EP2275738B2 - Elément de refroidissement pour une source d'éclairage semi-conductrice d'un dispositif d'éclairage d'un véhicule automobile - Google Patents

Elément de refroidissement pour une source d'éclairage semi-conductrice d'un dispositif d'éclairage d'un véhicule automobile Download PDF

Info

Publication number
EP2275738B2
EP2275738B2 EP10002907.3A EP10002907A EP2275738B2 EP 2275738 B2 EP2275738 B2 EP 2275738B2 EP 10002907 A EP10002907 A EP 10002907A EP 2275738 B2 EP2275738 B2 EP 2275738B2
Authority
EP
European Patent Office
Prior art keywords
cooling
cooling element
cast part
cast
cooling body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Not-in-force
Application number
EP10002907.3A
Other languages
German (de)
English (en)
Other versions
EP2275738A2 (fr
EP2275738B1 (fr
EP2275738A3 (fr
Inventor
Matthias Brendle
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Marelli Automotive Lighting Reutlingen Germany GmbH
Original Assignee
Automotive Lighting Reutlingen GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=42752280&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=EP2275738(B2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Automotive Lighting Reutlingen GmbH filed Critical Automotive Lighting Reutlingen GmbH
Publication of EP2275738A2 publication Critical patent/EP2275738A2/fr
Publication of EP2275738A3 publication Critical patent/EP2275738A3/fr
Publication of EP2275738B1 publication Critical patent/EP2275738B1/fr
Application granted granted Critical
Publication of EP2275738B2 publication Critical patent/EP2275738B2/fr
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141—Light emitting diodes [LED]
    • F21S41/151—Light emitting diodes [LED] arranged in one or more lines
    • F21S41/153—Light emitting diodes [LED] arranged in one or more lines arranged in a matrix
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/75—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with fins or blades having different shapes, thicknesses or spacing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/80—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with pins or wires
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the invention relates to a cooling element for a semiconductor light source of a lighting device of a motor vehicle according to the preamble of claim 1, as from the document DE 102 51 955 A1 known. Moreover, the invention relates to a method for producing such a cooling element according to the preamble of the independent method claim.
  • LED Light Emitting Diode
  • LEDs Unlike halogen or gas discharge lamps, LEDs emit cold light. The radiation itself thus contains no heat radiation components which would be comparable to the corresponding proportions of a halogen lamp or gas discharge lamp. Nevertheless, even when operating LEDs, losses of about 80% occur. This means that 80% of the electrical energy used for operation is released as heat loss and the LED heat up. This is problematic because important properties of LEDs such as their luminous flux, color, forward voltage and lifetime are highly temperature dependent. The temperature of the semiconductor light sources must therefore be within narrow, fixed limits by a predetermined thermal operating point. In particular, the LEDs must be protected against overheating.
  • the maximum permissible chip temperature is between 125 ° C and 185 ° C. Exceeding the respective maximum temperature results in destruction of the LED. Since only about 20% of the electrical energy used is converted into light, headlamp heat losses occur, which can reach values between 20 watts and 40 watts.
  • cooling concepts are applied, which provide in particular large aluminum or copper cooling elements of the type mentioned above, to absorb the heat loss through the flange and serving as a heat sink To submit ribs and / or other surface-enlarging structures to the environment.
  • heat sink mainly aluminum heat sinks are used, which are manufactured either by the die casting, continuous casting or extrusion process.
  • heat sinks produced using the die-casting process enable particularly complex shapes.
  • functional elements and functional surfaces can be easily integrated, as fastening and centering can be easily molded with.
  • the object of the invention is to specify a cooling element of the type mentioned above, which combines the advantages of the die casting process - great freedom in shaping - with the advantages of extruded or continuously cast heat sinks - namely, low thermal resistances.
  • the object of the invention is to specify a method for producing such a cooling element.
  • the invention is characterized in particular by the fact that the cooling element is a composite part of a casting and an inserted during casting of the casting in the mold insert, wherein the flange plate is the casting and the heat sink is the insert.
  • the casting of the flange plate achieves the important advantages of the great freedom of design in the case of the flange plate.
  • the use of the heat sink as an insert allows in particular the use of extruded or continuously cast heat sink.
