EP2274749A1 - Composant électronique et procédé de fabrication correspondant - Google Patents

Composant électronique et procédé de fabrication correspondant

Info

Publication number
EP2274749A1
EP2274749A1 EP10730707A EP10730707A EP2274749A1 EP 2274749 A1 EP2274749 A1 EP 2274749A1 EP 10730707 A EP10730707 A EP 10730707A EP 10730707 A EP10730707 A EP 10730707A EP 2274749 A1 EP2274749 A1 EP 2274749A1
Authority
EP
European Patent Office
Prior art keywords
plate
electronic component
current measuring
resistance
shaped
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP10730707A
Other languages
German (de)
English (en)
Other versions
EP2274749B1 (fr
Inventor
Ullrich Hetzler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
IsabellenHuette Heusler GmbH and Co KG
Original Assignee
IsabellenHuette Heusler GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by IsabellenHuette Heusler GmbH and Co KG filed Critical IsabellenHuette Heusler GmbH and Co KG
Publication of EP2274749A1 publication Critical patent/EP2274749A1/fr
Application granted granted Critical
Publication of EP2274749B1 publication Critical patent/EP2274749B1/fr
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
    • H01M10/48—Accumulators combined with arrangements for measuring, testing or indicating the condition of cells, e.g. the level or density of the electrolyte
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/20—Modifications of basic electric elements for use in electric measuring instruments; Structural combinations of such elements with such instruments
    • G01R1/203—Resistors used for electric measuring, e.g. decade resistors standards, resistors for comparators, series resistors, shunts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/36—Arrangements for testing, measuring or monitoring the electrical condition of accumulators or electric batteries, e.g. capacity or state of charge [SoC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01087—Francium [Fr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H01L2924/143—Digital devices
    • H01L2924/1433—Application-specific integrated circuit [ASIC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing

Definitions

  • the invention relates to an electronic component, in particular a low-impedance current measuring resistor, as well as a corresponding manufacturing method.
  • EP 0 605 800 A1 discloses a low-impedance current measuring resistor which can be used, for example, in a motor vehicle electrical system in order to measure the battery current as part of a battery management.
  • the battery current to be measured is passed through the low-impedance current measuring resistor, wherein according to the known four-wire technique, the electrical voltage is measured which drops across the current measuring resistor and which corresponds to the battery current to be measured according to Ohm's law.
  • the current measuring resistor consists of two plate-shaped connecting parts made of a conductor material (for example copper) and a likewise plate-shaped resistance element made of a resistance material (for example CuMnNi), wherein the resistance element is inserted between the two connecting parts and electron beam welded to the two connecting parts.
  • a conductor material for example copper
  • a likewise plate-shaped resistance element made of a resistance material (for example CuMnNi)
  • connection contacts for such low-impedance current measuring resistors are known from the prior art, such as external solder terminals, internal solder terminals, AMP Flat connectors, press-in nuts, welded-on connection contacts, soldered strands or soldered printed circuit boards.
  • connection contacts for low-impedance current-measuring resistors are actually intended for other applications and are not optimally suited for contacting current-measuring resistors due to the high electrical currents.
  • press-fit nuts are already very close to the required assembly technique and have a minimum material consumption compared to external voltage measuring connections, such press-in nuts are expensive to manufacture and have the disadvantage that thermal stresses arising in the press-fit nut considerably increase the voltage measurement can falsify.
  • the invention is therefore based on the object to provide a current measuring resistor in which the connection contacts are optimized.
  • This object is achieved by an inventive electronic component and a corresponding manufacturing method according to the additional claims.
  • the invention includes the general technical teaching of forming a terminal contact in an electronic component (for example a low-impedance current measuring resistor) by an expression in a plate-shaped part of the component.
  • an electronic component for example a low-impedance current measuring resistor
  • Such characteristics are already known from DE 43 39 835 Al, but such characteristics have not yet been used to form electrical connection contacts, as the invention provides for the first time.
  • the electronic component according to the invention has at least one plate-shaped part (for example a connection part) in which the characteristic for the connection contact is formed.
  • the expression includes a through-hole in the plate-shaped part, i. a breakthrough from one side of the plate-shaped part on the opposite side of the plate-shaped part.
  • the expression or the through-bore in the plate-shaped part preferably has a thread in order to receive a fastening screw with which, for example, a cable lug can be screwed tightly to the connection contact.
  • the thread is preferably an internal thread, which preferably has at least 3, 4, 5 or at least 6 threads in order to securely receive the fastening screw.
  • it should be mentioned to the thread that it is preferably a metric thread as opposed to a thread for a tapping screw.
  • the expression projects from the plate-shaped section towards one side in the form of a collar. The expression can thus be produced, for example, by collar pulling according to DIN 8580.
  • the invention is not limited to the Kragen ist in terms of the forming process used to produce the expression, but also with other forming processes feasible.
  • the device has multiple (e.g., two) (voltage) terminals formed by a feature.
  • the invention is not limited to specific types of electronic components.
  • the electronic component according to the invention may be a passive, discrete, linear and / or bipolar component.
  • the device according to the invention may be suitable for surface mounting, so that it is an SMD component (SMD: Surface Mounted Device).
  • SMD Surface Mounted Device
  • the component according to the invention is preferably a resistor, in particular a fixed resistor and in particular a low-ohm current measuring resistor.
  • the current measuring resistor according to the invention preferably has two plate-shaped connecting parts made of a low-resistance conductor material (for example copper), as is known per se from the already mentioned document EP 0 605 800 A1.
  • the current measuring resistor according to the invention preferably also has a plate-shaped resistance element which is electrically connected between the two Closing parts is connected and consists of a low-resistance material (eg CuMnNi), which has a greater resistivity than the conductor material of the connecting parts.
  • the current measuring resistor according to the invention also has two connection contacts for electrical contacting (current supply) of the two plate-shaped connection parts and for measuring the voltage drop across the resistance element electrical voltage, wherein the two connection contacts for the voltage measurement are each formed by an expression in the respective plate-shaped connection part.
  • connection parts or the resistance element are planar. Rather, there is also the possibility that the plate-shaped connection parts and / or the plate-shaped resistance element are bent. All that is decisive is that the plate-shaped connection parts or the plate-shaped resistance element can be produced from a strip material, so that the connection parts and the resistance element are generally relatively thin with respect to the lateral extent and have parallel upper and lower sides ,
  • connection contacts for voltage measurement preferably also has at least two connection contacts for feeding or discharging the electrical current to be measured.
  • these connection contacts for the current to be measured can consist of circular bores in the two connection parts into which screws can be inserted.
  • connection contacts for the electric current consist of the screws already mentioned at the beginning of the prior art, as described in EP 0 605 800 A1.
  • the invention is not limited to the two examples described above with regard to the type of connection contacts for the electric current, but also includes other types of connection contacts.
  • the resistance material of the low-resistance marssele- ment may be, for example, a copper alloy, in particular a copper-manganese alloy, such as CuMn7Sn, CuMn3 or CuMnl2Ni.
  • a copper-nickel alloy such as CuNil5, CuNiIO, CuNi ⁇ , CuNi44, CuNi2 or CuNiI.
  • the resistance material is a copper-nickel-manganese alloy, such as CuNi23Mn or CuNi30Mn.
  • the resistance material may also be a nickel alloy, such as a nickel-chromium alloy, such as NiCr6015, NiCr20AISi, NiCr8020 or NiCr3020. Further, there is a possibility that the resistor material is a nickel-copper alloy such as NiCu30Fe. Another example of a possible resistance material is nickel, in particular Ni99.2,
  • the resistance material may also be a nickel-iron alloy or an iron-chromium alloy, such as Ni-Fe30 or Ni99.4Fe or FeCrIOAl (Aluchrom).
  • copper in particular so-called E copper, which is also referred to as Cu ETP.
  • the conductor material for the connection parts copper or a copper alloy is preferably used.
  • the decisive factor for use in a current-carrying resistor is the fact that the connection parts consist of a material with a greater specific conductivity than the resistance element.
  • the resistance element is inserted between the two connection parts, so that the two connection parts are connected to the opposite side edges of the resistance element.
  • This design allows a production of a so-called tri-band, which consists of an elongated band of the resistive material, which is welded on both sides with a band of the conductor material and thus consists of three welded together bands.
  • connection parts are spaced apart on the same side of the resistance element and connected to a common side edge of the resistance element.
  • This variant allows the production of a composite material tape in which only one band of the resistance material is welded to a band of the conductor material.
  • the invention is not limited to the above-described inventive component as a single part. Rather, the invention also includes a battery management module for monitoring a battery, in particular in a motor vehicle electrical system.
