DE102018211753B4 - Printed circuit board component and method for fluid-tight connection of the printed circuit board component to a printed circuit board - Google Patents

Abstract

A circuit board component for limiting a fluid volume on a circuit board is described. The printed circuit board component comprises a housing with an opening which is to be placed on the printed circuit board, the opening being defined by a circumferential border of the housing. The housing comprises at least in a region of the peripheral border a molded interconnect device (MID) which has a metal coating along the peripheral border. Furthermore, an assembly is described which comprises a printed circuit board component. In addition, a display assembly is described that includes an assembly. Furthermore, methods for the fluid-tight connection of a printed circuit board component to a printed circuit board and for producing a printed circuit board component by means of a molded interconnect device (MID) technology are presented.

Description

Technical field

The present disclosure relates generally to the field of circuit board components. Specifically, a circuit board component for limiting a fluid volume on a circuit board, a circuit board assembly, a display assembly, a method for fluid-tight connection of the circuit board component to the circuit board and a method for producing the circuit board component are presented.

background

A large part of electronic circuits today is realized in the form of printed circuit boards. However, the use of such printed circuit boards is not limited to the processing of electrical signals. For some applications it is also necessary to limit fluids on the circuit board. As part of component cooling, it may be necessary, for example, to surround the component with a heat-conducting fluid. Provision can also be made for a fluid to be guided to a sensor system on the printed circuit board in order to record properties of the fluid, such as its temperature, pressure or composition.

The skilled person is faced with many problems when handling fluids on a printed circuit board. The fluid volume must be limited in a fluid-tight manner by means of a suitable printed circuit board component in order to protect other components and / or to minimize measurement errors in a fluid sensor system. However, seals with O-rings can take up a lot of space and are susceptible to the effects of heat, for example due to soldering and curing processes. In addition, these seals include many components that require complex assembly. The circuit board components that define the fluid volume usually also require complex component structures that lead to complex manufacturing processes. The DE 10 2016 225 544 B3 shows a circuit board component with a metal-tight housing, the edge of which is connected to a circuit board to seal the interior of the housing.

Short outline

The present disclosure is based on the object of providing a printed circuit board component which ensures reliable fluid limitation on a printed circuit board. Furthermore, a method for producing such a printed circuit board component, a method for fluid-tight connection of the printed circuit board component to a printed circuit board and an assembly with this printed circuit board component and a display assembly are to be specified.

According to a first aspect, a printed circuit board component for limiting a fluid volume on a printed circuit board is specified. The printed circuit board component comprises a housing with an opening which is to be placed on the printed circuit board, the opening being defined by a circumferential border of the housing. The housing comprises at least in a region of the peripheral border a molded interconnect device (MID) which has a metal coating along the peripheral border.

The printed circuit board can be a printed circuit board for receiving components of the surface mounted device (SMD) type, a multilayer printed circuit board and / or a flexible printed circuit board.

The MID can be an injection molded component. The MID can be produced by means of two-component injection molding, hot stamping, laser MID process, mask exposure process, film injection molding or direct conductor writing or a combination thereof. The area of the housing which has the metal coating can have been defined by means of a laser direct structuring.

The housing can have at least one fluid passage. The housing can have multiple fluid passages. The at least one fluid passage can differ from the opening of the housing to be placed on the circuit board.

The housing can comprise at least one connecting piece which opens into the fluid passage. For a plurality of fluid passages, the housing can each comprise a connecting piece which opens into the respective fluid passage.

The metal coating can at least partially extend over at least one of an end face of the border, an inner surface of the housing adjoining the end face and an outer surface of the housing adjoining the end face. The metal coating can extend over the entire end face.

The circuit board component can comprise a cooling structure which is in thermal contact with the housing or an interior of the housing. The cooling structure and the housing can be two separate components, wherein the cooling structure can be partially embedded in the housing. The cooling structure can include cooling fins.

According to a second aspect, a printed circuit board assembly is specified. The assembly includes a circuit board component as described herein. Furthermore, the assembly comprises a printed circuit board with a solderable printed circuit board area which is a Placement of an end face of the border of the housing in an area of the circuit board area is permitted. The assembly also includes a solder joint that connects the metal coating to the circuit board area in a fluid-tight manner.

