EP2219206A4 - Control device, exposure method, and exposure device - Google Patents
Control device, exposure method, and exposure deviceInfo
- Publication number
- EP2219206A4 EP2219206A4 EP08846902A EP08846902A EP2219206A4 EP 2219206 A4 EP2219206 A4 EP 2219206A4 EP 08846902 A EP08846902 A EP 08846902A EP 08846902 A EP08846902 A EP 08846902A EP 2219206 A4 EP2219206 A4 EP 2219206A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- exposure
- control device
- exposure method
- control
- exposure device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70191—Optical correction elements, filters or phase plates for controlling intensity, wavelength, polarisation, phase or the like
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70091—Illumination settings, i.e. intensity distribution in the pupil plane or angular distribution in the field plane; On-axis or off-axis settings, e.g. annular, dipole or quadrupole settings; Partial coherence control, i.e. sigma or numerical aperture [NA]
- G03F7/70116—Off-axis setting using a programmable means, e.g. liquid crystal display [LCD], digital micromirror device [DMD] or pupil facets
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/702—Reflective illumination, i.e. reflective optical elements other than folding mirrors, e.g. extreme ultraviolet [EUV] illumination systems
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70283—Mask effects on the imaging process
- G03F7/70291—Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70091—Illumination settings, i.e. intensity distribution in the pupil plane or angular distribution in the field plane; On-axis or off-axis settings, e.g. annular, dipole or quadrupole settings; Partial coherence control, i.e. sigma or numerical aperture [NA]
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70091—Illumination settings, i.e. intensity distribution in the pupil plane or angular distribution in the field plane; On-axis or off-axis settings, e.g. annular, dipole or quadrupole settings; Partial coherence control, i.e. sigma or numerical aperture [NA]
- G03F7/70108—Off-axis setting using a light-guiding element, e.g. diffractive optical elements [DOEs] or light guides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70141—Illumination system adjustment, e.g. adjustments during exposure or alignment during assembly of illumination system
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007289090 | 2007-11-06 | ||
PCT/JP2008/069455 WO2009060745A1 (en) | 2007-11-06 | 2008-10-27 | Control device, exposure method, and exposure device |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2219206A1 EP2219206A1 (en) | 2010-08-18 |
EP2219206A4 true EP2219206A4 (en) | 2011-04-27 |
Family
ID=40588415
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP08846902A Withdrawn EP2219206A4 (en) | 2007-11-06 | 2008-10-27 | Control device, exposure method, and exposure device |
Country Status (6)
Country | Link |
---|---|
US (5) | US8792081B2 (en) |
EP (1) | EP2219206A4 (en) |
JP (2) | JP5418230B2 (en) |
KR (1) | KR101708943B1 (en) |
TW (1) | TW200933307A (en) |
WO (1) | WO2009060745A1 (en) |
Families Citing this family (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8379187B2 (en) | 2007-10-24 | 2013-02-19 | Nikon Corporation | Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method |
KR101708943B1 (en) * | 2007-11-06 | 2017-02-21 | 가부시키가이샤 니콘 | Control device, exposure method, and exposure device |
US8115904B2 (en) * | 2008-05-30 | 2012-02-14 | Corning Incorporated | Illumination system for sizing focused spots of a patterning system for maskless lithography |
WO2010024106A1 (en) * | 2008-08-28 | 2010-03-04 | 株式会社ニコン | Illumination optical system, aligner, and process for fabricating device |
EP2317386B1 (en) * | 2008-12-23 | 2012-07-11 | Carl Zeiss SMT GmbH | Illumination system of a microlithographic projection exposure apparatus |
KR101057191B1 (en) * | 2008-12-30 | 2011-08-16 | 주식회사 하이닉스반도체 | Method of forming fine pattern of semiconductor device |
JP5330205B2 (en) * | 2009-11-26 | 2013-10-30 | 株式会社東芝 | Exposure method |
JP5532213B2 (en) * | 2009-12-07 | 2014-06-25 | 株式会社ニコン | Illumination optical system, exposure apparatus, and device manufacturing method |
