EP2158644A1 - Système de mise en contact - Google Patents

Système de mise en contact

Info

Publication number
EP2158644A1
EP2158644A1 EP08760822A EP08760822A EP2158644A1 EP 2158644 A1 EP2158644 A1 EP 2158644A1 EP 08760822 A EP08760822 A EP 08760822A EP 08760822 A EP08760822 A EP 08760822A EP 2158644 A1 EP2158644 A1 EP 2158644A1
Authority
EP
European Patent Office
Prior art keywords
contacting
surface parts
microphone
contact
mating contacts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP08760822A
Other languages
German (de)
English (en)
Other versions
EP2158644B1 (fr
Inventor
Georg Busch
Alois Lensing
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gigaset Communications GmbH
Original Assignee
Gigaset Communications GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gigaset Communications GmbH filed Critical Gigaset Communications GmbH
Publication of EP2158644A1 publication Critical patent/EP2158644A1/fr
Application granted granted Critical
Publication of EP2158644B1 publication Critical patent/EP2158644B1/fr
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/06—Arranging circuit leads; Relieving strain on circuit leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2421—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
    • H01R13/405—Securing in non-demountable manner, e.g. moulding, riveting
    • H01R13/41—Securing in non-demountable manner, e.g. moulding, riveting by frictional grip in grommet, panel or base
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2410/00—Microphones

