WO2017050582A1

WO2017050582A1 - Pressure measuring device

Info

Publication number: WO2017050582A1
Application number: PCT/EP2016/071144
Authority: WO
Inventors: Daniel Sixtensson; Fred Haker
Original assignee: Endress+Hauser Gmbh+Co. Kg
Priority date: 2015-09-23
Filing date: 2016-09-08
Publication date: 2017-03-30
Also published as: DE102015116059A1

Abstract

The description relates to a pressure measuring device having a support (1), particularly a support (1) made of a metal, particularly made of a stainless steel, a base (3) provided on the support (1) and comprising an exposed base section (23), and a pressure sensor (5) that is arranged on the base (3) and the footprint of which is larger than a footprint of the base (5), characterised in that the pressure sensor (5) has, on its side facing the support (1), a recess (17) that is open towards the support (1) and in which a cylindrical or hollow cylindrical end (19) of the base (3), which end is arranged in the recess (17), is connected to the pressure sensor (5) by means of an adhesive bond (21).

Description

Pressure measuring device

The invention relates to a pressure-measuring device with a carrier, esp. A support made of a metal, esp. Of a stainless steel, provided on the support, a freestanding base section base, and arranged on the base pressure sensor whose base is larger than a base of the Socket is.

Pressure measuring devices are used for the metrological detection of pressures, esp. Of absolute pressures, relative pressures and differential pressures, and are used in industrial metrology.

Pressure measuring devices may for this purpose as absolute, relative or differential pressure sensors formed, regularly referred to as so-called semiconductor sensors or sensor chips pressure sensors comprise, using the from

Semiconductor technology known processes are produced.

These pressure sensors are very sensitive and are therefore regularly mounted on a usually metallic support, which is then inserted into a typically metallic housing in such a way that it closes a pressure sensor externally surrounding the pressure sensor outside, filled with a pressure fluid pressure measuring chamber to the outside , There is the problem that carrier and pressure sensor made of different materials, the very different thermal

Have expansion coefficients. Due to the mechanical connection between the carrier and the pressure sensor required for the sensor assembly, therefore, mechanical stresses can occur which have an effect on the transmission behavior of the measuring diaphragm and thus impair the achievable measuring accuracy and its reproducibility. This applies esp. For a temperature-dependent hysteresis of

Measurement results.

This problem occurs e.g. also in the case of the relative pressure measuring device described in DE 10 2008 043 175 A1. This includes a mounted on a support

Relative pressure sensor with a basic body made of silicon, on which a pressure-sensitive measuring membrane is arranged. Below the measuring diaphragm, a chamber is enclosed, which can be acted upon by a reference pressure supply with a reference pressure. For this purpose, the base body has a through hole which comprises a first section opening into the chamber and a second section facing the support. The second section has a larger diameter than the first section. The reference pressure is supplied via an inserted into the carrier

Reference pressure channel, which is a sleeve-shaped, out of the carrier in the direction of Pressure sensor outstanding, extending in the second section of the bore extension comprises. Pressure sensor and extension are connected to each other via a pressure-bearing adhesive, which extends over the entire cylindrical outer surface of the extension. There is the problem that by different thermal

Expansion coefficient of the carrier, reference pressure channel and pressure sensor thermo-mechanical stresses over the entire length of the extension acting on the pressure sensor.

This problem can be counteracted by mounting the pressure sensor on the support on a pedestal comprising a freestanding pedestal section and whose base is significantly smaller than the base of the one mounted thereon

Pressure sensor is. For this purpose, two different embodiments are known, e.g. in DE 34 36 440 A1 are described. In one embodiment, the base is an integral part of the metallic carrier and is made of the material of the carrier. In the second embodiment, the base is formed as a separate component which is inserted by means of a glazing in a bore in the carrier.

In these pressure measuring devices, a further improvement of the protection of the measuring membrane from thermomechanical stresses can be achieved by the

Pressure sensor is mounted by means of a glued on the base. Bonding offers the advantage that they are thermomechanical due to their elasticity

Reduce tension.