KR102046286B1 (en) | 2010-02-03 | 2019-11-18 | 가부시키가이샤 니콘 | Illumination optical device, illumination method, and exposure method and device |
KR102117986B1 (en) | 2010-09-27 | 2020-06-02 | 가부시키가이샤 니콘 | Method for driving spatial light modulator, method for forming pattern for exposure, exposure method, and exposure apparatus |
NL2007477A (en) | 2010-10-22 | 2012-04-24 | Asml Netherlands Bv | Method of optimizing a lithographic process, device manufacturing method, lithographic apparatus, computer program product and simulation apparatus. |
JP5880443B2 (en) * | 2010-12-13 | 2016-03-09 | 株式会社ニコン | Exposure method, exposure apparatus, and device manufacturing method |
NL2008009A (en) * | 2011-02-02 | 2012-08-06 | Asml Netherlands Bv | Illumination system, lithographic apparatus and method. |
JP5807761B2 (en) * | 2011-06-06 | 2015-11-10 | 株式会社ニコン | Illumination method, illumination optical apparatus, and exposure apparatus |
TWI519816B (en) * | 2011-06-13 | 2016-02-01 | 尼康股份有限公司 | Illumination optical system, exposure apparatus, and device manufacturing method |
JP5554753B2 (en) * | 2011-06-29 | 2014-07-23 | 株式会社日立ハイテクノロジーズ | Exposure method and apparatus |
WO2013061803A1 (en) * | 2011-10-27 | 2013-05-02 | 大日本印刷株式会社 | Projection device |
US9732934B2 (en) | 2011-10-28 | 2017-08-15 | Nikon Corporation | Illumination device for optimizing polarization in an illumination pupil |
CN104170054B (en) | 2012-01-18 | 2018-11-02 | 株式会社尼康 | The driving method of spatial light modulator, the generation method of exposure pattern and exposure method and device |
US8802333B2 (en) | 2012-03-15 | 2014-08-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | Reflective lithography masks and systems and methods |
JP2014022582A (en) * | 2012-07-19 | 2014-02-03 | Hitachi Maxell Ltd | Semiconductor device manufacturing method and semiconductor device |
DE102012223217B9 (en) * | 2012-12-14 | 2014-07-10 | Carl Zeiss Smt Gmbh | Optical system of a microlithographic projection exposure apparatus |
EP2876498B1 (en) * | 2013-11-22 | 2017-05-24 | Carl Zeiss SMT GmbH | Illumination system of a microlithographic projection exposure apparatus |
US20150234295A1 (en) | 2014-02-20 | 2015-08-20 | Nikon Corporation | Dynamic patterning method that removes phase conflicts and improves pattern fidelity and cdu on a two phase-pixelated digital scanner |
JP6558528B2 (en) * | 2015-03-30 | 2019-08-14 | 株式会社ニコン | Spatial light modulator and method of using the same, modulation method, exposure method and apparatus, and device manufacturing method |
DE102015212658A1 (en) * | 2015-07-07 | 2017-01-12 | Carl Zeiss Smt Gmbh | LITHOGRAPHIC APPARATUS AND METHOD FOR OPERATING A LITHOGRAPHIC APPARATUS |
US10840103B2 (en) | 2015-11-23 | 2020-11-17 | Nikon Corporation | Forced grid method for correcting mask patterns for a pattern transfer apparatus |
JP6676941B2 (en) * | 2015-12-01 | 2020-04-08 | 株式会社ニコン | Control apparatus and control method, exposure apparatus and exposure method, device manufacturing method, data generation method, and program |
DE102015224522B4 (en) * | 2015-12-08 | 2018-06-21 | Carl Zeiss Smt Gmbh | Illumination system of a microlithographic projection system and method for operating such a system |
CN110431486B (en) | 2017-03-16 | 2022-03-15 | 株式会社尼康 | Control device and control method, exposure device and exposure method, device manufacturing method, data generation method, and computer-readable medium |
JP7260959B2 (en) * | 2018-03-16 | 2023-04-19 | キヤノン株式会社 | Lithographic apparatus, illumination apparatus and method of manufacturing an article |
CN109116685B (en) * | 2018-09-14 | 2020-11-20 | 重庆惠科金渝光电科技有限公司 | Exposure method and exposure device thereof |
JP7240162B2 (en) * | 2018-12-14 | 2023-03-15 | キヤノン株式会社 | Exposure apparatus, exposure method, and article manufacturing method |
KR20220122705A (en) | 2020-01-10 | 2022-09-02 | 가부시키가이샤 니콘 | Optical apparatus, exposure apparatus, manufacturing method of flat panel display, and device manufacturing method |
CN115039033A (en) | 2020-03-19 | 2022-09-09 | 极光先进雷射株式会社 | Exposure system and method for manufacturing electronic device |
