EP2158644B1 - Système de mise en contact - Google Patents

Système de mise en contact Download PDF

Info

Publication number
EP2158644B1
EP2158644B1 EP08760822.0A EP08760822A EP2158644B1 EP 2158644 B1 EP2158644 B1 EP 2158644B1 EP 08760822 A EP08760822 A EP 08760822A EP 2158644 B1 EP2158644 B1 EP 2158644B1
Authority
EP
European Patent Office
Prior art keywords
microphone
contacting
contacting area
forming
contacts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Not-in-force
Application number
EP08760822.0A
Other languages
German (de)
English (en)
Other versions
EP2158644A1 (fr
Inventor
Georg Busch
Alois Lensing
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gigaset Communications GmbH
Original Assignee
Gigaset Communications GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gigaset Communications GmbH filed Critical Gigaset Communications GmbH
Publication of EP2158644A1 publication Critical patent/EP2158644A1/fr
Application granted granted Critical
Publication of EP2158644B1 publication Critical patent/EP2158644B1/fr
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/06—Arranging circuit leads; Relieving strain on circuit leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2421—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
    • H01R13/405—Securing in non-demountable manner, e.g. moulding, riveting
    • H01R13/41—Securing in non-demountable manner, e.g. moulding, riveting by frictional grip in grommet, panel or base
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2410/00—Microphones

