EP1866656A2 - Detection et prevision de temperature dans des prises a circuits integres - Google Patents

Detection et prevision de temperature dans des prises a circuits integres

Info

Publication number
EP1866656A2
EP1866656A2 EP06736932A EP06736932A EP1866656A2 EP 1866656 A2 EP1866656 A2 EP 1866656A2 EP 06736932 A EP06736932 A EP 06736932A EP 06736932 A EP06736932 A EP 06736932A EP 1866656 A2 EP1866656 A2 EP 1866656A2
Authority
EP
European Patent Office
Prior art keywords
temperature
package
surface temperature
amount
measured
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP06736932A
Other languages
German (de)
English (en)
Inventor
Christopher A. Lopez
Brian J. Denheyer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wells-CTI LLC
Wells CTI LLC
Original Assignee
Wells-CTI LLC
Wells CTI LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wells-CTI LLC, Wells CTI LLC filed Critical Wells-CTI LLC
Publication of EP1866656A2 publication Critical patent/EP1866656A2/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/42—Circuits effecting compensation of thermal inertia; Circuits for predicting the stationary value of a temperature
    • G01K7/425—Thermal management of integrated systems
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature

Definitions

  • This invention relates to integrated circuits and, more particularly, to temperature sensing and prediction for more accurate temperature control of integrated circuits.
  • Integrated circuit (IC) packages must be tested after their manufacture, normally at elevated temperatures, which is typically a burn-in process. During that process, it is often necessary to control the temperature of ICs, sensors, and other elements. Techniques for doing so have been widely practiced for many years.
  • the system normally consists of a heater (or cooler), a temperature sensor, and a comparator which applies energy to a heater in proportion to the difference in voltage measured on the temperature sensor as compared to a reference voltage. The energy is applied in the proper direction to cause the difference voltage to be reduced.
  • Temperature control modules and temperature sensors of many types are widely sold for these purposes. A typical application is the control of the temperature of ICs for a burn-in process because of the temperature sensitivity of the ICs.
  • each individual IC being tested.
  • the actual temperature of each IC can vary due to different rates of convection, heat dissipation, or radiation within the oven.
  • Individual temperature control can be achieved by sensing the temperature of each IC and varying the heat directed to each IC through the use of individual heaters.
  • a temperature sensor 110 is positioned within an insulated sensor housing 112 such that the sensor 110 protrudes from the housing 112 to contact the outer casing of the integrated circuit being tested.
  • Hamilton discloses measuring the surface temperature (the case temperature) of the IC under test and does not disclose any apparatus or method for determining the temperature of the center of the IC (the junction temperature).
  • Jones discloses determining the junction temperature of the IC under test by calculating that junction temperature from the sensed case temperature and a predetermined thermal profile of the IC.
  • the determination of the junction temperature of the IC is subject to time delays caused by the thermal time constants of the materials between the temperature sensor on the case surface of the IC and the junction of the IC.
  • One aspect of the invention is a method for controlling the temperature of an integrated circuit (IC).
  • the method includes sensing a surface temperature of the IC, predicting a junction temperature, and adjusting the surface temperature based on the predicted junction temperature.
  • predicting the junction temperature includes measuring a power consumption of the IC and calculating a temperature adjustment value to the measured surface temperature based on the power consumption and thermal profile of the IC.
  • Another aspect of the invention is an IC temperature sensing and prediction device.
  • the device includes a sensing device to measure current through an IC and a temperature control apparatus to change a surface temperature of the IC.
  • the device also includes an electronic controller that receives a first signal from the sensing device representing the measured current through the IC and a second signal from the temperature control apparatus representing the surface temperature of the IC.
  • the temperature control apparatus includes a temperature sensor to thermally contact the IC and measure the surface temperature and a heater or cooler to directly contact the IC.
  • FIG. 1 is a schematic block diagram illustrating an exemplary embodiment of an IC temperature sensing and prediction device according to principles of the invention.
  • FIG. 2 is a shows a simplified diagram of one embodiment of the IC temperature sensing and prediction device 20 in FIG. 1.
  • FIG. 3 is a simplified plan view of a system of testing boards within a testing or burn-in chamber according to another embodiment of the invention.
  • FIG. 1 shows a simple block diagram of an integrated circuit (IC) temperature sensing and prediction device 20 to provide accurate temperature control of the IC according to principles of the invention.
  • Integrated circuits include individual dies and IC packages and the term integrated circuit (IC) used throughout this specification encompasses all forms of integrated circuits.
  • the IC temperature sensing and prediction device 20 can be used during testing which includes burning-in, testing, and programming of the IC or in applications where accurate temperature control of the IC is desired.
  • a temperature control apparatus 28 is preferably positioned on the device under test
  • the temperature controller includes a sensor to sense the surface (or case) temperature of the DUT 24 and a heater or cooler to conduct heat toward or away from the DUT 24.
  • the temperature control apparatus 28 may be similar to that described in commonly-owned U.S. Serial No. 10/920,531, entitled “Integrated Circuit Temperature Sensing Device and Method,” published as US 2005/0189957 Al, incorporated by reference herein.