The circuit board assembly can comprise a pressure sensor arranged within the housing. The pressure sensor can be arranged on the circuit board and contacted by it.

The circuit board assembly can comprise a component to be cooled, which is arranged within the housing. The component to be cooled can be arranged on the circuit board and contacted by it. The component to be cooled can be a semiconductor component, such as a processor.

The circuit board can have at least one fluid passage that is designed to provide a fluid connection to an interior of the housing. The fluid passage of the circuit board can be in the area of the housing opening.

The circuit board assembly may include a thermal fluid received in the housing. In addition to this, the assembly may include two fluid passages configured to allow the thermal fluid to flow from one of the fluid passages to another of the fluid passages in the housing. The two fluid passages can be arranged on two opposite walls of the housing. The thermal fluid may include a gas or liquid (such as water, oil, or alcohol).

According to a third aspect, a display module is specified. The display assembly comprises an assembly with a pressure sensor as described above. Furthermore, the assembly comprises a display and a storage, which comprises a container filled with a fluid. The bearing is designed to support at least a part of the display in such a way that a force acting on the display leads to a change in pressure of the fluid. The housing of the assembly is in communication with the fluid.

According to a fourth aspect, a method for the fluid-tight connection of a circuit board component to a circuit board is specified. The method comprises providing a printed circuit board component comprising a housing with an opening which is to be placed on the printed circuit board, the opening being defined by a circumferential border of the housing and the housing at least in a region of the circumferential border a molded interconnect device (MID), which has a metal coating along the circumferential border. Furthermore, the method comprises providing a printed circuit board with a solderable printed circuit board area, which allows an end face of the border of the housing to be placed in an area of the printed circuit board area. The method further comprises arranging the circuit board component on the circuit board, the end face of the housing abutting in the region of the circuit board area. The method also includes a fluid-tight connection of the metal coating of the housing to the circuit board area by means of a solder.

The fluid-tight connection can include applying and melting a solder.

The steps of arranging and / or of the fluid-tight connection can take place in the context of a surface assembly in which the printed circuit board is equipped with components (for example using an assembly robot). The components can be SMDs.

According to a fifth aspect, a method for producing a printed circuit board component by means of a molded interconnect device (MID) technique is specified. The printed circuit board component comprises a housing with an opening which is to be placed on a printed circuit board, the opening being defined by a circumferential border of the housing. The method comprises injection molding at least a region of the peripheral border of the housing. Furthermore, the method comprises defining a metallizable area on at least part of the injection molded area. In addition, the method comprises applying a metallization to the metallizable area.

list of figures

• 1A eine Schnittansicht eines ersten Ausführungsbeispiels eines Leiterplattenbauteils;
• 1B eine Sicht von unten auf eine Stirnseite einer Umrandung des ersten Ausführungsbeispiels aus 1A;
• 2A-C eine Schnittansicht eines zweiten, dritten und vierten Ausführungsbeispiels eines Leiterplattenbauteils;
• 3A-E eine Schnittansicht eines fünften, sechsten, siebten, achten und neunten Ausführungsbeispiels eines Leiterplattenbauteils;
• 4 ein Flussdiagramm für ein Verfahren zum fluiddichten Verbinden eines Leiterplattenbauteils mit einer Leiterplatte;
• 5A-D eine Schnittansicht eines ersten Ausführungsbeispiels einer Leiterplatten-Baugruppe während verschiedener Herstellungsschritte;
• 6A-D eine Schnittansicht eines zweiten Ausführungsbeispiels einer Leiterplatten-Baugruppe während verschiedener Herstellungsschritte;
• 7A-B eine Schnittansicht eines dritten und vierten Ausführungsbeispiels einer Leiterplatten-Baugruppe;
• 8 eine schematische Darstellung eines Ausführungsbeispiels einer Anzeige-Baugruppe; und
• 9A-B eine Schnittansicht eines fünften und sechsten Ausführungsbeispiels einer Leiterplatten-Baugruppe.

