EP2310913A1 - Procédé de photo-imagerie sur un substrat - Google Patents

Procédé de photo-imagerie sur un substrat

Info

Publication number
EP2310913A1
EP2310913A1 EP09785286A EP09785286A EP2310913A1 EP 2310913 A1 EP2310913 A1 EP 2310913A1 EP 09785286 A EP09785286 A EP 09785286A EP 09785286 A EP09785286 A EP 09785286A EP 2310913 A1 EP2310913 A1 EP 2310913A1
Authority
EP
European Patent Office
Prior art keywords
photoimaging
substrate
substrate according
photoresist polymer
liquid photoresist
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP09785286A
Other languages
German (de)
English (en)
Inventor
Sheila Hamilton
Charles Jonathan Kennett
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rainbow Technology Systems Ltd
Original Assignee
Rainbow Technology Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GBGB0813196.3A external-priority patent/GB0813196D0/en
Priority claimed from GB0901526A external-priority patent/GB0901526D0/en
Application filed by Rainbow Technology Systems Ltd filed Critical Rainbow Technology Systems Ltd
Publication of EP2310913A1 publication Critical patent/EP2310913A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/7035—Proximity or contact printers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2012—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image using liquid photohardening compositions, e.g. for the production of reliefs such as flexographic plates or stamps
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2035—Exposure; Apparatus therefor simultaneous coating and exposure; using a belt mask, e.g. endless
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/056—Using an artwork, i.e. a photomask for exposing photosensitive layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing

Definitions

  • the present invention relates to a method and apparatus for photoimaging. More particularly, the present invention relates to a method and apparatus for photoimaging a substrate covered with a wet curable photopolymer, wherein the photoimaged substrate is used to form images such as electrical circuits.
  • a method for photoimaging a substrate comprising: providing a substrate with a cladding; depositing a liquid photoresist polymer on at least part of the cladding to form a film of photoresist polymer with a thickness of less than about 178 ⁇ m (0.007 inch); positioning a phototool onto the liquid photoresist polymer; and applying radiation to the liquid photoresist polymer to cure the photoresist layer in exposed areas through the phototool.
  • the present invention therefore relates to a method of photoimaging a substrate covered with a wet curable photopolymer (i.e. a wet resist), wherein the photoimaged substrate may be used to form electrical circuits such as PCBs and flat panel displays.
  • the present invention may also relate to forming dielectric images on dielectrics.
  • the present invention therefore relates to the use of wet films rather than expensive dry films such as Mylar (Trade Mark). Dry films are considerably more expensive than the use of wet films.
  • the use of wet films also overcomes the need for curing of the wet films and therefore leads to a very controllable process. In the present invention there is also no drying step (i.e.
  • the cladding may be made from or comprises any appropriate material or composite and may, for example, be metallic or non-metallic. In particular embodiments, there may therefore be metallic cladding and in alternative embodiments there may be non-metallic cladding.
  • the cladding may extend at least partially around or fully around the substrate.
  • the substrate may comprise a first and second side and the cladding may extend over one or both of the first and second sides of the substrate.
  • the substrate may therefore be laminated with the cladding over one or both of the first and second sides of the substrate.
  • the cladding may be in the form of a film or layer which is attached and/or adhered to the substrate.
  • the metal cladding may comprise or consist of conductive material.
  • the substrate which may, for example, be a dielectric material which may therefore be fully or at least substantially encapsulated by the metal cladding.
  • the metal cladding may comprise or consist of conducting material such as any suitable metal material. Suitable metals may, for example, be copper, silver, gold and the like.
  • the cladding may comprise or consist of dielectric material.
  • the substrate with the cladding may be substantially flat and may range in size up to about 1 m x 1 m.
  • the present invention has the advantage in that there is, in effect, no size limitation on the substrate apart from the apparatus actually performing the photoimaging process.
  • the liquid photoresist polymer is in a wet form (i.e. in a flowable form).
  • the physical properties of the liquid photoresist polymer may be matched to the required curing properties.
  • the liquid photoresist polymer may be deposited with a thickness of less than or equal to about 150 ⁇ m, 125 ⁇ m, 100 ⁇ m, 75 ⁇ m, 50 ⁇ m, 25 ⁇ m, 10 ⁇ m, 5 ⁇ m, 1 ⁇ m, 0.5 ⁇ m or 0.1 ⁇ m.