  • the junction (or die) temperature is preferably measured along with the surface temperature.
  • the junction temperature is a key characteristic in IC operation and long-term reliability.
  • the junction temperature cannot be measured directly due to intervening material in the DUT 24, such as an encapsulating case material (i.e., the IC package).
  • the intervening material causes a thermal time delay between the junction temperature and the surface temperature of the DUT 24.
  • T P ⁇
  • ⁇ the thermal resistance
  • V IR
  • I current
  • R resistance
  • the thermal model equates temperature to voltage and power to current.
  • Package thermal resistance is the measure of the package's heat dissipation capability from a die's active surface (the junction) to a specified reference point (the case, board, ambient, etc.).
  • junction-to-case thermal resistance ( ⁇ jc) measures the ability of the device to dissipate heat from the surface of the die to the top or bottom surface of the package.
  • IC manufacturers typically provide information on thermal resistance for their components.
  • Commercial thermal analysis software packages such as FLOTHERM® are also available to predict device thermal performance.
  • a power supply 22 provides power to the DUT 24.
  • a current sensing device 26 is preferably coupled between the power supply 22 and the DUT 24 and measures the current passing through the DUT 24.
  • the current through the DUT 24 can be measured by using a low impedance current sensing resistor 26 (for example, a 0.015 ohm resistor) placed in series with the power supply 22.
  • a system controller 30 is preferably connected to the temperature control apparatus 28 and to the current sensing device 26.
  • the system controller 30 receives a signal from the temperature control apparatus that indicate the sensed case temperature of the DUT 24.
  • the system controller 30 also receives signals from the current sensing device 26.
  • Tj is the junction or die temperature
  • Tc is the case or package temperature
  • P is the power dissipated by the device (in watts).
  • the system controller 30 can more accurately control the temperature of the DUT 24 by using, along with the sensed case temperature from the temperature control apparatus 28, the calculated power consumption to control the junction temperature of the DUT 24.
  • the temperature sensing and prediction device 20 also provides an accelerated temperature feedback loop to the system controller 30 since measuring the voltage drop across the current sensing resistor 26 is not subject to the time delays associated with measuring the case temperature.
  • problems in a given DUT 24 can be readily identified if the sensed case temperature differs greatly from the expected junction temperature for a given level of power consumption.
  • a thermal profile may be predicted for a given device type. If the device is manufactured incorrectly such that its actual thermal profile differs from the expected thermal profile (such as when mispackaging creates a greater thermal resistance between the junction and the case), the case temperature measured may be lower than expected given a certain level of power consumption.
  • measuring the case temperature and calculating the power consumption of the DUT 24 provides additional information that can identify defective ICs.
  • FIG. 2 shows a simplified diagram of one embodiment of the IC temperature sensing and prediction device 20 in FIG. 1.
  • a DUT 24 is placed in an IC testing socket 23 on a testing board 42.
  • the testing socket 23 can be a socket designed to receive an IC for testing which includes, burning-in, testing and programming of the DUT 24.
  • IC testing using testing sockets is merely one example in which inventive principles of the invention can be applied.
  • the invention can also be applied to devices that are mounted directly to a printed circuit board (PCB).
  • the IC testing socket 23 generally comprises a base 40 connected to a testing board 42 and a socket lid 44.
  • the IC testing socket 23 includes a temperature control apparatus 28 for directly controlling the temperature of the IC during testing.
  • a temperature sensor 48 in the temperature control apparatus 28 measures the temperature of the top surface of the DUT 24.
  • the temperature control apparatus 28 is positioned in the socket lid 44 so that when the IC testing socket 23 is in a closed position, the temperature control apparatus 28 thermally contacts the DUT 24. The temperature control apparatus 28 then effects a change in the temperature of the DUT 24 by conducting heat to or away from the DUT 24.
  • the temperature control apparatus 28 includes a heater or a cooler.
  • FIG. 2 also includes a simple circuit diagram showing a system controller 30 in communication with the temperature sensor 48 and the temperature control apparatus 28.
  • the system controller 30 is further connected to a current sensing device 26 which may be located on the board 42.
  • the system controller 30 may be embedded in the socket lid 44.
  • FIG. 3 shows a simplified plan view of a system of testing boards 42 within a testing or burn-in chamber 68 according to another embodiment of the invention.
  • a matrix of DUTs 24 and IC temperature sensing and prediction devices 20 is located on each testing board 42.
  • the testing boards 42 are in communication with an outside power source and driver electronics 70.
  • the power source and driver 70 communicates with the testing boards 42 by means of a data/power bus 71.
  • the power source and driver electronics 70 serves as a system controller which allows a user to determine a desired testing temperature for each DUT 24.
  • a typical testing chamber 68 is a burn-in chamber where air flow 67 from a fan or some other source is maintained across the testing boards 42.
  • the air flow 67 is preferably maintained at a high enough rate to keep the IC packages below the selected temperature prior to application of heat from the individual heaters 28.
  • the heaters 28 can then more easily maintain an independently selected temperature of each IC package 24.
  • a more detailed description of a system for testing of ICs in which the present invention can be incorporated is shown in commonly-owned U.S. Serial No. 11/069,589, entitled “Burn-In Testing Apparatus and Method," published as US 2005/0206368 Al .