Further advantages, details and features of the present disclosure result from the following description of exemplary embodiments and from the figures. Show it:

• 1A a sectional view of a first embodiment of a circuit board component;
• 1B a view from below of an end face of a border of the first embodiment 1A ;
• 2A-C a sectional view of a second, third and fourth embodiment of a circuit board component;
• 3A-E a sectional view of a fifth, sixth, seventh, eighth and ninth embodiment of a circuit board component;
• 4 a flowchart for a method for fluid-tight connection of a circuit board component to a circuit board;
• 5A-D a sectional view of a first embodiment of a circuit board assembly during various manufacturing steps;
• 6A-D a sectional view of a second embodiment of a circuit board assembly during various manufacturing steps;
• 7A-B a sectional view of a third and fourth embodiment of a circuit board assembly;
• 8th a schematic representation of an embodiment of a display module; and
• 9A-B a sectional view of a fifth and sixth embodiment of a circuit board assembly.

Detailed description

In the exemplary embodiments, the same reference numerals refer to corresponding elements of the exemplary embodiments.

1A shows a sectional view of a first embodiment of a circuit board component 10 , The circuit board component 10 includes a housing 12 with an opening 14 which is to be placed over a component on a printed circuit board (not shown). The housing 12 has an outer surface 16 and an inner surface 18 on.

In the 1A shown outer surface 16 and inner surface 18 have essentially the shape of a semi-ellipsoid. This flat shape is space-saving and has no edges on the inside surface 18 Pressure peaks or, in the event of a flow through the housing 12 , Areas with low flow can arise. The housing 12 is rotationally symmetrical. The housing 12 can also have other shapes. The housing 12 can for example have the shape of a cuboid, a pyramid, a cone, a truncated cone, a cylinder, a spherical segment or similar structures.

The opening 14 defines an encircling border 20 , The border 20 has an end face 22 to be placed on a circuit board (not shown). The face 22 borders on the outer surface 16 and the inner surface 16 on. In the 1A shown end face is flat. Since most circuit boards are also flat, the end face can 22 so lie flat on a flat circuit board. Alternatively, the end face 22 have a different shape. For example, the end face can be curved and / or have a step if the printed circuit board or components arranged thereon have a corresponding shape.

The border 20 has a circular course (see 1B) , As described above, this avoids edges. Alternatively, the border 20 but also have a different course. The border can have an elliptical, rectangular or polygonal course.

That in the 1A and 1B shown housing 12 is an injection molded plastic component. Furthermore, the housing 12 along the circumferential border 20 a metal coating 24 on. Specifically, it is the case 12 a molded interconnect device, (MID). With MID technology, a metal coating is applied to an injection molded plastic component using various manufacturing processes.

One of these manufacturing processes is laser direct structuring. Here, the plastic component, namely the housing described above 12 , injection molded from a plastic-based material that has a laser-activatable metal compound. The metal compound can be an inorganic metal compound of metals of the d and f groups of the periodic table. The injection-molded plastic component is then irradiated by means of a laser in such a way that an area (namely the end face 22 ) is defined in which the laser-activatable metal compound is activated. Activation can include breaking the metal link. The surface of the defined area then has metal nuclei. When the plastic component is metallized, the metal nuclei have a catalytic effect, so that a metal coating forms on the area with the metal nuclei. In the 1A and 1B metal coating shown 24 is only on the face 22 applied. This makes the metal coating easy to manufacture 24 possible because the laser beam only has to define a flat surface.

As an alternative to laser direct structuring, the metal coating can also be carried out using other MID manufacturing processes. The metal coating can be produced using two-component injection molding, hot stamping, a mask exposure process, film injection molding and direct conductor writing.

MID components are characterized, among other things, by the great freedom of design of the component shape. Since the component can be injection molded, more complex shapes can be produced than with metal stamping. Furthermore, MID components have a lower weight than corresponding metal components due to the lower density of plastic. The housing makes all of these advantages 12 own.

The metal coating 24 defines an area on the surface of the housing 12 on which a flat solder connection can be achieved. Because the metal coating 24 along the perimeter of the opening 14 is formed, the solder along the entire circumference of the border of the opening 14 be applied. This allows the circuit board component 10 be soldered to a circuit board in such a way that the border 22 is connected to the circuit board in a fluid-tight manner.

