WO2017050582A1 - Dispositif de mesure de pression - Google Patents

Dispositif de mesure de pression Download PDF

Info

Publication number
WO2017050582A1
WO2017050582A1 PCT/EP2016/071144 EP2016071144W WO2017050582A1 WO 2017050582 A1 WO2017050582 A1 WO 2017050582A1 EP 2016071144 W EP2016071144 W EP 2016071144W WO 2017050582 A1 WO2017050582 A1 WO 2017050582A1
Authority
WO
WIPO (PCT)
Prior art keywords
base
pressure sensor
recess
pressure
measuring device
Prior art date
Application number
PCT/EP2016/071144
Other languages
German (de)
English (en)
Inventor
Daniel Sixtensson
Fred Haker
Original Assignee
Endress+Hauser Gmbh+Co. Kg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Endress+Hauser Gmbh+Co. Kg filed Critical Endress+Hauser Gmbh+Co. Kg
Publication of WO2017050582A1 publication Critical patent/WO2017050582A1/fr

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/04—Means for compensating for effects of changes of temperature, i.e. other than electric compensation

Definitions

  • the invention relates to a pressure-measuring device with a carrier, esp.
  • a carrier esp.
  • a support made of a metal, esp. Of a stainless steel, provided on the support, a freestanding base section base, and arranged on the base pressure sensor whose base is larger than a base of the Socket is.
  • Pressure measuring devices are used for the metrological detection of pressures, esp. Of absolute pressures, relative pressures and differential pressures, and are used in industrial metrology.
  • Pressure measuring devices may for this purpose as absolute, relative or differential pressure sensors formed, regularly referred to as so-called semiconductor sensors or sensor chips pressure sensors comprise, using the from
  • pressure sensors are very sensitive and are therefore regularly mounted on a usually metallic support, which is then inserted into a typically metallic housing in such a way that it closes a pressure sensor externally surrounding the pressure sensor outside, filled with a pressure fluid pressure measuring chamber to the outside ,
  • carrier and pressure sensor made of different materials, the very different thermal
  • Relative pressure sensor with a basic body made of silicon, on which a pressure-sensitive measuring membrane is arranged. Below the measuring diaphragm, a chamber is enclosed, which can be acted upon by a reference pressure supply with a reference pressure.
  • the base body has a through hole which comprises a first section opening into the chamber and a second section facing the support. The second section has a larger diameter than the first section.
  • the reference pressure is supplied via an inserted into the carrier
  • Reference pressure channel which is a sleeve-shaped, out of the carrier in the direction of Pressure sensor outstanding, extending in the second section of the bore extension comprises.
  • Pressure sensor and extension are connected to each other via a pressure-bearing adhesive, which extends over the entire cylindrical outer surface of the extension.
  • the base is an integral part of the metallic carrier and is made of the material of the carrier.
  • the base is formed as a separate component which is inserted by means of a glazing in a bore in the carrier.
  • Pressure sensor is mounted by means of a glued on the base. Bonding offers the advantage that they are thermomechanical due to their elasticity
  • the position of an object in the sense used here denotes the position of the object in a two-dimensional coordinate system spanned parallel to the plane of the carrier, and the orientation indicates this
  • Components e.g.
  • Orientation of the pressure sensor can be positioned and aligned when its
  • Positioning and its spatial orientation on the support is not already predetermined by other conditions.
  • the latter is the case, for example, with fillers which have bores through which connection pins fixedly connected to the carrier pass for the electrical connection of the pressure sensor.
  • connection pins fixedly connected to the carrier pass for the electrical connection of the pressure sensor.
  • It is an object of the invention to provide a pressure measuring device comprising a support, a pedestal provided on the support, a free-standing pedestal portion, and a pressure sensor arranged on the pedestal whose base area is larger than a base of the pedestal, which overcomes the aforementioned disadvantages ,
  • the invention comprises a pressure measuring device, with
