EP1859238A1 - Capteur solaire de technologie mid - Google Patents

Capteur solaire de technologie mid

Info

Publication number
EP1859238A1
EP1859238A1 EP06707261A EP06707261A EP1859238A1 EP 1859238 A1 EP1859238 A1 EP 1859238A1 EP 06707261 A EP06707261 A EP 06707261A EP 06707261 A EP06707261 A EP 06707261A EP 1859238 A1 EP1859238 A1 EP 1859238A1
Authority
EP
European Patent Office
Prior art keywords
sensor arrangement
carrier
mid
electro
sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP06707261A
Other languages
German (de)
English (en)
Inventor
Wolfgang Jeitner
Thomas Ofenhitzer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Preh GmbH
Original Assignee
Preh GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Preh GmbH filed Critical Preh GmbH
Publication of EP1859238A1 publication Critical patent/EP1859238A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00Photometry, e.g. photographic exposure meter
    • G01J1/02Details
    • G01J1/04Optical or mechanical part supplementary adjustable parts
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00Photometry, e.g. photographic exposure meter
    • G01J1/02Details
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00Photometry, e.g. photographic exposure meter
    • G01J1/02Details
    • G01J1/0204Compact construction
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00Photometry, e.g. photographic exposure meter
    • G01J1/42Photometry, e.g. photographic exposure meter using electric radiation detectors
    • G01J1/4228Photometry, e.g. photographic exposure meter using electric radiation detectors arrangements with two or more detectors, e.g. for sensitivity compensation
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0284Details of three-dimensional rigid printed circuit boards
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00Photometry, e.g. photographic exposure meter
    • G01J1/42Photometry, e.g. photographic exposure meter using electric radiation detectors
    • G01J2001/4266Photometry, e.g. photographic exposure meter using electric radiation detectors for measuring solar light
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09118Moulded substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10121Optical component, e.g. opto-electronic component
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10151Sensor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431Details of mounted components
    • H05K2201/10439Position of a single component
    • H05K2201/10484Obliquely mounted