2A shows a sectional view of a second embodiment of a circuit board component 10 , In contrast to the first embodiment, only part of the housing 12 trained as MID. The housing 12 in the example shown comprises an annular MID section 23 (with the border 20 ) and one to the MID section 23 adjacent dome section 25 , For fastening the MID section 23 on the dome section 25 is an adhesive 21 intended. If only part of the case 12 is designed as a MID component, the volume of necessary plastic with a laser-activatable metal connection is reduced. Furthermore, a housing base body (e.g. in the form of the dome section 25 ) are produced on the differently shaped (e.g. different height) MID sections 23 can be attached.

2 B shows a sectional view of a third embodiment of a circuit board component 10 , While in the first and second embodiments, the metal coating 24 on the face 22 the border 20 is provided, has the border in the third embodiment 20 on part of the outer surface 16 the metal coating 24 on, which is adjacent to the circuit board (not shown). As will be explained further below, the solder can be placed on the side of the housing 12 be applied after the housing 12 was placed on the circuit board. Because the circuit board in this case is the face 22 the border 20 the solder is difficult to apply. Shows the outline 20 however, as in 2 B shown on the outer surface 16 a metal coating, the solder can instead be on the outer surface 16 be applied.

2C shows a sectional view of a fourth embodiment of a circuit board component 10 , The fourth exemplary embodiment differs from the first exemplary embodiment essentially by a fluid passage 26 in the housing 12 , The fluid passage 26 is designed to communicate fluidly with the interior of the housing 12 to enable. So the fluid passage 26 be provided to one through the housing 12 fill limited volume with a fluid (such as a thermal fluid). The fluid passage 26 can also be provided to a fluid to a sensor system (not shown) in the housing 12 to lead. For example, through the fluid passage 26 a gas like air to the sensors in the housing 12 be directed. The sensor system can then record parameters of the gas, such as pressure, temperature or composition. The composition can be detected by means of an optical sensor system. For example, a light sensor system can be provided that enables conclusions to be drawn about its composition by means of a detected light absorption behavior of the fluid. Generally the housing 12 have a connection piece (not shown) to which a fluid line, such as a hose, is attached. The fluid passage 26 (or the connecting piece) can be designed to be closable.

3A shows a sectional view of a fifth embodiment of a circuit board component 10 , The fifth embodiment differs from the fourth embodiment essentially in the areas that have a metal coating 24 exhibit. The border 20 points to the face 22 , part of the outer surface 16 and part of the inner surface 18 a metal coating 24 on. Due to the larger metal coating 24 a larger amount of solder can be used for improved fluid tightness. Furthermore, when the solder flows, the risk that the solder will reach an area of the housing is reduced 12 wetted with no metal coating 24 having.

The metal coating 24 can be in various combinations on surfaces of the border 20 be upset. So only part of the outer surface 16 and the face 20 a metal coating 24 exhibit. It can also be only part of the inner surface 18 and the face 20 a metal coating 24 exhibit. The metal coating 24 can also be a large part or all of the outside and / or inside 16 . 18 cover. Such configurations improve protection of the housing 12 against electrostatic discharge (ESD) and electromagnetic shielding.

3B shows a sectional view of a sixth embodiment of a circuit board component 10 , The sixth embodiment differs from the fifth embodiment essentially in that the housing 12 a connecting piece 28 having. The connecting piece 28 opens into the fluid passage 26 , The connecting piece 28 extends from the outer surface 16 of the housing 12 away and allows a fluid-tight connection of a fluid line (z. B. a hose, not shown) to the fluid passage 26 , The connecting piece 28 also extends as an option into that of casing 12 limited volume. As a result, the fluid can be targeted to a near the inner end of the connection piece 28 provided component (not shown). As an alternative to this, the connecting piece can extend from the fluid passage 26 no further into that from the case 12 limited volume.

3C shows a sectional view of a seventh embodiment of a circuit board component 10 , The seventh embodiment differs from the fifth embodiment essentially in that the housing 12 in addition to the first fluid passage 26 a second fluid passage 27 having. The second fluid passage 27 can be used to the housing 12 to vent while through the first fluid passage 26 a fluid in the housing 12 is filled. Furthermore, the provision of two fluid passages enables 26 . 27 fluid flow (e.g. circulation) through the housing 12 , For example, by means of the first fluid passage 26 the housing 12 a fluid can be supplied during the second fluid passage 27 drains the fluid again. Such a fluid passage allows heat and / or contaminants to be continuously removed from the housing.

