EP2332172A4 - Ceramic heat pipe with porous ceramic wick - Google Patents

Ceramic heat pipe with porous ceramic wick

Info

Publication number
EP2332172A4
EP2332172A4 EP09818180.3A EP09818180A EP2332172A4 EP 2332172 A4 EP2332172 A4 EP 2332172A4 EP 09818180 A EP09818180 A EP 09818180A EP 2332172 A4 EP2332172 A4 EP 2332172A4
Authority
EP
European Patent Office
Prior art keywords
ceramic
heat pipe
wick
porous
porous ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP09818180.3A
Other languages
German (de)
French (fr)
Other versions
EP2332172A2 (en
Inventor
William D Koenigsberg
Adam M Scotch
David W Hamby
John H Selverian
David Wentzel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osram Sylvania Inc
Original Assignee
Osram Sylvania Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Sylvania Inc filed Critical Osram Sylvania Inc
Publication of EP2332172A2 publication Critical patent/EP2332172A2/en
Publication of EP2332172A4 publication Critical patent/EP2332172A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/86—Ceramics or glass
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
EP09818180.3A 2008-09-30 2009-08-25 Ceramic heat pipe with porous ceramic wick Withdrawn EP2332172A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/242,051 US20100078151A1 (en) 2008-09-30 2008-09-30 Ceramic heat pipe with porous ceramic wick
PCT/US2009/054846 WO2010039358A2 (en) 2008-09-30 2009-08-25 Ceramic heat pipe with porous ceramic wick

Publications (2)

Publication Number Publication Date
EP2332172A2 EP2332172A2 (en) 2011-06-15
EP2332172A4 true EP2332172A4 (en) 2013-10-09

Family

ID=42056134

Family Applications (1)

Application Number Title Priority Date Filing Date
EP09818180.3A Withdrawn EP2332172A4 (en) 2008-09-30 2009-08-25 Ceramic heat pipe with porous ceramic wick

Country Status (7)

Country Link
US (1) US20100078151A1 (en)
EP (1) EP2332172A4 (en)
JP (1) JP2012504339A (en)
KR (1) KR20110063844A (en)
CN (1) CN102171819A (en)
CA (1) CA2738072A1 (en)
WO (1) WO2010039358A2 (en)

