EP1982233A2 - Verfahren und vorrichtung zur korrektur von abbildungsfehlern - Google Patents
Verfahren und vorrichtung zur korrektur von abbildungsfehlernInfo
- Publication number
- EP1982233A2 EP1982233A2 EP06840995A EP06840995A EP1982233A2 EP 1982233 A2 EP1982233 A2 EP 1982233A2 EP 06840995 A EP06840995 A EP 06840995A EP 06840995 A EP06840995 A EP 06840995A EP 1982233 A2 EP1982233 A2 EP 1982233A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- projection exposure
- optical correction
- exposure apparatus
- elements
- correction element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70308—Optical correction elements, filters or phase plates for manipulating imaging light, e.g. intensity, wavelength, polarisation, phase or image shift
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70933—Purge, e.g. exchanging fluid or gas to remove pollutants
Definitions
- the invention relates to a projection exposure apparatus for microlithography, which has optical correction elements for modifying the imaging properties, and to a method for correcting aberrations of a projection exposure apparatus.
- FIG. 1 shows such a projection exposure apparatus by way of example for explaining the prior art.
- the projection exposure apparatus 1 consists essentially of a lighting device 3, a device 4 for receiving and exact positioning of a provided with a grid-like structure mask, a so-called reticle 5, through which the later structures are determined on the wafer 2, a device 6 for mounting , Movement and exact positioning of just this wafer 2 and an imaging device, namely a projection lens 7, with multiple optical elements, such.
- the basic principle of operation provides that the structures introduced into the reticle 5 are imaged in a reduced manner on the wafer 2.
- the illumination device 3 provides a projection beam 11 required for imaging the reticle 5 on the wafer 2 as electromagnetic radiation, for example from the visible or the UV or EUV range.
- the source of this radiation may be a laser or the like.
- the radiation is in the illumination device 3 via optical Elements are formed so that the projection beam 11 when hitting the reticle 5 has the desired properties in terms of diameter, polarization, shape of the wavefront and the like.
- the optical elements may in particular be refractive, reflective or other types of components or combinations thereof.
- the wafer 2 After a successful exposure, the wafer 2 is moved further in the direction of the arrow, so that a plurality of individual fields, each with the structure predetermined by the reticle 5, are exposed on the same wafer 2. Due to the step-by-step advancing movement of the wafer 2 in the projection exposure apparatus 1, it is often referred to as a stepper.
- the projection objective 7 has a multiplicity of individual refractive, diffractive and / or reflective optical elements, such as eg. As lenses, mirrors, prisms, end plates and the like.
- a common problem with the use of the described projection exposure systems is that the illumination and imaging optics used generally have more or less severe aberrations of different orders. To correct these aberrations, it is customary to introduce correction elements into the beam path of both the illumination device and the projection objective of the projection exposure device. Examples of such measures are disclosed in patent applications EP 0874283 A2, US 2003/0128349 A1 and in US patent 5,392,119. Furthermore, the inter- national patent application WO 2005/064404 the problem of quickly changing a correction element in a projection exposure system. In this case, the optical correction element is moved by means of a changing device into or out of the beam path of the projection exposure apparatus; The optical correction element can be located in particular in the region of a pupil plane of the projection exposure apparatus.
- the pupil plane is a particularly favorable place to make an image error correction by means of optical correction elements, since measures in the pupil plane similar modifications of the image can be achieved in each location of an image plane.
- the correction of aberrations often depends to a significant extent on the structure currently being exposed; Such structures usually vary during use of the projection exposure apparatus at short intervals.
- the thus required change of the optical correction elements causes the risk of misalignments of the projection exposure system due to shocks, voltage changes or other mechanical or thermal influences and a possible contamination of the interior of the projection exposure system by impurities.
- the inventive projection exposure apparatus for semiconductor lithography shows a first and at least one further optical correction element, wherein the first optical correction element is arranged in the region of a pupil plane of the projection exposure system and the further optical correction element is arranged at a greater distance from the pupil plane than the first correction element.
- the first correction element can be arranged at a distance from the pupil plane which corresponds to a subaperture ratio of greater than 0.75, in particular greater than 0.9.