  • a support in particular a support made of a metal, in particular of a stainless steel,
  • a pressure sensor arranged on the base, the base area of which is greater than a base area of the base,
  • the pressure sensor on its side facing the carrier has a recess open towards the carrier, in which a arranged in the recess cylindrical or hollow cylindrical end of the base is connected via an adhesive bond with the pressure sensor.
  • Base surface which is slightly larger than the base surface of the base, esp. A base whose outer dimensions exceed the outer dimensions of the base of the end of the base by a measure that the sum of the associated manufacturing of the base manufacturing tolerances and with the production of Recess associated manufacturing tolerances corresponds.
  • a second embodiment is characterized in that the recess has a depth parallel to the longitudinal axis of the base, which is equal to a sum of a layer thickness extending over a pressure sensor facing end side of the base extending adhesive and a parallel to the longitudinal axis of the base extending length in the Recess extending end of the base is.
  • a third embodiment is characterized in that the bond is an adhesive applied with an epoxy resin-based adhesive, a thermoplastic adhesive or a silicone adhesive, in particular a silicone rubber.
  • the bond is executed with an adhesive based on epoxy resin or a thermoplastic adhesive bond and has a layer thickness in the range of 10 ⁇ to 200 ⁇ , or
  • the bond is executed with a silicone adhesive bond and has a layer thickness in the range of 50 ⁇ to 300 ⁇ .
  • the located in the recess end of the base has a length greater than or equal to 40 ⁇
  • the located in the recess end of the base has a length of less than or equal to 200 ⁇ .
  • the base comprises a free-standing pedestal portion extending from the support to the
  • Recess extends and connects to the ends of the arranged in the recess end of the base
  • the free-standing pedestal portion has a length which equal a greater equal
  • Gap width of 100 ⁇ to 300 ⁇ is provided.
  • a first embodiment of the fourth development is characterized in that the component is a filler, in particular a filler made of a plastic, esp. From
  • PPS Polyphenylene sulfide
  • PBT polybutylene terephthalate
  • ceramic esp. Of alumina (Al 2 0 3 ), which reduces an inner volume of a pressure sensor outside the surrounding pressure measuring chamber.
  • the filler has a parallel to the longitudinal axis of the base through the filler body extending recess,
  • the base and the pressure sensor are arranged in the recess, and
  • the recess has at the height of the pressure sensor has a base surface which is larger than the base surface of the pressure sensor, esp. A base surface which is formed the same shape to the base of the pressure sensor.
  • a further embodiment of the first embodiment of the fourth development or the last-mentioned embodiment is characterized in that electrical connections are provided for the electrical connection of the pressure sensor, which run through the carrier and the filling body.
  • the pedestal has a circular or annular base surface with an outer diameter in the range from 0.5 mm to 7 mm,
  • the carrier encloses an enclosed in the housing, the pressure sensor outside on all sides surrounding pressure measuring chamber to the outside, and / or
  • Base and carrier are designed as separate components and the base of a
  • the invention comprises a method for producing a pressure measuring device according to the invention, which is characterized in that the pressure sensor is mounted on the base by
  • Adhesive is applied to an end face of the base facing the pressure sensor, the pressure sensor is positioned on the base and aligned, in particular by means of a
  • Positioning machine is positioned and aligned from above on the base, wherein
  • the recess acts as a positioning aid, which causes a positioning of the pressure sensor, wherein a running through the base center longitudinal axis of the base passes through a center of the pressure sensor, and
  • the alignment is carried out by rotation of the pressure sensor about a longitudinal axis of the socket corresponding rotation axis, and
  • Pressure measuring device is characterized in that the component is arranged on the carrier before mounting the pressure sensor and the orientation of the pressure sensor is made based on an orientation of the already arranged on the carrier component.
