EP1859238A1 - Solar sensor in mid-technology - Google Patents

Solar sensor in mid-technology

Info

Publication number
EP1859238A1
EP1859238A1 EP06707261A EP06707261A EP1859238A1 EP 1859238 A1 EP1859238 A1 EP 1859238A1 EP 06707261 A EP06707261 A EP 06707261A EP 06707261 A EP06707261 A EP 06707261A EP 1859238 A1 EP1859238 A1 EP 1859238A1
Authority
EP
European Patent Office
Prior art keywords
sensor arrangement
carrier
mid
electro
sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP06707261A
Other languages
German (de)
French (fr)
Inventor
Wolfgang Jeitner
Thomas Ofenhitzer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Preh GmbH
Original Assignee
Preh GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Preh GmbH filed Critical Preh GmbH
Publication of EP1859238A1 publication Critical patent/EP1859238A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/02—Details
    • G01J1/04—Optical or mechanical part supplementary adjustable parts
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/02—Details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/02—Details
    • G01J1/0204—Compact construction
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
    • G01J1/4228—Photometry, e.g. photographic exposure meter using electric radiation detectors arrangements with two or more detectors, e.g. for sensitivity compensation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
    • G01J2001/4266—Photometry, e.g. photographic exposure meter using electric radiation detectors for measuring solar light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10484—Obliquely mounted