- the subaperture ratio is a measure of the distance of an object to a pupil plane; a subaperture ratio of 1 means that an object is in the pupil plane.
- the subaperture ratio is described as a ratio of principal ray height to marginal ray height VM on the optically effective surface of an optical element.
- the further optical correction element may be arranged at a distance from the pupil plane which corresponds to a subaperture ratio of less than 0.75, in particular less than 0.5.
- This arrangement of the two optical correction elements has the advantage that, on the one hand, an efficient correction of image aberrations, in particular of constant image aberrations in the region of the pupil plane over the entire image plane, is best possible. Since it is precisely the optical elements arranged in the area of the pupil plane that generate constant aberrations over the entire image plane, this makes it most possible to effectively correct such errors.
- Plan parallel plates as correction elements have the advantage that on the one hand they are easy to manufacture and to change in the projection exposure apparatus and on the other hand can be measured easily by interferometric methods. In addition, they are comparatively robust in their correcting action to decentrations, especially when used near a pupil plane.
- diaphragms in particular vapor-deposited first-order or variable aperture diaphragms into consideration.
- interference filters or intensity filters in particular gray filters, can be used.
- gray filters have the property that they make it possible in a simple way to compensate for local deviations, in particular in the radial direction, of the transmission of the objective.
- diaphragms An advantageous possibility of using diaphragms is that the zeroth diffraction order of the diffraction image generated by the reticle can be efficiently masked out or attenuated by means of an aperture arranged in or near a pupil plane, which leads to an improvement of the contrast and thus to an improvement in the Picture on the wafer leads.
- the diffraction occurring at the reticle is strongly dependent on the type of structures to be exposed and on the illumination settings. This creates the need to flexibly adapt the shape and position of the aperture used to the particular circumstances. This can be achieved, for example, by providing a changing device which permits a rapid change of the optical correction element as soon as the optical conditions change, for example, through the use of a new particle.
- the use of a changing device has the particular advantage that the complete objective housing does not have to be opened in order to change the optical correction element, which reduces the risk of contamination of the interior of the objective housing.
- the use of the changing device is not limited to the rapid replacement of diaphragms, and the other optical correction elements specified above can be exchanged quickly by means of the changing device in an advantageous manner.
- a field plane or image plane is understood as meaning a plane in which an image or an intermediate image of the object plane is created.
- the optical elements used such as lenses for example, are exposed to inhomogeneous stresses to a great extent, which leads to aberrations.
- the density of the lens material in the heavily exposed areas can locally change or increase, so that the imaging properties of the lens change and imaging errors occur.
- an effective correction of such errors can be achieved in that the further optical correction element is arranged in the region of the field-near optical elements of the projection exposure apparatus, since in this way the errors caused by the effects described above are in the vicinity of the location to be cured of their formation.
- An advantageous procedure for replacing the optical correction element consists in the fact that first the application parameters of the projection exposure apparatus are detected and predicted on the basis of the detection Degradationserscheinept. Subsequently, at least one adjusted correction element can be produced in advance, well ahead of the planned time of an exchange, which is then exchanged at the specified point in time. This procedure can be further refined by additionally measuring the application parameters of the projection exposure apparatus or a prediction of the expected degradation phenomena is carried out on the basis of drift measurements and / or known illumination settings. This method has the advantage that the times required for an exchange of optical correction elements can be effectively reduced.
- FIG. 2 shows an exemplary arrangement of the two optical correction elements in the projection objective of a projection exposure apparatus
- FIG. 3 shows an exemplary changing device for changing one of the optical correction elements
- Figure 4 shows a variant of the invention, in which the Kirvor- direction is designed as a turntable
- Figure 5 shows an alternative to the formation of the changing device as a turntable
- Figure 5a shows another alternative to the formation of the changing device in conjunction with two opposing magazines
- Figure 6 shows a further variant of the invention, in which a carriage is combined as a changing device with a designed as a turntable magazine;
- FIG. 7 shows an embodiment of the present invention in which the optical correction elements are arranged together on a support frame; and FIG. 8 shows a concept for mounting an optical correction element.
- FIG. 2 shows an exemplary arrangement of the two optical correction elements 13, 14 in the projection objective 7 of a projection exposure apparatus.