Applicable adhesives for this purpose, however, must be regularly subjected to a curing process in which the adhesive in a curing oven on a this

required temperature is heated. There is a risk that the pressure sensor during transport to the curing oven, e.g. due to vibrations, and / or during the curing process, e.g. due to convection currents in the oven, slipped. Slippage of the pressure sensor can be avoided by the use of a special adapted to the geometry of the pressure sensor and socket special device, the pressure sensor until complete curing of the adhesive in its position and

Orientation fixed. In this case, the position of an object in the sense used here denotes the position of the object in a two-dimensional coordinate system spanned parallel to the plane of the carrier, and the orientation indicates this

Rotation around a perpendicular to this plane extending axis of rotation occupied spatial orientation.

The use of such special tools, however, is complicated and expensive. In addition, these special devices must be regularly connected to the pressure sensor be that they enclose the pressure sensor on the outside. However, this requires that there is sufficient space around the base and pressure sensor. If this space is missing, this device can not be used. Accordingly, to be mounted on the support near pedestal and pressure sensor

Components, e.g. For the electrical connection of the pressure sensor required components and / or packing to reduce the liquid to be filled with the pressure to be filled inner volume of the pressure sensor outside surrounding pressure chamber are mounted only after the gluing of the pressure sensor on the base. The positioning and alignment of the respective component must take place taking into account the already predetermined position and orientation of the pressure sensor. Otherwise, there is a risk that the component is in direct mechanical contact with the pressure sensor after its attachment and thus the

Pressure measurement characteristics of the pressure sensor impaired. However, a component can only take into account the position and

Orientation of the pressure sensor can be positioned and aligned when its

Positioning and its spatial orientation on the support is not already predetermined by other conditions. The latter is the case, for example, with fillers which have bores through which connection pins fixedly connected to the carrier pass for the electrical connection of the pressure sensor. Here can only be remedied that between the component and the pressure sensor a

Minimum distance is maintained, which ensures that a mechanical contact between the pressure sensor and component even without a precise on the alignment of the

Pressure sensor matched alignment of the component is avoided. However, large distances between the packing and the pressure sensor run counter to the function of the packing.

It is an object of the invention to provide a pressure measuring device comprising a support, a pedestal provided on the support, a free-standing pedestal portion, and a pressure sensor arranged on the pedestal whose base area is larger than a base of the pedestal, which overcomes the aforementioned disadvantages ,

To achieve this object, the invention comprises a pressure measuring device, with

a support, in particular a support made of a metal, in particular of a stainless steel,

- One provided on the support a freestanding base section

comprehensive pedestal, and

a pressure sensor arranged on the base, the base area of which is greater than a base area of the base,

which is characterized by the fact that

- The pressure sensor on its side facing the carrier has a recess open towards the carrier, in which a arranged in the recess cylindrical or hollow cylindrical end of the base is connected via an adhesive bond with the pressure sensor.

A first embodiment is characterized in that the recess a

Base surface, which is slightly larger than the base surface of the base, esp. A base whose outer dimensions exceed the outer dimensions of the base of the end of the base by a measure that the sum of the associated manufacturing of the base manufacturing tolerances and with the production of Recess associated manufacturing tolerances corresponds.

A second embodiment is characterized in that the recess has a depth parallel to the longitudinal axis of the base, which is equal to a sum of a layer thickness extending over a pressure sensor facing end side of the base extending adhesive and a parallel to the longitudinal axis of the base extending length in the Recess extending end of the base is.

A third embodiment is characterized in that the bond is an adhesive applied with an epoxy resin-based adhesive, a thermoplastic adhesive or a silicone adhesive, in particular a silicone rubber.

A development of the second or third embodiment is characterized in that

- The bond is executed with an adhesive based on epoxy resin or a thermoplastic adhesive bond and has a layer thickness in the range of 10 μιη to 200 μιη, or

- The bond is executed with a silicone adhesive bond and has a layer thickness in the range of 50 μιη to 300 μιη.

A second development of the invention is characterized in that

- The located in the recess end of the base has a length greater than or equal to 40 μιη, and

- The located in the recess end of the base has a length of less than or equal to 200 μιτι.