Definitions

  • the present invention relates to a sensor arrangement in a motor vehicle for determining a solar radiation acting on the motor vehicle.
  • Solar sensors are often used in motor vehicles, wherein the detected solar radiation is used in addition to other measures for controlling an air conditioner.
  • electro-optical components such as photodiodes are aligned on a printed circuit board and connected in this position with the board, so as to achieve a desired spatial arrangement of the components.
  • this approach has the disadvantage that the process of aligning and attaching or contacting is very time-consuming and thus costly.
  • the orientation is subject to inaccuracy, which is why the assemblies produced in this manner have variations in their detection characteristics that exceed the tolerances of the components used.
  • the invention is based on the object to provide a sensor arrangement which does not have the aforementioned disadvantages and in which the electro-optical components are easy, precise and reproducible mountable.
  • a sensor arrangement which is characterized by at least one electro-optical component which is mounted on a mono- or multi-part carrier in MID technology.
  • MID Molded Interconnect Device
  • MID Molded Interconnect Device
  • a carrier in MID technology offers the advantage that electro-optical components can be recorded accurately and reproducibly by the carriers.
  • the MID carrier carried out in several parts, the sensor assembly can be modularized, whereby an assembly and optionally a maintenance of the sensor assembly is simple and inexpensive to carry out. It is conceivable to design the sensor arrangement modularly in such a way that the electro-optical components and other assemblies are distributed over a plurality of carrier parts and thus can be separately mounted or replaced.
  • the electro-optical component or the electro-optical components are arranged inclined with respect to a flat base surface of the MID carrier. This allows the setting of an angle of attack of the component or of the components relative to the base of the carrier, which results, for example, adjustment possibilities of the sensor arrangement depending on the planned installation position in the motor vehicle. If the sensor arrangement is installed, for example, in the area of the dashboard of a motor vehicle, then it is conceivable that the base area of the MID carrier represents a plane parallel to the dashboard. Thus, the sensor or the sensors can be aligned with respect to the dashboard and thus also with respect to the motor vehicle.
  • the sensor arrangement is characterized by at least two electro-optical components on the MID carrier, wherein the surfaces of the electro-optical components are arranged inclined to each other. The perpendiculars to the component surfaces are thus not parallel to each other.
  • This arrangement is characterized inter alia by the fact that the direction of incidence of solar radiation is easier to detect. There is a subdivision of the detected range of incidence of the sunlight given in sectors, which can be evaluated by means of a corresponding evaluation, for example, to determine the direction of incidence of solar radiation.
  • the sensor arrangement has an integrated into the MID carrier connection for receiving a plug or other electrical contact.
  • a plug or other electrical contact are, for example, recesses which interact with contact pins. If these contact pins are arranged on a circuit board, the sensor arrangement can simply be plugged onto the circuit board.
  • the connection simplifies assembly or replacement of the sensor assembly and obviates the need for an outgoing connection such as a plug connected to a cable.
  • the sensor arrangement can be connected directly to the motor vehicle electronics, for example via a data bus of the vehicle.
  • the connection in the form of contact pins as Part of the Ml D-carrier is formed, which cooperate with a board, a plug or other assembly.
  • the contact pins can simply be formed from the MID material itself.
  • the MID carrier is designed in several parts.
  • the individual parts are connected to each other in such a way that they are adjustable against each other. This allows, for example, an exact alignment of the sensor arrangement in the motor vehicle.
  • the adjustment can also be made during operation of the sensor arrangement, for example for tracking the electro-optical component or the electro-optical components.
  • the adjustability is both rotational and translational possible, resulting in universal adjustment options in all degrees of freedom.
  • the adjustment is done by motor or manually.
  • At least one temperature sensor is arranged on the MID carrier. This makes it possible to detect the temperature in addition to the solar radiation with the sensor arrangement. This information is particularly advantageous for controlling an air conditioner.
  • the sensor arrangement is advantageously characterized by additional electrical or electronic components connected to the MID carrier.
  • additional electrical or electronic components connected to the MID carrier.
  • mount the MID carrier directly on a printed circuit board in order to achieve the shortest possible signal path and thus to reduce or prevent a possible falsification of the measuring signals.
  • the sensor arrangement has a scattering cap arranged above the electro-optical component for scattering the incident light.
  • a scattering cap as described for example in DE 103 23 709 A1, makes it possible inter alia that the sunlight hits the electro-optical components even at a flat angle of incidence.
  • the MID carrier has mechanical means with which the sensor arrangement in the motor vehicle and / or a means such as a scattering cap or a cover can be fastened to the sensor arrangement. Due to the fact that the MID Carrier is essentially an injection molded part, this can be provided with mechanical means such as recesses, projections, holding means or the like. Thus, it is possible to attach the sensor assembly without further components in the motor vehicle and to connect the scattering cap or a cover with the sensor assembly. This allows a further simplification of the assembly or any necessary repair of the sensor arrangement or of parts of the sensor arrangement.
  • Figure 1 shows a sensor arrangement according to the invention in a spatial representation
  • Figure 2 is an exploded view of another sensor arrangement.
  • the sensor arrangement 1 in Figure 1 consists essentially of a carrier 4 in MID technology, which is provided with conductor tracks 9, and two photodiodes 2 and 3.
  • Base 6 of the MID carrier 4 is parallel to the XY plane.
  • the photodiodes 2 and 3 are arranged inclined to each other, wherein in the present example, a respect to the
  • the photodiodes 2 and 3 are additionally arranged inclined relative to the flat base surface 6 of the MID carrier 4. Due to this spatial orientation, which can be realized particularly efficiently by the MID carrier 4, an improved directional evaluation of the incident solar radiation is possible.
  • resistors not shown in the figure are mounted on a web 7 of the MID carrier 4, with which the photodiodes 2 and 3 can be calibrated.
  • recesses 8 are provided, which are necessary to a conductive transition to the surface 5 opposite
  • Walls of the recesses 8 are electrically connected to tracks 9 on the front.
  • a connector not shown.
  • the sensor assembly 1 is connected by simply plugging a plug with the on-board electronics of a motor vehicle.
  • FIG. 10 shows an exploded view of another sensor assembly 11.
  • the MlD carrier 12 is equipped with a photodiode 13, a temperature sensor 14 and resistors 15 and 16.
  • the MID carrier 12 has projections, not shown, into which a leaflet 17 is clipped. This ensures a simple assembly and maintainability, to which little or no tool is necessary.
  • the MID carrier 12 is mounted in a housing 18 and protected by a cap 19. This has ventilation slots 20 through which the temperature sensor 14 is in thermal contact with the environment. Through the housing 18 contact pins 21 are pushed, with which an electrical connection to the MID carrier 12 is made.
  • components such as the temperature sensor 14, the resistors 15 and 16 or the scattering cap 17 can be omitted without departing from the spirit.
  • the invention is not limited to the embodiments specified in the exemplary embodiment. This applies in particular to the type, number and spatial arrangement of the electro-optical components.
  • the MID carrier can be equipped with additional electrical or electronic components or assemblies, such as signal amplifiers, analog-digital converters or other sensors.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Air-Conditioning For Vehicles (AREA)

Abstract

The invention relates to a sensor arrangement (1 , 12) in a motor vehicle for determination of the solar radiation incident on the motor vehicle, comprising at least one electrooptical component (2, 3, 14), fixed to one- or multi-piece supports (4, 13) using MID technology.

