EP2168412A4 - HEAT DISTRACTION DEVICE WITH LINEAR HEAT DISPOSAL UNIT AND FANLESS LED LAMP WITH DEVICE - Google Patents
HEAT DISTRACTION DEVICE WITH LINEAR HEAT DISPOSAL UNIT AND FANLESS LED LAMP WITH DEVICEInfo
- Publication number
- EP2168412A4 EP2168412A4 EP08778534A EP08778534A EP2168412A4 EP 2168412 A4 EP2168412 A4 EP 2168412A4 EP 08778534 A EP08778534 A EP 08778534A EP 08778534 A EP08778534 A EP 08778534A EP 2168412 A4 EP2168412 A4 EP 2168412A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- heat dissipating
- led lamp
- linear
- fanless led
- unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/80—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with pins or wires
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/233—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating a spot light distribution, e.g. for substitution of reflector lamps
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
- F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/78—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with helically or spirally arranged fins or blades
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/022—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being wires or pins
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4056—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to additional heatsink
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20070067755 | 2007-07-05 | ||
KR20070071536 | 2007-07-18 | ||
KR20070071537 | 2007-07-18 | ||
PCT/KR2008/003870 WO2009005285A2 (en) | 2007-07-05 | 2008-07-01 | Heat dissipating device having linear heat dissipating unit and fanless led lamp using the device |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2168412A2 EP2168412A2 (en) | 2010-03-31 |
EP2168412A4 true EP2168412A4 (en) | 2011-04-27 |
Family
ID=40226664
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP08778534A Withdrawn EP2168412A4 (en) | 2007-07-05 | 2008-07-01 | HEAT DISTRACTION DEVICE WITH LINEAR HEAT DISPOSAL UNIT AND FANLESS LED LAMP WITH DEVICE |
Country Status (11)
Country | Link |
---|---|
US (1) | US20110012494A1 (ko) |
EP (1) | EP2168412A4 (ko) |
JP (1) | JP2010531536A (ko) |
KR (1) | KR100879716B1 (ko) |
CN (1) | CN101690441A (ko) |
AU (1) | AU2008271463B2 (ko) |
BR (1) | BRPI0811798A2 (ko) |
CA (1) | CA2691738A1 (ko) |
MX (1) | MX2009014221A (ko) |
WO (1) | WO2009005285A2 (ko) |
ZA (1) | ZA200909151B (ko) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5203031B2 (ja) * | 2008-04-28 | 2013-06-05 | 臼井国際産業株式会社 | 扁平コイル状フィン部材を有する伝熱面構造及びその製造方法 |
TWI357479B (en) * | 2008-11-28 | 2012-02-01 | Univ Nat Taiwan Science Tech | A thermal module for light source |
CN102032474B (zh) * | 2009-09-30 | 2013-04-24 | 富士迈半导体精密工业(上海)有限公司 | 发光二极管灯具 |
KR101146693B1 (ko) * | 2009-10-07 | 2012-05-23 | 김수경 | 엘이디(led) 램프의 방열구조 |
KR100951553B1 (ko) * | 2010-01-25 | 2010-04-09 | 엔 하이테크 주식회사 | 선형의 방열부재가 구비된 캐노피 등 |
KR101255221B1 (ko) * | 2011-12-09 | 2013-04-23 | 한국해양대학교 산학협력단 | Led 방폭등 방열 장치 |
KR101340411B1 (ko) * | 2013-09-04 | 2013-12-13 | 인지전기공업 주식회사 | Led조명기구용 히트싱크 |
CN103954155B (zh) * | 2014-05-09 | 2017-08-25 | 中国科学院工程热物理研究所 | 抗重力型螺旋盘管式非相变取热装置 |
US10598443B2 (en) * | 2015-07-06 | 2020-03-24 | General Electric Company | Thermal management system |
US10317020B1 (en) | 2015-11-03 | 2019-06-11 | Thomas McChesney | Paint color matching light |
CN106016206B (zh) * | 2016-06-22 | 2019-06-04 | 东莞市闻誉实业有限公司 | Led照明设备 |
CN105953191B (zh) * | 2016-06-22 | 2019-06-04 | 东莞市闻誉实业有限公司 | 散热灯具 |
CN105953197A (zh) * | 2016-06-22 | 2016-09-21 | 东莞市闻誉实业有限公司 | 具有高效散热器的led照明装置 |
CN106195950A (zh) * | 2016-08-12 | 2016-12-07 | 广东工业大学 | 一种散热器和灯具 |
EP3293453A1 (en) * | 2016-09-09 | 2018-03-14 | Valeo Iluminacion | Lighting device with a heat dissipation element |
