EP2184385A2 - Electrode et procédé pour une séparation de couche électrolytique - Google Patents

Electrode et procédé pour une séparation de couche électrolytique Download PDF

Info

Publication number
EP2184385A2
EP2184385A2 EP09010994A EP09010994A EP2184385A2 EP 2184385 A2 EP2184385 A2 EP 2184385A2 EP 09010994 A EP09010994 A EP 09010994A EP 09010994 A EP09010994 A EP 09010994A EP 2184385 A2 EP2184385 A2 EP 2184385A2
Authority
EP
European Patent Office
Prior art keywords
electrode
deposition
sub
control unit
deposited
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP09010994A
Other languages
German (de)
English (en)
Inventor
Bardia Dr. Rostami
Jan Dr. Kruse
Thorsten Dr. Uelzen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zyrus Beteiligungs GmbH and Co Patente I KG
Original Assignee
IP Bewertungs AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by IP Bewertungs AG filed Critical IP Bewertungs AG
Publication of EP2184385A2 publication Critical patent/EP2184385A2/fr
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10Electrodes, e.g. composition, counter electrode
    • C25D17/12Shape or form
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00Processes for servicing or operating cells for electrolytic coating
    • C25D21/12Process control or regulation

Definitions

  • the invention relates to an electrode and a method for the electrolytic deposition of a layer.
  • electrolytic deposition processes are known from the prior art. These are based on conduction processes in liquids or gases.
  • the present invention preferably relates to conduction processes in liquids.
  • positively and / or negatively charged atoms or molecules, so-called ions migrate through the liquid.
  • Electrically conductive, liquid solutions which may have such ions are also called electrolytes.
  • two electrodes (usually called cathodes and anodes) are preferably immersed in the electrolyte. If these electrodes are connected to a voltage source, an electrolytic power line can take place.
  • electrolytic deposition By reduction, oxidation and / or redox reaction processes, a substance can be deposited on at least one electrode. This can also be referred to as electrolytic deposition.
  • Electrodes for the use of an electrodeposition are known from the prior art. For simple electrodes, their entire surface is also a deposition surface. In particular, such electrodes have no surface components which are not deposition surfaces.
  • a method of manufacturing a conductive polymer using an electrode having electrically conductive and electrically non-conductive sub-surfaces is known.
  • the conductive regions of this electrode correspond to a predetermined structure.
  • the predetermined structure of the conductive areas is therefore a constructive design feature of the electrode.
  • the electrode is thus constructed in such a way that its electrically conductive surfaces have the predeterminable structure.
  • the predefinable structure is therefore a design parameter for the production of the electrode as such.
  • the various layers are sequentially deposited on the at least substantially the same area of the electrode. It is therefore preferred that differently configured and / or structured layers can be deposited on one and the same area of the electrode. It can also be provided that the structure of the layer to be deposited is not structurally predetermined by the production of the electrode as such. In other words, it is preferred that fabric layers on or on an electrode can be deposited flexibly with respect to their structure, shape, geometry and / or thickness on the electrode or with the method.
  • the object of the invention is achieved by an electrode with the features of claim 1 and / or by a method having the features of claim 7.
  • an electrode in particular for an electrolytic deposition method, is characterized in that the electrode has a plurality of sub-surfaces which are electrically insulated from one another and in that the sub-surfaces, in particular separately and / or in groups, can be controlled, in particular switched, by a control unit, in particular in each case an electrical potential can be connected.
  • the electrode may be configured very similar to an electrode for an electrodeposition process known in the art.
  • the electrode according to the invention has a plurality of mutually insulating, separate sub-surfaces. The sub-surfaces can each have one, in particular infinitesimal, small thickness.
  • the fact that the sub-surfaces are separated from one another in an electrically insulating manner may mean that the sub-surfaces as such are separated from each other in an electrically insulating manner.
  • the sub-surfaces can also be physically separated from each other electrically insulating.
  • the sub-surfaces are separated from one another in an electrically insulating manner, but that they can be electrically connected to one another by a different type and / or manner.
  • two or more sub-surfaces, in particular switchable be connectable by electrical line connections. It may therefore be preferred that the sub-surfaces are understood as individual elements, in particular decoupled from their connection elements.
  • a preferred embodiment of the electrode is characterized in that a plurality of sub-surfaces in the adjoining regions are designed to be electrically insulating from one another. In other words, it is preferable that at least a plurality of the sub-surfaces are not directly electrically contacted with each other.
  • a preferred embodiment of the electrode is characterized in that the, in particular lateral, preferably opposite, abutting surfaces of the respective sub-surfaces are electrically isolated from each other by electrically insulating joints.
  • the electrically insulating joints can have an electrically insulating substance, in particular air.
  • An abutment surface may be a lateral edge of a partial surface.
  • a plurality of partial surfaces can be arranged laterally to a partial surface.
  • Each of these sub-surfaces may be disposed opposite to the one sub-surface. So also abutment surfaces of two sub-surfaces may be opposite.
  • the joints are preferably characterized by the fact that they are very narrow.
  • the joints may have a thickness adapted to the partial surfaces.
  • a joint may have the at least substantially the same thickness as a part surface in contact with the joint.
  • a further preferred embodiment of the electrode is characterized in that the electrode has an electrically insulating carrier.
  • the electrically insulating support may also be an electrically insulating core of the electrode. This can be particularly useful if the electrode has an at least substantially cylindrical shape, disc shape and / or round shape.
  • the electrically insulating carrier may comprise an electrically insulating substance.
  • the partial surfaces of the electrode may be firmly connected to the carrier.
  • the sub-surfaces can be positively, positively and / or materially connected to the carrier and / or the core.
  • the electrically insulating support and / or core can separate the sub-surfaces electrically insulating each other. The electrically insulating carrier and / or core can thus also form the electrically insulating joints.