A third development of the invention is characterized in that

- The base comprises a free-standing pedestal portion extending from the support to the

Recess extends and connects to the ends of the arranged in the recess end of the base, and

- The free-standing pedestal portion has a length which equal a greater equal

Tenths of a millimeter, esp. A length of the order of 0.5 mm. A fourth development is characterized by the fact that

- Is provided on the support in the immediate vicinity of the base and pressure sensor at least one component connected to the carrier, esp. A component whose orientation is limited or predetermined on the support by boundary conditions, and

- Between the component and the pressure sensor a gap, esp. A gap with a

Gap width of 100 μιη to 300 μιη, is provided.

A first embodiment of the fourth development is characterized in that the component is a filler, in particular a filler made of a plastic, esp. From

Polyphenylene sulfide (PPS) or polybutylene terephthalate (PBT), or of ceramic, esp. Of alumina (Al ₂ 0 ₃ ), which reduces an inner volume of a pressure sensor outside the surrounding pressure measuring chamber. A further embodiment of the first embodiment of the fourth development is characterized in that

- The filler has a parallel to the longitudinal axis of the base through the filler body extending recess,

- The base and the pressure sensor are arranged in the recess, and

- The recess has at the height of the pressure sensor has a base surface which is larger than the base surface of the pressure sensor, esp. A base surface which is formed the same shape to the base of the pressure sensor.

A further embodiment of the first embodiment of the fourth development or the last-mentioned embodiment is characterized in that electrical connections are provided for the electrical connection of the pressure sensor, which run through the carrier and the filling body.

Further preferred embodiments of the invention are characterized in that - the pressure sensor has a square or rectangular base in the

Order of magnitude of 1 mm ² to 100 mm ² ,

the pedestal has a circular or annular base surface with an outer diameter in the range from 0.5 mm to 7 mm,

- The carrier encloses an enclosed in the housing, the pressure sensor outside on all sides surrounding pressure measuring chamber to the outside, and / or

- Base and carrier are designed as separate components and the base of a

Insulator, in particular of ceramic, in particular of aluminum oxide (AI2O3), silicon nitride (S13N4) or aluminum nitride (AIN). Furthermore, the invention comprises a method for producing a pressure measuring device according to the invention, which is characterized in that the pressure sensor is mounted on the base by

Adhesive is applied to an end face of the base facing the pressure sensor, the pressure sensor is positioned on the base and aligned, in particular by means of a

Positioning machine is positioned and aligned from above on the base, wherein

- The recess acts as a positioning aid, which causes a positioning of the pressure sensor, wherein a running through the base center longitudinal axis of the base passes through a center of the pressure sensor, and

- The alignment is carried out by rotation of the pressure sensor about a longitudinal axis of the socket corresponding rotation axis, and

- The bond is generated, esp. By an adhesive-specific curing process is produced, esp. A method in which the assembly of base, adhesive and pressure sensor is heated to a predetermined temperature or a predetermined

Passes through temperature profile.

A development of the inventive method for producing a

Pressure measuring device according to the fourth embodiment is characterized in that the component is arranged on the carrier before mounting the pressure sensor and the orientation of the pressure sensor is made based on an orientation of the already arranged on the carrier component.

Pressure measuring devices according to the invention offer the advantage that they can be produced in an efficient and cost-effective manner. The recess acts in the

Basic body as a positioning aid, which allows precise positioning of the pressure sensor on the base. At the same time, the end of the base extending in the recess forms a centering device during the production of the bond, which prevents the pressure sensor from slipping.

Accordingly, the positioning and orientation of the pressure sensor can be carried out on the base by means of a placement machine with the pressure sensor is placed from above on the base. Elaborate the pressure sensor on the outside surrounding special devices for fixing the pressure sensor during the production of the bond are not required.