  • the invention combines the advantages of lower thermal resistances of a heat sink with the advantages of a large freedom of form in the flange without having to accept disadvantageously large thermal contact resistance between flange plate and heat sink in purchasing.
  • the advantage of low thermal resistances is achieved in particular with an embodiment which is characterized by at least one heat sink made of an aluminum, copper or magnesium alloy produced by a continuous casting or extrusion process.
  • cooling element with at least one magnesium die-cast heat sink have the advantage that lower wall thicknesses and thus more filigree cooling fins can be realized than in Al diecasting.
  • the low density allows significant weight savings.
  • Heat sinks designed with stamping and bending technology have cost advantages, especially with large quantities.
  • cooling elements with particularly small wall thicknesses (and weight) can be represented.
  • a further preferred embodiment therefore provides a plurality of separate heat sinks, which are connected by the casting to a composite heat sink.
  • the casting has molded functional surfaces during casting. This reduces the manufacturing effort and at the same time improves the heat transfer through the flange plate, since thermal contact resistance, which could occur through air gaps, can be avoided.
  • the casting has a set up for thermal coupling of the semiconductor light source bearing surface as a molded functional surface.
  • the composite part has during encapsulation of the insert with embedded metallic functional parts.
  • these functional parts By embedding these functional parts in particular a dimensionally accurate and firm mechanical connection of these parts is achieved with the flange plate.
  • the heat sink has a heat sink carrier plate and a heat release side adapted to emit heat to the environment, with a surface which is enlarged by first structures (eg by pins and / or ribs) and a heat absorption side arranged for insertion into a casting mold of the casting wherein the heat receiving side of the heat sink has second surface enlarging structures embedded in the casting.
  • first structures eg by pins and / or ribs
  • second surface enlarging structures embedded in the casting embedded in the casting.
  • ribs in particular dovetail-shaped profiled ribs, and / or pins and / or openings and / or outbreaks in the heat sink carrier plate are preferred, wherein the heat sink carrier plate on the set up for insertion into the mold of the casting Heat absorption side is arranged.
  • the shows Fig. 1 a perspective view of a conventional die-cast cooling element 10 with cooling fins 12 and a flange plate 14.
  • the flange plate 14 has integrally formed fastening elements such as attachment eyes 16 and screw domes 18 and centering elements such as centering pins 20, 22 and a mounted semiconductor light source 24.
  • the elements 16, 18, 20, 22, 24 are arranged on a functional surface 26.
  • the semiconductor light source is an arrangement 28 of an LED or a plurality of LEDs, which is mounted on a base element 30 and is mechanically and thermally connected to the flange plate 14 of the cooling element 10 via the base element 30.
  • the molded-on cooling fins 12 which represent the heat sink of the known cooling element 10, inevitably made relatively coarse. In the presentation of the FIG. 1 this is expressed by the comparatively rough design of each individual cooling rib 12 and the comparatively small number of eight cooling ribs 12 given given dimensions of the cooling element 10.
  • FIG. 2 shows an embodiment of a cooling element 32 according to the invention in a plan view of a functional surface 26.
  • the cooling element 32 not different from the known cooling element 10 and therefore has in particular those already in connection with the FIG. 1 explained functional surface 26 with molded fasteners in the form of screw-on eyes 16 and screw domes 18 and centering in the form of centering pins 20, 22 and a mounted with a base member 30 to the functional surface 26 semiconductor light source 24 with an LED array 28.
  • the base element 30 is centered by the centering pins 22 in a predetermined position on the functional surface 26 and fixed by fastening elements 34, for example by screws or by integrally formed on the functional surface 26 rivet pins on the flange plate 14.
  • the centering pins 20 and the fastening elements 16, 18 serve for centering and mounting the cooling element 32 in a lighting device (not shown) for a motor vehicle and / or for mounting an optical element (not shown) and / or a shutter arrangement.
  • the illumination device is a headlight or a light module of a headlight.
  • the optical element is a reflector arranged for focusing the light of the LED array 28 or a lens arranged for this purpose.
  • FIG. 3 shows a section along line III, III cut through the cooling element 32 of the FIG. 2
  • the cooling element 32 as an exemplary embodiment of a cooling element according to the invention a composite part of a casting 36 and an inserted during casting of the casting 36 in the mold insert 38.
  • the flange plate, the casting 36 and the heat sink, the insert 38 are both the flange as well as the casting of a cooling element 32 according to the invention designated by the reference numeral 36.