  • the liquid photoresist polymer may be deposited with a thickness ranging from about 177 ⁇ m to about 0.1 ⁇ m, about 125 ⁇ m to about 0.1 ⁇ m, about 100 ⁇ m to about 0.1 ⁇ m, about 75 ⁇ m to about 0.1 ⁇ m, about 50 ⁇ m to about 0.1 ⁇ m, about 25 ⁇ m to about 0.1 ⁇ m or about 10 ⁇ m to about 0.1 ⁇ m.
  • the liquid photoresist polymer may have a thickness of about 5 ⁇ m.
  • thin liquid photoresist polymer films allows low intensity radiation (e.g. UV light) to be used in the photoimaging process.
  • the liquid photoresist polymer may be applied to only one or both the first and second sides of the substrate wherein both the first and second sides of the substrate comprise cladding.
  • the present invention may therefore relate to a single-sided or a double-sided exposure in, for example, a front to back registration.
  • the liquid photoresist polymer may be deposited in a substantially even and continuous manner using any suitable technique.
  • the liquid photoresist layer may be deposited using a spray, a brush, a roller and/or a dip coating system.
  • the substrate comprising the cladding may be cleaned using a contact cleaning process to remove debris and/or contamination from the surface of the cladding.
  • the phototool may be positioned onto the substrate.
  • a compressive force may then be applied to the deposited liquid photoresist polymer.
  • the liquid photoresist polymer may be spread out and/or squeezed so that a substantially even, continuous film of photoresist may be achieved with a substantially even thickness.
  • a roller based system may be used to apply a compressive rolling force and may therefore be used to spread the liquid photoresist polymer.
  • a rubber cylindrical roller may be rolled over the phototool which applies the compressive to the liquid photoresist polymer.
  • the spreading out and/or squeezing may occur on both sides of the substrate at substantially the same time.
  • a particular function of the spreading out and/or squeezing is that this helps to ensure that substantially no air and therefore substantially no oxygen is trapped underneath the liquid photoresist polymer. It is preferred that there is no air and no oxygen trapped underneath the liquid photoresist polymer. This overcomes the need to have complex light systems and also provides significant improvements to the speed of the process as trapped oxygen slows down the photoimaging (i.e. curing) process.
  • a phototool is used in the photoimaging process.
  • the phototool may be a negative or positive image of desired electrical circuitry and may allow light to pass through some parts of the phototool but not others.
  • the phototool may be made from flexible plastics material and may be connected to a mechanism which correctly positions the phototool on the substrate on at least one or both sides of the substrate.
  • the phototool may be tensioned and wound around rollers such as solid steel rollers.
  • the phototool may also comprise a protective layer which may facilitate the phototool being peeled off the substrate after the imaging has taken place.
  • the protective layer may be any suitable non-stick material.
  • the phototool has the further advantage in that this provides the ability to control the temperature and humidity during the photoimaging process and along the full length of the photoimaged area. This allows the temperature and humidity to be maintained at substantially constant levels which provides a very controllable process.
  • the radiation used may be any suitable radiation which cures the liquid photoresist polymer.
  • UV radiation may be used to polymerise and/or harden and/or set the exposed liquid (e.g. wet) photoresist polymer.
  • the UV radiation may have a wavelength of about 200 - 400 nm and may have an intensity matched to cure the photopolymer being used.
  • a particularly preferred UV light source may be UV LEDs as they produce very small amounts of heat, have a long lamp life, start up immediately, have substantially no fall-off in power output, are low maintenance and can produce high levels of light intensity. LEDs may therefore be used to print fine lines in an inexpensive photoimaging process according to the present invention.
  • An alternative light source may be a laser light source.
  • the radiation may be collimated to improve the quality and/or resolution and/or definition of the photoimaging process.
  • At least one or both phototools may be accurately lined up using a registration system on one or both sides of the substrate.
  • the substrate may be positioned substantially vertically as at least one or both phototools are applied.
  • the photoimaging apparatus of the present invention may be used to process about one panel of substrate about every ten seconds.
  • liquid photoresist polymer which has not been exposed to radiation may be removed using standard wash off processes.
  • the method of the present invention may also be self-contained in a mini- clean room which therefore provides significant cost savings in the photoimaging process as large industrial clean rooms are not required.