Description

B E S C H R E I B U N G DESCRIPTION
Sonnensensor in MID-TechnikSun sensor in MID technology
Die vorliegende Erfindung betrifft eine Sensoranordnung in einem Kraftfahrzeug zur Ermittlung einer auf das Kraftfahrzeug einwirkenden Sonnenstrahlung.The present invention relates to a sensor arrangement in a motor vehicle for determining a solar radiation acting on the motor vehicle.
Sonnensensoren werden oftmals in Kraftfahrzeugen eingesetzt, wobei die detektierte Sonneneinstrahlung neben anderen Maßnahmen zur Regelung einer Klimaanlage verwendet wird. In einem Sonnensensor werden elektro-optische Bauelemente wie beispielsweise Photodioden auf einer Leiterplatine ausgerichtet und in dieser Position mit der Platine verbunden, um so eine gewünschte räumliche Anordnung der Bauelemente zu erreichen. Diese Vorgehensweise weist jedoch den Nachteil auf, dass der Vorgang des Ausrichtens und Befestigens beziehungsweise Kontaktierens sehr zeit- und damit kostenaufwändig ist. Des Weiteren haftet der Ausrichtung eine Ungenauigkeit an, weshalb die auf diese Art und Weise produzierten Baugruppen Streuungen in ihren Detektions-Charakteristiken aufweisen, die über die Toleranzen der eingesetzten Bauelemente hinausgehen.Solar sensors are often used in motor vehicles, wherein the detected solar radiation is used in addition to other measures for controlling an air conditioner. In a sun sensor electro-optical components such as photodiodes are aligned on a printed circuit board and connected in this position with the board, so as to achieve a desired spatial arrangement of the components. However, this approach has the disadvantage that the process of aligning and attaching or contacting is very time-consuming and thus costly. Furthermore, the orientation is subject to inaccuracy, which is why the assemblies produced in this manner have variations in their detection characteristics that exceed the tolerances of the components used.
Der Erfindung liegt die Aufgabe zu Grunde, eine Sensoranordnung anzugeben, die die vorgenannten Nachteile nicht aufweist und in der die elektro-optischen Bauelemente leicht, präzise und reproduzierbar montierbar sind.The invention is based on the object to provide a sensor arrangement which does not have the aforementioned disadvantages and in which the electro-optical components are easy, precise and reproducible mountable.
Gelöst wird diese Aufgabe durch eine Sensoranordnung, die gekennzeichnet ist durch mindestens ein elektro-optisches Bauelement, das auf einem ein- oder mehrteiligen Träger in MID-Technik befestigt ist.This object is achieved by a sensor arrangement, which is characterized by at least one electro-optical component which is mounted on a mono- or multi-part carrier in MID technology.
MID (Molded Interconnect Device) beschreibt eine Technologie, bei der Leiterbahnen in Formteile wie beispielsweise Spritzgußteile eingebettet sind. Es ergeben sich räumliche Träger, die direkt mit Bauteilen bestückt werden können. Bei diesen Bauteilen handelt es sich gemäß der vorliegenden Erfindung im Wesentlichen um elektro-optische Bauelemente zur Erfassung der einfallenden Sonnenstrahlung, die beispielsweise als Photodiode, Solarzelle oder Photoelement ausgebildet sein können.MID (Molded Interconnect Device) describes a technology in which conductor tracks are embedded in molded parts such as injection molded parts. This results in spatial support that can be equipped with components directly. These components are according to the present invention essentially to electro-optical components for detecting the incident solar radiation, which may be formed for example as a photodiode, solar cell or photoelement.