  • the battery management module according to the invention contains in addition to the low-resistance described above Strominesswiderstand also an electronic evaluation unit, which measures the voltage drop across the current measuring resistor between the two inventively designed voltage measuring terminals, wherein the evaluation unit is mechanically connected to the current measuring resistor.
  • the invention also generally comprises a current measuring module which, in addition to the low-impedance current measuring resistor described above, has an electronic evaluation unit which measures the voltage drop across the current measuring resistor between the two voltage measuring terminals designed according to the invention, the evaluation unit being mechanically connected to the current measuring resistor.
  • a current measuring module which, in addition to the low-impedance current measuring resistor described above, has an electronic evaluation unit which measures the voltage drop across the current measuring resistor between the two voltage measuring terminals designed according to the invention, the evaluation unit being mechanically connected to the current measuring resistor.
  • Such current measuring modules can be used in a variety of ways, for example in solar technology, drive technology or power supply technology.
  • the integrated electronic evaluation unit may be, for example, an ASIC (Application Specific Integrated Circuit), as is known, for example, from EP 1 363 131 A1, so that the content of this document also has an ASIC regarding the construction and operation this description is to be fully attributed.
  • ASIC Application Specific Integrated Circuit
  • the invention also encompasses a production method for an electronic component according to the invention. ment, in which a terminal contact is formed by an expression in the plate-shaped portion.
  • a through hole is preferably also produced in the plate-shaped section and a thread is applied to the stamping in order to receive a screw.
  • the shaping of the stamping, the insertion of the through hole and / or the application of the thread in a single operation is performed by the same machine.
  • the expression is generated by the forming process known as flow drilling, which in itself from the
  • Suitable tools for flow drilling are available, for example, from the German company Flowdrill GmbH and can be used in commercially available punching / bending machines.
  • the component according to the invention is preferably made of a composite material strip, as described in detail in EP 0 605 800 A1, so that the content of this document is fully attributable to the manufacture of the component according to the invention.
  • FIG. 1A shows a cross-sectional view of a current measuring resistor according to the invention
  • FIG. 1B shows a plan view of the current measuring resistor according to FIG.
  • FIG. 1C shows an enlarged cross-sectional view through the characteristic in the current measuring resistor according to FIGS. 1A and 1B,
  • FIG. 2A shows a plan view of a possible design of the current measuring resistor
  • FIG. 2B shows a plan view of an alternative possible design of the current measuring resistor
  • FIG. 3 shows a cross-sectional view through a battery management module with the current measuring resistor according to FIGS. 1A-1C and an ASIC with an A / D converter and an integrated signal processing
  • FIG. 4 shows a simplified circuit diagram for illustrating the use of the current measuring module according to FIG. 3 in a motor vehicle electrical system
  • FIG. 5A shows the production method according to the invention in the form of a flow chart
  • FIG. 5B shows a composite material strip and a current measuring resistor separated therefrom according to FIG. 5A
  • FIG. 6A shows a variant of the production method according to the invention in the form of a flow chart
  • FIG. 6B shows a composite material strip and a current measuring resistor separated therefrom according to FIG. 6A and FIG. 2.
  • Figures 1A-1C show a current measuring resistor 1 according to the invention, which can be used for example in a motor vehicle electrical system to measure a battery current I.
  • the current measuring resistor 1 consists essentially of two plate-shaped connecting parts 2, 3 made of copper and a likewise plate-shaped resistor element 4 made of a copper-manganese-nickel alloy (eg Manganin®), wherein the resistance element 4 between the two connecting parts 2, 3 used and with the two connection parts 2, 3 electron beam welded.
  • a copper-manganese-nickel alloy eg Manganin®
  • the current measuring resistor 1 For feeding or discharging the battery current I to be measured, the current measuring resistor 1 has two conventional
  • Connection contacts 5, 6, which in this embodiment consist of a respective circular bore in the two connection parts 2, 3.
  • the current measuring resistor 1 for voltage measurement on two connection contacts 7, 8, which are formed in a novel manner and each consist of one expression in the plate-shaped connection parts 2, 3.
  • the terminal contact 8 has a collar 9 projecting from the plate-shaped connecting part 3, which surrounds a through-hole 10, wherein the through-hole 10 forms a threaded passage with a metric internal thread 11.
  • a fastening screw 12 can be screwed to secure, for example, a cable lug 13 to the terminal contact 8.
  • a fastening screw 14 can be screwed to the terminal contact 7 in order to attach a cable lug 15 to the terminal contact 7.
  • a voltage measuring device 16 shown here only schematically measures the electrical voltage which drops between the two connection contacts 7, 8 and thus across the resistance element 4, the measured electrical voltage being proportional to the battery current I according to Ohm's law.
  • FIG. 2B shows an alternative possible design of the current measuring resistor 1, this type of construction partially matching the construction described above and illustrated in FIGS. 1A-1C, so that reference is made to the above description to avoid repetition, the same reference numerals being used for corresponding details become.
  • connection parts 2, 3 are welded to the resistance element 4 on the same side of the resistance element 4.
  • FIG. 3 shows a complete battery management module 17, which consists essentially of the current measuring resistor 1 according to FIGS. 1A-1C and an ASIC 18, the ASIC 18 being described, for example, in EP 1 363 131 A1 and dropping above the resistance element 4 of the current measuring resistor 1 - the electrical voltage measures.
  • the ASIC 18 is mechanically and electrically connected to the current measuring resistor 1 by means of a printed circuit board 19.
  • FIG. 4 shows a simplified circuit diagram for the use of the battery management module 17 according to FIG. 3 for measuring the battery current I in a motor vehicle electrical system 20 which contains a plurality of consumers and is fed by a battery 21. For simplicity, the generator used to charge the battery 21 is not shown here.
  • FIGS. 5A and 5B illustrate the production of the current measuring resistor according to the invention according to FIGS. 1A-1C.
  • a band 22 is electron beam welded on both sides, each with a band 23 or 24 made of the resistance material.
  • connection contacts 7, 8 are then pronounced in a further step S2, wherein at the same time the internal thread 11 is applied.
  • step S3 the individual current measuring resistors 1 are then separated from the composite material.
  • FIGS. 6A and 6B show the manufacturing method for producing the current measuring resistor 1 according to FIG. 2.
  • the strip 22 of the resistance material is electron beam-welded to the strip 24 made of the conductor material.
  • the resulting composite material strip thus contains only two bands which are welded together.
  • the connection contacts 7, 8 are pronounced again, at the same time again the internal thread 11 is applied.
  • intermediate pieces 25 are then cut out of the composite material strip so that only the later connecting parts 2, 3 remain standing.
  • step S4 the individual current measuring resistors 1 are separated from the composite material strip.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Chemical & Material Sciences (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Measuring Instrument Details And Bridges, And Automatic Balancing Devices (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Details Of Resistors (AREA)
EP10730707A 2009-07-01 2010-06-16 Composant électronique et procédé de fabrication correspondant Not-in-force EP2274749B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102009031408A DE102009031408A1 (de) 2009-07-01 2009-07-01 Elektronisches Bauelement und entsprechendes Herstellungsverfahren
PCT/EP2010/003621 WO2010121841A1 (fr) 2009-07-01 2010-06-16 Composant électronique et procédé de fabrication correspondant