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CN101552212B (en) * 2008-04-02 2011-01-12 展晶科技(深圳)有限公司 Method for jointing semiconductor element with thermotube
CN101865370B (en) * 2009-04-16 2013-08-07 富准精密工业(深圳)有限公司 Light-emitting diode lamp
US9603233B2 (en) 2010-11-11 2017-03-21 Schlumberger Technology Corporation Particle accelerator with a heat pipe supporting components of a high voltage power supply
TWI465678B (en) * 2011-08-29 2014-12-21 Asia Vital Components Co Ltd Temperature uniform plate structure and manufacturing method thereof
US11765861B2 (en) * 2011-10-17 2023-09-19 Asia Vital Components Co., Ltd. Vapor chamber structure
US20190271510A1 (en) * 2011-10-17 2019-09-05 Asia Vital Components Co., Ltd. Manufacturing method of vapor chamber
CN103292629A (en) * 2012-03-01 2013-09-11 欧司朗股份有限公司 Heat pipe and manufacturing method thereof
US9018022B2 (en) 2012-09-24 2015-04-28 Lam Research Corporation Showerhead electrode assembly in a capacitively coupled plasma processing apparatus
CN102881663A (en) * 2012-09-29 2013-01-16 江苏宏微科技股份有限公司 Metal-coated ceramic substrate with radiating function
CN102867788B (en) * 2012-09-29 2016-03-02 江苏宏微科技股份有限公司 Based on the novel power model covering cermet substrate
US9664378B2 (en) * 2013-04-17 2017-05-30 Venkata Sundereswar Rao VEMPATI Energy efficient pressure less steam generator
US20150101192A1 (en) * 2013-10-15 2015-04-16 Hao Pai Method of manufacturing ultra thin slab-shaped capillary structure for thermal conduction
JP5793551B2 (en) * 2013-12-09 2015-10-14 東芝三菱電機産業システム株式会社 Water cooling fins and high voltage equipment
US20150219406A1 (en) * 2014-01-31 2015-08-06 Asia Vital Components Co., Ltd. Heat Dissipation Device
EP3149391A1 (en) * 2014-05-22 2017-04-05 Philips Lighting Holding B.V. Thermo-optical enclosure for led lighting applications
WO2016012146A1 (en) 2014-07-22 2016-01-28 Koninklijke Philips N.V. Light source cooling body, light source assembly, a luminaire and method to manufacture a light source cooling or a light source assembly
US9401468B2 (en) 2014-12-24 2016-07-26 GE Lighting Solutions, LLC Lamp with LED chips cooled by a phase transformation loop
US11754205B2 (en) 2015-02-23 2023-09-12 Exotex, Inc. Method and apparatus of making pipes and panels using a treated fiber thread to weave, braid or spin products
EP3341654A4 (en) * 2015-08-26 2019-04-17 Thin Thermal Exchange Pte Ltd Evacuated core circuit board
WO2017053388A1 (en) 2015-09-21 2017-03-30 Exotex, Inc. Thermally insulating pipes
DE102015221802A1 (en) * 2015-11-06 2017-05-11 Bayerische Motoren Werke Aktiengesellschaft Rotary machine and motor vehicle
KR101810167B1 (en) * 2015-11-11 2017-12-19 전남대학교산학협력단 A device for three dimensional heat absorption
US10403792B2 (en) * 2016-03-07 2019-09-03 Rayvio Corporation Package for ultraviolet emitting devices
CN106066131B (en) * 2016-07-22 2019-03-12 中国科学院上海硅酸盐研究所 A kind of loop circuit heat pipe porous silicon nitride capillary wick
CN106225535B (en) * 2016-07-22 2018-12-21 北京空间机电研究所 A kind of cylindrical type loop circuit heat pipe capillary pump assembly
CN110621953B (en) * 2017-05-08 2022-04-01 开文热工科技公司 Thermal management plane
US11300362B2 (en) 2019-01-31 2022-04-12 Toyota Motor Engineering & Manufacturing North America, Inc. Hybrid evaporator-feeding wicks for uniform fluid delivery to multiple heat sources in a vapor chamber
CN111504105B (en) * 2020-04-30 2022-01-18 北京工业大学 Liquid absorption core for heat pipe or vapor chamber formed by multiple phase pore-forming agent and manufacturing method thereof
US11879690B2 (en) 2020-05-06 2024-01-23 Asia Vital Components (China) Co., Ltd. Flexible wick structure and deformable heat-dissipating unit using the same

Citations (5)

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Publication number Priority date Publication date Assignee Title
US4883116A (en) * 1989-01-31 1989-11-28 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Ceramic heat pipe wick
JPH0444352A (en) * 1990-06-12 1992-02-14 Fujikura Ltd Heat pipe type electronic parts cooler
US5555914A (en) * 1984-11-02 1996-09-17 The Boeing Company Cryogenic heat pipe
US20020185726A1 (en) * 2001-06-06 2002-12-12 North Mark T. Heat pipe thermal management of high potential electronic chip packages
DE202006019275U1 (en) * 2006-12-21 2007-05-24 Schmid, Christoph Heat pipe for high temperature applications comprises a sealed outer pipe and a porous inner pipe closed at the ends by smooth or curved caps and having inner and/or outer ribs