Die Verwendung eines Trägers in MID-Technik bietet den Vorteil, dass elektro-optische Bauelemente exakt und reproduzierbar von den Trägern aufgenommen werden können. Ist der MID-Träger mehrteilig ausgeführt, so kann die Sensoranordnung modularisiert werden, wodurch eine Montage und gegebenenfalls eine Wartung der Sensoranordnung einfach und kostengünstig durchführbar ist. Es ist vorstellbar, die Sensoranordnung in der Weise modular auszuführen, dass die elektro-optischen Bauelemente und sonstige Baugruppen auf mehrere Trägerteile verteilt sind und somit separat montiert bzw. ausgetauscht werden können.The use of a carrier in MID technology offers the advantage that electro-optical components can be recorded accurately and reproducibly by the carriers. is the MID carrier carried out in several parts, the sensor assembly can be modularized, whereby an assembly and optionally a maintenance of the sensor assembly is simple and inexpensive to carry out. It is conceivable to design the sensor arrangement modularly in such a way that the electro-optical components and other assemblies are distributed over a plurality of carrier parts and thus can be separately mounted or replaced.
Es ist vorstellbar, dass das elektro-optische Bauelement oder die elektro-optischen Bauelemente gegenüber einer ebenen Grundfläche des MID-Trägers geneigt angeordnet sind. Dies ermöglicht die Einstellung eines Anstellwinkels des Bauelements oder der Bauelemente gegenüber der Grundfläche des Trägers, wodurch sich beispielsweise Anpassungsmöglichkeiten der Sensoranordnung je nach geplanter Einbauposition im Kraftfahrzeug ergeben. Wird die Sensoranordnung beispielsweise im Bereich des Armaturenbretts eines Kraftfahrzeugs eingebaut, so ist es vorstellbar, dass die Grundfläche des MID-Trägers eine zum Armaturenbrett parallele Ebene darstellt. Somit lassen sich der Sensor oder die Sensoren in Bezug auf das Armaturenbrett und damit auch in Bezug auf das Kraftfahrzeug ausrichten.It is conceivable that the electro-optical component or the electro-optical components are arranged inclined with respect to a flat base surface of the MID carrier. This allows the setting of an angle of attack of the component or of the components relative to the base of the carrier, which results, for example, adjustment possibilities of the sensor arrangement depending on the planned installation position in the motor vehicle. If the sensor arrangement is installed, for example, in the area of the dashboard of a motor vehicle, then it is conceivable that the base area of the MID carrier represents a plane parallel to the dashboard. Thus, the sensor or the sensors can be aligned with respect to the dashboard and thus also with respect to the motor vehicle.
In einer vorteilhaften Ausgestaltungsform ist die Sensoranordnung gekennzeichnet durch mindestens zwei elektro-optische Bauelemente auf dem MID-Träger, wobei die Oberflächen der elektro-optischen Bauelemente gegeneinander geneigt angeordnet sind. Die Senkrechten auf die Bauelementoberflächen sind somit zueinander nicht parallel. Diese Anordnung zeichnet sich unter anderem dadurch aus, dass die Einfallsrichtung der Sonnenstrahlung einfacher detektierbar ist. Es ist eine Unterteilung des detektierten Einfallsbereichs des Sonnenlichts in Sektoren gegeben, die mit Hilfe einer entsprechenden Auswerteelektronik auswertbar ist, beispielsweise um die Einfallsrichtung der Sonneneinstrahlung zu ermitteln.In an advantageous embodiment, the sensor arrangement is characterized by at least two electro-optical components on the MID carrier, wherein the surfaces of the electro-optical components are arranged inclined to each other. The perpendiculars to the component surfaces are thus not parallel to each other. This arrangement is characterized inter alia by the fact that the direction of incidence of solar radiation is easier to detect. There is a subdivision of the detected range of incidence of the sunlight given in sectors, which can be evaluated by means of a corresponding evaluation, for example, to determine the direction of incidence of solar radiation.
In einer weiteren Ausgestaltungsform weist die Sensoranordnung einen in den MID-Träger integrierten Anschluss zur Aufnahme eines Steckers oder einer sonstigen elektrischen Kontaktierung auf. Bei dieser handelt es sich beispielsweise um Ausnehmungen, die mit Kontakstiften zusammenwirken. Sind diese Kontaktstifte auf einer Platine angeordnet, lässt sich die Sensoranordnung einfach auf die Platine aufstecken. Der Anschluss vereinfacht die Montage oder den Austausch der Sensoranordnung und umgeht die Notwendigkeit einer nach außen geführten Anschlussmöglichkeit wie einen an ein Kabel angeschlossenen Stecker. Über den integrierten Anschluss kann die Sensoranordnung direkt mit der Kraftfahrzeugelektronik verbunden werden, beispielsweise über einen Datenbus des