This offers the advantage that the orientation of the pressure sensor on the pedestal can be tuned to the alignment of components already arranged on the support prior to the application of the pressure sensor. This is esp. Beneficial if the positioning and orientation of these components by boundary conditions predetermined or restricted. In addition, it has the advantage that the other components can be provided at a comparatively small distance from the pressure sensor, without the risk that they will get into immediate, the measurement characteristics changing contact with the pressure sensor.

The invention and its advantages will now be explained in more detail with reference to the figures of the drawing, in which an embodiment is shown. Identical elements are provided in the figures with the same reference numerals. Fig. 1 shows: a pressure measuring device according to the invention;

Fig. 2 shows: an enlarged detail of the pressure measuring device of Fig. 1; and

Fig. 3 shows: a plan view of the equipped with the Füllköper and the pressure sensor

Support of FIG. 1.

Fig. 1 shows a pressure measuring device according to the invention. FIG. 2 shows an enlarged detail of the pressure measuring device of FIG. 1. The pressure measuring device comprises a carrier 1, a base 3 provided on the carrier 1 and a pressure sensor 5 mounted on the base 3. The carrier 1 is substantially disk-shaped and consists e.g. Made of a metal, esp. Of a stainless steel. The pressure sensor 5 is a so-called semiconductor pressure sensor, e.g. a silicon-based pressure sensor chip, and has, for example, a base body 7 and a measuring diaphragm 9 arranged thereon, under which a pressure chamber 1 1 is enclosed.

Pressure measuring devices according to the invention can be configured as differential pressure, as relative pressure or as absolute pressure measuring device. To capture

Absolutdrücken the enclosed under the measuring diaphragm 9 pressure chamber 1 1 is evacuated and completed by the measuring diaphragm 9 and the main body 7 completely outwards. In this case, a pressure p acting on the first side of the measuring diaphragm 9 causes a deflection of the measuring diaphragm 9 which is dependent on the absolute pressure to be measured. For detecting relative pressures, a first side of the measuring diaphragm 9 is actuated

Measuring diaphragm 9 acted upon by a pressure p and the second side of a through the carrier 1, the base 3 and the base body 7 extending therethrough, in the

Pressure chamber 1 1 opening - shown in dashed lines in Fig. 1 as an option -

Pressure transmission line 13 with a reference pressure p _ref , for example, an ambient pressure, applied, based on the pressure acting on the first page p is to be measured. The pressure difference between the pressure p and the reference pressure p _ref acting on the measuring diaphragm 9 causes a deflection of the measuring diaphragm 9 which is dependent on the relative pressure to be measured first side of the measuring diaphragm 9 is acted upon by a first pressure p-1, and its second side is acted upon via the pressure transmission line 13 with a second pressure p ₂ . In this embodiment, the pressure difference between the first and second pressures pi, p ₂ acting on the measuring diaphragm 9 causes a pressure difference to be measured

Differential pressure Δρ dependent deflection of the measuring diaphragm 9.

The resulting deflection of the measuring diaphragm 9 is in all three cases by means of an electromechanical transducer, z. B. on or in the measuring diaphragm 9 arranged sensor elements, e.g. interconnected to a resistance measuring bridge

Piezoresistive elements, detected and converted into an electrical signal, which is then available for further processing and / or evaluation.

The hollow cylindrical in the case of differential pressure and relative pressure measuring devices and cylindrical base 3 in the case of absolute pressure measuring devices has a base area which is smaller than the base area of the pressure sensor 5. About this geometry is already a decoupling of measuring diaphragm 9 and carrier 1 causes, which protects the pressure sensor 5 against thermo-mechanical stresses.

Semiconductor pressure sensors regularly have a, generally rectangular or square base area, whose size is depending on the measuring range and sensitivity in the order of 1 mm ² to 100 mm ² . In contrast, the base 3 has a circular or annular base. The outer diameter of the base 3 is preferably in the range of 0.5 mm, depending on the size of the base area of the pressure sensor 5

7 mm. In a cylindrical base 3, this corresponds to a base in the

Order of magnitude of about 0.2 mm ² to 40 mm ² .