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US2350348A (en) * 1942-12-21 1944-06-06 Gen Motors Corp Heat transfer device
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US3563309A (en) * 1968-09-16 1971-02-16 Hughes Aircraft Co Heat pipe having improved dielectric strength
LU66369A1 (en) * 1972-10-26 1973-01-23
CA1066964A (en) * 1976-09-28 1979-11-27 Edna A. Dancy Fabrication of ceramic heat pipes
US4274479A (en) * 1978-09-21 1981-06-23 Thermacore, Inc. Sintered grooved wicks
JPS5849607B2 (en) * 1979-04-09 1983-11-05 日本鋼管株式会社 Cooling stave with non-fused double cooling pipes
JPS5825248A (en) * 1982-07-12 1983-02-15 Ngk Spark Plug Co Ltd Manufacture of heat sink for ceramic substrate of electronic component
US4701739A (en) * 1984-03-30 1987-10-20 Figaro Engineering Inc. Exhaust gas sensor and process for producing same
DE3504992A1 (en) * 1985-02-14 1986-08-14 Brown, Boveri & Cie Ag, 6800 Mannheim PERFORMANCE SEMICONDUCTOR MODULE WITH INTEGRATED HEAT PIPE
US4885129A (en) * 1988-10-24 1989-12-05 The United States Of America As Represented By The Secretary Of The Air Force Method of manufacturing heat pipe wicks
US5386143A (en) * 1991-10-25 1995-01-31 Digital Equipment Corporation High performance substrate, electronic package and integrated circuit cooling process
JPH113893A (en) * 1997-06-13 1999-01-06 Orion Mach Co Ltd Temperature regulator of semiconductor substrate
JP2001165584A (en) * 1999-12-02 2001-06-22 Tokai Rubber Ind Ltd Sheet type heat pipe
JP2002327993A (en) * 2001-05-01 2002-11-15 Fujitsu Ltd Thin heat pipe, thin heat sink and heat control system, and method for manufacturing thin heat pipe
JP2003171656A (en) * 2001-12-03 2003-06-20 Mitsubishi Electric Corp Working fluid for heat pipe and method for manufacturing heat pipe
JP4194276B2 (en) * 2002-01-25 2008-12-10 株式会社フジクラ Flat plate heat pipe
JP2003343987A (en) * 2002-05-24 2003-12-03 Mitsubishi Electric Corp Manufacturing method for wick structural body
US7007863B2 (en) * 2002-10-08 2006-03-07 S.C. Johnson & Son, Inc. Wick-based delivery system with wick made of different composite materials
DE10261402A1 (en) * 2002-12-30 2004-07-15 Schulz-Harder, Jürgen, Dr.-Ing. Heat sink in the form of a heat pipe and method for producing such a heat sink
US6945317B2 (en) * 2003-04-24 2005-09-20 Thermal Corp. Sintered grooved wick with particle web
US6994152B2 (en) * 2003-06-26 2006-02-07 Thermal Corp. Brazed wick for a heat transfer device
US7095110B2 (en) * 2004-05-21 2006-08-22 Gelcore, Llc Light emitting diode apparatuses with heat pipes for thermal management
KR100795753B1 (en) * 2006-06-26 2008-01-21 (주)셀시아테크놀러지스한국 Flat type heat transfer device and its manufacturing method
JP2008218513A (en) * 2007-02-28 2008-09-18 Fujikura Ltd Cooling device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5555914A (en) * 1984-11-02 1996-09-17 The Boeing Company Cryogenic heat pipe
US4883116A (en) * 1989-01-31 1989-11-28 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Ceramic heat pipe wick
JPH0444352A (en) * 1990-06-12 1992-02-14 Fujikura Ltd Heat pipe type electronic parts cooler
US20020185726A1 (en) * 2001-06-06 2002-12-12 North Mark T. Heat pipe thermal management of high potential electronic chip packages
DE202006019275U1 (en) * 2006-12-21 2007-05-24 Schmid, Christoph Heat pipe for high temperature applications comprises a sealed outer pipe and a porous inner pipe closed at the ends by smooth or curved caps and having inner and/or outer ribs

Also Published As

Publication number Publication date
WO2010039358A3 (en) 2010-05-27
CA2738072A1 (en) 2010-04-08
KR20110063844A (en) 2011-06-14
WO2010039358A8 (en) 2011-04-21
JP2012504339A (en) 2012-02-16
US20100078151A1 (en) 2010-04-01
WO2010039358A2 (en) 2010-04-08
CN102171819A (en) 2011-08-31
EP2332172A2 (en) 2011-06-15

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Legal Events

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PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

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17P Request for examination filed

Effective date: 20110304

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR

AX Request for extension of the european patent

Extension state: AL BA RS

DAX Request for extension of the european patent (deleted)
RIN1 Information on inventor provided before grant (corrected)

Inventor name: HAMBY, DAVID, W.

Inventor name: WENTZEL, DAVID

Inventor name: KOENIGSBERG, WILLIAM, D.

Inventor name: SCOTCH, ADAM, M.

Inventor name: SELVERIAN, JOHN, H.

A4 Supplementary search report drawn up and despatched

Effective date: 20130910

RIC1 Information provided on ipc code assigned before grant

Ipc: F21V 29/00 20060101ALI20130904BHEP

Ipc: F28D 15/04 20060101AFI20130904BHEP

STAA Information on the status of an ep patent application or granted ep patent

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18D Application deemed to be withdrawn

Effective date: 20140408