EP2205955A2 - Dispositif de mesure de pression - Google Patents

Dispositif de mesure de pression

Info

Publication number
EP2205955A2
EP2205955A2 EP08846746A EP08846746A EP2205955A2 EP 2205955 A2 EP2205955 A2 EP 2205955A2 EP 08846746 A EP08846746 A EP 08846746A EP 08846746 A EP08846746 A EP 08846746A EP 2205955 A2 EP2205955 A2 EP 2205955A2
Authority
EP
European Patent Office
Prior art keywords
intermediate piece
base
pressure
silicon
measuring device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP08846746A
Other languages
German (de)
English (en)
Inventor
Igor Getman
Dieter Stolze
Anh Tuan Tham
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Endress and Hauser SE and Co KG
Original Assignee
Endress and Hauser SE and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Endress and Hauser SE and Co KG filed Critical Endress and Hauser SE and Co KG
Publication of EP2205955A2 publication Critical patent/EP2205955A2/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/147—Details about the mounting of the sensor to support or covering means

Definitions

  • the invention relates to a pressure-measuring device with a mounted on a base semiconductor pressure sensor.
  • Pressure measuring devices are used to detect pressures, in particular of absolute pressures, relative pressures and differential pressures, and are used in industrial measurement technology.
  • Semiconductor pressure sensors used. Semiconductor sensors are now regularly silicon-based, e.g. manufactured using silicon-on-insulator (SOI) technology. They are designed as a pressure sensor chip, which typically has a carrier and a measuring diaphragm arranged on a carrier. In measuring mode, a first pressure is supplied to a first side of the measuring diaphragm.
  • SOI silicon-on-insulator
  • a second pressure is supplied for detecting differential pressures of the first side opposite the second side of the measuring diaphragm.
  • the existing pressure difference between the first and the second pressure causes a dependent of the differential pressure to be measured deflection of the measuring diaphragm.
  • Measuring membrane a reference pressure, e.g. an ambient pressure supplied.
  • the existing pressure difference between the first pressure and the reference pressure causes a dependent of the relative pressure to be measured deflection of the measuring diaphragm.
  • a closed evacuated chamber is regularly provided under the measuring diaphragm on the side remote from the first side second side.
  • the first pressure acting on the first side of the measuring diaphragm causes a deflection of the measuring diaphragm which is dependent on the absolute pressure to be measured.
  • the resulting deflection of the measuring diaphragm is detected in all three cases via arranged on the diaphragm sensor elements, such as piezoresistive resistors, and converted into an electrical output signal that then further processing and / or Evaluation is available.
  • the diaphragm sensor elements such as piezoresistive resistors
  • the semiconductor pressure sensors are very sensitive and are therefore used in a housing, via which the supply of the respective pressures, the output of the measurement result and the mounting of the pressure-measuring device takes place at the measuring location.
  • the semiconductor pressure sensor is mounted, for example, on a socket located in the housing such that a side facing away from the base first side of the measuring membrane has a first measuring chamber located in the housing, which is fed to the first pressure.
  • the second pressure or the reference pressure of the second side of the measuring diaphragm is additionally supplied via a bore extending in the interior of the base, which opens into a second measuring chamber enclosed by the measuring diaphragm carrier below the measuring diaphragm.
  • the chamber located under the measuring diaphragm is closed and evacuated.
  • the supply of the first and the second pressure takes place for example via integrated into the housing or upstream of this filled with a pressure-transmitting liquid diaphragm seal.
  • the reference pressure is supplied, for example, via a reference pressure supply integrated in the housing.
  • the base is, for example, a cylindrical extension piece or a pedestal, which is formed as an integral part of the housing or as a separate component fixed in the housing.
  • housing and base made of a mechanically stable material, esp. Of metal.
  • Socket and semiconductor pressure sensor thus necessarily consist of different materials that have very different physical properties, esp. Different thermal expansion coefficients. Due to the mechanical connection between the base and the semiconductor pressure sensor therefore mechanical stresses can occur, which affect the transmission behavior of the measuring membrane, and thus the achievable measurement accuracy and their reproducibility deteriorate. This applies esp. For temperature-dependent voltages.
  • an intermediate piece which consists of the same material as the semiconductor pressure sensor, is usually inserted between the base and the semiconductor pressure sensor.
  • an intermediate piece which consists of the same material as the semiconductor pressure sensor.
  • Such a measuring device comprises a semiconductor pressure sensor 1 with a measuring diaphragm 5 carried by a carrier 3.
  • the carrier 3 is mounted on an intermediate piece 7 which is arranged on a metallic base 9.