  • a further preferred embodiment of the electrode is characterized in that the sub-surfaces of the electrode are electrically isolated from one another by electrically insulating ceramics and / or by electrically insulating plastics.
  • the joints and / or the electrically insulating core can also consist of an electrically insulating plastic and / or of an electrically insulating ceramic and / or have these in each case.
  • the electrode is also according to the invention characterized in that the sub-surfaces, in particular separately and / or in groups, by a control unit controllable, in particular switchable, in particular each having an electrical potential can be connected.
  • Each of the sub-surfaces can be connectable with in particular the same electrical potential.
  • the electrical potential is preferably that of a voltage source and / or current source meant. Such a voltage source may preferably have a plurality of mutually different potentials exhibit. These potentials may differ in particular in their voltage level.
  • different sub-surfaces can each be connected to different electrical voltage potentials. Which sub-surfaces are connected to which electrical voltage potential can be controlled by the control unit.
  • the sub-surfaces in particular separately and / or in groups, can be connected to an electrical potential by electrically switchable line connections.
  • a line connection can thus have a switch.
  • the switchable line connection and / or the switch can be controlled or switchable by the control unit. It is therefore controllable by the control unit, which of the sub-surfaces are connected to an electrical potential.
  • a particularly preferred embodiment of the invention is characterized in that the sub-surfaces of the electrode, in particular separately and / or in groups, on the back, in particular with electrical connection lines are connectable.
  • the back side of a partial surface may be the side on which no layer is to be deposited and / or which does not face another partial surface, in particular directly.
  • the sub-surfaces of the electrode are separated from one another in an electrically insulating manner, they can be electrically connected to one another in groups, in particular in each case 2, 3, 4 and / or more sub-surfaces, by means of rear-side connecting lines.
  • a preferred embodiment of the electrode is characterized in that the electrode is controllable by the control unit.
  • controllable may be meant a directed influencing of the state and / or the behavior of the electrode from the outside.
  • the electrical voltage state of a partial surface of the electrode can be influenced or controlled by the control unit.
  • the control unit can connect a partial surface with an electrical potential having a certain voltage, in particular in the range from 0 volts to 10,000 volts.
  • the current through the electrode and / or through at least one of the sub-surfaces in particular in a range from 0 amps to 100 amps, preferably from 0 amps to 10 amps, can be controlled and / or regulated.
  • control unit can influence the behavior of the electrode, especially from the outside.
  • the electrolytic deposition on a partial surface of the electrode may depend on the electrical potential with which the partial surface connected, in particular controllably connected by the control unit, is.
  • the electrolytic deposition of a substance on the partial surface of the electrode may depend on a voltage level of the electrical potential to which the partial surface is connected. It is therefore particularly preferred that the control unit the voltage level of a control electrical potential and / or can determine, in particular with what potential a partial surface is connectable.
  • a preferred embodiment of the electrode is characterized in that the electrode is controllable by the control unit in such a way that a current can be generated by those partial surfaces of the electrode, which can be connected to the, in particular respective, electrical potential.
  • the sub-surfaces are thus preferably designed electrically conductive. It is also conceivable that they are configured electrically semiconducting.
  • An electrical potential of a partial surface may be controllable by the control unit in such a way that a potential difference arises between the electrical potential of the partial surface and a further electrical potential. If a substance allows a charge carrier transport between the two electrical potentials, a current can be generated and / or also controlled by controlling the electrical potential of the partial surface. In principle, therefore, the electrode can be controlled by the control unit. This can be attributed to the fact that sub-surfaces of the electrode can be controllably connected to an electrical potential. As a result, the current through a partial surface of the electrode can also be controlled by the control unit.
  • the electrode is particularly preferably suitable for depositing a layer on the deposition surfaces. If two deposition surfaces, in particular directly, are arranged next to one another, it may be advantageous if these deposition surfaces are arranged in relation to one another such that the layers connect to these deposition surfaces, in particular during the deposition. In other words, it may be advantageous if an at least electrically continuous layer can be deposited on, in particular directly, deposition surfaces arranged next to one another.
  • a preferred embodiment of the electrode is characterized in that a distance A between two, in particular lateral, preferably opposing abutment surfaces of the respective sub-surfaces to a layer thickness D of a layer to be deposited electrolytically on the electrode in a ratio of 2 * D ⁇ A and / or A> D is configured.
  • a further embodiment of the electrode is characterized in that the distance A between two points, one on, in particular lateral, preferably opposite, especially perpendicular, abutting surfaces or abutting edges of the respective sub-surfaces to the layer thickness D of an electrode to be deposited electrolytically on the electrode Layer in a ratio of 2D ⁇ A and / or A> D is configured.
  • the distance A can be the average distance between two abutment surfaces and / or abutting edges.
  • the distance A is the maximum distance.
  • the distance A for the ratio A> D is the minimum distance.
  • layers can grow continuously during the electrolytic deposition, radially outward. Outwardly may mean here that the layers can not grow into the electrode, in particular not in the deposition surface and / or joint.
  • the growth of a layer through the surface of the electrode, in particular through the sub-surfaces and / or joints may be limited in its local propagation. Nevertheless, a layer may grow from a partial surface, preferably a deposition surface, beginning over and / or over the joint.
  • the distance between the deposition surfaces should be such that the layers growing during the electrolytic deposition meet one another.
  • the distance between the sub-surfaces should also be designed so that a layer can not grow so far that it can bridge and / or overgrow a joint alone, so that two sub-surfaces are electrically contacted with each other.
