components can be successively evaporated in the liquid absorber 11 .
  • the circuit of the refrigerant thus essentially corresponds to that of the embodiment of FIG figure 2 and thus represents regular heat pump operation.
  • the four-way switching valve 16 can also be brought into a second position in which the refrigerant circuit is reversed.
  • evaporator 5 becomes the condenser
  • condenser 1 becomes the evaporator.
  • the heat pump can be converted into an air conditioner, by means of which the consumer coupled to the flow 21 and the return 22 can be cooled instead of heated.
  • Another use of such a reversal can be to provide efficient defrosting of the system.
  • icing can occur in the area of the evaporator 5 at low outside temperatures, which significantly reduces the efficiency of the heat pump.
  • a reversal of the refrigerant circuit can be switched on in order to achieve defrosting of the evaporator 5 .
  • the four-way switching valve 16 is consequently brought into a second position, with which the refrigerant flow is not routed from the evaporator 5 to the condenser, but vice versa from the condenser to the evaporator 5. While the refrigerant flow is on this first path through the four-way switching valve 16 is thus reversed in this operating mode, the refrigerant flow remains unchanged on the second path through the four-way switching valve 16 from the compressor 6 in the direction of the overheating heat exchanger 9 compared to the regular heat pump operation.
  • the refrigerant from the evaporator 5 is conducted further in the direction of the condenser 1 in the defrost or air conditioning mode with reverse circulation.
  • the refrigerant is guided through a check valve 15 in an additional section of the refrigerant circuit, which is parallel to the section with the expansion valve 4, through which the refrigerant flows in heat pump operation.
  • the refrigerant After flow through check valve 15 to condenser 1 the refrigerant also passes through an expansion valve 12, through which the refrigerant flows only in this defrosting/cooling mode, before it flows through the condenser 1 and then in an opposite direction compared to heat pump operation through the pipeline between the condenser and four-way switching valve 16 to the four-way Switching valve 16 is performed.
  • the ejector 10 has three connections, one of which is associated with the expansion valve ejector 7 and another with the check valve 14, so that the flow of refrigerant parallel to the pipeline with the expansion valve 4 is guided through these two connections.
  • a third port connects the ejector 10 to the gas-liquid separator 8. As shown in FIG figure 3 indicated schematically, the inlet of the section from the gas-liquid separator 8 to the ejector 10 is actually aligned perpendicularly to the direction of flow through the ejector from the expansion valve 7 to the check valve 14 .
  • the ejector 10 serves to increase the efficiency of the heat pump as follows.
  • the ejector 10 utilizes the expansion work present in the refrigerant downstream of the condenser 1 in order to draw in a partial mass flow and convey it to a higher level. Suction takes place via the third port, with which the ejector 10 communicates with the gas-liquid separator 8 .
  • the flow through the ejector 10 of the gaseous refrigerant which is introduced into the ejector by the expansion valve ejector 7, ensures that gaseous refrigerant is sucked out of the gas-liquid separator 8.
  • refrigerant from the low-pressure section of the refrigerant circuit is raised to a higher pressure level, bypassing the compressor 6, as a result of which the compressor 6 is relieved and less electrical energy has to be added to the compressor 6.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Heat-Pump Type And Storage Water Heaters (AREA)
  • Compression-Type Refrigeration Machines With Reversible Cycles (AREA)
EP21190743.1A 2020-08-31 2021-08-11 Pompe à chaleur et procédé de fonctionnement d'une pompe à chaleur Pending EP3961129A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102020122713.2A DE102020122713A1 (de) 2020-08-31 2020-08-31 Wärmepumpe und Verfahren zum Betreiben einer Wärmepumpe

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EP3961129A1 true EP3961129A1 (fr) 2022-03-02

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DE (1) DE102020122713A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11428447B2 (en) * 2019-11-19 2022-08-30 Carel Industries S.p.A. Single-valve CO2 refrigerating apparatus and method for regulation thereof

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE59805146D1 (de) 1997-03-18 2002-09-19 Andreas Bangheri Kompressionswärmepumpe oder Kompressionskältemaschine und Regelungsverfahren dafür
KR100540808B1 (ko) 2003-10-17 2006-01-10 엘지전자 주식회사 히트펌프 시스템의 과열도 제어 방법
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