Definitions

  • the invention relates to a contacting system according to the preamble of claim 1.
  • microphones with a diameter less than or equal to 4 mm. These microphones have juxtaposed spring contacts on a bottom side for the electrical connection or the electrical contacting of the microphone. The electrical connection of the microphone takes place pressure-based with the help of the spring contacts.
  • Such microphones are used, for example, in mobile communication terminals.
  • the microphone is mounted on a material carrier, for example a printed circuit board of a said corresponding mobile communication terminal corresponding printed circuit board.
  • mating contacts for the spring contacts of the microphone for example, electrically insulated surface parts of a contacting region are provided. The microphone is then pressure-contacted on these surface parts, these surface parts are known to be made of gold.
  • a holding device for a built-in electronic part which is a holding part having an elastic body for receiving the built-in electronic part and an elastic connecting part having a conductive structure of magnetic, electrically conductive parts.
  • the holding part and the elastic connecting part are formed into one piece.
  • the built-in electronic part is a small microphone, a speaker or something like that.
  • connection assembly for connecting without having to spend a plug-in force.
  • the connection arrangement comprises a movable element which, after insertion of the contact region into a plug housing, serves to elastically deform the contacts by means of insertion of a rod and ensures contact production.
  • the contact area here consists of a circuit board and an insulating layer, which serves to cover the surface of the contact area and for insulation against the contact elements contained in the connector housing during insertion. At the contact points recesses are provided in the insulating layer.
  • the object of the present invention is, starting from a contacting system of the type mentioned above, to improve such a contacting system in such a way that it is less expensive and meets the contacting criteria with regard to mechanical stability, electrical contact safety and simple manufacturing and low assembly costs.
  • electrically insulated surface parts of a justifyleiters Kunststoffs are provided for contacting the disposed on a bottom spring contacts of the microphone as mating contacts, wherein the contacting region is formed by a multi-layer structure with depending on the location within the contacting different numbers of mounting positions.
  • the multi-layer structure for forming the mating contacts of the microphone forming surface parts a predetermined number of mounting positions and has the contact area between the mating contacts of the microphone forming surface parts a number of mounting positions, compared to the predetermined number of mounting positions for the formation of the Mating contacts forming surfaces parts increased by at least the number 1.
  • the contacting area to at least portions around the mating contacts forming surface parts around a multi-layer structure with superstructure positions in such a number compared to the predetermined number of mounting positions for the formation of the mating contacts forming surface parts increased by at least the number 1.
  • the predetermined number of mounting positions for the formation of the mating contacts forming surface parts has the number 1. This is the position which enables the electrically conductive contacting. It is not necessary to provide even more layers at these locations. In this way, the contacting system remains easy to manufacture and low in cost.
  • the uppermost layer of the multilayer structure of the contacting region at those locations of the contacting region on which the counter-contacts forming surface parts are formed is a carbon layer which is inexpensive, in particular, in relation to the material gold.
  • the contact resistances are higher in the case of a carbon layer than in the case of a gold layer, the electrical effects associated with the higher contact resistance can also be supported by a corresponding electronic control, for example the controlled setting of a corresponding amplification factor for the volume control, if appropriate also supported by a corresponding software control. be compensated without special expensive effort.
  • Short-circuit situations between the spring contacts of the microphone can be avoided in particular if the uppermost layer of the multilayer structure of the contacting region at those locations of the contacting region at which not the mating contacts forming surface parts are formed, an electrically insulating layer.
  • a particularly simple realization of such an insulating layer is the provision of said locations of an electrical insulating varnish, which can be applied without great difficulty.
  • the material carrier can also be a printed circuit board, for example a printed circuit board which is part of a printed circuit board.
  • the measures according to the invention are particularly effective in connection with microphones that have a diameter less than or equal to 4mm and have the spring contacts, which are formed as coil springs with diameters less than or equal to 0.6 mm.
  • a corresponding shaping of the substrate of the contacting region for a microphone for example by a corresponding design of a copper conductor image on the basis and the provision of stopper layers in the middle region of multi-layered mounting positions of the contacting region types of contacting wells are formed.
  • the copper layers which can be processed with low tolerances, also allow the use of carbon for surface areas for which very narrow tolerance limits also apply. Carbon itself does not allow compliance with such narrow tolerance limits. In connection with a corresponding copper conductor image, however, a "bleeding" of the carbon at the surface boundaries is practically prevented.
  • the contact springs of an associated microphone are held in the well structure thus formed.
  • This tub structure also has the further advantage that such close tolerances as are achievable and otherwise necessary in the use of gold counter contacts no longer have to be complied with. It is therefore no longer necessary to provide gold surfaces for the Gegenutton ist of very small or extremely small microphones.
  • Another advantage of the measures according to the invention is that the electrical contacts made therewith are moisture insensitive, in contrast to metallic contacts.
  • FIGS. 1A to 3C are each schematic representations.
  • the A figures each show a plan view of a respective contacting system in a perspective oblique view.
  • the B-figures each show a sectional view of the objects of the A-figures, and also in a perspective oblique view. In each case, the profile of the underlying contacting system resulting from the cut is essential.
  • the C figures each show a direct plan view of a respectively underlying contacting system.
  • FIGS. A, B and C each show a sectional view of an independent embodiment of a contacting system according to the invention in a perspective oblique view. In each case, the different profile is relevant.
  • FIGS. 1 to 3 Underlying contacting systems relate to the contacting of a diameter of 4 mm here in the microphone, which has juxtaposed spring contacts on its underside for making electrical contact with one of the present in the figures contacting systems.
  • the spring contacts of the microphone are as coil springs with a respective cross-sectional diameter formed of 0.6 mm.
  • the microphone itself is in the FIGS. 1A to 3C not shown in detail.
  • FIGS. 1A to 3C are mutually corresponding or equivalent parts provided with the same reference numerals.