  • both the insert part and the heat sink identical to the insert part are designated by the reference numeral 38 below.
  • the insert is an extrusion or continuous casting heat sink, a magnesium die-cast heat sink, a heat sink designed as a punched-bent part or an arrangement of a plurality of such heat sink.
  • continuous casting and extrusion processes allow the use of alloys having better thermal properties than alloys suitable for die casting processes.
  • continuous casting and extrusion processes enable the production of significantly finer structures. That is, these methods allow production of heat sinks 38 with, for example, particularly high and / or thin cooling fins or cooling pins. Due to the resulting large surface can be particularly effective heat sink 38 with low thermal resistance, ie produce high thermal conductivity, at the same time compact dimensions.
  • This will be the subject of FIG. 3 by the number of cooling structures 46, which is higher by a factor of about 1.5 than the number eight of the cooling fins 12 of the conventional die-cast cooling element 10 of the FIG. 1 ,
  • magnesium diecasting In magnesium diecasting, smaller wall thicknesses and thus more filigree cooling fins can be realized than in die-cast aluminum. In addition, the low density of magnesium die-casting allows significant weight savings.
  • the disadvantage Do not allow rivet pins to be molded on magnesium die-cast parts, as magnesium die-casting can not be deformed sufficiently plastically. Even screw connections can not be realized without further ado because of the high reduction potential of magnesium (electrochemical voltage series: -2.38 volts, for comparison: aluminum: -1.66 volts). Special aluminum screws or screws with special coatings may be required.
  • Heat sinks designed with stamping and bending technology have cost advantages, especially with large quantities.
  • cooling elements with particularly low wall thicknesses and thus particularly low weight can be represented. Since the complexity of executed in stamping and bending technology heat sinks is significantly limited by the manufacturing process, in particular here offers the possibility to connect several heat sink part elements by casting with the material of the casting to form a complex composite heat sink.
  • a part of the heat sink 38 is placed in a mold or die-casting tool and encapsulated with the material of the flange plate 36.
  • the material is preferably aluminum, an aluminum alloy, a magnesium alloy, a copper alloy or an alloy having a plurality of these materials.
  • the einzug tellende heat sink 38 has in the embodiment that in the FIG. 3 a heat sink support plate 40 and a heat dissipating side 42 provided for discharging heat to the environment, and a heat receiving side 44 adapted for insertion into a mold of the casting.
  • the heat sink carrier plate 40 is preferably completely or partially cast into the casting 36.
  • the heat release side 42 has an increased surface area by first structures 46 such as pins and / or ribs to improve the heat dissipation to the environment.
  • the heat receiving side 44 of the heat sink 38 has second surface enlarging structures 48 embedded in the casting 36.
  • second surface-enlarging structures are preferably ribs, in particular dovetail-shaped profiled ribs and / or pins and / or openings (the material penetrating recesses) and / or outbreaks (reaching into the material, but not completely penetrating the material recesses) is used.
  • the second surface-enlarging structures 48 enlarge the form-fitting surface between the insert 36 and the casting 38. As a result, a firm connection without air gaps between the two components 36, 38 is achieved.
  • the resulting composite part offers great design freedom thanks to the casting process.
  • the casting process offers the possibility of embedding further metallic functional parts, for example screw and bearing bushings, centering pins and bearing bolts.
  • the good thermal properties correspond to those of the extruded or continuous casting heat sink.
  • insulating air layers between the parts can be reliably excluded.
  • the production cost is lower when casting, especially for larger quantities, as would be required for the subsequent machining of the functional surfaces on the extrusion or continuous casting heat sink.
  • the cooling element 32 with the features of the invention enables the saving of additional holding and fastening elements.
  • FIGS. 4 and 5 show embodiments of heat sinks with carrier plates in each case in perspective view. It shows FIG. 4 an embodiment in which both the first surface-enlarging structures 46 on the heat-emitting side 42 and the second surface-enlarging structures 48 on the heat receiving side 44 are pins. FIG. 5 shows an embodiment in which both surface-enlarging structures 46/48 are formed as ribs. It is understood, however, that differently shaped structures can also be used on both sides of the carrier plate 40.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Geometry (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Claims (11)