  • the fine lines may have a width of any of the following: less than or equal to about 200 ⁇ m; less than or equal to about 150 ⁇ m; less than or equal to about 140 ⁇ m; less than or equal to about 130 ⁇ m; less than or equal to about 120 ⁇ m; less than or equal to about
  • the fine lines may have a width of any of the following: greater than about 200 ⁇ m; greater than about 150 ⁇ m; greater than about 100 ⁇ m; greater than about 75 ⁇ m; greater than about 50 ⁇ m; greater than about 20 ⁇ m; or greater than about 10 ⁇ m.
  • the fine lines may have a width of any of the following: about 0.1 - 200 ⁇ m; about 1 - 150 ⁇ m; about 1 - 100 ⁇ m; about 20 - 100 ⁇ m or about 5 - 75 ⁇ m.
  • the fine lines may be used in PCBs and other electrical components such as flat screen displays.
  • the method of the present invention may have the added advantage in that all steps such as the deposition of the liquid photoresist polymer and the removal of the phototool may occur in a single pass through apparatus according to the present invention.
  • the depositing of a liquid photoresist polymer on at least one or both sides of the substrate, the positioning of phototool(s) over the liquid photoresist polymer on at least one or both sides of the substrate, the application of a compressive force to the deposited liquid photoresist polymer to form a film of photoresist polymer, and the application of radiation to the liquid photoresist polymer to cure the photoresist layer may all occur in a single pass through photoimaging apparatus of the present invention.
  • This one-step process therefore increases the throughput of photoimaged substrates through the apparatus and also provides an apparatus which is easy to control and monitor.
  • the present invention has a number of advantages which are obtained by photoimaging through a much smaller depth in comparison to the prior art.
  • the depth formed by the thin film of photoresist polymer and optionally a protective layer for the phototool may be about through which the photoimaging may occur may be any of the following: about 0.1 - 50 ⁇ m; about 1 - 50 ⁇ m; about 1 - 25 ⁇ m; about 1 - 10 ⁇ m; about 1 - 8 ⁇ m or about 1 - 5 ⁇ m.
  • the depth formed by the thin film of photoresist polymer and optionally a protective layer for the phototool may be about 8 ⁇ m.
  • the amount of undercut occurring in the present invention may be any of the following: less than about 10 ⁇ m; less than about 5 ⁇ m; less than about 2 ⁇ m; less than about 1 ⁇ m; less than about 0.84 ⁇ m; less than about 0.8 ⁇ m; less than about 0.5 ⁇ m; or less than about 0.25 ⁇ m.
  • a method for photoimaging a substrate comprising: providing a substrate with a cladding; depositing a liquid photoresist polymer on at least part of the cladding to form a thin film of photoresist polymer; positioning a phototool onto the liquid photoresist polymer; and applying radiation to the liquid photoresist polymer to cure the photoresist layer in exposed areas through the phototool.
  • drying step i.e. a pre-drying step before the film of wet photoresist polymer is irradiated with, for example, UV radiation.
  • the photoimaged circuits may be electrical circuits which may be used in the manufacture of, for example, PCBs and flat panel displays.
  • dielectric images on dielectrics formed according to the first or second aspect there is provided dielectric images on dielectrics formed according to the first or second aspect.
  • apparatus for photoimaging a substrate comprising: at least one phototool capable of being positioned onto a liquid photoresist polymer on at least one side of a substrate with a cladding; a roller capable of applying a compressive force to the liquid photoresist polymer on the substrate with the cladding to form a film of photoresist polymer with a thickness of less than about 178 ⁇ m (0.007 inch); and a radiation source capable of curing the liquid photoresist polymer.
  • the cladding may be made from or comprises any appropriate material or composite and may, for example, be metallic or non-metallic.
  • the apparatus does not comprise apparatus for pre-drying the wet film of photoresist polymer before applying the film to the radiation source.
  • the fine lines may have a width of any of the following: less than or equal to about 200 ⁇ m; less than or equal to about 150 ⁇ m; less than or equal to about 140 ⁇ m; less than or equal to about 130 ⁇ m; less than or equal to about 120 ⁇ m; less than or equal to about 110 ⁇ m; less than or equal to about 100 ⁇ m; less than or equal to about 90 ⁇ m; less than or equal to about 80 ⁇ m; less than or equal to about 75 ⁇ m; less than or equal to about 70 ⁇ m; less than or equal to about 60 ⁇ m; less than or equal to about 50 ⁇ m; less than or equal to about 40 ⁇ m; less than or equal to about 30 ⁇ m; less than or equal to about 20 ⁇ m; less than or equal to about 10 ⁇ m; or less than or equal to about 5 ⁇ m.