  • the object shown is a contacting region 1, which is associated with the above-mentioned and not shown in the drawing microphone.
  • the contacting region 1 shown in each case is associated in particular with the spring contacts of the said microphone.
  • the contacting region 1 as a mating contacts for the said spring contacts of the said microphone from each other electrically insulated surface parts 2, 3.
  • the spring contacts of the microphone designed as spiral springs contact the surface parts 2, 3 formed as associated mating contacts, in each case centrally on the sections 4, 5 (FIG. FIGS. 1A, 1C ; 2A, 2C ).
  • these ideal contacting positions usually do not occur due to e-existing tolerance conditions and placement variations, but contacts are made in relation to the portions 4, 5 offset positions 6, 7, which are shown as placed in the figures only example placements are.
  • FIGS. 1A to 1C has the contacting region 1, in particular FIG. 1B shows a single layer layer structure.
  • the single-ply layer structure of the contacting system according to FIGS. 1A to 1C has in detail in an outer, the contacting region 1 further outwardly delimiting area section a stopper layer 8, which in the Figure 1C not shown in detail.
  • the surface parts 2, 3 serving as mating contacts for the spring contacts of the microphone are placed on the same plane as the stopper layer 8. In this case, these surface parts 2, 3 between them a separation 9, to allow mutual electrical insulation.
  • the surface parts 2, 3 are gold contact surfaces.
  • the contacting region 1 according to the FIGS. 2A to 3C a multi-layer structure with depending on the location within the contacting area 1 different numbers of body positions.
  • the multi-layer structure for forming the mating contacts of the microphone forming surface parts 2, 3 on a predetermined number of mounting positions Starting from this predetermined number of assembly positions, the contacting region 1 between the mating contacts of the microphone surface forming parts 2, 3, a number of assembly positions, compared to this predetermined number of mounting positions for the formation of the mating contacts forming surface parts 2, 3 by at least the number 1 is increased.
  • the contacting region 1 around at least portions around the mating contacts forming surface parts 2, 3 around also a multilayer structure with mounting positions in such a number, compared to the predetermined number of mounting positions for the formation of the mating contacts forming surface parts 2, 3rd increased by at least the number 1.
  • FIGS. 2B . 3A, 3B and 3C show a kind of well for contacting the spring contacts of the microphone on the mating contacts forming surface parts 2, 3 of the contacting 1.
  • this troughing takes place as many sides towards a centering of the spring contacts of the microphone on the mating contacts forming surface parts 2, 3rd
  • the predetermined number of mounting positions for the formation of the counterparts forming surface parts 2, 3 may be one, but it can also be larger in principle.
  • the mating contacts forming surface parts 2, 3 Due to the centering effect, the best possible constant contact resistance between the surface contacts 2, 3 forming the mating contacts and the spring contacts of the microphone is always obtained. It is therefore further possible for the mating contacts forming surface parts 2, 3 to use the material carbon.
  • carbon for the mating contacts forming surface parts 2, 3 in a contacting system according to the FIGS. 1A to 1C and contacting of the mating contacts forming surface parts 2, 3 at staggered points 6, 7 as it is in particular in the FIGS. 1A and 1C is displayed it would lead to significant fluctuations in the contact resistance, which would no longer be negligible disturbing due to an otherwise required very high amplification factor for the signals of the microphone.
  • the contact resistance remains sufficiently low even if the spring contacts of the microphone contact not more than 100% serving as mating contacts surface parts 2, 3, the total possible contact area but still close enough 100% lies. When using carbon, the contact resistance would immediately be too different.
  • FIGS. 2A to 2C show an uppermost layer of the multi-layer structure of the contacting region 1 at those locations of the contacting region 1, where the mating contacts forming surface parts 2, 3 are not formed, an electrically insulating layer 10, which is for example an insulating varnish.
  • additional copper and / or stop-coat layers 11, 12 and / or 13 can be provided below uppermost layers of the multilayer structure of the contacting region 1 at those locations of the contacting region 1 on which the counter-contacts forming surface parts 2, 3 are not formed.
  • copper conductor tracks 11 are realized towards the outer region of the contacting region 1
  • a copper conductor track 12 is realized in the middle region of the contact region 1, where the area regions 2, 3 serving as mating contacts are kept at a distance from one another.
  • a stopper layer 13 is realized.
  • the stopper layer 13 is realized in such a way that it on the one hand to the delimitation of the contacting region 1 outwardly behind the copper conductors 12 and on the other hand, the copper conductor 11 covering over the copper conductor 11 in the central region of the contacting region 1 is realized.
  • the layer structure of the contacting region 1 is still single-layered in the outer regions of the contacting region 1 perpendicular to the stop-coat layer 13, while the layer structure in the middle region of the contacting region 1 is already double-layered perpendicular to the copper conductor 11 with the stop-coat layer 13 realized thereon.
  • the insulating lacquer layer 10 is applied to the stop-coat layer 13.
  • the layer structure of the contacting region 1 is now double-layered in the outer regions of the contacting region 1 perpendicular to the stop-coat layer 13 and the insulating-lacquer layer 10 applied thereto, while the layer structure in the middle region of the contacting region 1 is perpendicular to the copper-conductor trace 11 with the stop-coat layer 13 realized thereon in turn realized insulation varnish 10 is now three layers.
  • the carbon pressure takes place, by means of which the surface parts 2, 3 serving as mating contacts are formed in the recesses between the middle and the outside region of the contacting region 1.
  • the carbon pressure covers each surface part 2 or 3 to the respective associated outer region of the contacting region 1 toward the respective existing copper conductor 12, via which the respective relevant surface part 2 or 3 is each separately electrically controlled.
  • the copper conductor track 12 concerned in each case with respect to the respective associated surface part 2 or 3 isolated from each other, as already assumed, is executed.
  • a variant of the contacting region 1 is realized such that the copper conductor track 11 provided in the middle region of the contacting region 1 is additionally designed to be increased.
  • the copper conductor tracks 12 arranged outwardly with respect to the contacting region 1 could also be made flat.
  • FIG. 3B 3A a further variant of the contacting region 1 is realized starting from the variant according to FIG. 3A, to the extent that the copper conductor tracks 12 arranged outwardly with respect to the contacting region 1 are formed so far into the surface that they are in each case below the respective surface parts 2, 3 are formed.
  • the contacting region 1 can be arranged on a material carrier not shown in the figures.
  • the material carrier may be a printed circuit board.
  • the printed circuit board can be part of a printed circuit board.