Fahrzeugs. Weiterhin ist es möglich, dass der Anschluss in Form von Kontaktstiften als Bestandteil des Ml D-Trägers ausgebildet ist, die mit einer Platine, einem Stecker oder einer sonstigen Baugruppe zusammenwirken. Die Kontaktstifte können einfach aus dem MID- Material selber geformt sein.In a further embodiment, the sensor arrangement has an integrated into the MID carrier connection for receiving a plug or other electrical contact. These are, for example, recesses which interact with contact pins. If these contact pins are arranged on a circuit board, the sensor arrangement can simply be plugged onto the circuit board. The connection simplifies assembly or replacement of the sensor assembly and obviates the need for an outgoing connection such as a plug connected to a cable. Via the integrated connection, the sensor arrangement can be connected directly to the motor vehicle electronics, for example via a data bus of the vehicle. Furthermore, it is possible that the connection in the form of contact pins as Part of the Ml D-carrier is formed, which cooperate with a board, a plug or other assembly. The contact pins can simply be formed from the MID material itself.
In einer weiteren vorteilhaften Ausgestaltungsvariante der Erfindung ist der MID-Träger mehrteilig ausgebildet. Dabei sind die einzelnen Teile derart miteinander verbunden, dass sie gegeneinander verstellbar sind. Dies ermöglicht beispielsweise eine exakte Ausrichtung der Sensoranordnung im Kraftfahrzeug. Das Verstellen kann jedoch auch während des Betriebs der Sensoranordnung vorgenommen werden, beispielsweise zur Nachführung des elektro-optischen Bauelements beziehungsweise der elektro-optischen Bauelemente. Die Verstellbarkeit ist dabei sowohl rotatorisch als auch translatorisch möglich, wodurch sich universelle Anpassungsmöglichkeiten in allen Freiheitsgraden ergeben. Das Verstellen erfolgt hierbei motorisch oder auch manuell.In a further advantageous embodiment variant of the invention, the MID carrier is designed in several parts. The individual parts are connected to each other in such a way that they are adjustable against each other. This allows, for example, an exact alignment of the sensor arrangement in the motor vehicle. However, the adjustment can also be made during operation of the sensor arrangement, for example for tracking the electro-optical component or the electro-optical components. The adjustability is both rotational and translational possible, resulting in universal adjustment options in all degrees of freedom. The adjustment is done by motor or manually.
Weiterhin ist es möglich, dass mindestens ein Temperatursensor auf dem MID-Träger angeordnet ist. Dies ermöglicht es, mit der Sensoranordnung neben der Sonneneinstrahlung auch die Temperatur zu erfassen. Diese Information ist insbesondere zur Regelung einer Klimaanlage vorteilhaft.Furthermore, it is possible for at least one temperature sensor to be arranged on the MID carrier. This makes it possible to detect the temperature in addition to the solar radiation with the sensor arrangement. This information is particularly advantageous for controlling an air conditioner.
In vorteilhafter Weise ist die Sensoranordnung gekennzeichnet durch zusätzliche, mit dem MID-Träger verbundene elektrische oder elektronische Bauteile. Anhand dieser Bauteile ist es beispielsweise möglich, die elektro-optischen Bauelemente zu kalibrieren oder deren Ausgangssignale derart aufzubereiten, dass die Sensoranordnung direkt an das elektronische System des Kraftfahrzeugs anschließbar ist. Es ist ebenfalls vorstellbar, den MID-Träger direkt auf einer Leiterplatine zu befestigen, um einen möglichst kurzen Signalweg zu erzielen und somit eine mögliche Verfälschung der Messsignale zu vermindern oder zu unterbinden.The sensor arrangement is advantageously characterized by additional electrical or electronic components connected to the MID carrier. On the basis of these components, it is possible, for example, to calibrate the electro-optical components or to process their output signals in such a way that the sensor arrangement can be connected directly to the electronic system of the motor vehicle. It is also conceivable to mount the MID carrier directly on a printed circuit board in order to achieve the shortest possible signal path and thus to reduce or prevent a possible falsification of the measuring signals.