- the projection objective 7 has a plurality of lenses 8 mounted in frames 9;
- the location of a pupil plane 12 of the projection lens 7 is indicated by a dashed line.
- the area of the pupil plane 12 is the first optical correction element
- the manipulators 15 allow a variation of the tilt of the optical correction element 13 or also a variation of the distance of the optical correction element 13 from the pupil plane 12; They can be designed in particular as a piezo manipulator.
- the fixation of the optical correction element 13 on the manipulators 15 can be effected via spring elements, pneumatic elements, magnetic elements, vacuum elements or even form-fitting elements.
- the distance in which the first correction element 13 is arranged from the pupil plane 12 corresponds to a subaperture ratio of> 0.75.
- the second optical correction element 14 Spaced from the pupil plane 12 and thus from the first optical correction element 13, the second optical correction element 14 is arranged, wherein the distance of the second optical correction element 14 from the pupil plane 12 corresponds to a Subaperturiller of ⁇ 0.75.
- the optical correction elements 13 and 14 may be, for example, plane-parallel plates, diaphragms such as, for example, a vapor-deposited first-order diaphragm or else variable diaphragms.
- interference filters or intensity filters, in particular gray filters can be used as optical correction elements 13 and 14, respectively.
- the invention is not limited to that - as shown in Figure 2 - the optical correction elements 13 and 14 are executed adjacent; rather, it is conceivable that in the region between the optical correction elements 13 and 14 further optical elements are arranged.
- FIG. 3 shows an exemplary changing device 17 for exchanging one of the optical correction elements 13 or 14.
- the changing device 17 is designed as a carriage.
- the changing device 17 embodied as a slide is realized as an arrangement of fixed guide rails 19 in connection with an adapter holder 29 on movable guide rails 18, by which a linear guidance of the optical correction element 13 into the beam path of the projection objective 7 (not shown in FIG ) is guaranteed.
- the movable guide rails 18, the adapter holder 29 or also the fixed guide rails 19 can be equipped with sensor units 20 for determining the position of the optical correction element 13.
- the drive of the changing device 17, not shown in Figure 3 is to be chosen so that the entry of vibration or heat in the projection lens 7 is as low as possible; This can be achieved in particular by the use of linear motors, pneumatic elements or voice coils as a drive.
- the optical correction element 13 is realized as an intensity filter for center shading.
- the optical correction element 13 is inserted into the region of the holding member 16 by a linear movement.
- the definition of the end position of the optical correction element 13 with respect to the other components of the projection lens 7 already takes place when introducing the opti- see correction element 13 in the adapter holder 29.
- the holding member 16 is connected to the lens housing 10 of the projection lens 7, not shown in Figure 3.
- the external components for the positioning of the optical correction element 13 prevent friction particles from precipitating on the surfaces of the optical elements arranged in the projection objective 7 and causing scattered light. In the event of a defect, the optical correction element 13 can be replaced without exchanging the entire projection objective 7 are completely replaced with little effort
- Figure 4 shows a variant of the invention, in which the changing device 17 is formed as a turntable.
- the changing device 17 is formed as a turntable.
- the particular advantage of using a turntable as changing device 17 lies in the fact that it is possible in this way, the horizontal forces acting on the lens housing 10 and thus on the projection lens 7 to keep low, there as acceleration torques with rapid deceleration or accelerating the changing device 17 only torques and no linear forces occur.
- the changing device 17 embodied as a turntable can, as shown in FIG.
- FIG. 5 shows a changing device 17, which is designed as a linear slide.
- the receiving units 22 are arranged in the form of a linear slide changing device 17 linear along the course of the carriage. Trained as a linear slide changing device 17 can thereby extend horizontally through the entire lens housing 10.
- the two solutions shown in Figures 4 and 5 have in common that the changing device 17 itself has a plurality of receiving units 22 and thus shows a double functionality on the one hand as a changing device 17 and on the other hand as a magazine.
- An advantage of this solution is in particular that a separate magazine is unnecessary, whereby a considerable amount of space can be saved.
- FIG. 5a shows a further variant of the invention in which a high degree of flexibility and in particular changing speed achieved.
