EP2332172A4 - CERAMIC WARMING EAR WITH POROUS CERAMIC DOUGH - Google Patents

CERAMIC WARMING EAR WITH POROUS CERAMIC DOUGH

Info

Publication number
EP2332172A4
EP2332172A4 EP09818180.3A EP09818180A EP2332172A4 EP 2332172 A4 EP2332172 A4 EP 2332172A4 EP 09818180 A EP09818180 A EP 09818180A EP 2332172 A4 EP2332172 A4 EP 2332172A4
Authority
EP
European Patent Office
Prior art keywords
ceramic
heat pipe
wick
porous
porous ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP09818180.3A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP2332172A2 (en
Inventor
William D Koenigsberg
Adam M Scotch
David W Hamby
John H Selverian
David Wentzel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osram Sylvania Inc
Original Assignee
Osram Sylvania Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Sylvania Inc filed Critical Osram Sylvania Inc
Publication of EP2332172A2 publication Critical patent/EP2332172A2/en
Publication of EP2332172A4 publication Critical patent/EP2332172A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/86—Ceramics or glass
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
EP09818180.3A 2008-09-30 2009-08-25 CERAMIC WARMING EAR WITH POROUS CERAMIC DOUGH Withdrawn EP2332172A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/242,051 US20100078151A1 (en) 2008-09-30 2008-09-30 Ceramic heat pipe with porous ceramic wick
PCT/US2009/054846 WO2010039358A2 (en) 2008-09-30 2009-08-25 Ceramic heat pipe with porous ceramic wick

Publications (2)

Publication Number Publication Date
EP2332172A2 EP2332172A2 (en) 2011-06-15
EP2332172A4 true EP2332172A4 (en) 2013-10-09

Family

ID=42056134

Family Applications (1)

Application Number Title Priority Date Filing Date
EP09818180.3A Withdrawn EP2332172A4 (en) 2008-09-30 2009-08-25 CERAMIC WARMING EAR WITH POROUS CERAMIC DOUGH

Country Status (7)

Country Link
US (1) US20100078151A1 (ja)
EP (1) EP2332172A4 (ja)
JP (1) JP2012504339A (ja)
KR (1) KR20110063844A (ja)
CN (1) CN102171819A (ja)
CA (1) CA2738072A1 (ja)
WO (1) WO2010039358A2 (ja)