In einer weiteren Ausgestaltungsform weist die Sensoranordnung eine über dem elektro- optischen Bauelement angeordnete Streukappe zur Streuung des einfallenden Lichts auf. Eine derartige Streukappe, wie sie beispielsweise in der DE 103 23 709 A1 beschrieben wird, ermöglicht es unter anderem, dass das Sonnenlicht auch bei flachem Einfallswinkel auf die elektro-optischen Bauelemente trifft.In a further embodiment, the sensor arrangement has a scattering cap arranged above the electro-optical component for scattering the incident light. Such a scattering cap, as described for example in DE 103 23 709 A1, makes it possible inter alia that the sunlight hits the electro-optical components even at a flat angle of incidence.
In vorteilhafter Weise weist der MID-Träger mechanische Mittel auf, mit denen die Sensoranordnung im Kraftfahrzeug und/oder ein Mittel wie eine Streukappe oder eine Abdeckung an der Sensoranordnung befestigbar ist. Dadurch, dass es sich bei dem MID- Träger im Wesentlichen um ein Spritzgußteil handelt, kann dieser mit mechanischen Mitteln wie Ausnehmungen, Vorsprüngen, Haltemitteln oder dergleichen versehen werden. Somit ist es möglich, die Sensoranordnung ohne weitere Bauteile im Kraftfahrzeug zu befestigen sowie die Streukappe oder eine Abdeckung mit der Sensoranordnung zu verbinden. Dadurch wird eine weitere Vereinfachung der Montage beziehungsweise einer eventuell notwendigen Reparatur der Sensoranordnung oder von Teilen der Sensoranordnung ermöglicht.In an advantageous manner, the MID carrier has mechanical means with which the sensor arrangement in the motor vehicle and / or a means such as a scattering cap or a cover can be fastened to the sensor arrangement. Due to the fact that the MID Carrier is essentially an injection molded part, this can be provided with mechanical means such as recesses, projections, holding means or the like. Thus, it is possible to attach the sensor assembly without further components in the motor vehicle and to connect the scattering cap or a cover with the sensor assembly. This allows a further simplification of the assembly or any necessary repair of the sensor arrangement or of parts of the sensor arrangement.
Anhand zweier Ausführungsbeispiele soll die Erfindung näher erläutert werden. Dabei zeigt:Based on two embodiments, the invention will be explained in more detail. Showing:
Figur 1 eine erfindungsgemäße Sensoranordnung in räumlicher Darstellung undFigure 1 shows a sensor arrangement according to the invention in a spatial representation and
Figur 2 eine Explosionsdarstellung einer weiteren Sensoranordnung.Figure 2 is an exploded view of another sensor arrangement.
Die Sensoranordnung 1 in Figur 1 besteht im Wesentlichen aus einem Träger 4 in MID- Technik, der mit Leiterbahnen 9 versehen ist, und zwei Photodioden 2 und 3. Die ebeneThe sensor arrangement 1 in Figure 1 consists essentially of a carrier 4 in MID technology, which is provided with conductor tracks 9, and two photodiodes 2 and 3. The plane
Grundfläche 6 des MID-Trägers 4 liegt parallel zu der XY-Ebene. Die Photodioden 2 und 3 sind gegeneinander geneigt angeordnet, wobei im vorliegenden Beispiel eine bezüglich derBase 6 of the MID carrier 4 is parallel to the XY plane. The photodiodes 2 and 3 are arranged inclined to each other, wherein in the present example, a respect to the
XZ-Ebene symmetrische Anordnung dargestellt ist. Die Photodioden 2 und 3 sind zusätzlich gegenüber der ebenen Grundfläche 6 des MID-Trägers 4 geneigt angeordnet. Aufgrund dieser räumlichen Ausrichtung, die durch den MID-Träger 4 besonders effizient realisiert werden kann, ist eine verbesserte Richtungsauswertung der einfallenden Sonnenstrahlung möglich.XZ-plane symmetrical arrangement is shown. The photodiodes 2 and 3 are additionally arranged inclined relative to the flat base surface 6 of the MID carrier 4. Due to this spatial orientation, which can be realized particularly efficiently by the MID carrier 4, an improved directional evaluation of the incident solar radiation is possible.