- the changing device 17 is formed in this embodiment as a linear slide with two receiving units 22 for optical correction elements 13.
- two stacking magazines 23a and 23b are arranged on opposite sides of the objective housing 10.
- the changing device 17 can be moved horizontally through the entire lens housing 10 from one magazine 23a, b to the other in a linear movement.
- optical correction elements 13 can be removed from the changing device 17 or introduced into this. This arrangement makes it possible, during the operation of the projection exposure apparatus with an optical correction element 13 in one of the magazines 23a or 23b, to introduce the optical correction element 13 suitable for the subsequently provided operating parameters of the installation into the receiving unit 22 of the exchanging device 17.
- This procedure makes it possible, with a practically unlimited number of different correction elements within a single linear movement, to remove a no longer required correction element 13 from the beam path of the installation and to introduce the new correction element 13 required for the parameters of the installation into the beam path during the same movement , In this way, changing the parameters of the system within times ⁇ 30 ms, in particular ⁇ 10 ms, possible.
- the measure mentioned above can considerably increase the efficiency of the plant and thus increase productivity.
- Figure 6 shows a further variant of the invention, in which a carriage is combined as a changing device 17 with a designed as a turntable magazine 23.
- the magazine 23 shows four receiving units 22, three of which are equipped with optical correction elements 13.
- the fourth receiving unit 22 is not occupied in the present example, it is for receiving an optical correction element 13 from the interior of the lens housing 10 is available.
- the changing device 17 is formed in the known manner as a linear slide, which moves along the guide rails 18 and 19 in and out of the interior of the lens housing 10.
- This embodiment of the invention has the advantage that the opening through which the optical correction elements 13 are introduced into the interior of the lens housing 10, in contrast to the turntable solution described in Figure 4 can be kept small and thus the risk of introducing contaminants in the Interior of the lens housing 10 can be effectively reduced.
- the risk of contamination can be further reduced by providing a lock 24, which passes through the optical correction elements 13 before and after the change, and which is constantly flowed through, for example by means of a purge gas, possibly resulting from the exterior space. low levels of contamination can be dissipated before the optical correction element 13 reaches the interior of the lens housing 10. It is also conceivable to arrange the entire changing device 17 and the magazine 23 together in a space flowed through by flushing gas, so that there is no contact with the environment when changing the optical correction element 13 and in particular the optical correction elements 13 already during their storage in the magazine 23rd flowed around by purge gas and thus are largely protected against contamination.
- the purge gas can advantageously be removed from the projection objective in the region of the exchanging device 17.
- the main track output (not shown) of the projection objective 7 is located in the region of the changing device 17. This measure avoids contamination of the interior of the projection objective 7 in a particularly effective manner.
- the magazine 23 can also be realized as a stacking magazine with optical correction elements 13 or 14 stacked vertically one above the other.
- both the pupil plane 12 closer optical correction elements 13 and the pupil plane 12 more distant optical correction elements 14 can be changed.
- FIG. 1 A further advantageous embodiment of the present invention is shown in FIG.
- the optical correction elements 13 and 14 are arranged together on a support frame 25.
- the first optical correction element 13 may for example be integrated firmly in the carrier mount in the vicinity of the pupil plane.
- the carrier mount carries the second optical correction element 14 via the holding elements 16 and the manipulators 15.
- the carrier mount 25 can be embodied in such a way that it can be simply exchanged as a whole.
- the second optical correction element 14 in the support frame 25th be replaced without removing them from the lens housing 10.
- the second optical correction element 14 can be simply exchanged in a known manner (see preceding figures) in this way;
- this variant shows the particular advantage that the two optical correction elements 13 and 14 are arranged within a structural unit and thus in a particularly compact manner.
- FIG. 8 shows a bearing concept for mounting an optical correction element 13 or 14 in the interior of a projection objective 7, wherein the optical correction element 13 or 14 is embodied as a fixed stop and at only two bearing points 27 in the interior of the projection objective 7, not shown in FIG Bearings 26 and 28 is stored.
- the design of the bearings 27 can be chosen in particular in such a way that a bearing point of a hard metal, a ruby prism or hardened steel is used.