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Claims (14)

  1. Système de mise en contact présentant une zone de mise en contact pour la mise en contact d'un microphone très petit ou extrêmement petit, le microphone présentant des contacts à ressort disposés sur le côté inférieur du microphone, auxquels sont associées, en guise de contacts homologues, des parties de surface isolées électriquement les unes des autres de la zone de mise en contact,
    caractérisé en ce que la zone de mise en contact (1) est disposée sur un support de matériau et est formée par une structure multicouches avec des nombres différents de couches de structure en fonction de l'endroit au sein de la zone de mise en contact (1), en ce que la structure multicouches présente un nombre prescrit de couches de structure pour la formation des parties de surface (2 ; 3) formant les contacts homologues du microphone, et en ce que la zone de mise en contact (1) présente un nombre de couches de structure entre les parties de surface (2 ; 3) formant les contacts homologues du microphone, lequel est augmenté au moins du nombre de 1 par rapport au nombre prescrit de couches de structure pour la formation des parties de surface (2 ; 3) formant les contacts homologues, et en ce que la zone de mise en contact (1) présente une élévation entre les parties de surface (2 ; 3) formant les contacts homologues du microphone.
  2. Système de mise en contact selon la revendication 1,
    caractérisé en ce que la zone de mise en contact (1) présente, au moins tout autour de tronçons des parties de surface (2; 3) formant les contacts homologues, une structure multicouches avec des couches de structure d'un tel nombre, lequel est augmenté au moins du nombre de 1 par rapport au nombre prescrit de couches de structure pour la formation des parties de surface (2 ; 3) formant les contacts homologues.
  3. Système de mise en contact selon la revendication 1 ou 2, caractérisé en ce que le nombre prescrit de couches de structure pour la formation des parties de surface (2 ; 3) formant les contacts homologues est le nombre 1.
  4. Système de mise en contact selon l'une des revendications 1 à 2,
    caractérisé en ce qu'une couche supérieure de la structure multicouches de la zone de mise en contact est une couche de carbone dans ceux des endroits de la zone de mise en contact (1) auxquels sont formées les parties de surface (2 ; 3) formant les contacts homologues.
  5. Système de mise en contact selon la revendication 3,
    caractérisé en ce que la zone de mise en contact est une couche de carbone dans ceux des endroits de la zone de mise en contact (1) auxquels sont formées les parties de surface (2 ; 3) formant les contacts homologues.
  6. Système de mise en contact selon l'une des revendications 1 à 5,
    caractérisé en ce qu'une couche supérieure de la structure multicouches de la zone de mise en contact (1) est une couche isolante électriquement dans ceux des endroits de la zone de mise en contact (1) auxquels les parties de surface (2 ; 3) formant les contacts homologues ne sont pas formées.
  7. Système de mise en contact selon la revendication 6, caractérisé en ce que la couche isolante électriquement est une couche de vernis isolante (10).
  8. Système de mise en contact selon l'une des revendications 6 ou 7,
    caractérisé en ce que, en-dessous de couches supérieures de la structure multicouches de la zone de mise en contact (1), dans ceux des endroits de la zone de mise en contact (1) auxquels les parties de surface (2 ; 3) formant les contacts homologues ne sont pas formées, des couches supplémentaires en cuivre et/ou vernis épargne (11, 12 ; 13) sont disposées.
  9. Système de mise en contact selon la revendication 8, caractérisé en ce que le support de matériau est une carte de circuits imprimées.
  10. Système de mise en contact selon la revendication 9, caractérisé en ce que la carte de circuits imprimés est une partie d'un module plat.
  11. Système de mise en contact présentant une zone de mise en contact selon l'une des revendications 1 à 10 ainsi qu'un microphone avec des contacts à ressort agencés sur le côté inférieur du microphone.
  12. Système de mise en contact selon la revendication 11, caractérisé en ce que les contacts à ressort du microphone sont formés par des ressorts hélicoïdaux.
  13. Système de mise en contact selon l'une des revendications 11 à 12,
    caractérisé en ce que le diamètre du microphone est inférieur ou égal à 4 mm.
  14. Système de mise en contact selon la revendication 12 ou 13,
    caractérisé en ce que le diamètre des ressorts hélicoïdaux est inférieur ou égal à 0,6 mm.
EP08760822.0A 2007-06-28 2008-06-11 Système de mise en contact Not-in-force EP2158644B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE200710029854 DE102007029854B3 (de) 2007-06-28 2007-06-28 Kontaktierungssystem
PCT/EP2008/057266 WO2009000648A1 (fr) 2007-06-28 2008-06-11 Système de mise en contact

