EP2048704A4 - Anbringverfahren, anbringstruktur, verfahren zur herstellung elektronischer geräte, elektronische geräte, verfahren zur herstellung eines leuchtdiodendisplays und leuchtdiodendisplay - Google Patents

Anbringverfahren, anbringstruktur, verfahren zur herstellung elektronischer geräte, elektronische geräte, verfahren zur herstellung eines leuchtdiodendisplays und leuchtdiodendisplay

Info

Publication number
EP2048704A4
EP2048704A4 EP07767530.4A EP07767530A EP2048704A4 EP 2048704 A4 EP2048704 A4 EP 2048704A4 EP 07767530 A EP07767530 A EP 07767530A EP 2048704 A4 EP2048704 A4 EP 2048704A4
Authority
EP
European Patent Office
Prior art keywords
light emitting
emitting diode
electronic equipment
diode display
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP07767530.4A
Other languages
English (en)
French (fr)
Other versions
EP2048704A1 (de
Inventor
Katsuhiro Tomoda
Masato Doi
Toshiya Takagishi
Toshiaki Kanemitsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Publication of EP2048704A1 publication Critical patent/EP2048704A1/de
Publication of EP2048704A4 publication Critical patent/EP2048704A4/de
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
    • H01L2224/26152—Auxiliary members for layer connectors, e.g. spacers being formed on an item to be connected not being a semiconductor or solid-state body
    • H01L2224/26175—Flow barriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/27—Manufacturing methods
    • H01L2224/27011—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature
    • H01L2224/27013—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature for holding or confining the layer connector, e.g. solder flow barrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/83009—Pre-treatment of the layer connector or the bonding area
    • H01L2224/83051—Forming additional members, e.g. dam structures
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    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8312—Aligning
    • H01L2224/83143—Passive alignment, i.e. self alignment, e.g. using surface energy, chemical reactions, thermal equilibrium
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    • H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/1026—Compound semiconductors
    • H01L2924/1032—III-V
    • H01L2924/10349—Aluminium gallium indium phosphide [AlGaInP]
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
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    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
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    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12043—Photo diode
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    • H01L2924/14—Integrated circuits
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H01L2924/15155—Shape the die mounting substrate comprising a recess for hosting the device the shape of the recess being other than a cuboid
    • H01L2924/15156—Side view
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    • H01L2924/15157—Top view
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    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Die Bonding (AREA)
EP07767530.4A 2006-07-12 2007-06-25 Anbringverfahren, anbringstruktur, verfahren zur herstellung elektronischer geräte, elektronische geräte, verfahren zur herstellung eines leuchtdiodendisplays und leuchtdiodendisplay Withdrawn EP2048704A4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006191365A JP4899675B2 (ja) 2006-07-12 2006-07-12 実装方法、電子機器の製造方法および発光ダイオードディスプレイの製造方法
PCT/JP2007/062724 WO2008007535A1 (fr) 2006-07-12 2007-06-25 Procédé de montage, structure de montage, procédé de fabrication d'équipement électronique, équipement électronique, procédé de fabrication d'affichage à diode électroluminescente et affichage à diode électroluminescente

Publications (2)

Publication Number Publication Date
EP2048704A1 EP2048704A1 (de) 2009-04-15
EP2048704A4 true EP2048704A4 (de) 2013-08-07

Family

ID=38923100

Family Applications (1)

Application Number Title Priority Date Filing Date
EP07767530.4A Withdrawn EP2048704A4 (de) 2006-07-12 2007-06-25 Anbringverfahren, anbringstruktur, verfahren zur herstellung elektronischer geräte, elektronische geräte, verfahren zur herstellung eines leuchtdiodendisplays und leuchtdiodendisplay

Country Status (6)

Country Link
US (1) US8101457B2 (de)
EP (1) EP2048704A4 (de)
JP (1) JP4899675B2 (de)
KR (1) KR20090031411A (de)
CN (1) CN101490828B (de)
WO (1) WO2008007535A1 (de)

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KR102652723B1 (ko) 2018-11-20 2024-04-01 삼성전자주식회사 마이크로 led 전사 장치 및 이를 이용한 마이크로 led 전사 방법
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CN109830191B (zh) * 2019-04-24 2019-08-02 南京中电熊猫平板显示科技有限公司 一种像素结构以及微发光二极管的转移方法
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WO2008007535A1 (fr) 2008-01-17
US8101457B2 (en) 2012-01-24
KR20090031411A (ko) 2009-03-25
JP4899675B2 (ja) 2012-03-21
US20090290337A1 (en) 2009-11-26
CN101490828A (zh) 2009-07-22
EP2048704A1 (de) 2009-04-15
CN101490828B (zh) 2011-07-06

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