- the first bearing 26 is realized as a fixed bearing; as the second bearing 28 a floating bearing is used in the present example, in which the principle of a line system is used.
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Epidemiology (AREA)
- Health & Medical Sciences (AREA)
- Public Health (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Optics & Photonics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Lenses (AREA)
- Optical Elements Other Than Lenses (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/341,894 US7724351B2 (en) | 2006-01-30 | 2006-01-30 | Lithographic apparatus, device manufacturing method and exchangeable optical element |
| PCT/EP2006/012120 WO2007085290A2 (de) | 2006-01-30 | 2006-12-15 | Verfahren und vorrichtung zur korrektur von abbildungsfehlern |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| EP1982233A2 true EP1982233A2 (de) | 2008-10-22 |
Family
ID=37779394
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP06840995A Ceased EP1982233A2 (de) | 2006-01-30 | 2006-12-15 | Verfahren und vorrichtung zur korrektur von abbildungsfehlern |
| EP07250149A Withdrawn EP1813989A1 (de) | 2006-01-30 | 2007-01-16 | Lithographische Projektionsvorrichtung und Verfahren zur Herstellung einer Vorrichtung |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP07250149A Withdrawn EP1813989A1 (de) | 2006-01-30 | 2007-01-16 | Lithographische Projektionsvorrichtung und Verfahren zur Herstellung einer Vorrichtung |
Country Status (8)
| Country | Link |
|---|---|
| US (6) | US7724351B2 (de) |
| EP (2) | EP1982233A2 (de) |
| JP (2) | JP2009525599A (de) |
| KR (2) | KR20080098629A (de) |
| CN (1) | CN101013269B (de) |
| SG (1) | SG134294A1 (de) |
| TW (1) | TWI352880B (de) |
| WO (1) | WO2007085290A2 (de) |
Families Citing this family (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007022922A2 (de) * | 2005-08-23 | 2007-03-01 | Carl Zeiss Smt Ag | Austauschvorrichtung für ein optisches element |
| US7724351B2 (en) | 2006-01-30 | 2010-05-25 | Asml Netherlands B.V. | Lithographic apparatus, device manufacturing method and exchangeable optical element |
| KR101235492B1 (ko) * | 2006-07-03 | 2013-02-20 | 칼 짜이스 에스엠테 게엠베하 | 리소그래피 투사 대물렌즈 교정/수리 방법 |
| JP5154564B2 (ja) | 2006-12-01 | 2013-02-27 | カール・ツァイス・エスエムティー・ゲーエムベーハー | 像収差を低減するための交換可能で操作可能な補正構成を有する光学システム |
| EP1950594A1 (de) * | 2007-01-17 | 2008-07-30 | Carl Zeiss SMT AG | Abbildende Optik, Projektionsbelichtunsanlage für die Mikrolithographie mit einer derartigen abbildenden Optik, Verfahren zur Herstellung eines mikrostrukturierten Bauteils mit einer derartigen Projektionsbelichtungsanlage, durch das Herstellungsverfahren gefertigtes mikrostrukturiertes Bauelement sowie Verwendung einer derartigen abbildenden Optik |
| DE102007009867A1 (de) * | 2007-02-28 | 2008-09-11 | Carl Zeiss Smt Ag | Abbildungsvorrichtung mit auswechselbaren Blenden sowie Verfahren hierzu |
| WO2008113605A2 (de) | 2007-03-20 | 2008-09-25 | Carl Zeiss Smt Ag | Verfahren zum verbessern von abbildungseigenschaften eines optischen systems sowie derartiges optisches system |
| EP2048543B1 (de) * | 2007-10-09 | 2013-12-04 | ASML Netherlands B.V. | Optischer Fokussensor, Prüfvorrichtung und lithografische Vorrichtung |
| DE102007055567A1 (de) * | 2007-11-20 | 2009-05-28 | Carl Zeiss Smt Ag | Optisches System |