  • the fine lines may have a width of any of the following: greater than about 200 ⁇ m; greater than about 150 ⁇ m; greater than about 100 ⁇ m; greater than about 75 ⁇ m; greater than about 50 ⁇ m; greater than about 20 ⁇ m; or greater than about 10 ⁇ m.
  • the fine lines may have a width of any of the following: about 0.1 - 200 ⁇ m; about 1 - 150 ⁇ m; about 1 - 100 ⁇ m; about 20 - 100 ⁇ m or about 5 - 75 ⁇ m.
  • the fine lines may be used in PCBs and other electrical components such as flat screen displays.
  • the compressive force may be applied onto at least one or both phototools whereupon the phototool(s) applies the compressive force to the liquid photoresist polymer.
  • the apparatus may also comprise collimating means to collimate radiation emitting from the radiation source.
  • the radiation source may comprise LEDs and/or a laser light source.
  • the radiation source may be capable of emitting UV radiation.
  • the apparatus may also comprise positioning means to locate the at least one phototool on the substrate.
  • the apparatus of the present invention also has the advantage of having a small footprint. This makes the apparatus extremely adaptable.
  • the apparatus may have a footprint of about 5 m X 2 m or even smaller.
  • the apparatus of the present invention may also have a low power consumption due to there being no curing process required for the wet film (i.e. no pre-drying step).
  • the apparatus may therefore be operated at low power such as less than about 10 kW or preferably less than about 5 kW.
  • prior art techniques operate in the region of greater than about 100 kW.
  • the apparatus of the present invention may therefore provide about a 50 times or even about a 100 times improvement in energy consumption.
  • the apparatus may therefore have a low environmental impact.
  • the apparatus of the present invention may also operate at a high capacity such as about 100 - 500 panels per hour or typically at about 360 panels per hour.
  • the apparatus may also be fully automated and therefore requires the minimum of handling.
  • the apparatus may also be easy to maintain.
  • apparatus for photoimaging a substrate comprising: at least one phototool capable of being positioned onto a liquid photoresist polymer on at least one side of a substrate with a cladding; a roller capable of applying a compressive force to the liquid photoresist polymer on the substrate with the cladding to form a thin film of photoresist polymer; and a radiation source capable of curing the liquid photoresist polymer.
  • the apparatus does not comprise apparatus for pre-drying the wet film of photoresist polymer before applying the film to the radiation source.
  • a method for producing tracks and/or electrical circuitry on a substrate comprising: providing a substrate; providing ink jet deposits on at least one side of the substrate, said ink jet deposits comprising conductive particles; depositing a liquid photoresist polymer on at least one side of the substrate comprising the ink jet deposits; positioning a phototool onto the liquid photoresist polymer on at least one side of the substrate; applying a compressive force to the deposited liquid photoresist polymer to form a film of photoresist polymer with a thickness less than about 178 ⁇ m (0.007 inch); and applying radiation to the liquid photoresist polymer to cure the photoresist layer in exposed areas through the phototool.
  • the ink jet deposits may comprise conductive particles such as silver, gold and/or copper.
  • there is also no drying step i.e. a pre-drying step) before the film of wet photoresist polymer is irradiated with, for example, UV radiation.
  • the ink jet deposits may have a width of about 50 ⁇ m - 500 ⁇ m, 50 ⁇ m -
  • the ink jet deposits may therefore be modified using the photoimaging concept described in the present invention.
  • the ink jet deposits may be formed on a substrate of, for example, a plastics sheeting.
  • the ink jet deposits may form an approximate required track on the plastics sheeting.
  • at least one or multiple tracks may then be formed within the ink jet deposits using the photoimaging concept described in the present invention.
  • apparatus for photoimaging a substrate comprising: at least one phototool capable of being positioned onto a liquid photoresist polymer on at least one side of a substrate with a cladding; a roller capable of applying a compressive force to the liquid photoresist polymer on the substrate with the cladding to form a thin film of photoresist polymer; and a radiation source capable of curing the liquid photoresist polymer.