  • the electrode preferably has line connections.
  • further electrical line connections can lead from the electrode to the control unit and / or to an electrical potential.
  • the electrode may have a main connection.
  • the main connection may be an interface between the electrode and other elements, for example a line connection to an electrical potential and / or to the control unit.
  • the main terminal may be an element of a quick connect device.
  • the quick connect device may be a mating and / or braceable connection device.
  • the lead connections of the electrode may connect a terminal of the main terminal to at least a partial surface of the electrode.
  • electrodes can be designed differently in their size and in particular in their surface. Electrodes having a large surface area may also at least cumulatively have a large deposition surface. From this, at least cumulatively, large currents can arise. In order to avoid electrical losses at high currents, electrical lines through which these high currents are intended to flow are usually increased in their effective cross section. If high currents are to flow through the sub-surfaces of the electrode, the line connections of the electrode can be correspondingly large, in particular in their Cross section, be adapted. The electrical line connections can also, in particular in each case, have an electrical insulation to another, in particular adjacent, electrical line connection of the electrode. It may therefore also be an object of the invention to design the electrode as compact as possible.
  • a preferred embodiment of the electrode is characterized in that the electrode and / or its core has at least one transistor, in particular field-effect transistor, preferably metal-oxide-semiconductor field-effect transistor.
  • one of the in particular a plurality of transistors can connect one or more sub-surfaces of the electrode to an electrical potential.
  • Such a transistor may be controllable and / or switchable by the control unit.
  • a terminal of the transistor may be connected to a partial surface of the electrode.
  • Another terminal of the transistor may be electrically connected to an electrical potential.
  • a further terminal of the transistor, in particular the control terminal of the transistor can be connected to the control unit, in particular in an electrically conductive manner.
  • the transistor can therefore act like a switch which can be switched by the control unit and can connect at least one partial surface of the electrode to an electrical potential.
  • the transistor is a FET and / or MOSFET transistor
  • its source electrode may be connected to an electrical potential, its drain electrode to at least a partial surface of the electrode and / or its gate electrode to the control unit.
  • a partial surface of the electrode, a transistor electrode, in particular the source electrode of a MOSFET transistor at least be proportionate.
  • a further preferred embodiment of the electrode is characterized in that the electrode has at least one power line and at least one control line. Particularly preferably, the electrode has a power line and a plurality of control lines. Thus, the power line may be electrically connected to at least one of the transistors.
  • such a power line can also be a transistor electrode, in particular a source electrode, at least partially.
  • a power output for a plurality of transistors may each form a transistor electrode.
  • the power line can also act as "supply line" and / or be configured.
  • one of the control lines can be connected to a control electrode of a transistor and / or to a plurality of control electrodes of a plurality of transistors.
  • the at least one power line and / or the at least one control line can be connected to the main terminal of the electrode.
  • the electrode can be designed very compact.
  • the power line may have the same cross-section as several separate line connections to the sub-surfaces, the separate line connections are preferably electrically isolated from one another. Such insulation can be omitted in the power line.
  • the electrode may have a smaller volume with a comparable surface. The electrode can therefore be more compact. This advantage also exists considering the control lines. Because by the control lines when driving a transistor as well as no electricity or a very small current flows. The control lines can therefore have a very small cross-section compared to power lines.
  • Electrodes are known for electrolytic deposition processes. Common to these electrodes is that the structure, shape and / or geometry of the substance to be electrodeposited or of the layer to be electrodeposited determines the surface configuration of an electrode. Such an electrode can therefore not be used for a variety of electrolytic deposition processes, wherein different layers, namely its structure, shape and / or geometry to be deposited, to be. It is therefore desirable to provide an electrode, in particular for an electrolytic deposition method, on which, in particular in terms of shape, geometry and / or structure, different layers and / or substances can be deposited. To illustrate the advantage of the electrode, an analog advantage is first explained by way of example on a computer screen. A computer screen has a plurality of so-called pixels.
  • Each pixel is a pixel on the screen.
  • These pixels can be controlled by a control unit in such a way that they each indicate a color. Furthermore, they can also be controlled so that images can be displayed in their synopsis. Similar advantages can also be achieved by the partial surfaces of the electrode.
  • the sub-surfaces of the electrode can be made so small in their surface, that any layers can be deposited on the electrode by a corresponding control. According to a layer to be deposited, the sub-surfaces corresponding thereto can be connected to at least one electrical potential.
  • the electrode therefore does not need to be adapted and / or configured during its production to a layer to be deposited. Rather, the electrode can be adapted to and / or configured for a multiplicity of layers to be deposited.
  • a method for the electrolytic deposition of a layer wherein the method is characterized in that an electrode, in particular one which has at least one of the advantages and / or features explained above, and / or in particular one in one of the previously mentioned embodiments, is brought into contact with an electrolyte, the electrode having a plurality of partial surfaces, and in that a control unit has a plurality of the partial surfaces of the partial surfaces Driving electrode as deposition surfaces in such a way that a voltage is applied between the deposition surfaces and at least one counter electrode.
  • An electrode suitable for this purpose has already been described above. It was also explained how the control unit can be connected to the electrode. In principle, several or even all of the sub-surfaces can be connected to an electrical potential.
  • one or more of the sub-surfaces are not connected to an electrical potential.