CN116068860A (en) * | 2021-11-04 | 2023-05-05 | 邱俊荣 | Exposure apparatus and exposure method |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002353105A (en) * | 2001-05-24 | 2002-12-06 | Nikon Corp | Illumination optical apparatus, aligner provided with the same and method of manufacturing microdevice |
US20060017902A1 (en) * | 2004-07-26 | 2006-01-26 | Asml Holding N.V. | Lithographic apparatus having double telecentric illumination |
EP1865359A1 (en) * | 2006-06-07 | 2007-12-12 | ASML Netherlands B.V. | Cooled mirror array for lithography |
Family Cites Families (40)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5312513A (en) | 1992-04-03 | 1994-05-17 | Texas Instruments Incorporated | Methods of forming multiple phase light modulators |
JPH0777191B2 (en) | 1993-04-06 | 1995-08-16 | 日本電気株式会社 | Exposure light projection device |
JPH08313842A (en) | 1995-05-15 | 1996-11-29 | Nikon Corp | Lighting optical system and aligner provided with the optical system |
RU2084941C1 (en) | 1996-05-06 | 1997-07-20 | Йелстаун Корпорейшн Н.В. | Adaptive optical module |
DE19752479A1 (en) * | 1996-12-03 | 1998-06-04 | Eastman Kodak Co | Correction system for light uniformity for photographic copy printing |
US5754305A (en) * | 1996-12-03 | 1998-05-19 | Eastman Kodak Company | Method and apparatus for correcting light non-uniformity in an LCD photographic printer |
US5870205A (en) * | 1996-12-03 | 1999-02-09 | Eastman Kodak Company | Method and apparatus for correcting light non-uniformity in an LCD photographic printer |
JPH113849A (en) | 1997-06-12 | 1999-01-06 | Sony Corp | Deformable illumination filter and semiconductor aligner |
AU2747999A (en) | 1998-03-26 | 1999-10-18 | Nikon Corporation | Projection exposure method and system |
SE0100336L (en) | 2001-02-05 | 2002-08-06 | Micronic Laser Systems Ab | Addressing method and apparatus using the same technical area |
US7015491B2 (en) * | 2001-06-01 | 2006-03-21 | Asml Netherlands B.V. | Lithographic apparatus, device manufacturing method and device manufactured thereby, control system |
EP1262836B1 (en) * | 2001-06-01 | 2018-09-12 | ASML Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JP4307813B2 (en) | 2001-11-14 | 2009-08-05 | 株式会社リコー | Optical deflection method, optical deflection apparatus, method of manufacturing the optical deflection apparatus, optical information processing apparatus, image forming apparatus, image projection display apparatus, and optical transmission apparatus including the optical deflection apparatus |
US6900915B2 (en) | 2001-11-14 | 2005-05-31 | Ricoh Company, Ltd. | Light deflecting method and apparatus efficiently using a floating mirror |
US20050095749A1 (en) | 2002-04-29 | 2005-05-05 | Mathias Krellmann | Device for protecting a chip and method for operating a chip |
WO2003093167A1 (en) | 2002-04-29 | 2003-11-13 | Fraunhofer-Gesellschaft Zur Förderung Der Angewandten Forschung | Device for protecting a chip and method for operating a chip |
WO2004019128A2 (en) | 2002-08-23 | 2004-03-04 | Nikon Corporation | Projection optical system and method for photolithography and exposure apparatus and method using same |
TWI281099B (en) * | 2002-12-02 | 2007-05-11 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
US6891655B2 (en) | 2003-01-02 | 2005-05-10 | Micronic Laser Systems Ab | High energy, low energy density, radiation-resistant optics used with micro-electromechanical devices |
US6870554B2 (en) * | 2003-01-07 | 2005-03-22 | Anvik Corporation | Maskless lithography with multiplexed spatial light modulators |
EP1620350A1 (en) | 2003-04-24 | 2006-02-01 | Metconnex Canada Inc. | A micro-electro-mechanical-system two dimensional mirror with articulated suspension structures for high fill factor arrays |
US7095546B2 (en) | 2003-04-24 | 2006-08-22 | Metconnex Canada Inc. | Micro-electro-mechanical-system two dimensional mirror with articulated suspension structures for high fill factor arrays |
JP4717813B2 (en) * | 2003-09-12 | 2011-07-06 | カール・ツァイス・エスエムティー・ゲーエムベーハー | Illumination system for microlithographic projection exposure equipment |
US7116403B2 (en) * | 2004-06-28 | 2006-10-03 | Asml Netherlands B.V | Lithographic apparatus and device manufacturing method |