  1. Elément de refroidissement (32) pour une source de lumière semi-conductrice (24) d'un véhicule automobile comprenant un corps de refroidissement (38) conçu pour l'émission de chaleur vers l'environnement et comprenant une plaque de bride (36) conçue pour le couplage thermique de la source de lumière semi-conductrice (24) et pour la fixation de l'élément de refroidissement (32) au dispositif d'éclairage, le corps de refroidissement (38) comportant une plaque de support de corps de refroidissement (40) et un côté d'émission de chaleur (42), conçu pour l'émission de chaleur vers l'environnement, présentant une surface agrandie par des premières structures (46), et un côté d'absorption de chaleur (44), l'élément de refroidissement étant une pièce composite constituée d'une pièce coulée et d'une pièce d'insertion (38) insérée dans le moule de coulée lors de la coulée de la pièce coulée, la plaque de bride (36) étant la pièce coulée et le corps de refroidissement (38) étant la pièce d'insertion, et le côté d'absorption de chaleur (44) étant adapté pour être inséré dans un moule de coulée de la pièce coulée (36) et comprenant des deuxièmes structures (48) agrandissant la surface, lesquelles sont encastrées dans la pièce coulée (36), caractérisé en ce que le matériau de la pièce coulée est de l'aluminium, un alliage d'aluminium, un alliage de magnésium, un alliage de cuivre ou un alliage comprenant plusieurs de ces matériaux.
  2. Elément de refroidissement (32) selon la revendication 1, caractérisé par au moins un corps de refroidissement (38) fabriqué à partir d'un alliage d'aluminium, de cuivre ou de magnésium à l'aide d'un procédé de coulée continue ou d'extrusion.
  3. Elément de refroidissement (32) selon la revendication 1, caractérisé par au moins un corps de refroidissement (38) réalisé sous forme de corps de refroidissement en magnésium coulé sous pression (38) ou sous forme de pièce estampée pliée.
  4. Elément de refroidissement (32) selon l'une quelconque des revendications précédentes, caractérisé par plusieurs corps de refroidissement séparés qui sont reliés au moyen de la pièce coulée (36) pour former un corps de refroidissement composite.
  5. Elément de refroidissement (32) selon la revendication 1 ou 2, caractérisé en ce que la pièce coulée (36) présente des surfaces fonctionnelles (26) formées lors de la coulée.
  6. Elément de refroidissement (32) selon la revendication 3, caractérisé en ce que la pièce coulée (36) présente une surface d'appui sous forme de surface fonctionnelle (26) formée, conçue pour le couplage thermique de la source de lumière semi-conductrice (24).
  7. Elément de refroidissement (32), selon l'une quelconque des revendications précédentes, caractérisé en ce qu'il comprend des parties fonctionnelles métalliques encastrées lors de l'enrobage par coulée de la pièce d'insertion (38) avec le matériau de la pièce coulée (36).