Abstract

Cette invention concerne un appareil et un procédé qui combinent de préférence la détection et la prévision de température pour une régulation plus précise de la température dans des circuits intégrés. A cet effet, un dispositif de détection et de prévision de température de circuit intégré (20) comprend un dispositif de détection de courant (26) qui mesure le courant traversant un circuit intégré (24), et un appareil de régulation de température (28) qui mesure une température de surface du circuit intégré (24). Ce dispositif comprend en outre un contrôleur électronique (30) qui calcule la puissance consommée par le circuit intégré (24) en fonction d'une courant mesuré et qui règle la température d'un organe de chauffage ou de refroidissement (28) en réaction à la température de surface et à la consommation de puissance mesurées.
EP06736932A 2005-03-08 2006-03-03 Detection et prevision de temperature dans des prises a circuits integres Withdrawn EP1866656A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US65980805P 2005-03-08 2005-03-08
PCT/US2006/007687 WO2006096543A2 (fr) 2005-03-08 2006-03-03 Detection et prevision de temperature dans des prises a circuits integres

Publications (1)

Publication Number Publication Date
EP1866656A2 true EP1866656A2 (fr) 2007-12-19

Family

ID=36953894

Family Applications (1)

Application Number Title Priority Date Filing Date
EP06736932A Withdrawn EP1866656A2 (fr) 2005-03-08 2006-03-03 Detection et prevision de temperature dans des prises a circuits integres

Country Status (5)

Country Link
EP (1) EP1866656A2 (fr)
JP (1) JP2008537637A (fr)
KR (1) KR20070114310A (fr)
CN (1) CN101495821A (fr)
WO (1) WO2006096543A2 (fr)

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US20110106476A1 (en) * 2009-11-04 2011-05-05 Gm Global Technology Operations, Inc. Methods and systems for thermistor temperature processing
US8384395B2 (en) * 2010-05-06 2013-02-26 Texas Instrument Incorporated Circuit for controlling temperature and enabling testing of a semiconductor chip
JP4891423B2 (ja) * 2010-06-01 2012-03-07 ファナック株式会社 電子回路の冷却部の異常検査システム
CN102636291B (zh) * 2011-02-15 2013-12-25 三一电气有限责任公司 一种igbt结温检测装置及其方法
US8547122B2 (en) * 2011-07-11 2013-10-01 Microchip Technology Incorporated Temperature measurement of active device under test on strip tester
JP5742642B2 (ja) * 2011-10-06 2015-07-01 三菱電機株式会社 半導体素子の接合温度の推定方法、推定システムおよび推定プログラム
WO2013066292A1 (fr) 2011-10-31 2013-05-10 Hewlett-Packard Development Company, L.P. Réponse à un blocage du flux l'air dans un système
KR101942027B1 (ko) * 2012-03-28 2019-04-11 삼성전자 주식회사 디바이스의 온도 예측 방법
CN103364739B (zh) * 2012-03-29 2016-04-20 北京动力源科技股份有限公司 一种开关电源中开关管的结点温升测试方法
KR101600176B1 (ko) * 2014-04-11 2016-03-07 영남대학교 산학협력단 열저항을 이용한 led모듈체의 방열판 결합상태 검사시스템 및 열저항을 이용한 led모듈체의 방열판 결합상태 검사방법
JP6417700B2 (ja) 2014-04-23 2018-11-07 富士通株式会社 半導体部品および電子機器
CN106546357B (zh) * 2015-09-23 2020-06-02 中兴通讯股份有限公司 一种检测环境温度的方法、装置和电子设备
US10782316B2 (en) 2017-01-09 2020-09-22 Delta Design, Inc. Socket side thermal system
CN110928340B (zh) * 2018-09-19 2021-12-24 中车株洲电力机车研究所有限公司 一种功率器件主动结温控制系统及方法
TWI701447B (zh) * 2019-03-15 2020-08-11 鴻勁精密股份有限公司 具溫控單元之測試裝置及其應用之測試分類設備
CN113182198B (zh) * 2020-01-14 2023-08-29 鸿劲精密股份有限公司 具温控单元的测试装置及其应用的测试分类设备
CN111310362B (zh) * 2020-04-01 2023-11-10 纬湃科技投资(中国)有限公司 直流母线接插件的温度估算方法和计算机可读存储介质
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Also Published As

Publication number Publication date
JP2008537637A (ja) 2008-09-18
WO2006096543A2 (fr) 2006-09-14
WO2006096543A3 (fr) 2009-04-16
CN101495821A (zh) 2009-07-29
KR20070114310A (ko) 2007-11-30

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