  • Pressure measuring devices according to the invention offer the advantage that they can be produced in an efficient and cost-effective manner.
  • the recess acts in the
  • Basic body as a positioning aid, which allows precise positioning of the pressure sensor on the base.
  • the end of the base extending in the recess forms a centering device during the production of the bond, which prevents the pressure sensor from slipping.
  • the positioning and orientation of the pressure sensor can be carried out on the base by means of a placement machine with the pressure sensor is placed from above on the base. Elaborate the pressure sensor on the outside surrounding special devices for fixing the pressure sensor during the production of the bond are not required.
  • Fig. 1 shows: a pressure measuring device according to the invention
  • Fig. 2 shows: an enlarged detail of the pressure measuring device of Fig. 1;
  • Fig. 3 shows: a plan view of the equipped with the Grescoper and the pressure sensor
  • FIG. 1 shows a pressure measuring device according to the invention.
  • FIG. 2 shows an enlarged detail of the pressure measuring device of FIG. 1.
  • the pressure measuring device comprises a carrier 1, a base 3 provided on the carrier 1 and a pressure sensor 5 mounted on the base 3.
  • the carrier 1 is substantially disk-shaped and consists e.g. Made of a metal, esp. Of a stainless steel.
  • the pressure sensor 5 is a so-called semiconductor pressure sensor, e.g. a silicon-based pressure sensor chip, and has, for example, a base body 7 and a measuring diaphragm 9 arranged thereon, under which a pressure chamber 1 1 is enclosed.
  • Pressure measuring devices can be configured as differential pressure, as relative pressure or as absolute pressure measuring device.
  • Absolutly the enclosed under the measuring diaphragm 9 pressure chamber 1 1 is evacuated and completed by the measuring diaphragm 9 and the main body 7 completely outwards.
  • a pressure p acting on the first side of the measuring diaphragm 9 causes a deflection of the measuring diaphragm 9 which is dependent on the absolute pressure to be measured.
  • a first side of the measuring diaphragm 9 is actuated
  • Pressure transmission line 13 with a reference pressure p ref for example, an ambient pressure, applied, based on the pressure acting on the first page p is to be measured.
  • the pressure difference between the pressure p and the reference pressure p ref acting on the measuring diaphragm 9 causes a deflection of the measuring diaphragm 9 which is dependent on the relative pressure to be measured first side of the measuring diaphragm 9 is acted upon by a first pressure p-1, and its second side is acted upon via the pressure transmission line 13 with a second pressure p 2 .
  • the pressure difference between the first and second pressures pi, p 2 acting on the measuring diaphragm 9 causes a pressure difference to be measured
  • the resulting deflection of the measuring diaphragm 9 is in all three cases by means of an electromechanical transducer, z. B. on or in the measuring diaphragm 9 arranged sensor elements, e.g. interconnected to a resistance measuring bridge
  • Piezoresistive elements detected and converted into an electrical signal, which is then available for further processing and / or evaluation.
  • the hollow cylindrical in the case of differential pressure and relative pressure measuring devices and cylindrical base 3 in the case of absolute pressure measuring devices has a base area which is smaller than the base area of the pressure sensor 5.
  • a decoupling of measuring diaphragm 9 and carrier 1 causes, which protects the pressure sensor 5 against thermo-mechanical stresses.
  • Semiconductor pressure sensors regularly have a, generally rectangular or square base area, whose size is depending on the measuring range and sensitivity in the order of 1 mm 2 to 100 mm 2 .
  • the base 3 has a circular or annular base.
  • the outer diameter of the base 3 is preferably in the range of 0.5 mm, depending on the size of the base area of the pressure sensor 5
  • base and carrier it is possible to design base and carrier as a one-piece component.
  • an electrical insulation of the pressure sensor 5 relative to the carrier 1 is preferably effected in that the base body 7 consists of an insulator, for example a quartz glass.
  • socket 3 and carrier 1 may be formed as separate components.
  • the base 3 can be inserted into a hole in the carrier 1, for example by means of a glazing 15 (shown as a possible variant in FIG. 1).