  8. Elément de refroidissement (32) selon la revendication 7, caractérisé par au moins un élément de centrage et/ou au moins un élément de fixation pour la source de lumière semi-conductrice (24) et/ou pour au moins un élément optique et/ou pour la fixation de l'élément de refroidissement (32) dans le dispositif d'éclairage.
  9. Elément de refroidissement (32) selon la revendication 8, caractérisé par au moins une douille filetée et/ou au moins une douille de palier et/ou au moins une goupille de centrage (20,22) et/ou au moins un goujon fileté et/ou au moins un boulon de palier faisant office d'élément de centrage et/ou d'élément de fixation.
  10. Elément de refroidissement (32) selon la revendication 1, caractérisé en ce que les deuxièmes structures (48) agrandissant la surface sont des ailettes, en particulier des ailettes profilées en forme de queue d'aronde, et/ou des goupilles et/ou des ouvertures et/ou des creux dans la plaque de support de corps de refroidissement (40), et que la plaque de support de corps de refroidissement (40) est disposée sur le côté d'absorption de chaleur (44) conçu pour l'insertion dans le moule de coulée de la pièce coulée (36).
  11. Procédé de fabrication d'un élément de refroidissement (32) pour une source de lumière semi-conductrice (24) d'un véhicule automobile comprenant un corps de refroidissement (38) conçu pour l'émission de chaleur vers l'environnement et comprenant une plaque de bride (36) conçue pour le couplage thermique de la source de lumière semi-conductrice (24) et pour la fixation de l'élément de refroidissement (32) au dispositif d'éclairage, le corps de refroidissement (38) comportant une plaque de support de corps de refroidissement (40) et un côté d'émission de chaleur (42), conçu pour l'émission de chaleur vers l'environnement, présentant une surface agrandie par des premières structures (46), et un côté d'absorption de chaleur (44), l'élément de refroidissement étant une pièce composite constituée d'une pièce coulée et d'une pièce d'insertion (38) insérée dans le moule de coulée lors de la coulée de la pièce coulée, la plaque de bride (36) étant la pièce coulée et le corps de refroidissement (38) étant la pièce d'insertion, et le côté d'absorption de chaleur (44) étant adapté pour être inséré dans un moule de coulée de la pièce coulée (36) et comprenant des deuxièmes structures (48) agrandissant la surface, lesquelles sont encastrées dans la pièce coulée (36), caractérisé en ce que le matériau de la pièce coulée est de l'aluminium, un alliage d'aluminium, un alliage de magnésium, un alliage de cuivre ou un alliage comprenant plusieurs de ces matériaux.
EP10002907.3A 2009-07-13 2010-03-19 Elément de refroidissement pour une source d'éclairage semi-conductrice d'un dispositif d'éclairage d'un véhicule automobile Not-in-force EP2275738B2 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102009033949A DE102009033949A1 (de) 2009-07-13 2009-07-13 Kühlelement für eine Halbleiterlichtquelle einer Beleuchtungseinrichtung eines Kraftfahrzeugs