In principle, it is possible to design base and carrier as a one-piece component. In the case, an electrical insulation of the pressure sensor 5 relative to the carrier 1 is preferably effected in that the base body 7 consists of an insulator, for example a quartz glass. Alternatively, socket 3 and carrier 1 may be formed as separate components. In this case, the base 3 can be inserted into a hole in the carrier 1, for example by means of a glazing 15 (shown as a possible variant in FIG. 1). Another alternative is to attach the base by means of a joint, preferably a bond, on the support. In this case, the mounting of the base, for example, on the in the 22.12.2014 filed by the Applicant, still unpublished German Patent Application DE 20141 19396.2 described way done by an end facing the carrier is glued into a recess in the carrier. If base 3 and support 1 are separate components, then any required electrical insulation of the pressure sensor 5 relative to the support 1 is preferably effected by the base 3 being made of an insulator, eg of a ceramic, eg aluminum oxide (Al 2 O ₃ ), silicon nitride ( Si ₃ N ₄ ) or aluminum nitride (AIN).

According to the invention, the pressure sensor 5, on its side facing the carrier 1, has a recess 17 which is open toward the carrier 1, in which a cylindrical or hollow cylindrical end 19 of the freestanding base 3 extending into the recess 17 is connected to the pressure sensor 5 via an adhesive bond 21 ,

Epoxy-based adhesives are particularly suitable for the production of the bond 21.

thermoplastic adhesive or silicone adhesive, such as silicone rubber.

Bondings are significantly more elastic than rigid joints, such as

Glazings, bonding compounds, soldering or welding, and thus able due to different thermal expansion coefficients of carrier 1 and socket 3 to compensate for the resulting stresses. The bond 21 thus causes a reduction of thermo-mechanical stresses that would otherwise affect the pressure sensor 5, esp.

whose measuring diaphragm 9, would affect or transfer. In the production of pressure measuring devices according to the invention, adhesive is applied to the end face of the base 3 facing the pressure sensor 5. Subsequently, the pressure sensor 5 is placed on the adhesive. Here, the recess 17 acts as

Positioning aid, which ensures a precise positioning of the pressure sensor 5, wherein the extending through the base center longitudinal axis of the base 3 through the center of the

Pressure sensor 5 leads.

In this case, the cylindrical or hollow cylindrical shape of the end 19 of the base 3 allows the pressure sensor 5 to rotate about one of the longitudinal axes of the base 3

spatially align corresponding rotation axis. Both operations can be fully automated by having the pressure sensor 5 e.g. sucked by means of a placement machine and positioned from above on the base 3 and aligned.

Subsequently, the bond 21 is produced from the applied adhesive. For this, e.g. adhesive-specific curing methods used as regularly prescribed by the manufacturer of the adhesive. Typically, the assembly of base 3, adhesive and pressure sensor 5 is introduced into a curing oven, in which the adhesive is heated to a predetermined temperature or a predetermined

Passes through temperature profile. In this case, the recess 17 acts both during the

Transports to the curing oven as well as throughout the curing process as centering device integrated in the pressure sensor 5, which ensures that the pressure sensor 5 during the entire manufacturing process of the bond 21 in the desired Position remains. For this purpose, no special tools with a correspondingly large space requirement in the environment of the pressure sensor are needed.

With regard to the most accurate positioning and centering of the pressure sensor 5, the recess 17 preferably has a base surface which is only slightly larger than the base surface of the base 3. The outer dimensions of the base surface of the recess 17 are preferably dimensioned such that they exceed the outer dimensions of the base surface of the base 3 by a degree that corresponds to the sum of the manufacturing tolerances associated with the production of the base 3 and the associated with the production of the recess 17 manufacturing tolerances , For this purpose, the

Recess 17 e.g. have a square base surface whose side lengths exceed the outer diameter of the end 19 of the base 19 by this amount, or have a circular base surface whose outer diameter exceeds the outer diameter of the end 19 of the base 19 by this amount.

The recess 17 has, parallel to the longitudinal axis of the base 3, a depth equal to the buzzer of a layer thickness of the bond 21 extending over the end face of the base 3 and a length of the end 19 of the base running parallel to the longitudinal axis of the base 3 3 is.