  • Another alternative is to attach the base by means of a joint, preferably a bond, on the support.
  • any required electrical insulation of the pressure sensor 5 relative to the support 1 is preferably effected by the base 3 being made of an insulator, eg of a ceramic, eg aluminum oxide (Al 2 O 3 ), silicon nitride ( Si 3 N 4 ) or aluminum nitride (AIN).
  • an insulator eg of a ceramic, eg aluminum oxide (Al 2 O 3 ), silicon nitride ( Si 3 N 4 ) or aluminum nitride (AIN).
  • the pressure sensor 5, on its side facing the carrier 1, has a recess 17 which is open toward the carrier 1, in which a cylindrical or hollow cylindrical end 19 of the freestanding base 3 extending into the recess 17 is connected to the pressure sensor 5 via an adhesive bond 21 ,
  • Epoxy-based adhesives are particularly suitable for the production of the bond 21.
  • thermoplastic adhesive or silicone adhesive, such as silicone rubber.
  • Bondings are significantly more elastic than rigid joints, such as
  • the bond 21 thus causes a reduction of thermo-mechanical stresses that would otherwise affect the pressure sensor 5, esp.
  • Positioning aid which ensures a precise positioning of the pressure sensor 5, wherein the extending through the base center longitudinal axis of the base 3 through the center of the
  • Pressure sensor 5 leads.
  • the cylindrical or hollow cylindrical shape of the end 19 of the base 3 allows the pressure sensor 5 to rotate about one of the longitudinal axes of the base 3
  • Both operations can be fully automated by having the pressure sensor 5 e.g. sucked by means of a placement machine and positioned from above on the base 3 and aligned.
  • the bond 21 is produced from the applied adhesive.
  • adhesive-specific curing methods used as regularly prescribed by the manufacturer of the adhesive.
  • the assembly of base 3, adhesive and pressure sensor 5 is introduced into a curing oven, in which the adhesive is heated to a predetermined temperature or a predetermined
  • the recess 17 preferably has a base surface which is only slightly larger than the base surface of the base 3.
  • the outer dimensions of the base surface of the recess 17 are preferably dimensioned such that they exceed the outer dimensions of the base surface of the base 3 by a degree that corresponds to the sum of the manufacturing tolerances associated with the production of the base 3 and the associated with the production of the recess 17 manufacturing tolerances ,
  • the manufacturing tolerances associated with the production of the base 3 and the associated with the production of the recess 17 manufacturing tolerances
  • Recess 17 e.g. have a square base surface whose side lengths exceed the outer diameter of the end 19 of the base 19 by this amount, or have a circular base surface whose outer diameter exceeds the outer diameter of the end 19 of the base 19 by this amount.
  • the recess 17 has, parallel to the longitudinal axis of the base 3, a depth equal to the buzzer of a layer thickness of the bond 21 extending over the end face of the base 3 and a length of the end 19 of the base running parallel to the longitudinal axis of the base 3 3 is.
  • the layer thickness of the bond 21 is preferably determined as a function of the choice of the adhesive and the required compressive strength of the bond 21.
  • the bond 21 may be used in conjunction with epoxy resin based adhesives, as well as in conjunction with thermoplastic adhesives after completion of their manufacture e.g. have a layer thickness in the range of 10 ⁇ to 200 ⁇ .
  • a greater layer thickness e.g. a layer thickness in the range of 50 ⁇ to 300 ⁇ provided.
  • the length of the end 17 located in the recess 17 of the base 3 is on the one hand preferably dimensioned such that it is sufficiently large to ensure reliable positioning and centering of the pressure sensor 5. For this purpose, it preferably has a length of greater than or equal to 40 ⁇ . On the other hand, it is preferably dimensioned such that by a possibly occurring. Direct contact between an outer surface of the end 19 with the end 19 on the outside surrounding side wall of the recess 17 to the pressure sensor 5 transferable thermo-mechanical stresses are minimized. For this purpose, the end 19 preferably has a length of less than or equal to 200 ⁇ .
  • the base 3 comprises a free-standing base portion 23 extending from the carrier 1 to the recess 17 at the end that extends in the recess 17 End 19 of the base 3 connects.