  • a bore is provided which leads through the base 9 and the intermediate piece 7 into a measuring chamber enclosed below the measuring diaphragm 5.
  • the intermediate piece 7 is circular disk-shaped and has a matched to the outer diameter of the semiconductor pressure sensor 1 outer diameter.
  • the base 9 is hollow cylindrical and has a much smaller outer diameter.
  • annular circumferential groove 11 is provided, which is directly adjacent to the base 9.
  • the groove 11 serves to absorb mechanical stresses caused by the connection between the base 9 and the intermediate piece 7 and to avoid their reaction to the measuring membrane 5.
  • this measuring device has the disadvantage that the mechanical stability of the measuring device is limited by the adhesive strength of the connection between the base 9 and the intermediate piece 7. Insb. This is limited in differential pressure measuring devices, the maximum pressure that can be fed through the base of the measuring diaphragm.
  • this connection must ensure that the semiconductor pressure sensor remains on the base even if an overpressure is supplied via the base.
  • the thickness of the intermediate piece could be increased and / or the depth of the groove can be increased.
  • a deeper groove leads to a reduced breakage.
  • the increase in the thickness of the intermediate piece in turn leads to an increase in the production costs, esp. When the intermediate piece is made of silicon.
  • the invention in a pressure-measuring device, with
  • the second cylindrical portion has a base facing the resting on an exposed end face of the base end face having a
  • Connecting surface forms over which the intermediate piece with the base is mechanically firmly connected.
  • Pressure measuring device for detecting differential pressures
  • Pressure measuring device for recording absolute pressures. It has one of the measuring diaphragm, its carrier and the Intermediate completely closed evacuated chamber on.
  • a parallel to the longitudinal axis extending base side opening blind hole is provided in the intermediate piece.
  • the semiconductor pressure sensor is a silicon-based sensor.
  • the intermediate piece is made of silicon, and the base is made of metal or ceramic. According to a further embodiment, the intermediate piece and the
  • the invention consists in a method for producing a pressure-measuring device according to the invention, in which the
  • Silicon wafer is produced in the
  • the first and the second silicon wafer are placed flush on one another and joined together by bonding,
  • this area has an outer diameter, the same
  • Outer diameter of the recess is, and has an inner diameter which is equal to the outer diameter of the first cylindrical
  • Section of the intermediate piece is,
  • a third silicon wafer is placed flush on the second silicon wafer and bonded thereto by bonding
  • this area has an outer diameter, the same
  • Outer diameter of the recess is, and an inner diameter which is equal to the outer diameter of the second cylindrical portion of the intermediate piece, and
  • the semiconductor pressure sensor is mounted on a side remote from the second silicon layer side of the first silicon layer.
  • the first and / or the second silicon wafer on one or both outer surfaces of an oxide layer, and the first and the second silicon wafer are connected to each other by high-temperature wafer bonding, wherein at least one of the oxide layers between the first and second silicon wafer is located.
  • the second and / or third silicon wafers have an oxide layer on one or both outer surfaces, and the second and third silicon wafers are bonded together by high temperature wafer bonding with at least one of the oxide layers between the second and third silicon wafers.
  • the attachment of the semiconductor pressure sensor is such that
  • Low-temperature silicon direct bonding is attached to the polished surface.
  • the intermediate piece is glued to the base by means of an epoxy resin adhesive.
  • the inventive design of the recess ensures a reliable mechanical decoupling of the measuring diaphragm. Esp. the effects of mechanical stresses caused by the connection between the base and the intermediate piece to the measurement properties of the measuring membrane are largely avoided.
  • a significant advantage of the pressure-measuring device is that it ensures a high mechanical stability. Due to the subdivision of the recess according to the invention in the intermediate piece into a recess enclosing the thin first cylindrical portion and a groove adjacent thereto on the base side surrounding the thicker second cylindrical portion, there is a large connection surface for the mechanical attachment of the intermediate piece to the base on the base side. At the same time there is a reliable decoupling of the measuring membrane by the socket-side opening of the recess and the comparatively thin first cylindrical portion. Mechanical stresses caused by the connection between the base and the intermediate piece have virtually no effect on the transmission behavior and the measuring properties of the measuring diaphragm. Accordingly, the achievable measurement accuracy is ensured with a high long-term stability and high reproducibility.
  • Fig. 1 shows a section through a known from the prior art pressure measuring device
  • FIG. 2 shows a section through a pressure measuring device according to the invention for detecting relative or differential pressures