| NL1036794A1 (nl) | 2008-04-25 | 2009-10-27 | Asml Netherlands Bv | Robot for in-vacuum use. |
| DE102008047562B4 (de) * | 2008-09-16 | 2012-11-08 | Carl Zeiss Smt Gmbh | Vorrichtung zur Dämpfung von Schwingungen in Projektionsbelichtungsanlagen für die Halbleiterlithographie |
| DE202009002387U1 (de) | 2008-12-22 | 2010-05-12 | Maiorova, Tatiana, Dmitrov | Optische Anordnung zum Ändern eines Abbildungsverhältnisses oder einer Brechkraft |
| DE102008064512A1 (de) * | 2008-12-22 | 2010-06-24 | Maiorova, Tatiana, Dmitrov | Optische Anordnung zum Ändern eines Abbildungsverhältnisses oder einer Brechkraft |
| DE102010040108A1 (de) * | 2010-09-01 | 2012-03-01 | Carl Zeiss Smt Gmbh | Obskurationsblende |
| CN101976021B (zh) * | 2010-10-12 | 2012-11-14 | 上海微电子装备有限公司 | 对准系统参考板和探测光纤的安装、调整装置及装调方法 |
| US9083227B2 (en) * | 2011-09-09 | 2015-07-14 | Asml Holding N.V. | Linear motor and lithography arrangement including linear motor |
| EP2657747A1 (de) * | 2012-04-24 | 2013-10-30 | Deutsches Krebsforschungszentrum | 4Pi-STED-Fluoreszenzlichtmikroskop mit hoher dreidimensionaler räumlicher Auflösung |
| WO2013174646A1 (en) | 2012-05-24 | 2013-11-28 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US9535334B2 (en) | 2013-10-31 | 2017-01-03 | Taiwan Semiconductor Manufacturing Company, Ltd. | Extreme ultraviolet lithography process to print low pattern density features |
| PT3138655T (pt) * | 2015-09-02 | 2018-11-15 | Asm Tech Singapore Pte Ltd | Estação ótica para troca de elementos óticos |
| DE102016208172A1 (de) * | 2016-05-12 | 2017-04-27 | Carl Zeiss Smt Gmbh | Optisches system, blende sowie lithographieanlage |
| DE102016218744A1 (de) * | 2016-09-28 | 2018-03-29 | Carl Zeiss Smt Gmbh | Projektionsbelichtungsanlage mit Flüssigkeitsschicht zur Wellenfrontkorrektur |
| DE102019208232A1 (de) | 2019-06-05 | 2020-12-10 | Carl Zeiss Microscopy Gmbh | Optische Anordnung und Verfahren zur Korrektur von Zentrierfehlern und/oder Winkelfehlern |
| US11575865B2 (en) | 2019-07-26 | 2023-02-07 | Samsung Electronics Co., Ltd. | Processing images captured by a camera behind a display |
| US11721001B2 (en) | 2021-02-16 | 2023-08-08 | Samsung Electronics Co., Ltd. | Multiple point spread function based image reconstruction for a camera behind a display |
| US11722796B2 (en) | 2021-02-26 | 2023-08-08 | Samsung Electronics Co., Ltd. | Self-regularizing inverse filter for image deblurring |
| US12393765B2 (en) | 2021-08-06 | 2025-08-19 | Samsung Electronics Co., Ltd. | Automating search for improved display structure for under-display camera systems |
| US12216277B2 (en) | 2021-10-14 | 2025-02-04 | Samsung Electronics Co., Ltd. | Optical element for deconvolution |
| US12482075B2 (en) | 2022-06-08 | 2025-11-25 | Samsung Electronics Co., Ltd. | Restoring images using deconvolution |
| DE102022205972B3 (de) | 2022-06-13 | 2023-12-07 | Carl Zeiss Smt Gmbh | Verfahren und austauschwerkzeug |
| DE102024208525A1 (de) * | 2024-09-09 | 2025-08-28 | Carl Zeiss Smt Gmbh | Verfahren |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1186956A2 (de) * | 2000-09-02 | 2002-03-13 | Carl Zeiss | Projektionsbelichtungsanlage |