JP4335114B2 (en) | 2004-10-18 | 2009-09-30 | 日本碍子株式会社 | Micromirror device |
US20060138349A1 (en) * | 2004-12-27 | 2006-06-29 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JPWO2006085626A1 (en) * | 2005-02-14 | 2008-06-26 | 株式会社ニコン | Exposure method and apparatus, and device manufacturing method |
JP2008533728A (en) | 2005-03-15 | 2008-08-21 | カール・ツァイス・エスエムティー・アーゲー | Projection exposure method and projection exposure system therefor |
US7548302B2 (en) * | 2005-03-29 | 2009-06-16 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7317506B2 (en) * | 2005-03-29 | 2008-01-08 | Asml Netherlands B.V. | Variable illumination source |
US7400382B2 (en) * | 2005-04-28 | 2008-07-15 | Asml Holding N.V. | Light patterning device using tilting mirrors in a superpixel form |
JP2007289090A (en) | 2006-04-26 | 2007-11-08 | Sunnyhealth Co Ltd | Fat substitute, animal meat or fish meat processed food, method for improving palate feeling of the processed food, and production method for the processed product |
US7617721B2 (en) * | 2006-10-02 | 2009-11-17 | 3Rd Millennium Solutions, Ltd. | Apparatus and methods for determining a predicted vehicle braking operation |
US7804603B2 (en) * | 2006-10-03 | 2010-09-28 | Asml Netherlands B.V. | Measurement apparatus and method |
WO2008061681A2 (en) | 2006-11-21 | 2008-05-29 | Carl Zeiss Smt Ag | Illumination lens system for projection microlithography, and measuring and monitoring method for such an illumination lens system |
US8937706B2 (en) * | 2007-03-30 | 2015-01-20 | Asml Netherlands B.V. | Lithographic apparatus and method |
US20080259304A1 (en) * | 2007-04-20 | 2008-10-23 | Asml Netherlands B.V. | Lithographic apparatus and method |
CN101669071B (en) | 2007-04-25 | 2012-03-21 | 卡尔蔡司Smt有限责任公司 | Illumination system for illuminating a mask in a microlithographic exposure apparatus |
KR101708943B1 (en) * | 2007-11-06 | 2017-02-21 | 가부시키가이샤 니콘 | Control device, exposure method, and exposure device |
JP5862895B2 (en) * | 2010-09-22 | 2016-02-16 | 株式会社ニコン | Spatial light modulator, exposure apparatus, and device manufacturing method |
-
2008
- 2008-10-27 KR KR1020107012422A patent/KR101708943B1/en active IP Right Grant
- 2008-10-27 JP JP2009540019A patent/JP5418230B2/en active Active
- 2008-10-27 EP EP08846902A patent/EP2219206A4/en not_active Withdrawn
- 2008-10-27 WO PCT/JP2008/069455 patent/WO2009060745A1/en active Application Filing
- 2008-10-29 TW TW097141604A patent/TW200933307A/en unknown
- 2008-11-06 US US12/266,367 patent/US8792081B2/en active Active
-
2013
- 2013-11-19 JP JP2013238858A patent/JP5673785B2/en active Active
-
2014
- 2014-06-30 US US14/320,075 patent/US9268235B2/en active Active
-
2016
- 2016-01-08 US US14/991,667 patent/US9551942B2/en active Active
- 2016-12-09 US US15/374,484 patent/US9946162B2/en active Active
-
2018
- 2018-03-14 US US15/920,834 patent/US10261421B2/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002353105A (en) * | 2001-05-24 | 2002-12-06 | Nikon Corp | Illumination optical apparatus, aligner provided with the same and method of manufacturing microdevice |
US20060017902A1 (en) * | 2004-07-26 | 2006-01-26 | Asml Holding N.V. | Lithographic apparatus having double telecentric illumination |
EP1865359A1 (en) * | 2006-06-07 | 2007-12-12 | ASML Netherlands B.V. | Cooled mirror array for lithography |
Non-Patent Citations (1)
Title |
---|
See also references of WO2009060745A1 * |
Also Published As
Publication number | Publication date |
---|---|
JP5418230B2 (en) | 2014-02-19 |
US10261421B2 (en) | 2019-04-16 |
US20170090300A1 (en) | 2017-03-30 |
US8792081B2 (en) | 2014-07-29 |
EP2219206A1 (en) | 2010-08-18 |
US20090117494A1 (en) | 2009-05-07 |
WO2009060745A1 (en) | 2009-05-14 |
US20160124314A1 (en) | 2016-05-05 |
KR20100103498A (en) | 2010-09-27 |
US20180203363A1 (en) | 2018-07-19 |
US20140313501A1 (en) | 2014-10-23 |
KR101708943B1 (en) | 2017-02-21 |
JP2014042073A (en) | 2014-03-06 |
TW200933307A (en) | 2009-08-01 |
US9551942B2 (en) | 2017-01-24 |
US9946162B2 (en) | 2018-04-17 |
US9268235B2 (en) | 2016-02-23 |
JPWO2009060745A1 (en) | 2011-03-24 |
JP5673785B2 (en) | 2015-02-18 |
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