Publications (4)

Publication Number Publication Date
EP2275738A2 EP2275738A2 (fr) 2011-01-19
EP2275738A3 EP2275738A3 (fr) 2012-05-23
EP2275738B1 EP2275738B1 (fr) 2014-10-22
EP2275738B2 true EP2275738B2 (fr) 2019-06-12

Family

ID=42752280

Family Applications (1)

Application Number Title Priority Date Filing Date
EP10002907.3A Not-in-force EP2275738B2 (fr) 2009-07-13 2010-03-19 Elément de refroidissement pour une source d'éclairage semi-conductrice d'un dispositif d'éclairage d'un véhicule automobile

Country Status (2)

Country Link
EP (1) EP2275738B2 (fr)
DE (1) DE102009033949A1 (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011086193A1 (de) * 2011-11-11 2013-05-16 Osram Gmbh Leuchtdiodenmodul und verfahren zur fertigung eines leuchtdiodenmoduls
CN103162207A (zh) * 2011-12-15 2013-06-19 欧司朗股份有限公司 Led单元安装模块及其制造方法、led照明装置和汽车前照灯
FR2998034A1 (fr) * 2012-11-09 2014-05-16 Valeo Vision Module d'eclairage a carte unitaire et dissipateurs distincts
DE102014104937A1 (de) * 2014-04-08 2015-10-08 Hella Kgaa Hueck & Co. Kühlkörper zur Kühlung einer Halbleiterlichtquelle eines Scheinwerfers
CN105371119A (zh) * 2015-11-24 2016-03-02 苏州威恩斯光电科技有限公司 一种led灯具及其制作方法
AT518543B1 (de) * 2016-06-17 2017-11-15 Zkw Group Gmbh LED Systemreflektor mit Wärmekopplung
DE102018217456B4 (de) 2018-10-11 2020-07-09 Conti Temic Microelectronic Gmbh Elektronische Steuervorrichtung und Verfahren zur Herstellung einer elektronischen Steuervorrichtung
DE102018128681A1 (de) * 2018-11-15 2020-05-20 HELLA GmbH & Co. KGaA Kühlkörper
CN111570774A (zh) * 2020-05-27 2020-08-25 杭州小鲤工业设计有限公司 一种便于散热的led节能灯加工的系统

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6045240A (en) † 1996-06-27 2000-04-04 Relume Corporation LED lamp assembly with means to conduct heat away from the LEDS
US6085830A (en) † 1997-03-24 2000-07-11 Fujikura Ltd. Heat sink, and process and apparatus for manufacturing the same
US20010022414A1 (en) † 2000-01-11 2001-09-20 Mccullough Kevin A. Injection modling apparatus with bleed off pocket for overmodeling heat pipes
DE202007016052U1 (de) † 2007-11-15 2008-02-14 Hella Kgaa Hueck & Co. Scheinwerfer für Fahrzeuge
DE102007002838A1 (de) † 2006-09-08 2008-03-27 Robert Bosch Gmbh LED-Modul mit Montagemittel umfassenden Kühlkörpern
US20090016074A1 (en) † 2007-07-09 2009-01-15 Magna International Inc. Semiconductor light engine using glass light pipes
US20090086474A1 (en) † 2007-09-27 2009-04-02 Enertron, Inc. Method and Apparatus for Thermally Effective Trim for Light Fixture

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202004003793U1 (de) * 2004-03-11 2004-05-13 Hella Kg Hueck & Co. Leuchtdiodenanordnung, insbesondere zum Einbau in Fahrzeuge
JP4707189B2 (ja) * 2006-06-02 2011-06-22 株式会社小糸製作所 車輌用灯具
US20090059594A1 (en) * 2007-08-31 2009-03-05 Ming-Feng Lin Heat dissipating apparatus for automotive LED lamp
JP4992111B2 (ja) * 2007-09-20 2012-08-08 株式会社小糸製作所 車両用灯具

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6045240A (en) † 1996-06-27 2000-04-04 Relume Corporation LED lamp assembly with means to conduct heat away from the LEDS
US6085830A (en) † 1997-03-24 2000-07-11 Fujikura Ltd. Heat sink, and process and apparatus for manufacturing the same
US20010022414A1 (en) † 2000-01-11 2001-09-20 Mccullough Kevin A. Injection modling apparatus with bleed off pocket for overmodeling heat pipes
DE102007002838A1 (de) † 2006-09-08 2008-03-27 Robert Bosch Gmbh LED-Modul mit Montagemittel umfassenden Kühlkörpern
US20090016074A1 (en) † 2007-07-09 2009-01-15 Magna International Inc. Semiconductor light engine using glass light pipes
US20090086474A1 (en) † 2007-09-27 2009-04-02 Enertron, Inc. Method and Apparatus for Thermally Effective Trim for Light Fixture
DE202007016052U1 (de) † 2007-11-15 2008-02-14 Hella Kgaa Hueck & Co. Scheinwerfer für Fahrzeuge

Also Published As

Publication number Publication date
EP2275738A2 (fr) 2011-01-19
EP2275738B1 (fr) 2014-10-22
EP2275738A3 (fr) 2012-05-23
DE102009033949A1 (de) 2011-01-20