Definitions

  • the present invention relates to a sensor arrangement in a motor vehicle for determining a solar radiation acting on the motor vehicle.
  • Solar sensors are often used in motor vehicles, wherein the detected solar radiation is used in addition to other measures for controlling an air conditioner.
  • electro-optical components such as photodiodes are aligned on a printed circuit board and connected in this position with the board, so as to achieve a desired spatial arrangement of the components.
  • this approach has the disadvantage that the process of aligning and attaching or contacting is very time-consuming and thus costly.
  • the orientation is subject to inaccuracy, which is why the assemblies produced in this manner have variations in their detection characteristics that exceed the tolerances of the components used.
  • the invention is based on the object to provide a sensor arrangement which does not have the aforementioned disadvantages and in which the electro-optical components are easy, precise and reproducible mountable.
  • a sensor arrangement which is characterized by at least one electro-optical component which is mounted on a mono- or multi-part carrier in MID technology.
  • MID Molded Interconnect Device
  • MID Molded Interconnect Device
  • a carrier in MID technology offers the advantage that electro-optical components can be recorded accurately and reproducibly by the carriers.
  • the MID carrier carried out in several parts, the sensor assembly can be modularized, whereby an assembly and optionally a maintenance of the sensor assembly is simple and inexpensive to carry out. It is conceivable to design the sensor arrangement modularly in such a way that the electro-optical components and other assemblies are distributed over a plurality of carrier parts and thus can be separately mounted or replaced.
  • the electro-optical component or the electro-optical components are arranged inclined with respect to a flat base surface of the MID carrier. This allows the setting of an angle of attack of the component or of the components relative to the base of the carrier, which results, for example, adjustment possibilities of the sensor arrangement depending on the planned installation position in the motor vehicle. If the sensor arrangement is installed, for example, in the area of the dashboard of a motor vehicle, then it is conceivable that the base area of the MID carrier represents a plane parallel to the dashboard. Thus, the sensor or the sensors can be aligned with respect to the dashboard and thus also with respect to the motor vehicle.
  • the sensor arrangement is characterized by at least two electro-optical components on the MID carrier, wherein the surfaces of the electro-optical components are arranged inclined to each other. The perpendiculars to the component surfaces are thus not parallel to each other.
  • This arrangement is characterized inter alia by the fact that the direction of incidence of solar radiation is easier to detect. There is a subdivision of the detected range of incidence of the sunlight given in sectors, which can be evaluated by means of a corresponding evaluation, for example, to determine the direction of incidence of solar radiation.
  • the sensor arrangement has an integrated into the MID carrier connection for receiving a plug or other electrical contact.
  • a plug or other electrical contact are, for example, recesses which interact with contact pins. If these contact pins are arranged on a circuit board, the sensor arrangement can simply be plugged onto the circuit board.
  • the connection simplifies assembly or replacement of the sensor assembly and obviates the need for an outgoing connection such as a plug connected to a cable.
  • the sensor arrangement can be connected directly to the motor vehicle electronics, for example via a data bus of the vehicle.
  • the connection in the form of contact pins as Part of the Ml D-carrier is formed, which cooperate with a board, a plug or other assembly.
  • the contact pins can simply be formed from the MID material itself.
  • the MID carrier is designed in several parts.
  • the individual parts are connected to each other in such a way that they are adjustable against each other. This allows, for example, an exact alignment of the sensor arrangement in the motor vehicle.
  • the adjustment can also be made during operation of the sensor arrangement, for example for tracking the electro-optical component or the electro-optical components.
  • the adjustability is both rotational and translational possible, resulting in universal adjustment options in all degrees of freedom.
  • the adjustment is done by motor or manually.
  • At least one temperature sensor is arranged on the MID carrier. This makes it possible to detect the temperature in addition to the solar radiation with the sensor arrangement. This information is particularly advantageous for controlling an air conditioner.
  • the sensor arrangement is advantageously characterized by additional electrical or electronic components connected to the MID carrier.
  • additional electrical or electronic components connected to the MID carrier.
  • mount the MID carrier directly on a printed circuit board in order to achieve the shortest possible signal path and thus to reduce or prevent a possible falsification of the measuring signals.
  • the sensor arrangement has a scattering cap arranged above the electro-optical component for scattering the incident light.
  • a scattering cap as described for example in DE 103 23 709 A1, makes it possible inter alia that the sunlight hits the electro-optical components even at a flat angle of incidence.
  • the MID carrier has mechanical means with which the sensor arrangement in the motor vehicle and / or a means such as a scattering cap or a cover can be fastened to the sensor arrangement. Due to the fact that the MID Carrier is essentially an injection molded part, this can be provided with mechanical means such as recesses, projections, holding means or the like. Thus, it is possible to attach the sensor assembly without further components in the motor vehicle and to connect the scattering cap or a cover with the sensor assembly. This allows a further simplification of the assembly or any necessary repair of the sensor arrangement or of parts of the sensor arrangement.
  • Figure 1 shows a sensor arrangement according to the invention in a spatial representation
  • Figure 2 is an exploded view of another sensor arrangement.
  • the sensor arrangement 1 in Figure 1 consists essentially of a carrier 4 in MID technology, which is provided with conductor tracks 9, and two photodiodes 2 and 3.
  • Base 6 of the MID carrier 4 is parallel to the XY plane.
  • the photodiodes 2 and 3 are arranged inclined to each other, wherein in the present example, a respect to the
  • the photodiodes 2 and 3 are additionally arranged inclined relative to the flat base surface 6 of the MID carrier 4. Due to this spatial orientation, which can be realized particularly efficiently by the MID carrier 4, an improved directional evaluation of the incident solar radiation is possible.
  • resistors not shown in the figure are mounted on a web 7 of the MID carrier 4, with which the photodiodes 2 and 3 can be calibrated.
  • recesses 8 are provided, which are necessary to a conductive transition to the surface 5 opposite
  • Walls of the recesses 8 are electrically connected to tracks 9 on the front.
  • a connector not shown.
  • the sensor assembly 1 is connected by simply plugging a plug with the on-board electronics of a motor vehicle.
  • FIG. 10 shows an exploded view of another sensor assembly 11.
  • the MlD carrier 12 is equipped with a photodiode 13, a temperature sensor 14 and resistors 15 and 16.
  • the MID carrier 12 has projections, not shown, into which a leaflet 17 is clipped. This ensures a simple assembly and maintainability, to which little or no tool is necessary.
  • the MID carrier 12 is mounted in a housing 18 and protected by a cap 19. This has ventilation slots 20 through which the temperature sensor 14 is in thermal contact with the environment. Through the housing 18 contact pins 21 are pushed, with which an electrical connection to the MID carrier 12 is made.
  • components such as the temperature sensor 14, the resistors 15 and 16 or the scattering cap 17 can be omitted without departing from the spirit.
  • the invention is not limited to the embodiments specified in the exemplary embodiment. This applies in particular to the type, number and spatial arrangement of the electro-optical components.
  • the MID carrier can be equipped with additional electrical or electronic components or assemblies, such as signal amplifiers, analog-digital converters or other sensors.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Air-Conditioning For Vehicles (AREA)

