EP2137787A1 - Gleichspannungstrenner - Google Patents
GleichspannungstrennerInfo
- Publication number
- EP2137787A1 EP2137787A1 EP08748935A EP08748935A EP2137787A1 EP 2137787 A1 EP2137787 A1 EP 2137787A1 EP 08748935 A EP08748935 A EP 08748935A EP 08748935 A EP08748935 A EP 08748935A EP 2137787 A1 EP2137787 A1 EP 2137787A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- signal
- conductor
- capacitance
- voltage
- insulator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000002955 isolation Methods 0.000 title abstract 2
- 239000012212 insulator Substances 0.000 claims abstract description 26
- 239000003990 capacitor Substances 0.000 claims abstract description 23
- 239000004020 conductor Substances 0.000 claims description 175
- 230000005684 electric field Effects 0.000 claims description 16
- 230000001902 propagating effect Effects 0.000 claims description 12
- 230000007423 decrease Effects 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims description 2
- 238000000926 separation method Methods 0.000 description 13
- 239000000758 substrate Substances 0.000 description 9
- 230000005540 biological transmission Effects 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 238000001465 metallisation Methods 0.000 description 7
- 230000002829 reductive effect Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 230000036962 time dependent Effects 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 230000032258 transport Effects 0.000 description 2
- 229910002601 GaN Inorganic materials 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000005352 clarification Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000004870 electrical engineering Methods 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/32—Non-reciprocal transmission devices
- H01P1/36—Isolators
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/2007—Filtering devices for biasing networks or DC returns
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/201—Filters for transverse electromagnetic waves
- H01P1/202—Coaxial filters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/201—Filters for transverse electromagnetic waves
- H01P1/203—Strip line filters
Definitions
- the invention relates to a DC isolator with at least one ground conductor and at least one signal-carrying conductor, which are arranged spaced apart by means of an insulator, wherein a capacitance is arranged in the signal-carrying conductor.
- Such DC separators separate or superimpose the time-dependent component and the DC component of an electrical signal.
- a further connection is provided at one or both contacts of the capacitor, to which the DC voltage component is added or removed.
- the English name "Bias-T" is also common.
- a prior art bias T separates the DC component (DC) and the time dependent component (RF) of an electrical signal from one another.
- An ideal bias T is a 3-port which contains an infinite capacitance C and an infinite inductance L, cf. Fig. 1.
- gate 1 the superposition of the DC and RF signal falls on or off.
- the inductance only allows one DC signal, while the capacitance only passes one RF signal.
- the signal path of the DC component from port 1 to port 3 is the signal path of the HF component from port 1 to port 2.
- the bias DC can be used for DC separation from port 1 to port 2
- a real bias T has only finite values of capacitance C and inductance L. This results in a finite large lower limit frequency f gl . Below this cut-off frequency, the RF signal is heavily attenuated on its way from port 1 to port 2. Since the capacitive resistance X c of an AC circuit according to the formula
- a real inductance has finite dimensions. It therefore causes, like the capacitance, a discontinuity in the waveguide with the negative effects described above. Moreover, a real inductor has always finite values for capacity and ohm 1 see resistance. It can therefore be described as a network of several ideal components. This network has at least one resonance frequency at which it is the
- this resonant frequency must be high.
- the resonant frequency of an inductance increases as its dimensions become smaller. This, however, the cross-sectional area of the conductors is small and the load capacity with a DC current is limited.
- DE 103 08 211 A1 proposes to guide the electromagnetic wave on an inner conductor, which is surrounded by a gap-free, substantially coaxial outer conductor.
- the inner conductor is separated at a separation point by a gap. This separation point is bridged by a capacitor.
- this arrangement does not solve the problem of additionally contacting one side of the capacitor with a coil without disturbing the transmission.
- a bias T is known which is realized by microstrip lines of different widths.
- the microstrip line between Tor 1 and Tor 2 is continuously wider, whereby their impedance decreases.