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CN101552212B (zh) * 2008-04-02 2011-01-12 展晶科技(深圳)有限公司 半导体元件与热管的接合方法
CN101865370B (zh) * 2009-04-16 2013-08-07 富准精密工业(深圳)有限公司 发光二极管灯具
WO2012064801A2 (en) 2010-11-11 2012-05-18 Schlumberger Canada Limited Particle accelerator with a heat pipe supporting components of a high voltage power supply
TWI465678B (zh) * 2011-08-29 2014-12-21 Asia Vital Components Co Ltd 均溫板結構及其製造方法
US11765861B2 (en) * 2011-10-17 2023-09-19 Asia Vital Components Co., Ltd. Vapor chamber structure
US20190271510A1 (en) * 2011-10-17 2019-09-05 Asia Vital Components Co., Ltd. Manufacturing method of vapor chamber
CN103292629A (zh) * 2012-03-01 2013-09-11 欧司朗股份有限公司 热管及其制造方法
US9018022B2 (en) 2012-09-24 2015-04-28 Lam Research Corporation Showerhead electrode assembly in a capacitively coupled plasma processing apparatus
CN102867788B (zh) * 2012-09-29 2016-03-02 江苏宏微科技股份有限公司 基于新型覆金属陶瓷基板的功率模块
CN102881663A (zh) * 2012-09-29 2013-01-16 江苏宏微科技股份有限公司 带散热功能的覆金属陶瓷基板
WO2014170907A2 (en) * 2013-04-17 2014-10-23 Venkata Sundereswar Rao Vempati An energy efficient pressure less steam generator
US20150101192A1 (en) * 2013-10-15 2015-04-16 Hao Pai Method of manufacturing ultra thin slab-shaped capillary structure for thermal conduction
JP5793551B2 (ja) * 2013-12-09 2015-10-14 東芝三菱電機産業システム株式会社 水冷却フィン及び高電圧装置
US20150219406A1 (en) * 2014-01-31 2015-08-06 Asia Vital Components Co., Ltd. Heat Dissipation Device
US20170184296A1 (en) * 2014-05-22 2017-06-29 Philips Lighting Holding B.V. Thermo-optical enclosure for led lighting applications
EP3172488B1 (en) 2014-07-22 2019-05-22 Signify Holding B.V. Light source cooling body, light source assembly, a luminaire and method to manufacture a light source cooling body or a light source assembly
US9401468B2 (en) 2014-12-24 2016-07-26 GE Lighting Solutions, LLC Lamp with LED chips cooled by a phase transformation loop
US20180045341A1 (en) 2015-02-23 2018-02-15 Exotex, Inc. Method and Apparatus of Making Porous Pipes and Panels Using a Treated Fiber Thread to Weave, Braid or Spin Products
JP2018527760A (ja) * 2015-08-26 2018-09-20 シン サーマル エクスチェンジ ピーティーイー エルティーディー 真空コア回路基板
WO2017053388A1 (en) 2015-09-21 2017-03-30 Exotex, Inc. Thermally insulating pipes
DE102015221802A1 (de) * 2015-11-06 2017-05-11 Bayerische Motoren Werke Aktiengesellschaft Rotationsmaschine und Kraftfahrzeug
KR101810167B1 (ko) * 2015-11-11 2017-12-19 전남대학교산학협력단 3차원 열흡수 장치
US10403792B2 (en) * 2016-03-07 2019-09-03 Rayvio Corporation Package for ultraviolet emitting devices
CN106225535B (zh) * 2016-07-22 2018-12-21 北京空间机电研究所 一种圆柱型环路热管毛细泵组件
CN106066131B (zh) * 2016-07-22 2019-03-12 中国科学院上海硅酸盐研究所 一种环路热管用多孔氮化硅毛细芯
WO2018208801A1 (en) * 2017-05-08 2018-11-15 Kelvin Thermal Technologies, Inc. Thermal management planes
US11300362B2 (en) 2019-01-31 2022-04-12 Toyota Motor Engineering & Manufacturing North America, Inc. Hybrid evaporator-feeding wicks for uniform fluid delivery to multiple heat sources in a vapor chamber
CN111504105B (zh) * 2020-04-30 2022-01-18 北京工业大学 采用复相造孔剂造孔的热管或均热板用吸液芯及其制法
US11879690B2 (en) 2020-05-06 2024-01-23 Asia Vital Components (China) Co., Ltd. Flexible wick structure and deformable heat-dissipating unit using the same

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4883116A (en) * 1989-01-31 1989-11-28 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Ceramic heat pipe wick
JPH0444352A (ja) * 1990-06-12 1992-02-14 Fujikura Ltd ヒートパイプ式電子部品冷却器
US5555914A (en) * 1984-11-02 1996-09-17 The Boeing Company Cryogenic heat pipe
US20020185726A1 (en) * 2001-06-06 2002-12-12 North Mark T. Heat pipe thermal management of high potential electronic chip packages
DE202006019275U1 (de) * 2006-12-21 2007-05-24 Schmid, Christoph Wärmerohr