The layer thickness of the bond 21 is preferably determined as a function of the choice of the adhesive and the required compressive strength of the bond 21. Thus, the bond 21 may be used in conjunction with epoxy resin based adhesives, as well as in conjunction with thermoplastic adhesives after completion of their manufacture e.g. have a layer thickness in the range of 10 μιη to 200 μιη. On the other hand, in connection with silicone adhesives, a greater layer thickness, e.g. a layer thickness in the range of 50 μιη to 300 μιη provided.

The length of the end 17 located in the recess 17 of the base 3 is on the one hand preferably dimensioned such that it is sufficiently large to ensure reliable positioning and centering of the pressure sensor 5. For this purpose, it preferably has a length of greater than or equal to 40 μιη. On the other hand, it is preferably dimensioned such that by a possibly occurring. Direct contact between an outer surface of the end 19 with the end 19 on the outside surrounding side wall of the recess 17 to the pressure sensor 5 transferable thermo-mechanical stresses are minimized. For this purpose, the end 19 preferably has a length of less than or equal to 200 μιη.

The base 3 comprises a free-standing base portion 23 extending from the carrier 1 to the recess 17 at the end that extends in the recess 17 End 19 of the base 3 connects. This offers the advantage that due to the different coefficients of thermal expansion of pressure sensor 5, base 3 and support 1, thermo-mechanical stresses can be reduced over the entire length of the free-standing base section 23. For this purpose, the freestanding

Base portion 23 preferably has a length equal to greater than a few

Tenths of a millimeter, e.g. a length of the order of 0.5 mm.

The unit comprising the carrier 1, the base 3 and the pressure sensor 5 can be used in different ways. In the embodiment shown here, it is inserted into a housing 25 in such a way that the carrier 1 encloses a housing 25 enclosed, the pressure sensor 5 on all sides outside

Pressure measuring chamber 27 terminates to the outside. The pressure measuring chamber 27 is filled with a pressure-transmitting liquid which serves to transfer the pressure p or the first pressure p-i to the measuring diaphragm 9. This pressure p or p-ι can the measuring membrane 9, for example. via a pressure measuring chamber 27 shown here as an example

upstream, also filled with the liquid pressure transmitter 29 are supplied.

As already mentioned, it is often desirable or even necessary to provide further components connected to the carrier 1 in the immediate vicinity of the base 3 and pressure sensor 5.

As an example, in the pressure measuring device shown in Fig. 1, a packing 31 is provided, which is filled by means of a joint 33, e.g. a bond with the carrier 1 is connected. The filling body 31 consists e.g. made of a plastic, e.g. out

Polyphenylene sulfide (PPS) or polybutylene terephthalate (PBT), or ceramic, for example of alumina (AI2O ₃ ), and serves to reduce the pressure-transmitting liquid to be filled with the inner volume of the pressure measuring chamber 27. A smaller volume of liquid offers the advantage of a lower by a thermal

Extension of the fluid-related measurement error. For this purpose, the filling body 31 preferably has a shape which almost completely fills a socket 3 and pressure sensor 5 on the outside of the housing surrounding the housing. For this purpose, the filler body 31 may have a parallel to the longitudinal axis of the base 3 through the filling body 31 extending through recess 35 in which the base 3 and the pressure sensor 5 are arranged. In the case, the recess 35 at the level of the pressure sensor 5 has a base area which is larger than the base area of the pressure sensor 5, so that between the filling body 31 and the pressure sensor 5 there is a gap 37 surrounding the pressure sensor 5 on all sides.

Instead of the filling body 31 shown here may alternatively be provided one-piece packing with a different shape or two or more individual packing. In pressure measuring devices with at least one component connected in the immediate vicinity of the pressure sensor 5 and base 3 with the carrier 1, the recess 17 in the pressure sensor 5 has the advantage that these components act on the base 3 before mounting the pressure sensor 5 as a positioning aid and as a centering device the carrier 1 can be arranged. Subsequently, the pressure sensor 5 can then not only precisely positioned on the base 3 due to the recess 17 in the pressure sensor 5, but also by rotation of the pressure sensor 5 about its parallel to the

Longitudinal axis of the base 3 extending axis of rotation are aligned in coordination with the orientation of the already arranged on the carrier 1 components. This means in the present embodiment that the square or

rectangular base surface of the pressure sensor 5 is brought by rotation about the axis of rotation in a spatial orientation, which coincides with the spatial orientation of the preferably identical, esp. Square or rectangular base surface of the recess 35 in the already mounted on the carrier 1 packing 31.