Definitions

  • the invention relates to a contacting system according to the O-term of claim 1.
  • microphones with a diameter less than or equal to 4 mm. These microphones have juxtaposed spring contacts on a bottom side for the electrical connection or the electrical contacting of the microphone. The electrical connection of the microphone takes place pressure-based with the help of the spring contacts.
  • Such microphones are used, for example, in mobile communication terminals.
  • the microphone is mounted on a material carrier, for example a printed circuit board of a corresponding printed circuit board belonging to the corresponding printed circuit board.
  • a material carrier for example a printed circuit board of a corresponding printed circuit board belonging to the corresponding printed circuit board.
  • mutually electrically insulated surface parts of a contacting region are provided as mating contacts for the spring contacts of the microphone.
  • the microphone is then pressure-contacted on these surface parts, these surface parts being known to be made of gold.
  • a holding device for a built-in electronic part which is a HaI- Part having an elastic body for receiving the built-in electronic part and an elastic connecting part with a conductive structure of magnetic, electrically conductive parts.
  • the holding part and the elastic connecting part are formed into one piece.
  • the built-in electronic part is a small microphone, a speaker or something like that.
  • the object of the present invention is, starting from a contacting system of the type mentioned above, to improve such a contacting system in such a way that it is less expensive and meets the contacting criteria with regard to mechanical stability, electrical contact safety and simple manufacturing and low assembly costs.
  • electrically insulated surface portions of a contacting area are provided for contacting the spring contacts of the microphone arranged on a lower side as mating contacts, wherein the contacting area is formed by a multilayer construction with different numbers of mounting positions depending on the location within the contacting area.
  • the multi-layer structure for forming the mating contacts of the microphone forming surface parts on a predetermined number of mounting positions and has the contacting region between the mating contacts of the microphone surface forming a number of mounting positions, compared to the predetermined number of mounting positions for the formation of the the mating contacts forming surface parts is increased by at least the number 1.
  • the barrier prevents the spring contacts from being displaced or displaced by their unforeseen circumstances to such an extent that, for example, they both simultaneously reach one and the same counterpart contact surface part of the contacting region and thus cause a short circuit , Furthermore, it is prevented that both spring contacts of the microphone slip together so far that they touch each other and thus form a short circuit.
  • the contacting area to at least portions around the mating contacts forming surface parts around a multi-layer structure with superstructure positions in such a number compared to the predetermined number of mounting positions for the formation of the mating contacts forming surface parts increased by at least the number 1.
  • the predetermined number of mounting positions for the formation of the mating contacts forming surface parts has the number 1. This is the position which enables the electrically conductive contacting. It is not necessary to provide even more layers at these locations. In this way, the contacting system remains easy to manufacture and low in cost.
  • the uppermost layer of the multi-layer structure of the contacting region at those locations of the contacting region on which the counter-contacts forming surface parts are formed is a carbon layer, which is inexpensive, in particular with respect to the material gold.
  • the contact resistances are higher in a carbon layer than in a gold layer, the electrotechnical effects associated with the higher contact resistance may be assisted by a corresponding electrical control such as, for example, the controlled setting of a corresponding gain factor for the volume control Software control, be compensated without special expensive effort.
  • Short-circuit situations between the spring contacts of the microphone can be avoided in particular if the top position of the multilayer structure of the contacting region at those locations of the contacting region at which not the mating contacts forming surface parts are formed, an electrically insulating layer.
  • a particularly simple realization of such an insulating layer is the provision of said places of an electrical insulation varnish which can be applied without great difficulty.
  • the contacting region can be arranged on a material carrier, wherein the material carrier can advantageously also be a printed circuit board, for example a printed circuit board which is part of a printed circuit board.
  • the measures according to the invention are particularly effective in connection with microphones having a diameter less than or equal to 4mm and having spring contacts formed as helical springs with diameters less than or equal to 0.6 mm.
  • a corresponding shaping of the substrate of the contacting region for a microphone for example by a corresponding design of a copper conductor image on the basis and the provision of stopper layers in the middle region of multi-layered mounting positions of the contacting region types of contacting wells are formed.
  • the copper layers which can be processed with low tolerances, also allow the use of carbon for surface areas for which very narrow tolerance limits also apply. Carbon itself allows compliance with such narrow
  • Another advantage of the measures according to the invention is that the electrical contacts made therewith are moisture insensitive, in contrast to metallic contacts.
  • FIGS. 1A to 1C show a contacting system according to the prior art in three different views
  • FIGS. 2A to 2C show a first exemplary embodiment of a contacting system according to the invention in three different views
  • Figures 3A to 3C each further embodiments according to the invention in each case in a three-dimensional profile section.
  • FIGS. 1A to 3C are schematic representations, respectively.
  • the A figures each show a plan view of a respective contacting system in a perspective oblique view.
  • the B figures each show a sectional view of the objects of the A figures, and also in a perspective oblique view. What is essential in each case is the profile of the underlying contacting system that results from the cut.
  • the C figures each show a direct plan view of a respectively underlying contacting system.
  • FIGS. A, B and C each show a sectional view of an independent embodiment of a contacting system according to the invention in a perspective oblique view. In each case, the different profile is relevant.