Publications (2)

Publication Number Publication Date
EP2274749A1 true EP2274749A1 (fr) 2011-01-19
EP2274749B1 EP2274749B1 (fr) 2011-08-03

Family

ID=41335406

Family Applications (1)

Application Number Title Priority Date Filing Date
EP10730707A Not-in-force EP2274749B1 (fr) 2009-07-01 2010-06-16 Composant électronique et procédé de fabrication correspondant

Country Status (9)

Country Link
US (1) US8598976B2 (fr)
EP (1) EP2274749B1 (fr)
JP (1) JP5632467B2 (fr)
KR (1) KR20120047925A (fr)
CN (1) CN102473492B (fr)
AT (1) ATE519205T1 (fr)
DE (2) DE202009010319U1 (fr)
ES (1) ES2370773T3 (fr)
WO (1) WO2010121841A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018197504A1 (fr) * 2017-04-25 2018-11-01 Yazaki Europe Limited Résistance de puissance

Families Citing this family (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011028870A1 (fr) 2009-09-04 2011-03-10 Vishay Dale Electronics, Inc. Résistance avec compensation de coefficient thermique de résistance électrique (tcr)
DE102010035485A1 (de) 2010-08-26 2012-03-01 Isabellenhütte Heusler Gmbh & Co. Kg Strommesswiderstand
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ES2370773T3 (es) 2011-12-22
DE102009031408A1 (de) 2011-01-05
EP2274749B1 (fr) 2011-08-03
WO2010121841A1 (fr) 2010-10-28
CN102473492B (zh) 2013-11-13
JP2012531760A (ja) 2012-12-10
ATE519205T1 (de) 2011-08-15
JP5632467B2 (ja) 2014-11-26
CN102473492A (zh) 2012-05-23
US20120154104A1 (en) 2012-06-21
DE202009010319U1 (de) 2009-11-19
US8598976B2 (en) 2013-12-03

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