Since no space for receiving a pressure sensor 5 on the outside surrounding special tool is required on the outer sides of the pressure sensor 5, it is possible to arrange the components at a very small distance from the pressure sensor 5 on the support 1. In that regard, an existing between the component and the pressure sensor 5 gap 37 with a small gap width, esp. A gap width of 100 μιη to 300 μιη already sufficient.

Since the orientation of the pressure sensor 5 can be tuned to the orientations of already arranged in the immediate vicinity of the carrier 1 components, components can be provided in the immediate vicinity of the pressure sensor 5, their orientation on the carrier 1 by additional

Boundary conditions or can only be adapted to a very limited extent. An example of such boundary conditions are electrical connections 39 extending through the carrier 1 and the filling body 31 for the electrical connection of the pressure sensor 5, whose shape and position on the carrier 1 are to be taken into account as boundary conditions in the positioning and alignment of the filling body 31. The terminals 39 are formed in the illustrated embodiment as metallic pins, which are each electrically guided by a passage 41, for example, a glazing implementation, electrically insulated with respect to the carrier 1 through the carrier 1, pass through holes in the carrier 1 through and on the side facing away from the carrier 1 side of the filling body 31 are connected to provided on the pressure sensor 5 terminal contacts 43 of the pressure sensor 5 are connected. Alternatively, of course, other known to those skilled embodiments and / or Positioning of the terminals 39 may be provided, which extend at other locations through the packing 31 or across it.

1 carrier

3 sockets

5 pressure sensor

7 basic body

9 measuring membrane

1 1 pressure chamber

13 pressure transmission line

15 glazing

17 recess

19 end

21 gluing

23 freestanding base section

25 housing

27 pressure chamber

29 diaphragm seal

31 filler

33 coincidence

35 recess

37 gap

39 connections

41 implementation

43 connection contact

Claims

claims

1. Pressure measuring device, with

a support (1), in particular a support (1) made of a metal, in particular of a stainless steel,

- One on the support (1) provided a freestanding base portion (23) comprising the base (3), and

a pressure sensor (5) arranged on the base (3), the base area of which is greater than a base area of the base (5),

characterized in that

- The pressure sensor (5) on its side facing the carrier (1) has a recess (17) open towards the support (1), in which a cylindrical or hollow-cylindrical end (19) of the base (3) is arranged in the recess (17) ) is connected via an adhesive bond (21) with the pressure sensor (5).

2. Pressure measuring device according to claim 1, characterized in that

the recess (17) has a base surface that is slightly larger than the base surface of the base (3), esp. A base whose outer dimensions exceed the outer dimensions of the base of the end (19) of the base (3) to a degree that the Sum of the manufacturing tolerances associated with the manufacture of the base (3) and the manufacturing tolerances associated with the manufacture of the recess (17).

3. Pressure measuring device according to claim 1, characterized in that

the recess (17) has a depth parallel to the longitudinal axis of the base (3) which is equal to a sum of a layer thickness of the bond (21) extending over an end face of the base (3) facing the pressure sensor (5) and parallel to the longitudinal axis of the base Base (3) extending length of the recess extending in the end (19) of the base (3).

4. Pressure measuring device according to claim 1, characterized in that

the bond (21) is an adhesive applied with an epoxy-based adhesive, a thermoplastic adhesive or a silicone adhesive, in particular a silicone rubber.

5. Pressure measuring device according to claim 3 and 4, characterized in that

- The bond (21) one with an adhesive based on epoxy or a

thermoplastic adhesive executed bond (21) and has a layer thickness in the range of 10 μιη to 200 μιη, or

- The bond (21) is executed with a silicone adhesive bond (21) and has a layer thickness in the range of 50 μιη to 300 μιη.