  • the sub-surfaces not connected to an electrical potential may be separated from an electrical potential by an open switch. But they can also be separated in general by a broken line connection of an electrical potential.
  • the deposition surfaces may thus be a subset of the sub-surfaces of the electrodes. In principle, it is preferred that each of the sub-surfaces can also be deposition surface. It is the control unit that can control which of the sub-surfaces are also deposition surfaces.
  • the control unit may for this purpose connect those sub-surfaces, which are also intended to be deposition surface, to an electrical potential which differs from a potential of a counterelectrode, such that an electrical voltage is present between the deposition surfaces and the at least one counterelectrode.
  • the voltages of the deposition surfaces and / or the counterelectrode may be selected depending on the substance to be deposited and / or depending on the manner in which the electrolytic deposition is to take place.
  • the voltages of the deposition surfaces and / or the counterelectrode may be selected.
  • the voltage of the respective deposition surfaces is higher than the voltage of a counter electrode.
  • the voltage of the counter electrode is lower than a voltage of the respective deposition surface.
  • the height of the stress of a respective deposition surface differ from each other.
  • a higher voltage can be selected for a deposition surface if a thicker layer is to be deposited thereon for a same time in which a comparatively thinner layer can be deposited on an equally sized deposition surface with a lower voltage level.
  • the deposition surfaces can be characterized in that they are traversed by a current in each case in the same direction, in particular current direction.
  • a flow direction may preferably point to or from a deposition surface.
  • the same applies generally to a sub-surface. Partial surfaces of the electrode, which are opposed by a current towards the current direction through the deposition directions A current flowing through the set current direction are preferably no deposition surfaces. They preferably form the counter electrode. It is also particularly preferred that no layer be deposited electrolytically on these sub-surfaces and / or on the surfaces which are not connected to an electrical potential.
  • the method is also characterized in that a control unit controls a plurality of the sub-surfaces of the electrode as deposition surfaces in such a way that a voltage is applied between the deposition surfaces and at least one counter electrode so that a current flows through the deposition surfaces and that on the deposition surfaces respectively a layer of at least one substance of the electrolyte, in particular electrolytically, is deposited.
  • Application of a voltage between a deposition surface and a counterelectrode can be achieved by the control unit in such a way that different potentials with different levels of voltage are connected to and / or connected to a deposition surface and to a counterelectrode.
  • an electrical potential difference between a deposition surface and the counter electrode can form.
  • a current through the deposition surfaces is cause.
  • the current direction can be determined by the choice of voltage. By reversing the voltage and / or the potential difference (in particular with opposite signs), the current can also flow in the reverse (in particular in the opposite) current direction. This may also depend on the electrolyte and / or the substance to be deposited.
  • a substance can be electrolytically deposited from the electrolyte on a deposition surface. It is particularly preferred that the substance is deposited from the electrolyte at least substantially only on the deposition surfaces.
  • the sub-surfaces of the electrode which are not deposition surfaces, may not be traversed by a current and / or at least not in the same direction through which a current flows, such as the deposition surfaces.
  • the height of the voltage of a partial surface preferably by the control unit, is variable.
  • the control unit adjusts the tension of the sub-surfaces in such a way that the sub-surfaces all have the same sign in their tension.
  • the control unit may control the electrodes in such a way that it can connect a partial surface of the electrode to an electrical potential and / or that it can change the level of such an electrical potential.
  • the control unit can do this by control lines with a voltage source and / or with the at least one Potential, in particular the voltage source to be connected. Further, the control unit may send control signals over the control lines to vary and / or control the magnitude of the voltage of a potential.
  • the control unit can set at least one switch between the deposition surfaces and the at least one electrical potential. These switches may be semiconductor transistors. The deposition surfaces may be connected separately and / or in groups by such a switch switchable with one of the electrical potentials. The switches may be connected by control lines to the control unit. In addition, the control unit can switch and / or control the switches by means of control signals. Thus, it can control the control unit on which partial surfaces a deposition takes place.
  • the deposition of the substance from the electrolyte then preferably takes place at least substantially only on the deposition surfaces.
  • the process of the actual deposition basically corresponds to a known from the prior art deposition. In this sense, for example, a method for the electrolytic deposition of an electrically conductive polymer layer from the document EP 1 289 031 known.
  • a preferred embodiment of the method is characterized in that in the electrolyte polymerizable and / or crosslinkable compounds, in particular monomers, are introduced. It may also be preferred that metallic substances are introduced into the electrolyte.
  • a polymer layer and / or a metal layer can be deposited. It is also possible that layers with different materials can be deposited by the method and / or with the electrode. These deposits can preferably take place one after the other.
  • the method can be carried out one after the other with different electrolytes.
  • a polymer can first be deposited on the electrode. Thereafter, the process can be carried out with a different electrolyte.
  • This electrolyte may, for example, comprise a metallic substance.
  • a metallic layer can be deposited.
  • the metallic layer can be deposited on the previously deposited polymer layer.
  • different deposition surfaces are selected for the deposition of different layers.
  • conduction paths and / or elements of integrated circuits can be deposited successively, in particular at different or at least partially different locations and / or regions. This production method is particularly advantageous because even very thin layers can be deposited by the method according to the invention.
  • the accuracy and / or the resolution of the layers to be deposited can be determined.
  • a further preferred embodiment of the method is characterized in that the control unit determines the deposition surfaces from the partial surfaces of the electrode, preferably by means of at least one control parameter.
