Classifications

• • H—ELECTRICITY
  • H04—ELECTRIC COMMUNICATION TECHNIQUE
  • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
  • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
• • H—ELECTRICITY
  • H04—ELECTRIC COMMUNICATION TECHNIQUE
  • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
  • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
  • H04N23/50—Constructional details
  • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
  • H01L2224/732—Location after the connecting process
  • H01L2224/73251—Location after the connecting process on different surfaces
  • H01L2224/73265—Layer and wire connectors
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
  • H01L2924/181—Encapsulation

Definitions

• the invention relates to an image recording system and a method for its production.
• an image recording system which has an image sensor, an optical unit, a housing and fastening means for fixing the image sensor relative to the housing.
• the housing alignment means are provided on the inside, which allow a non-fixing, axial alignment of the main axes of the image sensor and the optical unit to each other.
• a threaded receptacle is advantageously provided.
• Such an image recording system allows high optical accuracy.
• the structure is relatively complex and generally requires a complex assembly and adjustment.
• a potting compound is applied to the image sensor and its contacts on the substrate, which is optically transparent and thus allows a passivation or protection against mechanical effects, without affecting the optical measurement of the image sensor.
• the image sensor may in particular be a semiconductor device, e.g. be an imager chip, wherein as a substrate in particular a circuit board can be provided.
• the optical device eg a lens or a lens system
• the optical device can be used in the Potting compound according to different embodiments attached or formed.
• the production of the image recording system can be integrated into the mounting process of the substrate, ie, the production is carried out in the board assembly machine, so that the manufacturing costs are kept low and high quantities can be achieved at low cost.
• the erfmdungshiele image recording system can thus be made compact, safe and stable, yet with low production costs and high volumes.
• the applied potting compound can also be formed directly as an optical device, e.g. by appropriate shaping of their lying in the optical axis surface area, for. B. in the form of a lens region or a lens.
• these embodiments can also be combined.
• a mechanical protection or a passivation of both the sensor and its contacts can be achieved, so that a high accuracy and longevity is achieved and the respective environmental influences such as temperature, humidity, etc. affect the image recording at most low.
• a desired optical device can be applied or formed which ensures suitable focusing of the image sensor on a region to be observed, i. a desired depth of cut or focal length, allows.
• more complex lens systems can also be attached, e.g. a stack of lenses.
• the potting compound has a similar refractive index or a similar refractive index as the material of the optical device - eg glass or plastic, so that the interfaces between the potting compound and the pressed or glued optical device are not all that relevant.
• FIG. 1 shows the application of the potting compound on the image sensor.
• FIG. 2 shows the surface formation of the potting compound;
• FIG. 1 shows the application of the potting compound on the image sensor.
• Fig. 4 shows the insertion of a lens in the molded potting compound
• Fig. 5 shows the glued-lens imaging system
• Fig. 6 shows the production of an image pickup system according to another
• Fig. 7 shows 7 different lenses for use in the image acquisition system
• FIG 8 shows an image recording system according to a further embodiment with a lens formed directly in the potting compound.
• an image chip 2 is initially formed on the substrate top side 3a of a substrate 3, e.g. a printed circuit board 3, by means of e.g. an adhesive layer 4 attached and contacted via bonding wires 5.
• a potting compound 6 (glob top) on the substrate top 3 a applied such that it completely covers the imager chip 2 and its wire bonds 5.
• a boundary 8 for limiting the applied potting compound 6 is advantageously provided on the substrate top side 3a.
• the boundary 8 can in particular be circumscribed by a substrate 3, i. in particular ring-shaped, formed edge 8 may be formed. Furthermore, however, stop edges are possible in which excess material is discharged to the side in an overflow.
• the potting compound 6 is advantageously applied liquid or viscous or pasty in convex form, for example, droplet shape, which by a - A -
• the potting compound 6 may, for. B. cured by UV radiation.
• the potting compound 6 is optically, i. at least in a relevant one
• the imager chip 2 can serve in particular for receiving light in the optical wavelength range; However, in principle, applications in the IR spectral range are possible.
• the potting compound 6 serves as a passivation agent for passivation or mechanical protection of the imager chips 2 and its bonding wires 5 and the contacted surfaces on the substrate 3, z. As bond pads, without affecting the reception of the relevant radiation.
• the potting compound 6 is subsequently mechanically deformed by a punch 10 from above, whereupon the punch 10 is moved back again.
• a Aufhahmeverianaung 14 is formed and used after curing of the potting compound in a subsequent process step of FIG. 4 from above by means of an application tool 17, a lens 16 as an optical unit and e.g. is secured by means of adhesive 18 in the Aufhahmeverianaung 14.
• the adhesive 18 can be previously attached to the lens 16 or to lateral adhesive surfaces 15 of the corresponding optical unit 22. It can e.g. a UV-curing adhesive 18 is used and subsequently cured.
• the image recording system 1 shown in FIG. 5 is thus formed with the substrate 3, the imager chip 2, the optically transparent potting compound 6 and the lens 16 attached above it.
• Fig. 5 can remain between the lens 16 and the potting compound 6 a space 19.
• the adhesive 18 is provided only laterally further outside the optical axis A, so that it does not affect the beam path.
• an optically transparent adhesive 18 may also be provided between the lens 16 and the potting compound 6 in the optically relevant region
• the receiving recess 14 thus becomes mechanical Functional surface 14, that is formed as a lens frame or lens seat.
• a lens 20 may also be used directly by means of the application tool 17, e.g. a vacuum suction bell 17, are pressed into the potting compound 6, so that no adhesive 18 is provided.
• a defined optical beam path is obtained, since the potting compound 6 is deformed or pushed outwards only in regions located laterally further away from the optical axis A; in the region of the beam path A, the potting compound 6 and the lens 20 are provided above the imager chip 2.
• the respective applied lens 18, 20 or an optical unit 22 by applying an additional fuse from above, e.g. one of the edge of the respective lens 18, 20 fixing, in the potting compound 6 depressed locking ring are secured.
• Optical units 22 according to FIG. 7c are made of a plurality of lenses 23, 24, which are e.g. are connected together by adhesive 25.
• Fig. 8 shows an example in which the applied potting compound 6 is formed from above by a punch 28 at least in a relevant for the optical beam path central region in its surface 6a. This results in a lens region 30 in the surface 12 of the potting compound 6, which may be formed in particular convex for focusing the incident radiation.
• the lens area 30 can be subsequently ground and / or polished.
• the lens portion 30 is thus as a functional area in the
• Potting compound 6 is formed.
• a concave configuration of the lens area 30 may also be advantageous in order to compensate aberrations of the optical unit.
• the desired optical properties can be selected by selecting appropriate optical properties
• Refractive indices of the lens 16, 20 and the various lenses 23, 24 of the optical unit 22 and the potting compound 6 are influenced.
• All process steps can in the board assembly machine, ie in the Board assembly are performed. After applying the imager chips 2 and the bonding wires 5, a drop of the potting compound 6 is subsequently applied and the lens 16 is inserted prior to curing of the respective punches 10 or via the application tool 17. Also, as shown in FIG. 8, the molding of the potting compound 6 can be performed by the punch 28 during the board assembly process.
• the refractive indices of the potting compound 6 and the glass or plastic material of the lens 16, 20 and 23, 24 may be similar or even formed, so that the interfaces provide only a small contribution to the total refractive power of the optical system.
• the image recording system 1 can serve in particular as a fixed focus system with a fixed focal length.
• the image-side intercept can be determined by various measures for correct focusing and thus high image quality.
• the contact points of the lens 16, 20 or optics unit 22 are selectively processed, e.g. abraded, so that the position of the image sensor 1 after assembly coincides with the cutting width.
• the contact point of the lens 16 is in this case at the first
• the image acquisition system according to the invention can be used in motor vehicles for various purposes, e.g. for detecting seats, for monitoring the tank and other parts of the motor vehicle and for detecting and detecting the vehicle environment, in particular the detection and detection of the road condition, other road users, for pre-crash sensing and as overtaking and for the detection of traffic signs and the road environment to complement of digital road maps.
• an image sensor in particular cost-effective