Similar Documents

Publication Publication Date Title
EP2275738B2 (fr) Elément de refroidissement pour une source d'éclairage semi-conductrice d'un dispositif d'éclairage d'un véhicule automobile
EP2478296B1 (fr) Dispositif d'éclairage et procédé pour fabriquer un corps refroidisseur du dispositif d'éclairage et le dispositif d'éclairage
EP1923627B1 (fr) Commande intégrée d'agencements de DEL
EP1995514B1 (fr) Unité d'éclairage
DE112010002251B4 (de) Lampenbaugruppe und Verfahren zur Herstellung
DE10110835B4 (de) Beleuchtungsanordnung mit einer Mehrzahl von LED-Modulen auf einer Kühlkörperoberfläche
DE102007002839A1 (de) Leuchtaggregat mit mehreren LED-Bauelementen und Verfahren zu seiner Herstellung
DE202014002809U1 (de) Beleuchtungseinrichtung
DE102012202933A1 (de) Beleuchtungseinrichtung
AT518543B1 (de) LED Systemreflektor mit Wärmekopplung
DE102012007630A1 (de) Led-Retrofit-Lampe
DE102012219398A1 (de) LED-Lampeneinheit mit Kühlkörper
EP2885573B1 (fr) Système d'éclairage comprenant un dispositif de refroidissement et un élément optique
EP2539632A1 (fr) Dissipateur thermique pour une source lumineuse
AT509626B1 (de) Modulares led beleuchtungssystem mit partieller lichtstärkenanpassung
DE102010010044B4 (de) Beleuchtungseinrichtung für ein Kraftfahrzeug
DE102006014226A1 (de) Beleuchtungseinheit für ein Fahrzeug mit zumindest zwei Lichtquellen
DE202011101257U1 (de) Leuchtdioden-Leuchtmittel
DE102010005534A1 (de) Kraftfahrzeugbeleuchtungseinrichtung mit einem Kunststoffmaterial aufweisenden Gehäuse
DE202016103680U1 (de) Mehrkomponentenreflektor für Lichtmodul eines Kraftfahrzeugscheinwerfers
EP3118518B1 (fr) Boîtier de lampe
DE102017116932B4 (de) Leuchtvorrichtung mit Linse und Verfahren zu dessen Herstellung
DE102009024614A1 (de) Beleuchtungsvorrichtung für ein Fahrzeug
DE102019124583B4 (de) Lichtmodul mit Wärmeaustauschvorrichtung mit geschlossenporigem Metallschaum
EP1898144A2 (fr) Agrégat lumineux doté de plusieurs composants DEL et son procédé de fabrication

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR

AX Request for extension of the european patent

Extension state: AL BA ME RS

PUAL Search report despatched

Free format text: ORIGINAL CODE: 0009013

AK Designated contracting states

Kind code of ref document: A3

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR

AX Request for extension of the european patent

Extension state: AL BA ME RS

RIC1 Information provided on ipc code assigned before grant

Ipc: F21S 8/12 20060101ALI20120416BHEP

Ipc: F21V 29/00 20060101AFI20120416BHEP

17P Request for examination filed

Effective date: 20120706

REG Reference to a national code

Ref country code: DE

Ref legal event code: R079

Ref document number: 502010008087

Country of ref document: DE

Free format text: PREVIOUS MAIN CLASS: F21V0029000000

Ipc: F21S0008100000

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

RIC1 Information provided on ipc code assigned before grant

Ipc: F21V 29/00 20060101ALI20140312BHEP

Ipc: F21Y 101/02 20060101ALI20140312BHEP

Ipc: F21S 8/10 20060101AFI20140312BHEP

INTG Intention to grant announced

Effective date: 20140328

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

Free format text: NOT ENGLISH

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

REG Reference to a national code

Ref country code: AT

Ref legal event code: REF

Ref document number: 692835

Country of ref document: AT

Kind code of ref document: T

Effective date: 20141115

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

Free format text: LANGUAGE OF EP DOCUMENT: GERMAN

REG Reference to a national code

Ref country code: DE

Ref legal event code: R096

Ref document number: 502010008087

Country of ref document: DE

Effective date: 20141204

REG Reference to a national code

Ref country code: NL

Ref legal event code: VDEP

Effective date: 20141022

REG Reference to a national code

Ref country code: LT

Ref legal event code: MG4D

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20141022

Ref country code: NL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20141022