JP2018141614A (ja) * | 2017-02-28 | 2018-09-13 | 三菱マテリアル株式会社 | 熱交換部材 |
JP7098954B2 (ja) * | 2018-02-21 | 2022-07-12 | 三菱マテリアル株式会社 | ヒートシンク |
WO2021025045A1 (ja) * | 2019-08-06 | 2021-02-11 | 三菱マテリアル株式会社 | ヒートシンク |
KR102275357B1 (ko) * | 2020-06-30 | 2021-07-09 | 주식회사 레딕스 | 히트파이프가 결합된 led 모듈장치 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006106840A1 (ja) * | 2005-03-30 | 2006-10-12 | Jisouken Co., Ltd. | ヒートシンクおよびその製造方法 |
EP1780804A1 (en) * | 2005-10-25 | 2007-05-02 | L&C Lighting Technology Corp. | LED device with an active heat-dissipation device |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06275746A (ja) * | 1993-03-18 | 1994-09-30 | Hitachi Ltd | 半導体装置 |
JPH1154676A (ja) * | 1997-08-07 | 1999-02-26 | Ebara Densen Kk | 放熱部品 |
US5927386A (en) * | 1998-08-24 | 1999-07-27 | Macase Industrial Group Ga., Inc. | Computer hard drive heat sink assembly |
KR20020079296A (ko) * | 2001-04-11 | 2002-10-19 | 주식회사 태림테크 | 히트파이프 및 그를 이용한 집적회로의 냉각장치 |
JP2005166578A (ja) * | 2003-12-05 | 2005-06-23 | Hamai Denkyu Kogyo Kk | 電球形ledランプ |
KR20040027642A (ko) * | 2004-02-19 | 2004-04-01 | (주) 케이티지 | 하이브리드 ic형 led 전등 |
CN1938847B (zh) * | 2004-03-31 | 2010-10-27 | 株式会社事业创造研究所 | 散热装置的制造方法 |
KR100684429B1 (ko) * | 2005-06-30 | 2007-02-16 | 서울반도체 주식회사 | 발광 다이오드 램프 |
JP4969973B2 (ja) * | 2005-11-16 | 2012-07-04 | 臼井国際産業株式会社 | ヒートシンク |
-
2008
- 2008-07-01 WO PCT/KR2008/003870 patent/WO2009005285A2/en active Application Filing
- 2008-07-01 JP JP2010514635A patent/JP2010531536A/ja active Pending
- 2008-07-01 AU AU2008271463A patent/AU2008271463B2/en not_active Ceased
- 2008-07-01 BR BRPI0811798-5A2A patent/BRPI0811798A2/pt not_active IP Right Cessation
- 2008-07-01 EP EP08778534A patent/EP2168412A4/en not_active Withdrawn
- 2008-07-01 CA CA002691738A patent/CA2691738A1/en not_active Abandoned
- 2008-07-01 MX MX2009014221A patent/MX2009014221A/es active IP Right Grant
- 2008-07-01 US US12/667,449 patent/US20110012494A1/en not_active Abandoned
- 2008-07-01 CN CN200880023129A patent/CN101690441A/zh active Pending
- 2008-07-02 KR KR1020080063729A patent/KR100879716B1/ko active IP Right Grant
-
2009
- 2009-12-22 ZA ZA2009/09151A patent/ZA200909151B/en unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006106840A1 (ja) * | 2005-03-30 | 2006-10-12 | Jisouken Co., Ltd. | ヒートシンクおよびその製造方法 |
EP1890330A1 (en) * | 2005-03-30 | 2008-02-20 | Jisouken Co., Ltd. | Heat sink and method of manufacturing the same |
EP1780804A1 (en) * | 2005-10-25 | 2007-05-02 | L&C Lighting Technology Corp. | LED device with an active heat-dissipation device |
Also Published As
Publication number | Publication date |
---|---|
WO2009005285A2 (en) | 2009-01-08 |
US20110012494A1 (en) | 2011-01-20 |
CA2691738A1 (en) | 2009-01-08 |
AU2008271463A1 (en) | 2009-01-08 |
EP2168412A2 (en) | 2010-03-31 |
WO2009005285A3 (en) | 2009-03-12 |
ZA200909151B (en) | 2011-02-23 |
KR100879716B1 (ko) | 2009-01-22 |
BRPI0811798A2 (pt) | 2014-11-11 |
MX2009014221A (es) | 2010-01-28 |
CN101690441A (zh) | 2010-03-31 |
AU2008271463B2 (en) | 2011-05-12 |
KR20090004673A (ko) | 2009-01-12 |
JP2010531536A (ja) | 2010-09-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20091223 |
|
AK | Designated contracting states |
Kind code of ref document: A2 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR |
|
AX | Request for extension of the european patent |
Extension state: AL BA MK RS |
|
A4 | Supplementary search report drawn up and despatched |
Effective date: 20110329 |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: F21V 29/00 20060101ALI20110323BHEP Ipc: H05K 7/20 20060101AFI20090130BHEP |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION HAS BEEN WITHDRAWN |
|
18W | Application withdrawn |
Effective date: 20111005 |