  • the contacting systems on which the figures 1 to 3 are based relate to the contacting of a microphone 4 mm in diameter here, which has spring contacts disposed side by side on its underside for electrical contacting with one of the microphones shown here in the figures
  • the spring contacts of the microphone are designed as spiral springs with a respective cross-sectional Diameter of 0.6 mm formed.
  • the microphone itself is not shown in detail in Figures IA to 3C.
  • FIGS. 1A to 3C mutually corresponding or identical parts are provided with the same reference numerals.
  • the object shown in each case in FIGS. 1A to 3C is a contacting region 1, which is assigned to the microphone mentioned above and not shown in detail in the drawing.
  • the contacting region 1 shown in each case is associated in particular with the spring contacts of the said microphone.
  • the contacting region 1 as a mating contacts for the said spring contacts of said microphone rophons from each other electrically insulated surface parts 2, 3.
  • the contactors designed as spiral springs contact each other
  • the contacting region 1, in particular FIG. 1B, has a single layer layer structure.
  • the single-ply layer structure of the contacting system according to FIGS. 1A to 1C has, in detail, a stop-coat layer 8, which is not shown in greater detail in FIG. 1C in an outer region section which further delimits the contacting region 1 to the outside.
  • the surface parts 2, 3 serving as mating contacts for the spring contacts of the microphone are placed on the same plane as the stopper layer 8. In this case, these surface parts 2, 3 between them a separation 9, to allow mutual electrical insulation.
  • the surface parts 2, 3 are gold contact surfaces.
  • the contacting region 1 according to FIGS. 2A to 3C has a multi-layer structure with different numbers of mounting positions depending on the location within the contacting region 1.
  • the multi-layer structure for forming the mating contacts of the microphone forming surface parts 2, 3 on a predetermined number of mounting positions Starting from this predetermined number of assembly positions, the contacting region 1 between the mating contacts of the microphone surface forming parts 2, 3, a number of organizingla- gene, compared to this predetermined number of mounting positions for the formation of the mating contacts forming surface parts 2, 3 by at least the number 1 is increased.
  • Forming of the mating contacts forming surface parts 2, 3 is increased by at least the number 1.
  • This trough formation is after As many sides towards a centering of the spring contacts of the microphone on the mating contacts forming surface parts 2, 3rd
  • the predetermined number of mounting positions for the formation of the counterparts forming surface parts 2, 3 may be one, but it can also be larger in principle.
  • the mating contacts forming surface parts 2, 3 Due to the centering effect, the best possible constant contact resistance between the surface contacts 2, 3 forming the mating contacts and the spring contacts of the microphone is always obtained. It is therefore further possible for the mating contacts forming surface parts 2, 3 to use the material carbon.
  • carbon for the mating contacts forming surface parts 2, 3 in a Maisie- insurance system according to the figures IA to IC and the contact the face parts 2, 3 forming the mating contacts at offset locations 6, 7, as indicated in particular in FIGS. 1A and 1C would result in considerable fluctuations in the contact resistances, which would be due to an otherwise very high amplification factor the signals of the microphone no longer negligible would make disturbing noticeable.
  • the contact resistance remains sufficiently low even if the spring contacts of the microphone no longer contact 100% of the surface parts 2, 3 serving as mating contacts, but the total possible contacting surface still close enough at 100%. When carbon is used, the contact resistance would immediately be too different.
  • an o-highest position of the multilayer structure of the contacting region 1 at those locations of the contacting region 1 on which the counter-contacts forming surface parts 2, 3 are not formed may be an electrically insulating layer 10, for example, one Insulation lacquer layer is.
  • additional copper and / or stop-coat layers 11, 12 and 11 may be provided below uppermost layers of the multilayer structure of the contacting region 1 at those locations of the contacting region 1 where the mating contacts 2, 3 are not formed / or 13 be provided.
  • the stop-coat layer 13 is realized in such a way that, on the one hand, it delimits the contacting region 1 outwardly behind the copper conductor tracks 12 and on the other hand covers the copper conductor track 11 over the copper conductor track 11 in the middle region of the contacting region 1 becomes.
  • the layer structure of the contacting region 1 is still single-layered in the outer regions of the contacting region 1 perpendicular to the stop-coat layer 13, while the layer structure in the middle region of the contacting region 1 is already double-layered perpendicular to the copper conductor 11 with the stop-coat layer 13 realized thereon.
  • the insulating lacquer layer 10 is applied to the stop-coat layer 13.
  • Stopplacklage 13 and the turn realized thereon insulating varnish 10 is now three layers.
  • the carbon pressure takes place, by means of which the surface parts 2, 3 serving as mating contacts are formed in the depressions between the middle and the outside region of the contacting region 1.
  • the carbon pressure covers each surface part 2 or 3 to the respective associated outer region of the contacting region 1 toward the respective existing copper conductor 12, via which the respective relevant surface part 2 or 3 is each separately electrically controlled.
  • the respective affected copper conductor 12 with respect to the respective associated Flä- Chen part 2 or 3 isolated from each other, as already assumed, is executed.
  • a variant of the contacting region 1 is realized such that the copper conductor track 11 provided in the middle region of the contacting region 1 is additionally raised.
  • the copper conductor tracks 12 arranged outwardly with respect to the contacting region 1 could also be made flat.
  • FIG. 3B A further variant of the contacting region 1 is realized in FIG. 3B, starting from the variant according to FIG. 3A, to the effect that the copper conductor tracks 12 arranged outwardly with respect to the contacting region 1 are formed so far into the surface that they total one at a time are formed below the respective surface parts 2, 3.
  • FIG. 3C shows, starting from the variant according to FIG. 3B, a further variant of the contacting region 1, namely to the effect that the copper conductor track 11 is dispensed with in the middle region of the contacting region 1. Instead, a minimum distance is selected between the surface parts 2, 3 serving as mating contacts.
  • the contacting region 1 can be arranged on a material carrier not shown in the figures.
  • the material carrier may be a printed circuit board.
  • the printed circuit board can be part of a printed circuit board.