  • FIG. 3 shows a double-sided oxidized silicon wafer used for producing the pressure measuring device according to the invention with a central bore;
  • FIG. Fig. 4 shows a first and a second silicon wafer connected thereto;
  • Fig. 5 shows the composite shown in Fig. 4, in which a recess has been etched in the second silicon wafer;
  • Fig. 6 shows the composite of Fig. 5 with a third silicon wafer applied thereto;
  • Fig. 7 shows the composite of Fig. 6 with a groove etched in the third silicon wafer
  • Fig. 8 shows the composite of Fig. 7 with the outer two oxide layers removed
  • Fig. 9 shows the intermediate piece of the pressure-measuring device shown in Figure 2 with the mounted thereon semiconductor pressure sensor.
  • FIG. 10 shows a pressure measuring device according to the invention for detecting absolute pressures
  • Fig. 11 shows the intermediate piece of the pressure measuring device of Fig. 10 together with the semiconductor pressure sensor mounted thereon.
  • Fig. 2 shows a section through a first embodiment of a pressure-measuring device according to the invention.
  • the variant of the invention shown here is suitable for the detection of differential pressures as well as for the detection of relative pressures. It comprises a metallic base 13, an intermediate piece 15 made of a semiconductor arranged on the base 13 and connected to the base 13, and a semiconductor pressure sensor 17 arranged on the intermediate piece 15 and connected to the intermediate piece 15.
  • the intermediate piece 15 is preferably made of the same material which is also used for the production of the semiconductor pressure sensor 17, esp. Of silicon.
  • the base 13 is made of metal or ceramic, for example, and serves to mount the semiconductor pressure sensor 17 in a housing 18 which is only partially shown.
  • the base 13 is, for example, a cylindrical extension piece or a pedestal, which may be formed as an integral part of the housing 18 or as a separate component fixed in the housing 18.
  • the semiconductor pressure sensor 17 is a silicon-based pressure sensor chip, and has a carrier 19 and a measuring diaphragm 21 carried by the carrier 19.
  • the carrier 19 has an annular disc-shaped end face, which rests on a similar outer edge of the intermediate piece 15 and is firmly connected thereto.
  • a second pressure p2 is supplied to the opposite second side of the measuring diaphragm 21.
  • the first pressure p1 corresponds to the pressure to be measured and the second pressure p2 corresponds to the reference pressure to which the pressure to be measured is related.
  • the first and the second pressure p1, p2 the two pressures whose pressure difference is to be measured.
  • the output signal is then available via connecting lines 25 connected to the sensor elements 21 for further processing and / or evaluation.
  • the first pressure p1 is supplied to the first side of the measuring diaphragm 21 from the outside. This can be done in many ways.
  • the semiconductor pressure sensor 17 is mounted on the base 13 located in the housing 18 such that the side facing away from the base 13 first side of the measuring diaphragm 21 in a housing 18 located in the interior 27, to which the first pressure p1 is supplied.
  • the second pressure p2 is supplied to the second side of the measuring diaphragm 21 via a pressure feed line 28 which passes through the base 13 and the intermediate piece 15 and in a pressure measuring chamber 31 enclosed by the carrier 19 and the intermediate piece 15 and enclosed under the measuring diaphragm 21 empties.
  • the pressure supply line 28 is through a bore 29 in the intermediate piece 15 and a thereto subsequent further bore 30 formed in the base 13.
  • the bore 29 is arranged centrally in the intermediate piece 15. It runs parallel to its longitudinal axis L and opens on the base side.
  • the bore 29 passes through the intermediate piece 15 and opens into the enclosed under the measuring diaphragm 21 of the support 19 and the intermediate piece 15 completed pressure measuring chamber 31.
  • the further bore 30 passes through the base 13 therethrough.
  • the intermediate piece 15 has an inside of the base 13, runs parallel to its longitudinal axis L, and opens into the bore 29 in the intermediate piece 15. Both holes 29, 30 extend along the longitudinal axis L of the respective component, which coincides with the longitudinal axis L of the measuring device and preferably through the middle of the measuring membrane 21 leads.
  • the intermediate piece 15 has an inside of the
  • FIG. 8 shows the intermediate piece 15 of the embodiment shown in Fig. 2 in detail.
  • the recess 33 is formed in such a way that a first cylindrical section 35 of the intermediate piece 15 and a second cylindrical section 37 adjoining the base side thereof are formed in the interior of the recess 33.
  • the second cylindrical portion 37 has a larger outer diameter than the first cylindrical portion 35.
  • the recess 33 surrounds the thinner first cylindrical portion 35 and the base side adjacent thereto thicker second cylindrical portion 37.
  • the recess 33 consists of a bore 29 concentrically surrounding Cylindrical groove 39 adjacent to the side facing away from the base 13 side a hollow cylindrical recess 41, whose outer diameter is equal to the outer diameter of the groove 39, and whose inner diameter is smaller than the inner diameter of the groove 39. Accordingly, the outer diameter of the first portion 35 exposed through the recess 33 is smaller than the outer diameter of the second cylindrical portion 37 exposed through the recess 33.