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US2350348A (en) * 1942-12-21 1944-06-06 Gen Motors Corp Heat transfer device
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US3563309A (en) * 1968-09-16 1971-02-16 Hughes Aircraft Co Heat pipe having improved dielectric strength
LU66369A1 (ja) * 1972-10-26 1973-01-23
CA1066964A (en) * 1976-09-28 1979-11-27 Edna A. Dancy Fabrication of ceramic heat pipes
US4274479A (en) * 1978-09-21 1981-06-23 Thermacore, Inc. Sintered grooved wicks
JPS5849607B2 (ja) * 1979-04-09 1983-11-05 日本鋼管株式会社 非融着型二重冷却管を備えたク−リングステ−ブ
JPS5825248A (ja) * 1982-07-12 1983-02-15 Ngk Spark Plug Co Ltd 電子部品のセラミック基板用ヒ−トシンクの製造方法
US4701739A (en) * 1984-03-30 1987-10-20 Figaro Engineering Inc. Exhaust gas sensor and process for producing same
DE3504992A1 (de) * 1985-02-14 1986-08-14 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungshalbleitermodul mit integriertem waermerohr
US4885129A (en) * 1988-10-24 1989-12-05 The United States Of America As Represented By The Secretary Of The Air Force Method of manufacturing heat pipe wicks
US5386143A (en) * 1991-10-25 1995-01-31 Digital Equipment Corporation High performance substrate, electronic package and integrated circuit cooling process
JPH113893A (ja) * 1997-06-13 1999-01-06 Orion Mach Co Ltd 半導体基板の温度調節装置
JP2001165584A (ja) * 1999-12-02 2001-06-22 Tokai Rubber Ind Ltd シート状ヒートパイプ
JP2002327993A (ja) * 2001-05-01 2002-11-15 Fujitsu Ltd 薄型ヒートパイプ、薄型ヒートシンク、熱制御システムおよび薄型ヒートパイプの製造方法
JP2003171656A (ja) * 2001-12-03 2003-06-20 Mitsubishi Electric Corp ヒートパイプ用作動流体およびヒートパイプの製造方法
JP4194276B2 (ja) * 2002-01-25 2008-12-10 株式会社フジクラ 平板型ヒートパイプ
JP2003343987A (ja) * 2002-05-24 2003-12-03 Mitsubishi Electric Corp ウイック構造体の製造方法
US7007863B2 (en) * 2002-10-08 2006-03-07 S.C. Johnson & Son, Inc. Wick-based delivery system with wick made of different composite materials
DE10261402A1 (de) * 2002-12-30 2004-07-15 Schulz-Harder, Jürgen, Dr.-Ing. Wärmesenke in Form einer Heat-Pipe sowie Verfahren zum Herstellen einer solchen Wärmesenke
US6945317B2 (en) * 2003-04-24 2005-09-20 Thermal Corp. Sintered grooved wick with particle web
US6994152B2 (en) * 2003-06-26 2006-02-07 Thermal Corp. Brazed wick for a heat transfer device
US7095110B2 (en) * 2004-05-21 2006-08-22 Gelcore, Llc Light emitting diode apparatuses with heat pipes for thermal management
KR100795753B1 (ko) * 2006-06-26 2008-01-21 (주)셀시아테크놀러지스한국 판형 열전달장치 및 그것의 제조 방법
JP2008218513A (ja) * 2007-02-28 2008-09-18 Fujikura Ltd 冷却装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5555914A (en) * 1984-11-02 1996-09-17 The Boeing Company Cryogenic heat pipe
US4883116A (en) * 1989-01-31 1989-11-28 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Ceramic heat pipe wick
JPH0444352A (ja) * 1990-06-12 1992-02-14 Fujikura Ltd ヒートパイプ式電子部品冷却器
US20020185726A1 (en) * 2001-06-06 2002-12-12 North Mark T. Heat pipe thermal management of high potential electronic chip packages
DE202006019275U1 (de) * 2006-12-21 2007-05-24 Schmid, Christoph Wärmerohr

Also Published As

Publication number Publication date
US20100078151A1 (en) 2010-04-01
WO2010039358A2 (en) 2010-04-08
CA2738072A1 (en) 2010-04-08
WO2010039358A3 (en) 2010-05-27
WO2010039358A8 (en) 2011-04-21
EP2332172A2 (en) 2011-06-15
CN102171819A (zh) 2011-08-31
JP2012504339A (ja) 2012-02-16
KR20110063844A (ko) 2011-06-14

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Extension state: AL BA RS

DAX Request for extension of the european patent (deleted)
RIN1 Information on inventor provided before grant (corrected)

Inventor name: HAMBY, DAVID, W.

Inventor name: WENTZEL, DAVID

Inventor name: KOENIGSBERG, WILLIAM, D.

Inventor name: SCOTCH, ADAM, M.

Inventor name: SELVERIAN, JOHN, H.

A4 Supplementary search report drawn up and despatched

Effective date: 20130910

RIC1 Information provided on ipc code assigned before grant

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