- Inductance between Tor 1 and Tor 3 is characterized by a very narrow microstrip line formed with high impedance.
- the RF signal is prevented from passing through the narrow microstrip line to port 3.
- the width of the microstrip line and thus the impedance decreases again to the original value. Due to the short effective line length, DC currents can be supplied at slightly higher upper limit frequencies.
- the Bias-T has no capacity, it can not be used to separate a DC and an RF signal.
- the object of the present invention is accordingly to provide a DC voltage isolator or a DC voltage supply with increased bandwidth. Furthermore, the object of the present invention is to provide a DC voltage supply, which compared to the prior art has an increased upper limit frequency and an increased maximum DC current.
- the invention is achieved by a DC voltage disconnector having at least one ground conductor and at least one signal-carrying conductor, which are arranged spaced apart by means of an insulator, wherein in the signal-carrying conductor, a capacitance is arranged in a region in which the insulator facing surface of the signal conductor is larger as the insulator facing surface of the ground conductor.
- the surface of the envelope is understood as the surface of the signal and ground conductors facing the insulator.
- the envelope is the curve with minimum circumference, which completely encloses the cross section of the respective conductor.
- the insulator in the sense of the present patent application, any material is understood which prevents a direct galvanic current flow between the signal-carrying conductor and ground conductor.
- the insulator may consist of an air gap or a protective gas.
- the use of a dielectric solid in question is about 1 to about
- the bias T can be integrated in a particularly simple way monolithically with an amplifier on a substrate.
- combinations of several materials can be used either as an alloy or as a layer structure as an insulator.
- an enlarged signal conductor is used which faces a small ground conductor only.
- the electronic components which form the capacitance C of a bias Ts can be arranged in a space region in which they do not appreciably disturb the field distribution of the propagating RF wave. This is due to the fact that the wider conductor of an RF line always completely shields the field of the propagating wave, whereas edge effects occur at the narrower conductor, so that this conductor is encompassed by the field of the propagating wave.
- the object of the invention is thus achieved by a DC isolator with a ground conductor and a signal-carrying conductor, wherein the signal-carrying conductor, a capacitor is arranged, characterized in that the dimensions of the signal-carrying conductor and the
- the ground conductor are designed so that the signal-carrying conductor shields the electric field of the propagating AC signal, such that there is an area on the surface of the signal conductor in which the amplitude of the electric field strength of the AC signal is lower than the amplitude of the electric field strength of the AC signal, which occurs at the surface of the ground conductor, and the capacitor is disposed in the thus shielded portion of the signal-carrying conductor.
- the -electric field strength is accessible to calculations. With knowledge of the waveguide structure, ie the exact dimensions of the ground conductor and the signal-carrying conductor, the electric field strength can be calculated at each point of the waveguide structure.
- FIG. 3a is shown here.
- FIG. 3a is a cross section orthogonal to the direction of propagation of the alternating voltage signal through a waveguide structure according to the invention. It can be seen that the signal-carrying conductor (in this case the upper conductor) on the side remote from the ground conductor has a region where the electric field strength is lower than can be found on the surface of the ground conductor.
- the signal-carrying conductor in this case the upper conductor
- the ground conductor is encompassed by the field lines and so can be found at any point on its surface (neither on the side facing the signal-carrying conductor nor on the side facing away from the signal-carrying conductor) a point with such low amplitude the electric field strength of the AC signal as in the shielded area at the signal-carrying conductor.
- the shielded area on the signal-carrying conductor is on the side facing away from the ground conductor / surface of the signal-carrying conductor.
- the gap which is introduced into the signal-carrying conductor for carrying out the DC voltage separation, disturbs the shielding capability of the signal-carrying conductor.
- an almost field-free region again occurs, so that the effect of these stray fields is negligible.
- a specific conductor section along the propagation direction is taken, wherein the dimensions of the waveguide structure along this section are designed according to the invention, so that the signal-carrying conductor according to the invention a shielded area for DC separation is provided.
- the capacitors are installed for bridging the gap, ie in a region in which they do not appreciably disturb the field distribution of the propagating AC voltage signal.
