WO2010039358A8 - Ceramic heat pipe with porous ceramic wick - Google Patents

Ceramic heat pipe with porous ceramic wick Download PDF

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Publication number
WO2010039358A8
WO2010039358A8 PCT/US2009/054846 US2009054846W WO2010039358A8 WO 2010039358 A8 WO2010039358 A8 WO 2010039358A8 US 2009054846 W US2009054846 W US 2009054846W WO 2010039358 A8 WO2010039358 A8 WO 2010039358A8
Authority
WO
WIPO (PCT)
Prior art keywords
ceramic
heat pipe
wick
heat
extends
Prior art date
Application number
PCT/US2009/054846
Other languages
French (fr)
Other versions
WO2010039358A2 (en
WO2010039358A3 (en
Inventor
William D. Koenigsberg
Adam M. Scotch
David W. Hamby
John H. Selverian
David Wentzel
Original Assignee
Osram Sylvania Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Sylvania Inc. filed Critical Osram Sylvania Inc.
Priority to CN2009801384650A priority Critical patent/CN102171819A/en
Priority to CA2738072A priority patent/CA2738072A1/en
Priority to JP2011529054A priority patent/JP2012504339A/en
Priority to EP09818180.3A priority patent/EP2332172A4/en
Publication of WO2010039358A2 publication Critical patent/WO2010039358A2/en
Publication of WO2010039358A3 publication Critical patent/WO2010039358A3/en
Publication of WO2010039358A8 publication Critical patent/WO2010039358A8/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/86—Ceramics or glass
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A heat pipe for transporting heat from light emitting elements includes a sealed body made of a non-porous ceramic, a vapor channel inside the body that extends between two heat transfer locations spaced apart on an exterior surface of the body, a ceramic wick inside the body that extends between the two heat transfer locations, and a working fluid that partially fills the vapor transport channel. In a method of making this heat pipe, the body and wick are desirably formed together as a seamless monolithic structure made of the same ceramic material. Using a ceramic makes the heat pipe corrosion resistant and allows electrical components like LEDs to be mounted directly on the body because the ceramic is a dielectric.
PCT/US2009/054846 2008-09-30 2009-08-25 Ceramic heat pipe with porous ceramic wick WO2010039358A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN2009801384650A CN102171819A (en) 2008-09-30 2009-08-25 Ceramic heat pipe with porous ceramic wick
CA2738072A CA2738072A1 (en) 2008-09-30 2009-08-25 Ceramic heat pipe with porous ceramic wick
JP2011529054A JP2012504339A (en) 2008-09-30 2009-08-25 Ceramic heat pipe with porous ceramic core
EP09818180.3A EP2332172A4 (en) 2008-09-30 2009-08-25 Ceramic heat pipe with porous ceramic wick

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/242,051 2008-09-30
US12/242,051 US20100078151A1 (en) 2008-09-30 2008-09-30 Ceramic heat pipe with porous ceramic wick

Publications (3)

Publication Number Publication Date
WO2010039358A2 WO2010039358A2 (en) 2010-04-08
WO2010039358A3 WO2010039358A3 (en) 2010-05-27
WO2010039358A8 true WO2010039358A8 (en) 2011-04-21

Family

ID=42056134

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2009/054846 WO2010039358A2 (en) 2008-09-30 2009-08-25 Ceramic heat pipe with porous ceramic wick

Country Status (7)

Country Link
US (1) US20100078151A1 (en)
EP (1) EP2332172A4 (en)
JP (1) JP2012504339A (en)
KR (1) KR20110063844A (en)
CN (1) CN102171819A (en)
CA (1) CA2738072A1 (en)
WO (1) WO2010039358A2 (en)

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US20190271510A1 (en) * 2011-10-17 2019-09-05 Asia Vital Components Co., Ltd. Manufacturing method of vapor chamber
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CN102867788B (en) * 2012-09-29 2016-03-02 江苏宏微科技股份有限公司 Based on the novel power model covering cermet substrate
CN102881663A (en) * 2012-09-29 2013-01-16 江苏宏微科技股份有限公司 Metal-coated ceramic substrate with radiating function
WO2014170907A2 (en) * 2013-04-17 2014-10-23 Venkata Sundereswar Rao Vempati An energy efficient pressure less steam generator
US20150101192A1 (en) * 2013-10-15 2015-04-16 Hao Pai Method of manufacturing ultra thin slab-shaped capillary structure for thermal conduction
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KR101810167B1 (en) * 2015-11-11 2017-12-19 전남대학교산학협력단 A device for three dimensional heat absorption
US10403792B2 (en) * 2016-03-07 2019-09-03 Rayvio Corporation Package for ultraviolet emitting devices
CN106225535B (en) * 2016-07-22 2018-12-21 北京空间机电研究所 A kind of cylindrical type loop circuit heat pipe capillary pump assembly
CN106066131B (en) * 2016-07-22 2019-03-12 中国科学院上海硅酸盐研究所 A kind of loop circuit heat pipe porous silicon nitride capillary wick
WO2018208801A1 (en) * 2017-05-08 2018-11-15 Kelvin Thermal Technologies, Inc. Thermal management planes
US11300362B2 (en) 2019-01-31 2022-04-12 Toyota Motor Engineering & Manufacturing North America, Inc. Hybrid evaporator-feeding wicks for uniform fluid delivery to multiple heat sources in a vapor chamber
CN111504105B (en) * 2020-04-30 2022-01-18 北京工业大学 Liquid absorption core for heat pipe or vapor chamber formed by multiple phase pore-forming agent and manufacturing method thereof
US11879690B2 (en) 2020-05-06 2024-01-23 Asia Vital Components (China) Co., Ltd. Flexible wick structure and deformable heat-dissipating unit using the same

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Also Published As

Publication number Publication date
US20100078151A1 (en) 2010-04-01
WO2010039358A2 (en) 2010-04-08
CA2738072A1 (en) 2010-04-08
WO2010039358A3 (en) 2010-05-27
EP2332172A4 (en) 2013-10-09
EP2332172A2 (en) 2011-06-15
CN102171819A (en) 2011-08-31
JP2012504339A (en) 2012-02-16
KR20110063844A (en) 2011-06-14

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