  • the second portion 37 has a the base 13 facing circular disc-shaped resting on an exposed identical end face of the base 13 end face 43, which forms a connection surface via which the intermediate piece 15 is mechanically fixedly connected to the base 13.
  • the connection is preferably made by gluing or soldering.
  • the outer diameter of the base 13 is preferably equal to the outer diameter of the second portion 37, so that the recess 33 is opened via the base-side mouth of the groove 39 down. Through the recess 33, an outer socket-free section 40 is separated from the first and second sections 35, 37.
  • the inventive shape of the recess 33 ensures that the outer diameter of the socket-side second portion 37 can be dimensioned independently of the outer diameter of the first portion 35.
  • the thinner first portion 35 together with the socket-side opening of the recess 33 causes a reliable decoupling of the measuring diaphragm 21 caused by the mechanical connection of the intermediate piece 15 with the base 13 mechanical stresses.
  • the outer diameter of the first portion 35 is smaller than the outer diameter of the measuring diaphragm 21.
  • the larger outer diameter of the second portion 37 ensures that a large connection surface for the mechanical connection between the base 13 and the intermediate piece 15 is available.
  • the production of the pressure measuring devices according to the invention is preferably carried out using processes used in MEMS technology.
  • the production method according to the invention is first explained in more detail here with reference to the pressure measuring device for measuring differential or relative pressures shown in FIG. 2.
  • the central element is the production of the intermediate piece 15.
  • the intermediate piece 15 is preferably made up of three identical silicon wafers 45, 47, 49.
  • the base of the silicon wafers 45, 47, 49 is the geometry of the Semiconductor pressure sensor 17 adapted. That is, in conjunction with a semiconductor pressure sensor 17 with a rectangular base silicon wafers 45, 47, 49 are used with a rectangular base, in conjunction with a semiconductor pressure sensor 17 with a circular base corresponding to those with a circular base.
  • the silicon wafers 45, 47, 49 have, for example, a diameter or a side length of about 100 mm and a thickness of about 500 ⁇ m.
  • Silicon wafers 45, 47, 49 oxidized on both sides, so that they each have an oxide layer 51 on the two disc-shaped outer sides. However, this is not mandatory.
  • each silicon wafer 45, 47, 49 is provided with a central bore 53.
  • This condition is shown in FIG.
  • the center bores 53 can be generated mechanically. Preferably, however, they are produced by a dry chemical etching process.
  • Silicon wafer 45 and the second silicon wafer 47 flush with each other and connected to each other by bonding. This is shown in Fig. 4.
  • the alignment of the two silicon wafers 45, 47 preferably takes place via the central bores 53 of the two silicon wafers 45, 47.
  • the bonding is preferably carried out by means of wafer direct bonding at high temperature, esp. At a temperature of 1000 ° C to 1100 ° C, wherein at least one oxide layer 51 between the first and the second silicon wafer 45, 47 is located.
  • the area 55 is shown in dashed lines in FIG. 4. It has an outer diameter equal to the outer diameter of the recess 33, and has an inner diameter equal to the outer diameter of the thinner first cylindrical portion 35 of the intermediate piece 15.
  • the outer oxide layer 51 present on the side of the second silicon layer 47 facing away from the first silicon layer 45 is preferably structured by means of lithography, and the region 55 is removed by means of a dry chemical deep etching. This offers the advantage that the outer oxide layer 51 is available as a mask for the subsequent dry deep etching.
  • a further advantage is that the oxide layers 51 enclosed between the first and the second silicon layer 45, 47 form an effective etch stop due to the high etching selectivity between silicon and silicon oxide.
  • Silicon wafer 47 as shown in Fig. 6, flush mounted.
  • the third silicon wafer 49 is then located on the side facing away from the first silicon wafer 45 side of the second silicon slide 47.
  • the alignment (alignment) of the third silicon wafer 49 with respect to the composite of the two other silicon wafers 45, 47 preferably takes place via the central bores 53 of the silicon wafers 45, 47, 49.
  • the third silicon wafer 49 will now be connected to the second silicon wafer 47 by bonding.
  • the bond is also here preferably by means of wafer direct bonding at high temperature, esp. At a temperature of 1000 ° C to 1100 ° C, wherein at least oxide layer 51 between the second and the third silicon wafer 47, 49 is located.
  • the total thickness of the wafer composite formed in this way is now about 1.5 mm, for example.
  • the area 57 is shown in dashed lines in FIG. It has an outer diameter which is the same as the outer diameter of the recess 33, and has an inner diameter equal to the outer diameter of the second cylindrical portion 37 is.