- a conductor does not include surfaces of cavities encapsulated in the conductor, ie cavities encapsulated in the manner of a Faraday cage within a conductor.
- Fig. 9 is a cross section of a conductor (L) having such a cavity (H).
- the dashed line in the cavity (H) shown in cross-section shows the surface of the encapsulated cavity, which is not taken into account in the comparison of the electric field strengths on the surface of the signal conductor and on the surface of the ground conductor.
- this can be expanded to the complete bias T by the signal-carrying conductor is connected on at least one side of the capacitance with an inductance and / or ohm 1 see resistance. In this way, a direct current or a DC voltage can be superimposed on the signal conductor or dissipate such a voltage. Due to the inductance is from the DC voltage disconnector also simultaneously
- the capacitance and / or the inductance and / or the ohmic resistance consists of exactly one component, which is a capacitor, a coil or a sheet resistance on a case-by-case basis.
- the DC isolator can be made very compact, requires no supply voltage and is therefore conditionally robust and reliable.
- the capacitance and / or the inductance and / or the ohm 1 see Resistor may be formed by a network comprising semiconductor devices and / or resistors and / or capacitors and / or inductors.
- Resistor may be formed by a network comprising semiconductor devices and / or resistors and / or capacitors and / or inductors.
- the structure of the DC disconnector according to the present invention when the components used are provided with SMD housings.
- Such components have small geometric dimensions, whereby the influence of the components on the electric field distribution around the conductor arrangement is further reduced. Since no holes for wire connections must be present, this embodiment dispenses with a further source of error at which reflections and losses of the RF signal can occur.
- SMD components have standardized housings of similar dimensions which allow a simple and reliable construction.
- a particularly simple integration of the DC voltage isolator according to the invention into existing environments results when the surface of the signal conductor facing the insulator increases stepwise or continuously in the direction of the capacitance and the surface of the ground conductor facing the insulator decreases stepwise or continuously.
- the known narrow signal lines are used for much of the signal transport on the electronic circuit.
- the opposite ground surface can continue to be performed over a large area. Only in the area of the bias T, the conditions are reversed by the signal conductor is gradually or continuously widened and the ground conductor correspondingly narrower. This is then interrupted at the widest point of the signal conductor, the resulting gap being bridged by at least one capacitance.
- the signal line is again reduced stepwise or continuously to the original value and the ground line is correspondingly widened for this purpose.
- the characteristic impedance of the line remains constant over the bias T.
- reflections and deteriorations of the RF signal are reliably avoided.
- the dimensions of the conductors will be determined by a person skilled in the art on the basis of known formulas in individual cases, the width depending essentially on the thickness and the relative permittivity of the dielectric used.
- the bias T according to the invention is the measurement technology, for example on gallium nitride components and the amplifier technology, since there are special demands on the bandwidth and / or the load capacity with high direct currents in these areas.
- the DC power supply according to the invention can be integrated into an existing board layout with simple production methods according to the prior art.
- a Amplifier module possible, which on the one hand amplifies the RF signal and simultaneously imposes a DC voltage component.
- the monolithic integration of the DC voltage isolator with an amplifier on the same semiconductor wafer is possible. As a result, line lengths and transitions are again reduced and interfering reflections of the RF signal are avoided.
- the entire arrangement can be surrounded by an electrically conductive shield or a housing. This is especially preferably connected to the electrical ground.
- an electrically conductive shield or a housing This is especially preferably connected to the electrical ground.
- the person skilled in the art will, for example, provide a greater distance of the shield from the signal conductor. As a result, only the smaller ground conductor is significantly involved in the waveguide of the RF signal and the influence of the shield remains low.
- FIG. 1 shows the electrical circuit of a DC voltage supply according to the prior art.
- FIG. 2 shows a schematic illustration of the electrical field distribution of a microstrip line according to the prior art with and without Serial Capacity C.
- the signal conductor is the top conductor.