  • Figure 1 is a sectional side view of a substrate with a wet photoresist layer deposited thereon according to an embodiment of the present invention
  • Figure 2 is a sectional side view of the substrate with the wet photoresist layer shown in Figure 1 wherein a phototool is being used in a photoimaging process according to an embodiment of the present invention
  • Figure 3 is a view of a processing step in the photoimaging process where phototools are being applied to both sides of the substrate during the photoimaging process according to an embodiment of the present invention
  • Figures 4a and 4b are representations of an alternative photoimaging process according to a further embodiment of the present invention.
  • Figure 5a is a sectional view of a photoimaging process according to the prior art
  • Figure 5b is a sectional view of a photoimaging process according to an embodiment of the present invention.
  • Figure 6a is a sectional view of a photoimaging process according to the prior art showing undercut occurring
  • Figure 6b is a sectional view of a photoimaging process according to an embodiment of the present invention undercut occurring;
  • Figure 7a is a sectional view of a photoimaging process according to the prior art showing cured line width
  • Figure 7b is a sectional view of a photoimaging process according to an embodiment of the present invention showing cured line width.
  • FIG. 1 is a sectional side view of a laminated structure, generally designated 100 according to an embodiment of the present invention.
  • the laminated structure 100 comprises a substrate 110 such as a dielectric layer and a metal cladding 112 on both sides. (Although the description below is for a metal cladding it should be noted that a similar process may be used for a non- metallic cladding).
  • a liquid photoresist polymer 114 On top of the laminated structure 100 there is a layer of a liquid photoresist polymer 114.
  • the photoresist layer 114 is therefore wet.
  • the liquid photoresist polymer layer 114 has a thickness of about 5 ⁇ m.
  • the photoresist layer 114 may be applied to both sides of the laminated structure 100.
  • the photoresist layer 114 is first of all deposited in a substantially even and continuous or at least substantially continuous manner using any suitable technique onto the laminated structure 100.
  • the photoresist layer 114 is applied using a spray, a brush, a roller and/or a dip coating system.
  • there is no drying step i.e. a pre-drying step before the film of wet photoresist polymer is irradiated with, for example, UV radiation.
  • a phototool 116 is applied to the photoresist layer 114.
  • the phototool 116 is a negative (or positive) image of a desired electrical circuitry and allows light to pass through some parts of the phototool 116 but not others.
  • the phototool is made from flexible plastics material.
  • Figure 2 represents the phototool 116 being applied to the laminated structure 100.
  • a compression system is used to spread out and/or squeeze the photoresist layer 114 so that an even spread of the photoresist layer 114 is achieved with a substantially even thickness of about 5 ⁇ m.
  • the compression system also ensures that no air and hence oxygen is trapped underneath the photoresist layer 114.
  • a roller based system applies a compressive force and is used to spread the photoresist layer 114.
  • a rubber cylindrical roller may therefore be used to spread the photoresist layer 114. This may occur on both sides of the laminated structure 100.
  • UV radiation is used to polymerise and/or harden and/or set the exposed liquid photoresist layer 114.
  • the UV radiation has a wavelength of about 200 - 400 nm and has an intensity matched to cure the exposed liquid photoresist layer 114.
  • Any suitable UV light source may be used but UV LEDs are particularly suitable as they produce very small amounts of heat, have a long lamp life, start up immediately, have substantially no fall-off in power output, are low maintenance and can produce high levels of light intensity. LEDs can therefore be used to print fine lines in an inexpensive photoimaging process. Alternatively, a laser light source is used.
  • a significant advantage to note is that no partially cured dry films of photopolymer (e.g. Mylar) are required which therefore significantly reduces any undercutting of the light (i.e. light shadows) during the imaging process which will have a detrimental effect on the resolution.
  • the resolution of the method of the present invention is therefore enhanced by overcoming the need to have no partially cured dry films.
  • Figure 3 is a representation of photoimaging apparatus according to the present invention which shows the laminated structure 100 being drawn substantially vertically up into the apparatus wherein phototools 116 are applied to both sides of the laminated structure 100.
  • the phototools 116 are tensioned and extend around rollers 118,120.
  • the phototools 116 have a surface attraction to the photoresist layers 114 and can therefore 'self-stick' to the photoresist layers 114 via weak interactive forces such as van der Waals and/or electrostatic forces.