  • the outer oxide layer 51 present on the side of the third silicon layer 49 facing away from the second silicon layer 47 is preferably structured by means of lithography, and the region 57 is removed by means of a dry chemical deep etching. This offers the advantage that the outer oxide layer 51 is available as a mask for the subsequent dry deep etching.
  • the bore 29 is formed by the in the final state adjacent center bores 53 of the silicon wafers 45, 47, 49.
  • the diameter of the bore 29 is preferably at least 0.8 mm, and the wall thicknesses of the first and second cylindrical sections 35, 37 surrounding the bore 29 are preferably at least 2 mm.
  • the semiconductor differential pressure sensor 17 is mounted on a side remote from the second silicon layer 47 side of the first silicon layer 45.
  • a bonding method is preferably used. The choice of the method is dependent on the temperature resistance of the semiconductor pressure sensor 17.
  • the connection is preferably carried out by means of low-temperature silicon direct bonding.
  • the oxide layer 51 located on the side of the first silicon layer 45 facing away from the second silicon layer 47 is removed, and the side of the first silicon layer 45 facing away from the second silicon layer 47 is chemically polished. This is preferably done by means of a successive isotropic wet or dry chemical etching.
  • the semiconductor pressure sensor 17 is fixed on the polished surface by means of low-temperature silicon direct bonding at temperatures below 400 ° C.
  • the connection is preferably effected by means of high-temperature wafer bonding, in which case the oxide layer is on the side of the first silicon wafer 45 facing the semiconductor pressure sensor 17 51 is provided.
  • the bonding can be done for example by means of an epoxy resin adhesive.
  • the oxide layer 51 optionally located on the side of the third silicon layer 47 facing away from the second silicon layer 47 is removed, and the intermediate piece 15 is adhesively bonded to the base 13 with epoxy resin.
  • the oxide layer 51 can be removed, for example, by means of an etching process. In this case, an etching process is preferably selected which produces a rough surface, since epoxy resin adhesive adheres better to rough surfaces.
  • the bond can also be done by means of a silicone rubber.
  • the oxide layer 51 optionally located on the side of the third silicon layer 49 remote from the second silicon layer 47 is removed, and the side of the third silicon layer 49 remote from the second silicon layer 47 is chemically polished. Both processes are preferably carried out in a single operation by means of a successive wet or dry chemical isotropic etching. Finally, the intermediate piece 15 is glued to the base 13 with silicone rubber.
  • Silicone rubber is preferably used for pressure gauges to detect pressures less than 100 mbar.
  • epoxy resin adhesive can also be used for higher pressure measuring ranges.
  • oxide layers 51 to be removed are now provided on both outer sides of the composite shown in FIG. 7, it is advisable to make the removal of both oxide layers 51 in one operation before the semiconductor pressure sensor 17 is applied. The result is shown in FIG.
  • the invention is not limited to pressure measuring devices for detecting differential pressures or relative pressures. It can also be used analogously in pressure measuring devices for detecting absolute pressures. 10 shows an exemplary embodiment of a pressure measuring device according to the invention for detecting absolute pressures. Due to the great agreement with the embodiment described above, only the existing differences will be explained in more detail below.
  • the pressure measuring device shown in Fig. 10 for detecting absolute pressures comprises a base 13 ', an arranged on the base 13' with the base 13 'connected intermediate piece 15' of a semiconductor, and arranged on the intermediate piece 15 'with the Intermediate piece 15 'connected semiconductor pressure sensor 17 with the carrier 19 and the measuring diaphragm 21st
  • the measuring diaphragm 21 is supplied only to be measured pressure p. This is done in the same way as the supply of the pressure p1 in the previous embodiment. Accordingly, a through the base 13 'and the intermediate piece 15' passing through leading into a pressure measuring chamber 31 pressure supply line 28 is not required. Instead, located under the measuring diaphragm 21 of the measuring diaphragm 21, the support 19 and the intermediate piece 15 'completely completed evacuated chamber 61. A bore in the intermediate piece 15' is not required for the pressure supply. However, since the bore reinforces the mechanical decoupling, a hole in the intermediate piece 15 'can be provided even with absolute pressure measuring devices. In contrast to the bore 29, this bore is a socket-side opening blind hole 59 here.
  • the provided in the previous embodiment bore 30 in the base 13 'omitted.
  • the manufacturing method is analogous to the manufacturing method described above for the pressure sensor shown in Fig. 2. The only difference is that, instead of the first silicon wafer 45, a first silicon wafer 45 'having an oxide layer 51 on both sides and having no central bore 53 is used. This silicon wafer 45 'forms the rear wall of the blind hole 59 in the intermediate piece 15' and closes off the chamber 61 on the socket side completely. The resulting layer composite forming the intermediate piece 15 'is shown in FIG. 11 together with the semiconductor pressure sensor 17 arranged thereon.