  • This offers the advantage that due to the different coefficients of thermal expansion of pressure sensor 5, base 3 and support 1, thermo-mechanical stresses can be reduced over the entire length of the free-standing base section 23.
  • the freestanding base portion 23 extending from the carrier 1 to the recess 17 at the end that extends in the recess 17 End 19 of the base 3 connects.
  • Base portion 23 preferably has a length equal to greater than a few
  • Tenths of a millimeter e.g. a length of the order of 0.5 mm.
  • the unit comprising the carrier 1, the base 3 and the pressure sensor 5 can be used in different ways. In the embodiment shown here, it is inserted into a housing 25 in such a way that the carrier 1 encloses a housing 25 enclosed, the pressure sensor 5 on all sides outside
  • Pressure measuring chamber 27 terminates to the outside.
  • the pressure measuring chamber 27 is filled with a pressure-transmitting liquid which serves to transfer the pressure p or the first pressure p-i to the measuring diaphragm 9.
  • This pressure p or p- ⁇ can the measuring membrane 9, for example. via a pressure measuring chamber 27 shown here as an example
  • a packing 31 is provided, which is filled by means of a joint 33, e.g. a bond with the carrier 1 is connected.
  • the filling body 31 consists e.g. made of a plastic, e.g. out
  • PPS Polyphenylene sulfide
  • PBT polybutylene terephthalate
  • ceramic for example of alumina (AI2O 3 ), and serves to reduce the pressure-transmitting liquid to be filled with the inner volume of the pressure measuring chamber 27.
  • a smaller volume of liquid offers the advantage of a lower by a thermal
  • the filling body 31 preferably has a shape which almost completely fills a socket 3 and pressure sensor 5 on the outside of the housing surrounding the housing.
  • the filler body 31 may have a parallel to the longitudinal axis of the base 3 through the filling body 31 extending through recess 35 in which the base 3 and the pressure sensor 5 are arranged.
  • the recess 35 at the level of the pressure sensor 5 has a base area which is larger than the base area of the pressure sensor 5, so that between the filling body 31 and the pressure sensor 5 there is a gap 37 surrounding the pressure sensor 5 on all sides.
  • the filling body 31 shown here may alternatively be provided one-piece packing with a different shape or two or more individual packing.
  • the recess 17 in the pressure sensor 5 has the advantage that these components act on the base 3 before mounting the pressure sensor 5 as a positioning aid and as a centering device the carrier 1 can be arranged. Subsequently, the pressure sensor 5 can then not only precisely positioned on the base 3 due to the recess 17 in the pressure sensor 5, but also by rotation of the pressure sensor 5 about its parallel to the
  • rectangular base surface of the pressure sensor 5 is brought by rotation about the axis of rotation in a spatial orientation, which coincides with the spatial orientation of the preferably identical, esp. Square or rectangular base surface of the recess 35 in the already mounted on the carrier 1 packing 31.
  • orientation of the pressure sensor 5 can be tuned to the orientations of already arranged in the immediate vicinity of the carrier 1 components, components can be provided in the immediate vicinity of the pressure sensor 5, their orientation on the carrier 1 by additional
  • An example of such boundary conditions are electrical connections 39 extending through the carrier 1 and the filling body 31 for the electrical connection of the pressure sensor 5, whose shape and position on the carrier 1 are to be taken into account as boundary conditions in the positioning and alignment of the filling body 31.
  • the terminals 39 are formed in the illustrated embodiment as metallic pins, which are each electrically guided by a passage 41, for example, a glazing implementation, electrically insulated with respect to the carrier 1 through the carrier 1, pass through holes in the carrier 1 through and on the side facing away from the carrier 1 side of the filling body 31 are connected to provided on the pressure sensor 5 terminal contacts 43 of the pressure sensor 5 are connected.
  • Alternatively, of course, other known to those skilled embodiments and / or Positioning of the terminals 39 may be provided, which extend at other locations through the packing 31 or across it.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