  • the control unit determines the deposition surfaces before the control unit drives a plurality of the sub-surfaces of the electrode as deposition surfaces.
  • the control unit can use control parameters to determine the deposition surfaces from the sub-surfaces of the electrode. This is preferably a quantitative selection of whole sub-surfaces meant.
  • the control parameter may be distinguished by the fact that the control parameter, in particular location-dependent information and / or values, has the thickness, the structure, the shape and / or the geometry of the layer to be deposited.
  • control parameter may have multiple location values, with a value being tabulated for each location value indicating whether or not a layer is to be deposited at that location, and / or a value indicating the thickness of a layer on the location each place should be deposited.
  • a control parameter can have a multiplicity of such values and / or value vectors, which correlate a plurality of values to one another.
  • values of the control parameter may be associated with fixed locations on the electrode. It is also possible for the values of a control parameter to be associated with an, in particular fixed, sequence of the sub-surfaces of the electrode.
  • the values of a control parameter can indicate the switching state of a switch that can be connected to, in particular, a corresponding, partial surface.
  • the values of a value parameter can also indicate the height of the voltage of a partial surface, in particular wherein the partial surfaces can be connected to the corresponding voltages by the control unit. It is also possible that the values of a value parameter indicate the magnitude of the current of a sub-surface, in particular wherein the control unit controls and / or regulates the corresponding current through the sub-surface. Furthermore, the values of a value parameter may be correlated with a time corresponding, for example, to the duration of a voltage and / or the duration of a current. In principle, the voltages and / or the currents may also be pulsed. For a preferred embodiment, the values of a value parameter indicate a period duration, a pulse width and / or a duty cycle.
  • a further preferred embodiment of the method is characterized in that the control unit, preferably based on the control parameters, from the sub-surfaces of the electrode, which are not at the same time one of the deposition surfaces, determines open spaces on which at least substantially no substance from the electrolyte, in particular electrolytically , should be deposited. This can especially useful if an electrode is only partially brought into contact with an electrolyte.
  • the control of the electrode may be limited or tuned to the region which is or is to be contacted with the electrolyte.
  • a further preferred embodiment of the method is characterized in that the control unit, in particular on the basis of the control parameter, setpoints for the electrical voltages, in particular for their duration and / or preferably for their height, and / or desired values for the currents through the deposition surfaces, in particular for the duration thereof and / or preferably for the amount thereof, determined and / or in particular thereafter controlled and / or regulated.
  • the electrical voltages are meant in particular those voltages which are applied between the deposition surfaces and the at least one counter electrode.
  • the control parameter can have tabulated and / or shown values for each partial surface and / or for each deposition surface, one value corresponding to the duration of the voltage and / or one value each to the height of the voltage.
  • the control parameter can also have analog values for the currents. Thus, values can be tabulated for each partial surface of the electrode and / or for each deposition surface, one value corresponding to the duration and / or one value corresponding to the height of the desired current.
  • the setpoint variables for the electrical voltage and / or for the current can be determined by the control unit from the control parameter. In addition, the control unit can control and / or regulate the electrical voltage and / or the current through the deposition surfaces on the basis of the desired values using the control parameter. The setpoints may have previously been determined by the control unit based on the control parameters.
  • control unit may comprise sensors which measure the voltage and / or the current and / or in particular the flowed charge through the deposition surfaces, but at least through one of the deposition surfaces.
  • the measured quantities can be transmitted to the control unit.
  • the control unit can compare the measured variables with the desired values and adjust the electrical voltage and / or the current through the deposition surfaces accordingly, so that the measured variables correspond to the desired values.
  • a preferred embodiment of the method is characterized in that the control unit on the basis of the control parameter one or more sub-surfaces, preferably the deposition surfaces, in particular groups, each by line connection and / or by at least one controllable switch, in particular in each case, connects to a voltage source.
  • the control parameter may have tabulated to each sub-surface of the electrode parameters that allow the control unit to determine the deposition surfaces from the sub-surfaces. Further, the control parameter may also have tabulated values for the sub-surfaces indicating which sub-surfaces are a group. This group can be connected in groups by the control unit and / or by the at least one controllable switch.
  • the deposition surfaces and / or the grouped deposition surfaces can each be connectable to a voltage source and / or to an electrical potential of a voltage source.
  • the switch can be switched by the control unit in such a way that electrically conductive line connections are made.
  • a further preferred embodiment of the method is characterized in that the control unit controls the deposition surfaces and the free surfaces in such a way that a voltage is applied between the deposition surfaces and at least one of the free surfaces so that a current flows through the deposition surfaces and that on the deposition surfaces in each case a layer of at least one substance of the electrolyte is deposited.
  • the counter electrode is formed by at least one of the partial surfaces of the electrode which is not one of the deposition surface and / or which is an open surface.
  • the counterelectrode can be formed by partial surfaces of the electrode.
  • the counterelectrode can also have several sub-surfaces.
  • a current through a partial surface which is also a deposition surface, can consist of a plurality of partial flows of a plurality of partial surfaces, which in turn, in particular proportionally, are currents through the partial surfaces of the counterelectrode.
  • a further preferred embodiment of the method is characterized in that a voltage between the deposition surface and the sub-surface of the counter electrode is designed or applied in such a way that an electrolytic deposition takes place at least substantially only on the deposition surfaces.