Family Cites Families (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4667101A (en) * | 1985-02-04 | 1987-05-19 | The United States Of America As Respresented By The United States Department Of Energy | Predicting threshold and location of laser damage on optical surfaces |
| US5151186A (en) * | 1990-05-21 | 1992-09-29 | Skc Limited | Method for cleaning filter disks and system therefor |
| JPH05234850A (ja) | 1992-02-18 | 1993-09-10 | Canon Inc | 投影露光装置及びそれを用いた半導体デバイスの製造方法 |
| JPH06177007A (ja) | 1992-12-01 | 1994-06-24 | Nippon Telegr & Teleph Corp <Ntt> | 投影露光装置 |
| JPH06177008A (ja) * | 1992-12-01 | 1994-06-24 | Nippon Telegr & Teleph Corp <Ntt> | 投影露光装置 |
| US5392119A (en) | 1993-07-13 | 1995-02-21 | Litel Instruments | Plate correction of imaging systems |
| JP3463335B2 (ja) * | 1994-02-17 | 2003-11-05 | 株式会社ニコン | 投影露光装置 |
| US5677757A (en) * | 1994-03-29 | 1997-10-14 | Nikon Corporation | Projection exposure apparatus |
| JPH088157A (ja) * | 1994-06-16 | 1996-01-12 | Nikon Corp | 投影露光装置 |
| JPH07273005A (ja) * | 1994-03-29 | 1995-10-20 | Nikon Corp | 投影露光装置 |
| JP3893626B2 (ja) * | 1995-01-25 | 2007-03-14 | 株式会社ニコン | 投影光学装置の調整方法、投影光学装置、露光装置及び露光方法 |
| JPH098103A (ja) * | 1995-06-19 | 1997-01-10 | Nikon Corp | 投影露光装置及び投影露光方法 |
| EP0874283B1 (de) | 1997-04-23 | 2003-09-03 | Nikon Corporation | Optischer Belichtungsapparat und optisches Reinigungsverfahren |
| WO1998057213A1 (en) * | 1997-06-10 | 1998-12-17 | Nikon Corporation | Optical device, method of cleaning the same, projection aligner, and method of producing the same |
| US6829041B2 (en) | 1997-07-29 | 2004-12-07 | Canon Kabushiki Kaisha | Projection optical system and projection exposure apparatus having the same |
| US6235438B1 (en) * | 1997-10-07 | 2001-05-22 | Nikon Corporation | Projection exposure method and apparatus |
| TW449672B (en) * | 1997-12-25 | 2001-08-11 | Nippon Kogaku Kk | Process and apparatus for manufacturing photomask and method of manufacturing the same |
| JP3459773B2 (ja) * | 1998-06-24 | 2003-10-27 | キヤノン株式会社 | 投影露光装置及びデバイスの製造方法 |
| US6930754B1 (en) | 1998-06-30 | 2005-08-16 | Canon Kabushiki Kaisha | Multiple exposure method |
| JP2000306807A (ja) * | 1999-04-20 | 2000-11-02 | Nikon Corp | 露光装置、露光方法、及び半導体デバイスの製造方法 |
| WO2001073825A1 (en) | 2000-03-29 | 2001-10-04 | Nikon Corporation | Aligner, apparatus and method for transferring wafer, microdevice and method for manufacturing the same |
| KR20010095087A (ko) * | 2000-03-30 | 2001-11-03 | 시마무라 테루오 | 노광장치, 노광방법 및 디바이스의 제조방법 |
| US6483071B1 (en) * | 2000-05-16 | 2002-11-19 | General Scanning Inc. | Method and system for precisely positioning a waist of a material-processing laser beam to process microstructures within a laser-processing site |
| TWI220998B (en) * | 2001-02-13 | 2004-09-11 | Nikon Corp | Exposure method, exposure apparatus and manufacture method of the same |
| JP2004259786A (ja) * | 2003-02-24 | 2004-09-16 | Canon Inc | 露光装置 |
| KR101179286B1 (ko) | 2003-10-29 | 2012-09-03 | 칼 짜이스 에스엠테 게엠베하 | 조리개 변경 장치 |
| JP5021207B2 (ja) | 2003-10-29 | 2012-09-05 | カール・ツァイス・エスエムティー・ゲーエムベーハー | フォトリソグラフィにおける光学アセンブリ |
| US7265917B2 (en) * | 2003-12-23 | 2007-09-04 | Carl Zeiss Smt Ag | Replacement apparatus for an optical element |
| KR101252312B1 (ko) | 2004-12-23 | 2013-04-08 | 칼 짜이스 에스엠테 게엠베하 | 적어도 하나의 교체 가능한 광학 요소를 포함하는 대물렌즈모듈 |