In einer bevorzugten Ausführungsform sind auf einem Steg 7 des MID-Trägers 4 in der Figur nicht dargestellte Widerstände angebracht, mit denen die Photodioden 2 und 3 kalibriert werden können. In einer Fläche 5 des MID-Trägers 4 sind Ausnehmungen 8 vorgesehen, die notwendig sind, um einen leitenden Übergang zur der Fläche 5 gegenüberliegendenIn a preferred embodiment, resistors not shown in the figure are mounted on a web 7 of the MID carrier 4, with which the photodiodes 2 and 3 can be calibrated. In a surface 5 of the MID carrier 4 recesses 8 are provided, which are necessary to a conductive transition to the surface 5 opposite
Rückseite des MID-Trägers 4 herzustellen. Dort sind Kontakstifte angeordnet, die über dieMake back of the MID carrier 4. There Kontakstifte are arranged over the
Wandungen der Ausnehmungen 8 elektrisch mit Leiterbahnen 9 auf der Vorderseite verbunden sind. Mittels der Kontaktstifte wird ein elektrischer Kontakt mit einem nicht dargestellten Anschlussstecker hergestellt. Somit wird die Sensoranordnung 1 durch einfaches Einstecken eines Steckers mit der Bordelektronik eines Kraftfahrzeugs verbunden.Walls of the recesses 8 are electrically connected to tracks 9 on the front. By means of the contact pins, an electrical contact is made with a connector, not shown. Thus, the sensor assembly 1 is connected by simply plugging a plug with the on-board electronics of a motor vehicle.
Mittels der Vorsprünge 10 kann eine nicht dargestellte Abdeckkappe an der Sensoranordnung 1 angebracht werden. Ebenfalls nicht dargestellt sind weitere Ausnehmungen bzw. Vorsprünge, mit denen die Sensoranordnung im Einsatzbereich befestigt wird. Figur 2 zeigt eine Explosionsdarstellung einer weiteren Sensoranordnung 11. Der MlD- Träger 12 ist mit einer Photodiode 13, einem Temperatursensor 14 sowie Widerständen 15 und 16 bestückt. Der MID-Träger 12 weist nicht dargestellte Vorsprünge auf, in die eine Streukappe 17 eingeclipst wird. Dadurch wird eine einfache Montier- und Wartbarkeit gewährleistet, zu der kein oder nur wenig Werkzeug notwendig ist.By means of the projections 10, a cap (not shown) can be attached to the sensor arrangement 1. Also not shown are further recesses or projections, with which the sensor arrangement is mounted in the application area. Figure 2 shows an exploded view of another sensor assembly 11. The MlD carrier 12 is equipped with a photodiode 13, a temperature sensor 14 and resistors 15 and 16. The MID carrier 12 has projections, not shown, into which a leaflet 17 is clipped. This ensures a simple assembly and maintainability, to which little or no tool is necessary.
Der MID-Träger 12 wird in einem Gehäuse 18 befestigt und von einer Abdeckkappe 19 geschützt. Diese weist Belüftungsschlitze 20 auf, durch die der Temperatursensor 14 in thermischem Kontakt mit der Umgebung steht. Durch das Gehäuse 18 werden Kontaktstifte 21 geschoben, mit denen eine elektrische Verbindung zum MID-Träger 12 hergestellt wird.The MID carrier 12 is mounted in a housing 18 and protected by a cap 19. This has ventilation slots 20 through which the temperature sensor 14 is in thermal contact with the environment. Through the housing 18 contact pins 21 are pushed, with which an electrical connection to the MID carrier 12 is made.
Selbstverständlich können Komponenten wie der Temperatursensor 14, die Widerstände 15 bzw. 16 oder die Streukappe 17 weggelassen werden, ohne den Erfindungsgedanken zu verlassen.Of course, components such as the temperature sensor 14, the resistors 15 and 16 or the scattering cap 17 can be omitted without departing from the spirit.
Die Erfindung ist nicht auf die in dem Ausführungsbeispiel angegebenen Ausführungsformen beschränkt. Dies betrifft insbesondere die Art, Anzahl und räumliche Anordnung der elektro- optischen Bauelemente. Des Weiteren kann der MID-Träger mit zusätzlichen elektrischen oder elektronischen Bauteilen oder Baugruppen bestückt sein, beispielsweise Signalverstärkern, Analog-Digital-Wandlem oder weiteren Sensoren. The invention is not limited to the embodiments specified in the exemplary embodiment. This applies in particular to the type, number and spatial arrangement of the electro-optical components. Furthermore, the MID carrier can be equipped with additional electrical or electronic components or assemblies, such as signal amplifiers, analog-digital converters or other sensors.