  • Partial surfaces of the counterelectrode are preferably the partial surfaces of the electrode which form the counterelectrode.
  • the voltage difference between the deposition surfaces and the sub-surfaces of the counterelectrode can be greater than zero or less than zero.
  • the stress between the deposition surfaces and the sub-surfaces of the counter electrode are preferably not at least substantially equal to zero and / or preferably at least substantially not zero.
  • FIG. 1 a cross section of a section of an electrode 2 is shown.
  • the electrode 2 has a plurality of electrically isolated partial surfaces 4 separated from each other.
  • the multiple sub-surfaces 4 are separated from each other by the electrically insulating joints 6 .
  • the partial surface 4 may have a certain partial surface layer thickness 8 .
  • the partial surface layer thickness 8 is preferably very small.
  • the sub-surfaces 4 and the joints 6 form the functional surface 14 of the electrode 2 .
  • the functional surface 14 can be delimited from the passive surface 16 of the electrode 2 in that no electrolytic deposition takes place on the passive surface 16 and / or is provided.
  • the functional surface 14 and the passive surface 16 may be contacted with an electrolyte for electrodeposition.
  • the electrode 2 also has a core 12 .
  • the core 12 is designed at least partially electrically insulating. However, this does not apply to the line connections 10 disposed in the core 12 .
  • Each of the sub-surfaces 4 is connected to a separate line connection 10 .
  • each of the line connections 10 may be connected to a main terminal of the electrode 2 .
  • the main terminal is in FIG. 1 Not shown.
  • One of the preferred essential advantages of the electrode 2 is the electrically insulating separation of the partial surfaces 4 .
  • the sub-surfaces 4 are separated by the joints 6 and / or electrically isolated from each other.
  • the sub-surfaces 4 are not electrically connected.
  • the core 12 is insulating.
  • two or more sub-surfaces 4 may be electrically connected to each other by electrical line connections. Several of the sub-surfaces can thus be electrically connected and therefore grouped. This connection can be controlled by a control unit and / or controlled switchable.
  • the sub-surfaces 4 are significantly larger in cross section than the joints 6 in their cross section.
  • the cross section of a joint is significantly smaller than a cross section of a partial surface 4 .
  • completely scattered structures can be produced.
  • the insulating regions, preferably the joints 6 can be very wide in relation to the partial surfaces 4 .
  • FIG. 2 a sectional view of a multi-layered core 12 of an electrode 2 is shown.
  • the electrode has a plurality of partial surfaces 4 .
  • the multiple sub-surfaces 4 are each separated electrically insulated by joints 6 .
  • the core 12 of the electrode 2 is multi-layered.
  • the electrode 2 off FIG. 2 has seven layers 18 . These layers 18 are continuously designated by 18 a to 18 g.
  • Each layer 18 of the core 12 may include electrically conductive regions 22 and electrically insulating regions 20 .
  • the standing in contact with the sub-surface 4 layer 18 a of the core 12 may be configured in such a way that the electrically insulating portions 20 are at least in the joints and / or that electrically conductive portions 22 of the layer 18 a in the region of the sub-surfaces. 4 are.
  • the electrically conductive regions 22 of a layer 18 of the core 12 are configured in such a way that one of the electrical regions 22 is contacted only with, in particular, a partial surface 4 and, in particular, another electrically conductive region 22 , preferably electrically , and / or that in each case one of the electrical regions 22 only with, in particular exactly, two other, preferably not contacted, electrically conductive regions 22 , in particular in each case one layer of the core, in particular wherein the layers are not directly adjacent, and / or each one of the electrical regions 22 only, in particular, a terminal, in particular a main terminal, and, in particular, another electrically conductive region 22 , preferably electrically, is contacted.
  • the electrically conductive regions 22 of the layers 18 of the core 12 are designed in such a way that they do not electrically connect two or more sub-surfaces 4 to one another. It is preferred that an electrically conductive region 22 of one layer is contacted with an electrically conductive region 22 of another layer in such a way that the two electrically conductive regions 22 are electrically contacted with one another.
  • an electrically conductive region 22 a of the layer 18 a b may be electrically connected to the electrically conductive region 22 b of the layer eighteenth
  • the electrically conductive region 22 b is not electrically conductively connected to the electrically conductive region 22 c of the layer 18 c.
  • the uppermost part surface 4 a is electrically conductively connected to the electrically conductive region 22 b of the layer 18 b.
  • the electrically conductive region 22 b may also be connected to a connection, in particular to a main connection, of the electrode 2 .
  • the electrically conductive regions 22 and the electrically non-conductive regions 20 of the layers 18 a to 18 g can thus be designed in such a way that they form electrically conductive lines from the sub-surfaces 4 to a terminal of the electrode 2 .
  • These electrical line connections are each designed to be electrically insulating from each other. This electrical insulation is configured by the non-conductive regions 20 of the layers 18 .
  • the layers 18 of the core 12 can be applied successively and / or to one another.
  • This manufacturing principle is known from the prior art. In particular, this principle is used for the fabrication of transistors or integrated circuits.
  • the conductive regions 22 may for this purpose comprise a conductive substance, in particular a metallic substance and / or metal.
  • the non-conductive regions 20 are insulators. They have an insulating material. In particular, they may comprise an insulating polymer.
  • FIG. 3 a schematic representation of a device 24 with an electrode 2 and a control unit 26 is shown.
  • the electrode 2 has a plurality of electrically isolated partial surfaces 4 .
  • the sub-surfaces 4 are electrically insulated from each other by the joints 6 and by the core 12 of the electrode 2 .
  • the partial surfaces 4 can be connected to a voltage source 28 .
  • Each of the sub-surfaces 4 can be connected by an electrical line connection 10 to an electrical potential of the voltage source 28 .
  • These connections can be controlled and / or switched by the control unit 26 .
  • the device 24 has for this purpose a plurality of switches 32 .
  • the switches 32 are controllable and / or switchable by the control unit 26 .
  • the control unit 26 can thus determine and / or control the switching state of a switch 32 .