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

L'invention concerne un système de mise en contact pour les contacts à ressort d'un microphone ayant un diamètre inférieur ou égal à 4 mm, réalisés sous la forme de ressorts hélicoïdaux ayant un diamètre inférieur ou égal à 0,6 mm et disposés les uns à côté des autres sur un côté inférieur, lequel est peu coûteux et satisfait à des critères de mise en contact du point de vue de la stabilité mécanique, de la sécurité de contact électrique, d'une fabrication simple et d'un effort de montage réduit. Un système de mise en contact de ce type présente, pour la mise en contact des contacts à ressort, des parties de surface (2, 3) d'une zone de mise en contact (1) isolées électriquement les unes des autres et faisant office de contacts homologues. Selon l'invention, la zone de mise en contact (1) est constituée d'une structure multicouche comprenant des nombres de couches de structure différents en fonction de l'endroit au sein de la zone de mise en contact (1). La structure multicouche destinée à former les parties de surface (2, 3) formant les contacts homologues présente un nombre prédéfini de couches de structure. En partant de cela, la zone de mise en contact (1) présente entre les parties de surface (2, 3) formant les contacts homologues un nombre de couches de structure supérieur d'au moins 1 au nombre prédéfini de couches de structure pour la formation des parties de surface (2, 3) formant les contacts homologues.
EP08760822.0A 2007-06-28 2008-06-11 Système de mise en contact Not-in-force EP2158644B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE200710029854 DE102007029854B3 (de) 2007-06-28 2007-06-28 Kontaktierungssystem
PCT/EP2008/057266 WO2009000648A1 (fr) 2007-06-28 2008-06-11 Système de mise en contact

Publications (2)

Publication Number Publication Date
EP2158644A1 true EP2158644A1 (fr) 2010-03-03
EP2158644B1 EP2158644B1 (fr) 2015-04-01

Family

ID=39719220

Family Applications (1)

Application Number Title Priority Date Filing Date
EP08760822.0A Not-in-force EP2158644B1 (fr) 2007-06-28 2008-06-11 Système de mise en contact

Country Status (3)

Country Link
EP (1) EP2158644B1 (fr)
DE (1) DE102007029854B3 (fr)
WO (1) WO2009000648A1 (fr)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5236372A (en) 1991-02-20 1993-08-17 Nec Corporation No-insertion force connector assembly
JP3244448B2 (ja) * 1997-03-19 2002-01-07 富士高分子工業株式会社 導電性ゴム接点を使用した小型マイク組立品
JP3283226B2 (ja) * 1997-12-26 2002-05-20 ポリマテック株式会社 ホルダーの製造法
EP1326308B1 (fr) * 2000-09-22 2008-03-05 Shin-Etsu Polymer Co., Ltd. Element ressort, connecteur par pression, et porteur avec sonde destine a un element electroacoustique
GB0117227D0 (en) 2001-07-14 2001-09-05 Ibm Printed circuit for pin array connection
TW547805U (en) * 2002-10-22 2003-08-11 Benq Corp Connector
CN1327514C (zh) * 2003-10-01 2007-07-18 松下电器产业株式会社 配线衬底及其制造方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO2009000648A1 *

Also Published As

Publication number Publication date
WO2009000648A1 (fr) 2008-12-31
DE102007029854B3 (de) 2008-12-11
EP2158644B1 (fr) 2015-04-01

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