- the conductor shown below is the ground conductor.
- Fig. 3 (a) shows an undistorted inverted microstrip line and Fig. 3 (b) shows an inverted one
- Microstrip line having a series capacitance C according to the present invention.
- the upper conductor is the signal conductor.
- FIG. 3c shows a schematic representation of a microstrip line according to the invention
- FIG. 4 shows a board layout with which the DC voltage supply according to the invention can be realized as a microstrip line on a planar substrate.
- FIG. 5a shows the measured transmission
- FIG. 5b shows the same measurements in the frequency range from 500 MHz to 40 GHz.
- measured values of a line section are plotted as a comparison.
- FIG. 6 shows the difference between the measured transmission of a reference line and the DC voltage supply according to FIG. 4 in the frequency range from 500 MHz to 40 GHz.
- FIG. 7 shows a DC voltage supply according to the present invention in the construction of a coaxial line.
- FIG. 8 shows a schematic illustration of a symmetrical strip line according to the invention
- Figure 9 shows what is meant by a self-encapsulated in the conductor cavity
- Figure 2a shows a narrow signal line according to the prior art, which is arranged at a distance from a wide ground line. Between both conductors, a homogeneous field distribution of the propagating wave is formed. At the edge of the narrower conductor run curved field lines, which embrace the conductor. This also exists. Field lines, which emanate from the top of the narrow signal conductor.
- FIG. 2b shows the same prior art conductor with a series capacitance C in cross section. It can clearly be seen that the capacitance disturbs the field line course of the free conductor. This interference remains at low frequencies up to a few 100 MHz without affecting the signal quality. At high frequencies from about 10 GHz, however, the series capacity causes reflections that degrade the signal quality.
- FIG. 3a shows a microstrip line according to the present invention. This is characterized by the fact that the upper signal conductor is wider than the narrow ground conductor. The field distribution of the undisturbed microstrip line does not change as a result.
- FIG. 3b shows the
- Range of DC supply with capacitances C and an inductance L for DC supply are now, unlike the prior art according to FIG. 2b, arranged in the field-free region of the conductor arrangement.
- the field distribution also remains at the DC power supply unchanged over the undisturbed line.
- the occurrence of an upper limit frequency f g2 by the capacitance C and the inductance L is prevented as desired. Due to the larger cross-sectional area larger capacitors can be used with larger capacity values, so that the lower limit frequency is advantageously reduced.
- FIG. 3c shows a cross section orthogonal to the direction of propagation of the propagating alternating voltage signal through a microstrip conductor according to the invention.
- the ground conductor (B) is applied on one side of the dielectric substrate (S) and the signal-carrying conductor (A) on the other side of the dielectric substrate (S), wherein on the side of the signal-carrying conductor (A) remote from the substrate, a capacitor (C ) is arranged on the signal-carrying conductor (A), characterized in that the signal-carrying conductor (A) is wider than the ground conductor (B). Wider means that the track that marks the two outermost points . and a 2 connects the metallization of the signal-carrying conductor (A), is wider than the distance that the two outermost
- FIG. 4 shows the board layout of a DC voltage feeder realized in microstrip technology according to the present invention.
- the figure shows the surface metallization in gray and the backside metallization in black.
- the opposite ground conductor is significantly wider than the signal conductor.
- the DC supply with three capacitors for DC separation is realized.
- the DC voltage via inductances L is added or removed.
- the signal line is significantly wider than the ground line.
- the signal line is continuously increased until it reaches the width of the original ground conductor.
- the ground conductor is reduced in the same area adapted for this, until it has reached the width of the original signal conductor. Since the characteristic impedance of such a microstrip arrangement is a function of the conductor width, the printed circuit board thickness and the relative permittivity, the impedance of the line does not change due to this change in the conductor width, as the measurement results according to FIGS. 5 and 6 show.