3D shows a sectional view of an eighth embodiment of a circuit board component 10 , The eighth embodiment differs from the seventh embodiment essentially in an arrangement of the two fluid passages 26 . 27 , The fluid passages 26 . 27 are on two opposite areas of the housing 12 arranged. This makes the fluid passages 26 . 27 formed during operation of a fluid flow between the two fluid passages as described above 26 . 27 to exchange the fluid in an efficient manner. Furthermore, a component (not shown) that is between the two fluid passages 26 . 27 is arranged, flows around specifically, so that an improved removal of heat, impurities, etc. can take place.

3E shows a sectional view of a ninth embodiment of a circuit board component 10 , The circuit board component 10 has a fluid passage 26 for filling the housing 12 with a fluid. Alternatively, the circuit board component 10 also several fluid passages 26 , for example to ventilate the housing 12 , exhibit. Furthermore, the housing 12 a cooling structure 29 in the form of cooling fins. The cooling structure 29 is in thermal contact with the housing 12 and / or one in the housing 12 absorbed fluid. The fluid passage 26 is designed to be lockable. The heat transfer by means of the fluid and the cooling structure 29 is explained in more detail below (see 9B) , The cooling structure 29 can be a different material than the housing 12 contain. The cooling structure 29 may include materials with high thermal conductivity, such as a metal (e.g. silver, copper, gold, aluminum, or alloys thereof).

The PCB components presented here 10 are each designed to limit a fluid volume on a circuit board. For this purpose, the circuit board component is connected to the circuit board in a fluid-tight manner by means of a solder. 4 shows a flow chart 100 for a method for the fluid-tight connection of a circuit board component to a circuit board. The 5A-D and 6A-D each show different embodiments of the method 100 which essentially differ in the lot order. As will be shown in these exemplary embodiments, the sequence of the method steps can vary. This in 4 shown flowchart 100 therefore only shows a possible sequence of process steps.

The procedure includes according to step 102 providing a circuit board component 10 , The circuit board component 10 includes a housing 12 with an opening 14 that is to be placed on the circuit board, taking the opening 14 of an all-round border 20 of the housing 12 is defined and being the housing 12 at least in one area of the circumferential border 20 a Molded Interconnect Device (MID) that runs along the circumferential border 20 a metal coating 24 having.

The procedure includes according to step 104 providing a circuit board 30 with a solderable circuit board area 32 , which is putting on an end face of the border 20 of the housing 12 in an area of the circuit board area 32 allowed. An exemplary circuit board 30 is in each of the 5A and 6A shown. The circuit board 30 includes a solderable circuit board area 32 that in the circuit board 30 for example, is recessed. The circuit board area 32 can through a recess in a solder resist of the circuit board 30 be defined. Alternatively, the circuit board area 32 be raised. Furthermore, the circuit board area 32 a circumferential shape that is at least similar to the outline 20 of the circuit board component 10 has. Is the outline 20 For example, the circuit area has a circular shape 32 a circular course. Alternatively, the circuit board area 32 a different shape than the border 20 if the circuit board area 32 an application of the end face 22 the border 20 to the circuit board area 32 allowed.

The in 5A and 6A PCB area shown 32 has a larger area than that face 22 of the circuit board component 10 on. As a result, a larger amount of solder can be used for a more stable connection. There is also a placement of the circuit board component 10 on the circuit board 30 possible with a higher fault tolerance. Alternatively, the circuit board area 32 and the face 22 have substantially the same shape. In this case, the space required by the circuit board area 32 on the circuit board 30 lower.

Providing the circuit board 30 can be done during a robot-based assembly process (e.g. on a treadmill). The circuit board 30 can be arranged by machine or by hand on a treadmill, after which the subsequent manufacturing steps are carried out.