  • the control unit 26 can thus also control which of the sub-surfaces 4 is connected by the electrical line connections 10 to an electrical potential of the voltage source 28 .
  • several, preferably all, sub-surfaces 4 can be connected to an electrical potential of the voltage source 28 .
  • Which of the sub-surfaces 4 are to be connected to an electrical potential of the voltage source can be specified to the control unit.
  • the control unit 26 is connected to a central unit 34 .
  • the central processing unit may be connected to the control unit 26 through a signal line connection 30 .
  • the central unit 34 can transmit control signals to the control unit 26 .
  • the central processing unit 34 may transmit a control parameter to the control unit 26 . This control parameter may also be transmitted through the signal line connection.
  • control unit controls and / or switches the switches 32 .
  • the control signals and / or the control parameters thus have information or values with which the desired values for the sub-surfaces 4 can be determined.
  • These target values may be the voltage of a partial surface 4 , the duration of the application of a voltage to a partial surface 4 and / or the current through a partial surface 4 .
  • the control unit 26 can control a plurality of part surfaces 4 as deposition surfaces in such a way that in each case a voltage is applied between the deposition surfaces 4 and the counter electrode 36th
  • the counter electrode 36 is connected through an electrical line connection 38 with an electrical potential of Voltage source 28 connected. This electrical potential deviates from the electrical potential with which the sub-surfaces can be connected.
  • the control unit may, for example, the partial surfaces O1 and O2 by closing the switches 32 a and 32 b connected to an electric potential of the voltage source 28th
  • the counter-electrode 36 is connected to a different from the aforementioned electrical potential electrical potential. Thus, there is an electrical potential difference between the partial surface o1 and the counter electrode.
  • the control unit 26 can thus control, through which of the sub-surfaces 4 a current flows and / or which of the sub-surfaces 4 are connected to an electrical potential of the voltage drops 28 .
  • FIG. 4 a surface pattern 40 of an electrode is shown.
  • the surface pattern is characterized by quadrangular and octagonal sub-surfaces 4 .
  • a quadrangular sub-surface is surrounded by four octagonal sub-surfaces.
  • the sub-surfaces 4 are each separated by joints 6 from each other.
  • FIG. 5 a cross section of a section of a coated electrode 2 is shown.
  • the sub-surfaces 4 are separated from each other by the joints 6 .
  • the sub-surfaces are arranged electrically insulating from each other.
  • the joints are electrically insulating.
  • an electrolytic deposition is characterized in that a layer of a substance of the electrolyte is deposited on the flow-through partial surfaces 4 of the electrode. This can also be referred to as electrolytic deposition.
  • the deposition takes place continuously, as long as a current flows through the sub-surfaces.
  • the layer grows continuously over time, in particular radially, outwardly and / or to the side.
  • the layer in the region of a boundary from a flow-through partial surface to a joint, the layer also grows radially, in particular also on and / or over the joint.
  • the thickness D of a layer 42 decreases quarter-cylinder-like.
  • the layer 42 has a radius R. This radius R corresponds at least substantially to the thickness D of the layer 42 .
  • a layer to be deposited can grow from a partial surface alone to another, in particular adjacent, partial surface. Since the layer 42, starting from the attachment point 44 , grows radially outward and sideways at the boundary between a part-surface 4, in particular a current flow, and a joint 6 , the layer 42 thus also grows over the joint. If the distance A of the joint is greater than the layer thickness D and / or as the radius R , this layer does not contact the directly adjacent part surface. However, if layers 4 are to be deposited electrolytically on directly adjacent sub-surfaces, it is preferred that these layers grow together. It is therefore preferred that these layers are contacted with each other.
  • the ratio of 2 * D ⁇ A must be taken into account when configuring the electrode. For two layers 42 , which each grow from a touchdown point 44 at the respective boundary over the same joint 6 , then meet above the joint 6 . This is especially true if the ratio is as follows: 2 * D> A. In this case, twice the layer thickness 2 * D and / or twice the radius 2 * R is greater than the distance A between the two directly adjacent sub-surfaces 4 . In this way, it is ensured that layers to be deposited electrolytically on directly adjacent sub-surfaces also come into contact. Furthermore, both ratios, namely 2 * D ⁇ A and A> D , can also be taken into account and / or realized for the design of the electrode. The distance A must therefore be chosen between the limits D and 2 * D.
  • FIG. 6 is a schematic representation of the links from the location values o1 to o25 shown with the sub-surfaces 4 of an electrode 2 .
  • the location value o1 refers to the sub-surface top left.
  • the place values are numbered.
  • the location values are preferably values of the control parameter.
  • Such a control parameter is in FIG. 7 shown.
  • To the individual place values o1 to o25 are in FIG. 7 the associated set values for the stresses on the sub-surfaces or the location values o1 to o25 are tabulated.
  • a voltage value of 1 is provided for the sub-surfaces which are associated with the location parameters o2, o5 , o8 and o9, o16 and o23 . All other location parameters have no voltage value.
  • control unit can control the electrode.
  • the control unit reads out the values of the control parameter. With the control parameter off FIG. 7
  • the control unit controls the electrode in such a way that the sub-surfaces o2, o5, o8, o9, o16 and o23 with be connected to an electrical potential. All other sub-surfaces are not connected to the electrical potential. If the electrode 2 is brought into contact with the electrolyte and a voltage can form to a counter electrode, an electrolytic deposition of the substance from the electrolyte takes place on the sub-surfaces which are connected to the electrical potential, namely the sub-surfaces o2, o5, o8, o9, o16 and o23.
  • FIG. 8 is a schematic representation of coated partial surfaces of an electrode shown. These sub-surfaces are the deposition surfaces 48 . Coated are the sub-surfaces or deposition surfaces 48 discussed with reference to FIG FIG. 6 and FIG. 7 connected to an electrical potential.
  • the joints 6 which are arranged between two deposition surfaces 48 , are at least partially covered by the electrodeposited layer. Directly adjacent deposition surfaces 48 are therefore connected by an at least substantially continuous deposited layer.
  • the deposited layer does not completely cover and / or extend the joints between a deposition surface 48 and a partial surface 4 , which is non-deposition surface, such that the layer does not contact the partial surfaces that are not deposition surfaces 48 .