Ref country code: NO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20150122

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20150222

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20141022

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20150223

Ref country code: ES

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20141022

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20150123

Ref country code: LV

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20141022

Ref country code: PL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20141022

Ref country code: SE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20141022

Ref country code: CY

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20141022

Ref country code: HR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20141022

REG Reference to a national code

Ref country code: DE

Ref legal event code: R026

Ref document number: 502010008087

Country of ref document: DE

PLBI Opposition filed

Free format text: ORIGINAL CODE: 0009260

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: EE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20141022

Ref country code: SK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20141022

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20141022

Ref country code: RO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20141022

Ref country code: CZ

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20141022

26 Opposition filed

Opponent name: VALEO VISION SAS

Effective date: 20150722

PLAX Notice of opposition and request to file observation + time limit sent

Free format text: ORIGINAL CODE: EPIDOSNOBS2

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20141022

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MC

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20141022

Ref country code: LU

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20150319

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20150319

PLAF Information modified related to communication of a notice of opposition and request to file observations + time limit

Free format text: ORIGINAL CODE: EPIDOSCOBS2

REG Reference to a national code

Ref country code: IE

Ref legal event code: MM4A

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LI

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20150331

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20150319

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20150331

Ref country code: IE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20150319

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 7

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20141022

PLBB Reply of patent proprietor to notice(s) of opposition received

Free format text: ORIGINAL CODE: EPIDOSNOBS3

PLAS Information related to reply of patent proprietor to notice(s) of opposition deleted

Free format text: ORIGINAL CODE: EPIDOSDOBS3

PLBB Reply of patent proprietor to notice(s) of opposition received

Free format text: ORIGINAL CODE: EPIDOSNOBS3

REG Reference to a national code

Ref country code: AT

Ref legal event code: MM01

Ref document number: 692835

Country of ref document: AT

Kind code of ref document: T

Effective date: 20150319

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: AT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20150319

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20141022

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 8

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SM

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20141022

Ref country code: HU

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT; INVALID AB INITIO

Effective date: 20100319

Ref country code: BG

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20141022

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20150331

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: TR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20141022

PLAY Examination report in opposition despatched + time limit

Free format text: ORIGINAL CODE: EPIDOSNORE2

REG Reference to a national code

Ref country code: DE

Ref legal event code: R079

Ref document number: 502010008087

Country of ref document: DE

Free format text: PREVIOUS MAIN CLASS: F21S0008100000

Ipc: F21S0043000000

PLBC Reply to examination report in opposition received

Free format text: ORIGINAL CODE: EPIDOSNORE3

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 9

PLAY Examination report in opposition despatched + time limit

Free format text: ORIGINAL CODE: EPIDOSNORE2

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20141022

PLBC Reply to examination report in opposition received

Free format text: ORIGINAL CODE: EPIDOSNORE3

RIC2 Information provided on ipc code assigned after grant

Ipc: F21S 8/10 20060101AFI20140312BHEP

Ipc: F21V 29/00 20150101ALI20140312BHEP

Ipc: F21Y 101/02 20000101ALI20140312BHEP

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20190219

Year of fee payment: 10

PUAH Patent maintained in amended form

Free format text: ORIGINAL CODE: 0009272

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: PATENT MAINTAINED AS AMENDED

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 20190220

Year of fee payment: 10

27A Patent maintained in amended form

Effective date: 20190612

AK Designated contracting states

Kind code of ref document: B2

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR

REG Reference to a national code

Ref country code: DE

Ref legal event code: R102

Ref document number: 502010008087

Country of ref document: DE

REG Reference to a national code

Ref country code: DE

Ref legal event code: R119

Ref document number: 502010008087

Country of ref document: DE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20200331

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20201001