  • the phototools 116 may also comprise a protective nonstick layer which facilitates the removal (i.e. peeling) of the phototools 116 from the laminated structure 100 once imaging has occurred.
  • a registration system is used to accurately line up the phototools 116 on both sides of the laminate structure.
  • the photoimaging apparatus can be used to process about one panel of laminated structure 100 every ten seconds. Once the photoimaging has occurred, the phototools 116 are removed from the laminated structure 100 using any suitable mechanical means.
  • the photoimaging process is extremely quick as no air and oxygen is trapped under the liquid photoresist layer 114. This therefore provides a drying time of less than about 5 seconds or preferably less than 1 second for the photoresist layer 114.
  • liquid photoresist 114 which has not been exposed to UV radiation is removed using, for example, an aqueous alkali solution via a washing procedure. A standard chemical etching process may then be used.
  • acid or alkali may be used to produce a dielectric substrate containing the required metal (e.g. copper) circuitry covered by polymerised photoresist.
  • the polymerised photoresist can then be removed to yield a substrate with the required electrical conductive circuitry.
  • the apparatus as described in the present invention can also be fully contained in a mini-clean room which therefore provides significant cost savings in the photoimaging process.
  • the fine lines have a width of any of the following: less than or equal to about 200 ⁇ m; less than or equal to about 150 ⁇ m; less than or equal to about 140 ⁇ m; less than or equal to about 130 ⁇ m; less than or equal to about 120 ⁇ m; less than or equal to about 110 ⁇ m; less than or equal to about 100 ⁇ m; less than or equal to about 90 ⁇ m; less than or equal to about 80 ⁇ m; less than or equal to about 75 ⁇ m; less than or equal to about 70 ⁇ m; less than or equal to about 60 ⁇ m; less than or equal to about 50 ⁇ m; less than or equal to about 40 ⁇ m; less than or equal to about 30 ⁇ m; less than or equal to about 20 ⁇ m; less than or equal to about 10 ⁇ m; or less than or equal to about 5 ⁇ m.
  • the fine lines have a width of any of the following: greater than about 200 ⁇ m; greater than about 150 ⁇ m; greater than about 100 ⁇ m; greater than about 75 ⁇ m; greater than about 50 ⁇ m; greater than about 20 ⁇ m; or greater than about 10 ⁇ m.
  • the fine lines have a width of any of the following: about 0.1 - 200 ⁇ m; about 1 - 150 ⁇ m; about 1 - 100 ⁇ m; about 20 - 100 ⁇ m or about 5 - 75 ⁇ m.
  • the fine lines are used in PCBs and other electrical components such as flat screen displays.
  • Figures 4a and 4b are representations of an alternative photoimaging process according to the present invention.
  • Figure 4a represents a deposit of ink from an ink jet, the ink jet deposit is generally designated 200.
  • the ink jet deposit 200 comprises conductive particles such as silver, gold and/or copper and is therefore conductive.
  • the ink jet deposit 200 does not have straight sides but has a series of outer undulations 202 due to the ink being deposited in a series of small droplets.
  • the ink jet deposit 200 has a width 'd' of about 100 ⁇ m. Using such ink jet deposits 200 it is difficult to form fine tracks for electrical circuits.
  • the ink jet deposits 200 can be modified using the photoimaging concept described in the present invention.
  • the ink jet deposits 200 can be formed on a plastics sheeting.
  • the ink jet 200 deposit is used to form the approximate required electrical conductive track onto the plastics sheeting.
  • the process as described above is then used to improve the quality of the formed track.
  • a photoresist layer as described above is applied over the plastics sheeting.
  • a phototool is then applied to the plastics sheeting, a compressive force is applied and then radiation.
  • the applied photoimaging can be used to produce an improved track 210 within the ink jet deposit 200.
  • the ink jet deposit 200 has a width 'd' of about 100 ⁇ m, multiple separate high resolution tracks can be formed within the previous single track formed by the ink jet deposit. For example, four tracks can be formed within a 100 ⁇ m ink deposit track.
  • Figures 5a and 5b are comparisons of existing prior art processes and the process of the present invention.
  • Figure 5a relates to a prior art process which is generally designated 300.