Landscapes

• Engineering & Computer Science (AREA)
• Multimedia (AREA)
• Signal Processing (AREA)
• Solid State Image Pick-Up Elements (AREA)
• Transforming Light Signals Into Electric Signals (AREA)
• Lens Barrels (AREA)

Applications Claiming Priority (2)

Publications (1)

Family

ID=37989059

Family Applications (1)

Country Status (7)

Families Citing this family (11)

Family Cites Families (34)

• 2006
  • 2006-03-28 DE DE102006014247.0A patent/DE102006014247B4/de not_active Expired - Fee Related
• 2007
  • 2007-01-26 US US12/295,063 patent/US9742968B2/en not_active Expired - Fee Related
  • 2007-01-26 CN CN200780011018XA patent/CN101411179B/zh not_active Expired - Fee Related
  • 2007-01-26 KR KR1020087023185A patent/KR20090004882A/ko not_active Application Discontinuation
  • 2007-01-26 WO PCT/EP2007/050764 patent/WO2007110255A1/de active Application Filing
  • 2007-01-26 EP EP07704156A patent/EP2011330A1/de not_active Withdrawn
  • 2007-03-26 TW TW096110278A patent/TWI386327B/zh not_active IP Right Cessation

Non-Patent Citations (1)

Also Published As

Similar Documents

Legal Events