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)
EP09010994A 2008-10-30 2009-08-27 Electrode et procédé pour une séparation de couche électrolytique Withdrawn EP2184385A2 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102008053865 2008-10-30

Publications (1)

Publication Number Publication Date
EP2184385A2 true EP2184385A2 (fr) 2010-05-12

Family

ID=41698182

Family Applications (1)

Application Number Title Priority Date Filing Date
EP09010994A Withdrawn EP2184385A2 (fr) 2008-10-30 2009-08-27 Electrode et procédé pour une séparation de couche électrolytique

Country Status (1)

Country Link
EP (1) EP2184385A2 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106034404A (zh) * 2014-02-19 2016-10-19 德诺拉工业有限公司 用于金属电解提取池的阳极结构

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1289031A2 (fr) 2001-08-24 2003-03-05 Technische Universität Braunschweig Méthode de fabrication d'une couche polymer conductive structurée

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1289031A2 (fr) 2001-08-24 2003-03-05 Technische Universität Braunschweig Méthode de fabrication d'une couche polymer conductive structurée

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106034404A (zh) * 2014-02-19 2016-10-19 德诺拉工业有限公司 用于金属电解提取池的阳极结构

Similar Documents

Publication Publication Date Title
DE10141056C2 (de) Verfahren und Vorrichtung zum elektrolytischen Behandeln von elektrisch leitfähigen Schichten in Durchlaufanlagen
DE10212144B4 (de) Transistoranordnung mit einer Struktur zur elektrischen Kontaktierung von Elektroden einer Trench-Transistorzelle
DE19717512C3 (de) Vorrichtung zum Galvanisieren von Leiterplatten unter konstanten Bedingungen in Durchlaufanlagen
DE10153171A1 (de) Verfahren und Vorrichtung zum elektrolytischen Behandeln von Teilen in Durchlaufanlagen
DE112016002153T5 (de) Verfahren zur Erzeugung von Chrom-plattierten Teilen und Chrom-Plattieranlage
DE10255858A1 (de) Fluidisches Mikrosystem mit feldformenden Passivierungsschichten auf Mikroelektroden
EP2064372A2 (fr) Procédé de revêtement électrophorétique de pièces à usiner et installation de revêtement
DE102008057066A1 (de) Wieder konfigurierbare Halbleitervorrichtung
EP2184385A2 (fr) Electrode et procédé pour une séparation de couche électrolytique
DE102005009544A1 (de) Bauelementanordnung mit einem Lasttransistor und einem Messtransistor
DE102009005374A1 (de) Durchzieh-Elektroabscheideanlage
DE19942556A1 (de) Elektrotauchlackiervorrichtung
DE102005051417A1 (de) Simulations- bzw. Layoutverfahren für vertikale Leistungstransistoren mit variierbarer Kanalweite und variierbarer Gate-Drain-Kapazität
EP1033420B1 (fr) Procédé et dispositif de grainage électrochimique de supports de couches sensibles à la lumière
DE112018007274B4 (de) Beschichtungsvorrichtung und Beschichtungssystem
DE102006044673B3 (de) Kontaktiereinheit für die galvanische Abscheidung, Galvanisiervorrichtung und Galvanisiersystem
EP3249079B1 (fr) Réacteur électrolytique
DE102009023769A1 (de) Verfahren und Vorrichtung zum gesteuerten elektrolytischen Behandeln von dünnen Schichten
DE102009023768A1 (de) Verfahren und Vorrichtung zum Steuern von elektrochemischen Oberflächenprozessen
DE10215463C1 (de) Durchlaufanlage und Verfahren zum elektrolytischen Metallisieren von Werkstück
DE102006048625B4 (de) Halbleiterbauelement
DE19940233C2 (de) Verfahren zur Elektrotauchlackierung von Automobilkarossen
WO2002053806A2 (fr) Procede et dispositif de revetement electrochimique
WO2001027358A1 (fr) Support servant a amener du courant a des pieces a traiter par voie electrolytique ou a des contre-electrodes et procede de traitement electrolytique de pieces
DE102005033784A1 (de) System zur galvanischen Abscheidung einer leitfähigen Schicht auf einem nichtleitfähigen Trägermaterial

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR

AX Request for extension of the european patent

Extension state: AL BA RS

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: ZYRUS BETEILIGUNGSGESELLSCHAFT MBH & CO. PATENTE I

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20130301