Publications (2)

Publication Number Publication Date
EP2158644A1 EP2158644A1 (fr) 2010-03-03
EP2158644B1 true EP2158644B1 (fr) 2015-04-01

Family

ID=39719220

Family Applications (1)

Application Number Title Priority Date Filing Date
EP08760822.0A Not-in-force EP2158644B1 (fr) 2007-06-28 2008-06-11 Système de mise en contact

Country Status (3)

Country Link
EP (1) EP2158644B1 (fr)
DE (1) DE102007029854B3 (fr)
WO (1) WO2009000648A1 (fr)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5236372A (en) 1991-02-20 1993-08-17 Nec Corporation No-insertion force connector assembly
JP3244448B2 (ja) * 1997-03-19 2002-01-07 富士高分子工業株式会社 導電性ゴム接点を使用した小型マイク組立品
JP3283226B2 (ja) * 1997-12-26 2002-05-20 ポリマテック株式会社 ホルダーの製造法
EP1326308B1 (fr) * 2000-09-22 2008-03-05 Shin-Etsu Polymer Co., Ltd. Element ressort, connecteur par pression, et porteur avec sonde destine a un element electroacoustique
GB0117227D0 (en) 2001-07-14 2001-09-05 Ibm Printed circuit for pin array connection
TW547805U (en) * 2002-10-22 2003-08-11 Benq Corp Connector
CN1327514C (zh) * 2003-10-01 2007-07-18 松下电器产业株式会社 配线衬底及其制造方法

Also Published As

Publication number Publication date
WO2009000648A1 (fr) 2008-12-31
DE102007029854B3 (de) 2008-12-11
EP2158644A1 (fr) 2010-03-03

Similar Documents

Publication Publication Date Title
EP2912728B1 (fr) Dispositif de contact
EP2201585B1 (fr) Composant électrique multicouche
EP0456987B1 (fr) Réglette de raccordement pour les télécommunications
EP2338207B1 (fr) Antenne pour balise rfid
DE1566981A1 (de) Halbleitereinheit und Verfahren zu deren Herstellung
DE102016009251A1 (de) Leiterplattenverbinder, Leiterplatte und Verfahren zum Zusammenbauen eines Leiterplattenverbinders
EP3114734B1 (fr) Connecteur électrique
DE19511300A1 (de) Antennenstruktur
EP3080871A1 (fr) Élément de mise en contact
WO2017220071A1 (fr) Élément de connexion de conducteur électrique
EP3066618B1 (fr) Module de circuits intégrés pour différentes techniques de connexion
EP3232454B1 (fr) Barre omnibus comprenant une pluralité de condensateurs à film
WO2013007575A1 (fr) Dispositif electrique
EP0980322B1 (fr) Circuit detecteur pour vehicules automobiles
EP3010095B1 (fr) Contact d'insertion
EP2158644B1 (fr) Système de mise en contact
EP2237378A1 (fr) Dispositif de contact
DE60037717T2 (de) Datenträger mit integriertem schaltkreis und übertragungsspule
EP2933804A1 (fr) Composant à induction
DE10124117C2 (de) Leiterplatine mit kontaktiertem SMD-Baustein sowie zugehöriger SMD-Baustein
EP1130687B1 (fr) Cable plat électrique avec trajets pliés électriquement conducteurs
DE102019113068A1 (de) Leiterplatte mit einer Steckverbindung
DE19738588B4 (de) Elektrisches Bauelement mit einer Umhüllung und mit einem in der Umhüllung angeordneten Anschlußbereich und Verfahren zur Herstellung eines solchen elektrischen Bauelements
DE19749119C2 (de) Elektrisches Verbindungssystem
EP3101741B1 (fr) Procédé de fabrication d'un agencement destiné à la liaison électroconductrice de connecteurs électriques et agencement ainsi fabriqué