- the field of the electromagnetic wave which is always located between the wide and the narrow conductor, thus migrates in the region of the transition from the circuit board top to the bottom. In the area of capacities C and the
- the board layout from FIG. 4 was realized on a printed circuit board substrate having a thickness of 508 ⁇ m with a copper metallization on the top and bottom sides of 17 ⁇ m thickness in each case.
- the entire circuit board has a width of 4 cm and a length of 7.3 cm. Of these, an area of 2 x 7.3 cm 2 is occupied by the Bias-T, a further area of 2 x 7.3 cm 2 carries a straight, uniformly wide reference line without further components.
- FIG. 5a shows a measurement of the scattering parameters (S parameters) in the range from 500 kHz to 500 MHz.
- S-parameters are used to describe characteristics of linear time-invariant networks at high frequencies, since the variable quantities current and voltage can only be measured with great difficulty.
- S-parameters describe in magnitude and phase the signal parts which are transmitted or reflected at different ports of a network. According to FIG. 5, a virtually undisturbed transmission from port 1 to port 2 of the bias Ts is possible at a frequency of 25 MHz or higher. The bandwidth limit downwards is given by the inductance used.
- FIG. 5b shows the measurement of the S-parameters for the frequency range from 500 MHz to 40 GHz.
- the data of the same length microstrip line are shown without further components.
- Both the reference line and the DC voltage supply according to the invention show a transmission which continuously drops to higher frequencies.
- FIG. 5b reveals that the bias T according to the invention transports the signal with the same quality as the one shown in FIG straight reference line without further components. The previously observed by a GIeichwoodsZu Installation signal degradation does not occur in the board layout according to the invention.
- FIG. 5 shows the difference of the measured transmissions from FIG. 5 for the reference line and the logic voltage supply according to FIG. 4. Up to a frequency of 35 GHz, this difference is virtually zero, and from 35 GHz a difference of 2 dB can be measured.
- FIG. 7 shows an alternative embodiment of the DC supply according to the invention in coaxial form.
- the paradigm known from the prior art breaks down that the ground line represents the larger-area line.
- the inner conductor arranged on the axis of symmetry is used as the ground conductor. This is surrounded by a substantially cylindrical insulator material. Outside of the insulator material, the likewise substantially cylindrical signal conductor is attached as a hollow cylindrical outer conductor.
- the field distribution in the interior of the coaxial conductor does not differ from the field distribution according to the prior art.
- the externally arranged signal conductor allows components for DC separation and
- the outer conductor is separated and the resulting gap bridged with capacitors.
- the gap which is introduced to carry out the DC separation in the signal-carrying conductor, disturbs the Shielding capability of the externally arranged signal-carrying conductor. Nevertheless, an almost field-free area already occurs one to two gap width away from the gap, so that the effect of this stray field is negligible.
- the capacitors can be mounted on the outside of this or, if the outer conductor has a greater material thickness, can also be embedded in them.
- FIG. 8 shows a further embodiment of the DC isolator according to the invention, specifically in the form of the symmetrical stripline.
- the signal carrying conductor strip is embedded in a dielectric and runs parallel to two conductive layers deposited on the two opposite sides of the dielectric and serves as a grounding conductor.
- this arrangement is now modified (see FIG. 8) such that the two outer conductive layers (A 1 and A 2 ), which are applied on the two opposite sides of the dielectric, represent the signal-carrying conductors, and the inner conductor embedded in the dielectric (B) is the ground conductor.
- the outermost points of the metallization of the signal-carrying conductors A x and A 2 , and b x and b 2 the outermost points of the metallization of the ground conductor.
- to DC voltage separation is now introduced into the signal-carrying conductors A j and A 2 a gap along a x and a 2 .
- the capacitors for DC separation are arranged on the side of the signal-carrying conductors Ai and A 2 remote from the substrate, directly in the vicinity of the gap.