| US7593100B2 (en) * | 2005-01-24 | 2009-09-22 | Nikon Corporation | Measuring method, measuring system, inspecting method, inspecting system, exposure method and exposure system, in which information as to the degree of the flatness of an object is pre-obtained |
| US7728975B1 (en) * | 2005-02-23 | 2010-06-01 | Carl Zeiss Smt Ag | Method for describing, evaluating and improving optical polarization properties of a microlithographic projection exposure apparatus |
| EP1746463A2 (de) | 2005-07-01 | 2007-01-24 | Carl Zeiss SMT AG | Verfahren zum Korrigieren eines lithographischen Projektionsobjektivs und derartiges Projektionsobjektiv |
| US7724351B2 (en) | 2006-01-30 | 2010-05-25 | Asml Netherlands B.V. | Lithographic apparatus, device manufacturing method and exchangeable optical element |
-
2006
- 2006-01-30 US US11/341,894 patent/US7724351B2/en active Active
- 2006-12-15 EP EP06840995A patent/EP1982233A2/de not_active Ceased
- 2006-12-15 JP JP2008552693A patent/JP2009525599A/ja active Pending
- 2006-12-15 KR KR1020087021190A patent/KR20080098629A/ko not_active Withdrawn
- 2006-12-15 WO PCT/EP2006/012120 patent/WO2007085290A2/de not_active Ceased
-
2007
- 2007-01-16 EP EP07250149A patent/EP1813989A1/de not_active Withdrawn
- 2007-01-17 TW TW096101776A patent/TWI352880B/zh active
- 2007-01-23 JP JP2007012368A patent/JP4854530B2/ja not_active Expired - Fee Related
- 2007-01-26 SG SG200700650-5A patent/SG134294A1/en unknown
- 2007-01-29 CN CN2007100083729A patent/CN101013269B/zh active Active
- 2007-01-30 KR KR1020070009386A patent/KR100894887B1/ko not_active Expired - Fee Related
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2008
- 2008-07-11 US US12/171,394 patent/US8159648B2/en not_active Expired - Fee Related
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2012
- 2012-03-19 US US13/423,965 patent/US20120176591A1/en not_active Abandoned
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2015
- 2015-09-02 US US14/843,338 patent/US20160026094A1/en not_active Abandoned
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2019
- 2019-02-08 US US16/271,073 patent/US10620543B2/en not_active Expired - Lifetime
-
2020
- 2020-04-06 US US16/840,767 patent/US11003088B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1186956A2 (de) * | 2000-09-02 | 2002-03-13 | Carl Zeiss | Projektionsbelichtungsanlage |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI352880B (en) | 2011-11-21 |
| JP2007208257A (ja) | 2007-08-16 |
| US20080316444A1 (en) | 2008-12-25 |
| WO2007085290A3 (de) | 2007-10-04 |
| US8159648B2 (en) | 2012-04-17 |
| US20200233314A1 (en) | 2020-07-23 |
| EP1813989A1 (de) | 2007-08-01 |
| KR20080098629A (ko) | 2008-11-11 |
| US7724351B2 (en) | 2010-05-25 |
| US20190302627A1 (en) | 2019-10-03 |
| KR20070078816A (ko) | 2007-08-02 |
| WO2007085290A2 (de) | 2007-08-02 |
| KR100894887B1 (ko) | 2009-04-30 |
| US20120176591A1 (en) | 2012-07-12 |
| US20160026094A1 (en) | 2016-01-28 |
| US11003088B2 (en) | 2021-05-11 |
| US20070177122A1 (en) | 2007-08-02 |
| CN101013269A (zh) | 2007-08-08 |
| JP4854530B2 (ja) | 2012-01-18 |
| TW200732857A (en) | 2007-09-01 |
| SG134294A1 (en) | 2007-08-29 |
| JP2009525599A (ja) | 2009-07-09 |
| US10620543B2 (en) | 2020-04-14 |
| CN101013269B (zh) | 2011-01-12 |
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