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  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)

Abstract

L'invention concerne un dispositif de mesure de pression comportant un culot (13, 13'), une pièce intermédiaire (15, 15') disposée sur le culot (13, 13') et connectée à celui-ci, composée d'un semi-conducteur, et un capteur de pression à semi-conducteur (17) disposé sur la pièce intermédiaire (15, 15') et connecté à celle-ci, présentant un support (19) et une membrane de mesure (21). Le dispositif selon l'invention offre une protection efficace de la membrane de mesure sensible (21) contre des déformations mécaniques. L'intérieur de la pièce intermédiaire (15, 15') présente une cavité annulaire périphérique (33) entourant une première section cylindrique (35) et une deuxième section cylindrique (37) de la pièce intermédiaire (15, 15'), adjacente à la première côté culot. Le diamètre extérieur de la deuxième section cylindrique (37) est supérieur à celui de la première (35). La cavité est ouverte vers le côté de la pièce intermédiaire (15, 15') orienté vers le culot (13, 13'). La deuxième section cylindrique (37) présente une surface frontale orientée vers le culot (13, 13'), s'appuyant contre une surface frontale libre du culot (13, 13'), formant une surface de connexion au moyen de laquelle la pièce intermédiaire (15, 15') peut être connectée de façon mécaniquement fixe au culot (13, 13').
EP08846746A 2007-11-09 2008-11-07 Dispositif de mesure de pression Withdrawn EP2205955A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007053859A DE102007053859A1 (de) 2007-11-09 2007-11-09 Druck-Messeinrichtung
PCT/EP2008/065137 WO2009060069A2 (fr) 2007-11-09 2008-11-07 Dispositif de mesure de pression

Publications (1)

Publication Number Publication Date
EP2205955A2 true EP2205955A2 (fr) 2010-07-14

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Family Applications (1)

Application Number Title Priority Date Filing Date
EP08846746A Withdrawn EP2205955A2 (fr) 2007-11-09 2008-11-07 Dispositif de mesure de pression

Country Status (6)

Country Link
US (1) US8304844B2 (fr)
EP (1) EP2205955A2 (fr)
CN (1) CN102257372B (fr)
DE (1) DE102007053859A1 (fr)
RU (1) RU2441208C1 (fr)
WO (1) WO2009060069A2 (fr)

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DE102017127704A1 (de) * 2017-11-23 2019-05-23 Endress+Hauser SE+Co. KG Druckmesseinrichtung
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WO2009060069A2 (fr) 2009-05-14
US20100308426A1 (en) 2010-12-09
CN102257372A (zh) 2011-11-23
RU2441208C1 (ru) 2012-01-27
DE102007053859A1 (de) 2009-05-14
WO2009060069A3 (fr) 2010-10-28
CN102257372B (zh) 2014-07-16
US8304844B2 (en) 2012-11-06

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