Claims

P A T E N T A N S P R Ü C H E PATENT APPLICATIONS
1. Sensoranordnung (1 , 12) in einem Kraftfahrzeug zur Ermittlung einer auf das Kraftfahrzeug einwirkenden Sonnenstrahlung, gekennzeichnet durch mindestens ein elektro-optisches Bauelement (2, 3, 14), das auf einem ein- oder mehrteiligen Träger (4, 13) in MID-Technik befestigt ist.1. Sensor arrangement (1, 12) in a motor vehicle for determining a solar radiation acting on the motor vehicle, characterized by at least one electro-optical component (2, 3, 14) on a single or multi-part carrier (4, 13) in MID technology is attached.
2. Sensoranordnung (1 , 12) nach Anspruch 1 , gekennzeichnet durch mindestens zwei elektro-optische Bauelemente (2, 3) auf dem M I D-Träger, wobei die Oberflächen der elektro-optischen bauelemente (2, 3) gegeneinander geneigt angeordnet sind.2. Sensor arrangement (1, 12) according to claim 1, characterized by at least two electro-optical components (2, 3) on the M I D carrier, wherein the surfaces of the electro-optical components (2, 3) are arranged inclined to each other.
3. Sensoranordnung (1, 12) nach Anspruch 1 oder 2, dadurch gekennzeichnet, dass das elektro-optische Bauelement oder die elektro-optischen Bauelemente (2, 3) gegenüber einer ebenen Grundfläche (6) des MID-Trägers (4) geneigt angeordnet sind.3. Sensor arrangement (1, 12) according to claim 1 or 2, characterized in that the electro-optical component or the electro-optical components (2, 3) arranged inclined relative to a flat base surface (6) of the MID carrier (4) are.
4. Sensoranordnung (1 , 12) nach einem der Ansprüche 1 bis 3, gekennzeichnet durch einen in den M I D-Träger (4) integrierten Anschluss zur Aufnahme eines Steckers oder einer sonstigen elektrischen Kontaktierung.4. Sensor arrangement (1, 12) according to one of claims 1 to 3, characterized by a in the M I D carrier (4) integrated connection for receiving a plug or other electrical contact.
5. Sensoranordnung (1 , 12) nach einem der Ansprüche 1 bis 4, dadurch gekennzeichnet, dass bei mehrteiliger Ausgestaltung des MID-Trägers (4) die Teile derart miteinander verbunden sind, dass sie gegeneinander verstellbar sind.5. Sensor arrangement (1, 12) according to one of claims 1 to 4, characterized in that in multi-part design of the MID carrier (4) the parts are connected to each other such that they are mutually adjustable.
6. Sensoranordnung (1 , 12) nach einem der Ansprüche 1 bis 5, gekennzeichnet durch mindestens einen Temperatursensor (15) auf dem MID-Träger (13).6. Sensor arrangement (1, 12) according to one of claims 1 to 5, characterized by at least one temperature sensor (15) on the MID carrier (13).
7. Sensoranordnung (1 , 12) nach einem der Ansprüche 1 bis 6, gekennzeichnet durch zusätzliche, mit dem MID-Träger (13) verbundene elektrische oder elektronische Bauteile (16, 17).7. Sensor arrangement (1, 12) according to one of claims 1 to 6, characterized by additional, with the MID carrier (13) connected electrical or electronic components (16, 17).
8. Sensoranordnung (1 , 12) nach einem der Ansprüche 1 bis 7, gekennzeichnet durch eine über dem elektro-optischen Bauelement (14) angeordnete Streukappe (18) zur Streuung des einfallenden Lichts.8. Sensor arrangement (1, 12) according to one of claims 1 to 7, characterized by a over the electro-optical component (14) arranged scattering cap (18) for scattering the incident light.
9. Sensoranordnung (1 , 12) nach einem der Ansprüche 1 bis 8, dadurch gekennzeichnet, dass der MID-Träger (4, 13) mechanische Mittel (10) aufweist, mit denen die Sensoranordnung (1 , 12) im Kraftfahrzeug und/oder ein Mittel wie eine Streukappe (18) oder eine Abdeckung an der Sensoranordnung (12) befestigbar ist. 9. sensor arrangement (1, 12) according to one of claims 1 to 8, characterized in that the MID carrier (4, 13) mechanical means (10), with which the sensor arrangement (1, 12) in the motor vehicle and / or a means such as a stray cap (18) or a cover on the sensor assembly (12) can be fastened.
EP06707261A 2005-03-10 2006-02-24 Solar sensor in mid-technology Withdrawn EP1859238A1 (en)

Applications Claiming Priority (2)

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DE102005011053A DE102005011053A1 (en) 2005-03-10 2005-03-10 Sun sensor in MID technology
PCT/EP2006/001725 WO2006094656A1 (en) 2005-03-10 2006-02-24 Solar sensor in mid-technology

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US7546766B2 (en) 2009-06-16

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