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20091215

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR

AX Request for extension of the european patent

Extension state: AL BA MK RS

DAX Request for extension of the european patent (deleted)
17Q First examination report despatched

Effective date: 20130219

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

RIC1 Information provided on ipc code assigned before grant

Ipc: H04R 1/04 20060101ALI20141128BHEP

Ipc: H04R 1/06 20060101ALI20141128BHEP

Ipc: H01R 13/41 20060101ALI20141128BHEP

Ipc: H01R 13/24 20060101AFI20141128BHEP

INTG Intention to grant announced

Effective date: 20141217

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

Free format text: NOT ENGLISH

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

Free format text: LANGUAGE OF EP DOCUMENT: GERMAN

REG Reference to a national code

Ref country code: DE

Ref legal event code: R096

Ref document number: 502008012834

Country of ref document: DE

Effective date: 20150507

REG Reference to a national code

Ref country code: AT

Ref legal event code: REF

Ref document number: 719573

Country of ref document: AT

Kind code of ref document: T

Effective date: 20150515

RAP2 Party data changed (patent owner data changed or rights of a patent transferred)

Owner name: GIGASET COMMUNICATIONS GMBH

REG Reference to a national code

Ref country code: DE

Ref legal event code: R082

Ref document number: 502008012834

Country of ref document: DE

Representative=s name: MICHALSKI HUETTERMANN & PARTNER PATENTANWAELTE, DE

Ref country code: DE

Ref legal event code: R081

Ref document number: 502008012834

Country of ref document: DE

Owner name: GIGASET COMMUNICATIONS GMBH, DE

Free format text: FORMER OWNER: GIGASET COMMUNICATIONS GMBH, 81379 MUENCHEN, DE

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 8

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20150619

Year of fee payment: 8

Ref country code: GB

Payment date: 20150618

Year of fee payment: 8

REG Reference to a national code

Ref country code: NL

Ref legal event code: VDEP

Effective date: 20150401

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 20150619

Year of fee payment: 8

REG Reference to a national code

Ref country code: LT

Ref legal event code: MG4D

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: NL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20150401

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20150803

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20150401

Ref country code: NO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20150701

Ref country code: HR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20150401

Ref country code: LT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20150401

Ref country code: ES

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20150401

Ref country code: CZ

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20150401

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LV

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20150401

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20150702

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20150801

REG Reference to a national code

Ref country code: DE

Ref legal event code: R097

Ref document number: 502008012834

Country of ref document: DE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20150401

Ref country code: EE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20150401

Ref country code: MC

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20150401

Ref country code: IT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20150401

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: RO

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20150401

Ref country code: SK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20150401

Ref country code: LU

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20150611

Ref country code: PL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20150401

26N No opposition filed

Effective date: 20160105

REG Reference to a national code

Ref country code: IE

Ref legal event code: MM4A

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LI

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20150630

Ref country code: IE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20150611

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20150630

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20150401

REG Reference to a national code

Ref country code: AT

Ref legal event code: MM01

Ref document number: 719573

Country of ref document: AT

Kind code of ref document: T

Effective date: 20150611

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: AT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20150611

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20150401

REG Reference to a national code

Ref country code: DE

Ref legal event code: R119

Ref document number: 502008012834

Country of ref document: DE

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20160611

REG Reference to a national code

Ref country code: FR

Ref legal event code: ST

Effective date: 20170228

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20160630

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20170103

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: HU

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT; INVALID AB INITIO

Effective date: 20080611

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20160611

Ref country code: BG

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20150401

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CY

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20150401

Ref country code: SE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20150401

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20150630

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: TR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20150401