The procedure includes according to step 106 arranging the circuit board component 10 on the circuit board 30 , the front surface of the housing 12 in the area of the circuit board area 32 lies planar. Arranging the circuit board component 10 is for example in the 5C and 6B shown. 5C shows an arrangement of the circuit board component 10 on one lot 34 that was previously on the circuit board area 32 the circuit board 30 was applied. In this version, the circuit board component 10 (For example, due to a low weight of the circuit board component 10 ) on the lot 34 when it is melted, swim so that the face 22 of the circuit board component 10 the circuit board area 32 not touched. This effect can be used to self-center the PCB component 10 over the circuit board area 32 be used. Alternatively, the circuit board component 10 , as in 6B shown on the circuit board area 32 be arranged before a solder 34 is applied.

The procedure includes according to step 108 a fluid-tight connection of the metal coating of the housing to the circuit board area by means of a solder 34 , The fluid-tight connection comprises applying and melting the solder 34 , As in 5B shown, the solder 34 on the circuit board area 32 be applied before the circuit board component 10 on the circuit board 30 is arranged. The Lot 34 can be applied using screen printing, for example. For this purpose, the solder 34 Include solder paste. The application of the solder by means of screen printing is a common process for surface mounting, which allows an automatic assembly of a printed circuit board with surface-mounted components (SMDs). The circuit board component can then also be used as part of this surface mounting 10 be assembled, which enables an efficient manufacturing process.

How 5C shows, the circuit board component 10 then on the lot 34 arranged. This can be done using an SMD pick and place machine. The fluid-tight connection further comprises heating the solder 34 , Here, the solder 34 melted so the solder 34 the surfaces of the metal coating 24 and the circuit board area 32 wetted. The Lot 34 wets the metal coating 24 and the circuit board area 32 along the entire perimeter of the border 20 , The melting of the solder 34 can be done in an SMD oven, for example. Then the solder 34 cooled, causing it to solidify again. The Lot 34 is now with the metal coating 24 and the circuit board area 32 mechanically firmly connected. Because the solder 34 along the entire perimeter of the border 20 is applied, the solder forms a fluid-tight connection between the metal coating 24 and the circuit board area 32 ,

As an alternative to applying the solder 34 before arranging the circuit board component 10 on the circuit board 30 (as in 5B shown), the solder 34 can also be applied after the circuit board component 10 on the circuit board 30 was ordered. This is exemplified in the 6A and 6B shown. The circuit board component 10 is first on the circuit board area 32 arranged. This touches the metal coating 24 the face 22 the circuit board area 32 , Then a solder 34 on the circuit board area 32 and the metal coating 24 the outer surface 16 applied. The Lot 34 is then melted, leaving the circuit board area 32 and the metal coating 24 the outer surface 16 wetted. By choosing an appropriate lot 34 and / or shaping the border 20 (for example with grooves or other structures on the end face 22 ) the liquid solder 34 at least partially between the end face 22 and the circuit board area 32 flow. This creates a contact surface of the solder 34 on the metal coating 24 and the circuit board area 32 increased. After curing, the solder forms 34 , as described above, a fluid-tight connection between the metal coating 24 and the circuit board area 32 ,

That by means of the solder connection 34 interconnected components printed circuit board 30 and circuit board component 10 are parts of a printed circuit board assembly 40 , In the 5D and 6D shown first and second embodiments of circuit board assemblies 40 each limit a fluid volume 42 , The fluid volume 42 can be a gas (such as air, nitrogen or argon) or a liquid (such as water, oil or alcohol). In the 5D and 6D shown assemblies 40 have no fluid passages. Due to the fluid-tight connection between the metal coating 24 and the PCB area 32 the fluid cannot come out of the assembly 40 escape. The first and second embodiments are therefore low-maintenance. The circuit board component 10 can be designed to compensate for changes in volume of the fluid. For this purpose, the housing 12 have an elastic region (not shown). The housing 12 can be at least partially filled with a (compressible) gas, which changes when pressure changes within the housing 12 compresses or expands. This allows volume changes in the fluid that make up the solder joint 34 between the housing 12 and damage the circuit board can be avoided.