6. Pressure measuring device according to claim 1, characterized in that

- In the recess (17) located end (19) of the base (3) has a length greater than or equal to 40 μιη, and

- The in the recess (17) located end (19) of the base (3) has a length of less than or equal to 200 μιη,

7. Pressure measuring device according to claim 1, characterized in that

- The base (3) comprises a free-standing base portion (23) extending from the support (1) to the recess (17) and at the end of the recess (17) arranged in the end (19) of the base (3) connects, and

- The free-standing pedestal portion (23) has a length which is greater than or equal to a few tenths of a millimeter, esp. A length of the order of 0.5 mm.

8. Pressure measuring device according to claim 1, characterized in that

- on the support (1) in the immediate vicinity of the base (3) and pressure sensor (5)

at least one component connected to the carrier (1) is provided, in particular a component whose orientation on the carrier (1) is restricted or predetermined by boundary conditions, and

- Between the component and the pressure sensor (5) a gap (37), esp. A gap (37) with a gap width of 100 μιη to 300 μιη, is provided.

9. Pressure measuring device according to claim 8, characterized in that

the component is a filler body (31), in particular a plastic filling body (31), in particular of polyphenylene sulfide (PPS) or of polybutylene terephthalate (PBT), or of ceramic, in particular of aluminum oxide (Al ₂ O ₃ ), which is an internal volume of the pressure sensor (5) on the outside surrounding pressure measuring chamber (27) reduced.

10. Pressure measuring device according to claim 9, characterized in that

- The filling body (31) has a parallel to the longitudinal axis of the base (3) through the filling body (31) extending through recess (35),

- The base (3) and the pressure sensor (5) in the recess (35) are arranged, and

- The recess (35) at the height of the pressure sensor (5) has a base area which is greater than the base surface of the pressure sensor (5), esp. A base surface which is formed the same shape to the base of the pressure sensor (5).

1 1. Pressure measuring device according to claim 9 or 10, characterized in that

electrical connections (39) are provided for the electrical connection of the pressure sensor (5) which extend through the carrier (1) and the filling body (31).

12. Pressure measuring device according to claim 1, characterized in that - The pressure sensor (5) has a square or rectangular base area in the order of 1 mm ² to 100 mm ² ,

- The base (3) has a circular or annular base with a

Outer diameter in the range of 0.5 mm to 7 mm,

- The carrier (1) in the housing (25) enclosed, the pressure sensor (5) on the outside on all sides surrounding pressure measuring chamber (27) to the outside, and / or

- Base (3) and support (1) are designed as separate components and the base (3) of an insulator, esp. Made of ceramic, esp. Alumina (Al2O3), silicon nitride (S13N4) or aluminum nitride (AIN) consists.

13. A method for producing a pressure measuring device according to claim 1, characterized in that the pressure sensor (5) on the base (3) is mounted by

Adhesive is applied to an end face of the base (3) facing the pressure sensor (5),

- The pressure sensor (5) on the base (3) is positioned and aligned, esp. By means of a placement machine from above on the base (3) is positioned and aligned, wherein

- The recess (17) acts as a positioning aid, the positioning of the

Pressure sensor (5) causes, in the one passing through the base center

Longitudinal axis of the base (3) through a center of the pressure sensor (5) leads, and

- The alignment by rotation of the pressure sensor (5) about a longitudinal axis of the base (3) corresponding axis of rotation takes place, and

- The bond (21) is generated, esp. By an adhesive-specific curing process is produced, esp. A method in which the assembly of base (3), adhesive and pressure sensor (5) is heated to a predetermined temperature or a predetermined Passes through temperature profile.

14. The method according to claim 13 for the preparation of a pressure measuring device according to claim 8, characterized in that the component prior to assembly of the

Pressure sensor (5) on the support (1) is arranged and the alignment of the pressure sensor (5) based on an alignment of already on the support (1) arranged component is made.