  • Figure 5a shows that there is a copper panel 310 with a dry film layer 312 with a thickness of about 35 ⁇ m residing on top of the copper panel 310, a protective Mylar layer 314 with a thickness of about 25 ⁇ m and an emulsion protective film 316 with a thickness of about 9 ⁇ m used with a phototool 318.
  • the formed thin line or track images 320 are also shown.
  • Figure 5b relates to a process according to the present invention which is generally designated 400.
  • Figure 5b shows that there is a copper panel 410, a wet resist layer 412 with a thickness of about 5 ⁇ m and an ultrathin protective film 414 with a thickness of about 3 ⁇ m used with a phototool 416.
  • the formed thin line or track images 418 are also shown.
  • Figures 5a and 5 clearly show that the process of the present invention provides a much smaller depth through which the photoimaging must occur.
  • the prior art process 300 images through a total thickness of about 69 ⁇ m whereas the process 400 of the present invention 300 images through a total thickness of about 8 ⁇ m.
  • Figures 6a and 6b illustrate a further advantage of the present invention relating to undercut.
  • Figure 6a which is the process 300 of the prior art shows that there is a large amount of undercut of about 14.5 ⁇ m whereas in the process 400 of the present invention there is a small undercut of about 0.84 ⁇ m.
  • the resulting cured line width is 49 ⁇ m (representing a line growth of 145%) whereas the present invention process 400 the resulting cured line width is 21.7 ⁇ m (representing a line growth of only 8%).
  • any suitable type of substrate may be used.
  • the cladding may also be metallic or non- metallic.
  • any suitable liquid photoresist polymer or combinations thereof may be used. Any mechanical means may also be used to apply a compressive force to the deposited liquid photoresist polymer to form a thin film of material with no trapped air and oxygen underneath.
  • the radiation used may be of any appropriate wavelength which is capable of curing the liquid photoresist polymer.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

L'invention porte sur un procédé et sur un appareil de photo-imagerie. En particulier, l'invention porte sur un procédé et sur un appareil de photo-imagerie d'un substrat recouvert d'un photopolymère durcissant à l'humidité, le substrat photo-imagé étant utilisé pour former des images telles que des circuits électriques. L'invention porte également sur un procédé pour produire des pistes et/ou des circuits électriques sur un substrat, des dépôts par jet d'encre étant réalisés sur au moins un côté du substrat, et un photopolymère durcissant à l'humidité étant ultérieurement déposé, un motif par image étant réalisé à l'aide d'un masque photographique. Ce procédé économise la matière dans la fabrication des circuits conducteurs.
EP09785286A 2008-07-18 2009-07-08 Procédé de photo-imagerie sur un substrat Withdrawn EP2310913A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GBGB0813196.3A GB0813196D0 (en) 2008-07-18 2008-07-18 Photoimaging
GB0901526A GB0901526D0 (en) 2009-01-30 2009-01-30 Photoimaging
PCT/GB2009/050806 WO2010007405A1 (fr) 2008-07-18 2009-07-08 Procédé de photo-imagerie sur un substrat

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EP2310913A1 true EP2310913A1 (fr) 2011-04-20

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EP (1) EP2310913A1 (fr)
WO (1) WO2010007405A1 (fr)

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GB201019874D0 (en) * 2010-11-23 2011-01-05 Rainbow Technology Systems Ltd Improved photoimaging
WO2013158543A1 (fr) * 2012-04-17 2013-10-24 The Regents Of The University Of Michigan Procédés de fabrication de grilles conductrices à micro-échelle et à nano-échelle d'électrodes transparentes et de polariseurs par photolithographie rouleau à rouleau
GB201207417D0 (en) 2012-04-27 2012-06-13 Electra Polymers Ltd A method for photoimaging a substrate
TWI594080B (zh) * 2012-11-15 2017-08-01 彩虹科技系統有限公司 光成像法
GB201223064D0 (en) 2012-12-20 2013-02-06 Rainbow Technology Systems Ltd Curable coatings for photoimaging
GB201312450D0 (en) * 2013-07-11 2013-08-28 Rainbow Technology Systems Ltd Direct Imaging of a Sealed Wet Photopolymer Pouch
US9244356B1 (en) 2014-04-03 2016-01-26 Rolith, Inc. Transparent metal mesh and method of manufacture
WO2015183243A1 (fr) 2014-05-27 2015-12-03 Rolith, Inc. Éléments anti-contrefaçon et procédés de fabrication et de détection

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