Abstract

L'invention concerne un capteur solaire (1, 12) équipant un véhicule afin de déterminer le rayonnement solaire agissant sur le véhicule, comportant au moins un composant électro-optique (2, 3, 14) fixé sur un support (4, 13) de technologie MID (dispositif d'interconnexion moulé), en une ou plusieurs parties.
EP06707261A 2005-03-10 2006-02-24 Capteur solaire de technologie mid Withdrawn EP1859238A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102005011053A DE102005011053A1 (de) 2005-03-10 2005-03-10 Sonnensensor in MID-Technik
PCT/EP2006/001725 WO2006094656A1 (fr) 2005-03-10 2006-02-24 Capteur solaire de technologie mid

Publications (1)

Publication Number Publication Date
EP1859238A1 true EP1859238A1 (fr) 2007-11-28

Family

ID=36571011

Family Applications (1)

Application Number Title Priority Date Filing Date
EP06707261A Withdrawn EP1859238A1 (fr) 2005-03-10 2006-02-24 Capteur solaire de technologie mid

Country Status (5)

Country Link
US (1) US7546766B2 (fr)
EP (1) EP1859238A1 (fr)
JP (1) JP2008533708A (fr)
DE (1) DE102005011053A1 (fr)
WO (1) WO2006094656A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007093235A (ja) * 2005-09-27 2007-04-12 Kansai Electric Power Co Inc:The 立体日射計
JP5473745B2 (ja) * 2010-04-21 2014-04-16 オムロンオートモーティブエレクトロニクス株式会社 光検出装置
CN103994824B (zh) * 2014-04-25 2015-10-28 孝感华工高理电子有限公司 汽车阳光传感器
KR102298884B1 (ko) * 2017-02-14 2021-09-07 현대자동차주식회사 차량용 일사 감지 센서 조립체 및 이를 갖는 공조 시스템
DE102018211753B4 (de) * 2018-07-13 2020-02-27 Elektrobit Automotive Gmbh Leiterplattenbauteil und Verfahren zum fluiddichten Verbinden des Leiterplattenbauteils mit einer Leiterplatte

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0615288B2 (ja) * 1987-11-21 1994-03-02 株式会社ゼクセル 車両用空調装置
JP3033168B2 (ja) * 1990-10-04 2000-04-17 株式会社デンソー 日射センサ
JP2936702B2 (ja) * 1990-11-20 1999-08-23 株式会社デンソー 車両用空気調和制御装置
JP2603430Y2 (ja) * 1993-08-06 2000-03-13 カルソニック株式会社 日射検出センサ
GB2312567B (en) * 1997-03-14 1998-06-10 Itt Mfg Enterprises Inc Radio frequency connector to printed circuit board adpator
JP3783451B2 (ja) * 1999-03-12 2006-06-07 株式会社デンソー 光センサ
US6087650A (en) * 1998-05-04 2000-07-11 Ford Motor Company Solar sensor for measuring low angle solar heating of vehicle occupants
JP3800880B2 (ja) * 1999-08-26 2006-07-26 松下電工株式会社 受光ユニット
DE10302285B4 (de) * 2003-01-22 2006-05-04 Preh Gmbh Verfahren zur Bestimmung der Innenraumtemperatur eines Kfz-Fahrgastraumes, Anordnung zur Durchführung des Verfahrens sowie Temperatursensor
DE10311521B4 (de) * 2003-03-17 2010-11-11 Robert Bosch Gmbh Sensorelement, insbesondere Ölstandssensorelement, sowie Fluidsensor damit
DE10323709A1 (de) 2003-05-22 2004-12-09 Preh Gmbh Solarsensor
DE10340346A1 (de) * 2003-08-29 2005-04-28 Hella Kgaa Hueck & Co Sensorvorrichtung, insbesondere für Kraftfahrzeuge

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO2006094656A1 *

Also Published As

Publication number Publication date
JP2008533708A (ja) 2008-08-21
US20080087079A1 (en) 2008-04-17
US7546766B2 (en) 2009-06-16
WO2006094656A1 (fr) 2006-09-14
DE102005011053A1 (de) 2006-09-21

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