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Microwave Amplifiers (AREA)
- Filters And Equalizers (AREA)
- Control Of Eletrric Generators (AREA)
- Ignition Installations For Internal Combustion Engines (AREA)
- Emergency Protection Circuit Devices (AREA)
- Amplifiers (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102007018120A DE102007018120A1 (de) | 2007-04-16 | 2007-04-16 | Gleichspannungstrenner |
PCT/EP2008/003024 WO2008125341A1 (de) | 2007-04-16 | 2008-04-16 | Gleichspannungstrenner |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2137787A1 true EP2137787A1 (de) | 2009-12-30 |
EP2137787B1 EP2137787B1 (de) | 2010-07-21 |
Family
ID=39636917
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP08748935A Not-in-force EP2137787B1 (de) | 2007-04-16 | 2008-04-16 | Gleichspannungstrenner |
Country Status (9)
Country | Link |
---|---|
US (1) | US20100182106A1 (de) |
EP (1) | EP2137787B1 (de) |
JP (1) | JP2010524414A (de) |
KR (1) | KR20100007859A (de) |
CN (1) | CN101657933A (de) |
AT (1) | ATE475205T1 (de) |
CA (1) | CA2683690A1 (de) |
DE (2) | DE102007018120A1 (de) |
WO (1) | WO2008125341A1 (de) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3662533B1 (de) * | 2017-08-02 | 2023-05-03 | KYOCERA AVX Components Corporation | Übertragungsleitungsvorspannungswiderstand |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2189942A (en) | 1986-04-30 | 1987-11-04 | Philips Electronic Associated | Transmission-line bias T |
US4987391A (en) * | 1990-03-14 | 1991-01-22 | Kusiak Jr Michael | Antenna cable ground isolator |
JP2003188047A (ja) * | 2001-12-14 | 2003-07-04 | Mitsubishi Electric Corp | Dcブロック回路および通信装置 |
US6798310B2 (en) * | 2003-01-07 | 2004-09-28 | Agilent Technologies, Inc. | Coaxial DC block |
DE10308211A1 (de) | 2003-02-25 | 2004-09-09 | Shf Communication Technologies Ag | Element zur Gleichspannungstrennung in Leitungen, insbesondere bei Übertragung von Frequenzen im Bereich von 5 GHz bis 110 GHz |
JP3966865B2 (ja) * | 2004-04-08 | 2007-08-29 | 富士通株式会社 | Dcカット構造 |
US7385459B2 (en) * | 2005-09-08 | 2008-06-10 | Northrop Grumman Corporation | Broadband DC block impedance matching network |
-
2007
- 2007-04-16 DE DE102007018120A patent/DE102007018120A1/de not_active Ceased
-
2008
- 2008-04-16 CN CN200880012333A patent/CN101657933A/zh active Pending
- 2008-04-16 CA CA002683690A patent/CA2683690A1/en not_active Abandoned
- 2008-04-16 US US12/596,190 patent/US20100182106A1/en not_active Abandoned
- 2008-04-16 EP EP08748935A patent/EP2137787B1/de not_active Not-in-force
- 2008-04-16 AT AT08748935T patent/ATE475205T1/de active
- 2008-04-16 JP JP2010503396A patent/JP2010524414A/ja active Pending
- 2008-04-16 KR KR1020097021673A patent/KR20100007859A/ko not_active Application Discontinuation
- 2008-04-16 DE DE502008000996T patent/DE502008000996D1/de active Active
- 2008-04-16 WO PCT/EP2008/003024 patent/WO2008125341A1/de active Application Filing
Non-Patent Citations (1)
Title |
---|
See references of WO2008125341A1 * |
Also Published As
Publication number | Publication date |
---|---|
EP2137787B1 (de) | 2010-07-21 |
KR20100007859A (ko) | 2010-01-22 |
DE102007018120A1 (de) | 2008-10-30 |
DE502008000996D1 (de) | 2010-09-02 |
CN101657933A (zh) | 2010-02-24 |
US20100182106A1 (en) | 2010-07-22 |
JP2010524414A (ja) | 2010-07-15 |
WO2008125341A1 (de) | 2008-10-23 |
CA2683690A1 (en) | 2008-10-23 |
ATE475205T1 (de) | 2010-08-15 |
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