L'invention concerne un dispositif de mesure de pression comprenant un support (1), en particulier un support (1) en métal, en particulier en acier inoxydable, un socle (3) qui est placé sur le support (1) et qui comprend une partie de socle libre (23), ainsi qu'un capteur de pression (5) placé sur le socle (3), la surface de base de ce capteur de pression étant supérieure à celle du socle (5). L'invention est caractérisée en ce que le capteur de pression (5) présente sur son côté faisant face au support (1) un évidement (17) qui est ouvert en direction du support (1) et dans lequel une extrémité (19) cylindrique ou cylindrique creuse du socle (3) agencée dans l'évidement (17) est reliée au capteur de pression (5) par un moyen de collage (21).
PCT/EP2016/071144 2015-09-23 2016-09-08 Dispositif de mesure de pression WO2017050582A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102015116059.5A DE102015116059A1 (de) 2015-09-23 2015-09-23 Druckmesseinrichtung
DE102015116059.5 2015-09-23

Publications (1)

Publication Number Publication Date
WO2017050582A1 true WO2017050582A1 (fr) 2017-03-30

Family

ID=56883804

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2016/071144 WO2017050582A1 (fr) 2015-09-23 2016-09-08 Dispositif de mesure de pression

Country Status (2)

Country Link
DE (1) DE102015116059A1 (fr)
WO (1) WO2017050582A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111003683A (zh) * 2019-10-29 2020-04-14 武汉大学 一种SiC高温压力传感器及其封装方法
CN113218565A (zh) * 2021-05-27 2021-08-06 南京特敏传感技术有限公司 一种压力测量敏感组件

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016115197A1 (de) * 2016-08-16 2018-02-22 Endress + Hauser Gmbh + Co. Kg Füllkörper zur Reduktion eines Volumens einer Druckmesskammer
DE102020116175A1 (de) 2020-06-18 2021-12-23 Endress+Hauser SE+Co. KG Druckmessaufnehmer

Citations (8)

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Publication number Priority date Publication date Assignee Title
DE3436440A1 (de) 1984-10-04 1986-04-10 Siemens AG, 1000 Berlin und 8000 München Halbleiter-messeinrichtung
DE9315086U1 (de) * 1993-10-05 1993-12-09 Keller AG für Druckmeßtechnik, Winterthur Druckaufnehmer
US5635649A (en) * 1991-04-22 1997-06-03 Hitachi, Ltd. Multi-function differential pressure sensor with thin supporting base
US5945605A (en) * 1997-11-19 1999-08-31 Sensym, Inc. Sensor assembly with sensor boss mounted on substrate
US6003381A (en) * 1998-10-16 1999-12-21 Mitsubishi Denki Kabushiki Kaisha Pressure sensor
DE102008043175A1 (de) 2008-10-24 2010-04-29 Endress + Hauser Gmbh + Co. Kg Relativdrucksensor
US20130167961A1 (en) * 2011-12-12 2013-07-04 Endress + Hauser Gmbh + Co. Kg Tube-equipped, flanged, pressure transfer means, pressure measuring arrangement with such a tube-equipped, flanged. pressure transfer means and pressure measuring point with such a pressure measuring arrangement
DE102014119396A1 (de) 2014-12-22 2016-06-23 Endress + Hauser Gmbh + Co. Kg Druckmesseinrichtung

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JPS5723830A (en) * 1980-07-18 1982-02-08 Hitachi Ltd Post material for pressure transducer of semiconductor and its preparation
DE102007053859A1 (de) * 2007-11-09 2009-05-14 Endress + Hauser Gmbh + Co. Kg Druck-Messeinrichtung
DE102009046692A1 (de) * 2009-11-13 2011-05-19 Endress + Hauser Gmbh + Co. Kg Druck-Messeinrichtung

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3436440A1 (de) 1984-10-04 1986-04-10 Siemens AG, 1000 Berlin und 8000 München Halbleiter-messeinrichtung
US5635649A (en) * 1991-04-22 1997-06-03 Hitachi, Ltd. Multi-function differential pressure sensor with thin supporting base
DE9315086U1 (de) * 1993-10-05 1993-12-09 Keller AG für Druckmeßtechnik, Winterthur Druckaufnehmer
US5945605A (en) * 1997-11-19 1999-08-31 Sensym, Inc. Sensor assembly with sensor boss mounted on substrate
US6003381A (en) * 1998-10-16 1999-12-21 Mitsubishi Denki Kabushiki Kaisha Pressure sensor
DE102008043175A1 (de) 2008-10-24 2010-04-29 Endress + Hauser Gmbh + Co. Kg Relativdrucksensor
US20130167961A1 (en) * 2011-12-12 2013-07-04 Endress + Hauser Gmbh + Co. Kg Tube-equipped, flanged, pressure transfer means, pressure measuring arrangement with such a tube-equipped, flanged. pressure transfer means and pressure measuring point with such a pressure measuring arrangement
DE102014119396A1 (de) 2014-12-22 2016-06-23 Endress + Hauser Gmbh + Co. Kg Druckmesseinrichtung

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111003683A (zh) * 2019-10-29 2020-04-14 武汉大学 一种SiC高温压力传感器及其封装方法
CN113218565A (zh) * 2021-05-27 2021-08-06 南京特敏传感技术有限公司 一种压力测量敏感组件

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