However, to get a fluid in and / or out of the fluid volume within the housing 12 the assembly can 40 - As explained above - have at least one fluid passage. 7A shows a sectional view of a third embodiment of an assembly 40 , The circuit board 30 has a fluid passage 44 on. The fluid passage 44 is inside the circuit board area 32 arranged and thus opens into that of the circuit board component 10 limited fluid volume 42 , The fluid passage 44 can be designed to be closable by means of an applied solder (not shown).

Alternatively or additionally, the housing can 12 have a fluid passage. 7B shows a sectional view of a fourth embodiment of an assembly 40 , The housing 12 includes a fluid passage 26 and a connecting piece 28 that in the fluid passage 26 empties. The connecting piece 28 allows a hose to be attached 46 which is the fluid volume 42 in fluid communication with a pressure source 48 combines. Within the fluid volume 42 is on the circuit board 30 a pressure sensor 50 intended. The pressure sensor 50 is designed to measure the pressure within the fluid volume 42 and thus the pressure of the hose 46 with the fluid volume 42 connected pressure source 48 capture. The circuit board component 10 thus enables a reliable limitation of fluids on a circuit board 30 for the purpose of pressure measurement. The pressure source 50 can be a room, a cabin, the atmosphere of the earth, a vehicle tire, an engine cylinder or the like.

The pressure source 50 can also be part of an input device. 8th shows in this context a perspective view of a display assembly 60 , The display assembly 60 includes an assembly 40 with a pressure sensor 50 , such as according to the fourth embodiment 7B , The display assembly also includes 60 an ad 62 , The ad 62 is, for example, a liquid crystal panel. The display assembly also includes 60 elastic storage 64 that is trained to display 62 regarding a backlight 66 or other substrate. Warehousing 64 includes that between the ad 62 and the backlight 66 guided hose 46 who in 8th between the assembly 40 and the display 62 is indicated by dashed lines. Both the hose 46 as well as the assembly 40 contain air as a fluid for pressure measurement.

A user can use the display assembly 60 operate by applying a force to the display assembly 60 , specifically on the display comprising the liquid crystal panel 62 , exercises. When the force is applied, the elastic mounting 64 and therefore also the air in the hose 46 compressed. This leads to a change in pressure in the hose 46 , Because the hose 64 in fluid communication with that of the assembly 40 limited air volume 42 stands, the air volume experiences 42 also a change in pressure. This pressure change can be from the pressure sensor 50 be recorded. The pressure sensor 50 can send a pressure signal to a processor (not shown) of the display module 50 send. The processor is designed to evaluate this pressure signal as an input from the user and can be on the same circuit board 30 like the pressure sensor 50 be arranged.

The limitation of fluids on a printed circuit board is not limited to the measurement of air pressure. With the circuit board component presented here 10 heat dissipation of a component can also be realized on a printed circuit board. 9A and 9B show in this context a sectional view of assemblies 40 with a component to be cooled 51 ,

9A shows a sectional view of a fifth embodiment of an assembly 40 , the housing 12 two fluid passages 26 . 27 with connecting piece included. The circuit board component 10 has substantially the same features as that of the eighth embodiment in FIG 3D on. A pump (not shown) delivers fluid through the first fluid passage 26 in the housing 12 , The direction of fluid flow is indicated by an arrow. The fluid flows out of the second fluid passage 27 back out of the case 12 , The fluid flows around the component to be cooled 51 and transports them from the component 51 generated heat.

9B shows a sectional view of a sixth embodiment of an assembly 40 with a housing 12 which is a cooling structure 29 has in the form of cooling fins. The circuit board component 10 has substantially the same features as that of the ninth embodiment in FIG 3E on. The housing 12 also has a fluid passage 26 on the filling and / or emptying of the fluid volume 42 allowed. There can also be several fluid passages 26 be provided. The housing 12 has a clasp 31 that is formed, the fluid volume 42 to be closed fluid-tight. The closure 31 can include, for example, a screw cap, a cover fastened with adhesive, or a seal that can be deformed when heat is applied. The component generates during operation 51 a waste heat that is given off to the fluid. The fluid is in contact with the cooling structure 29 , which releases the heat of the fluid to the ambient air. The temperature gradient between the cooling structure 29 and the component 51 generates a convection current that carries the fluid between the component 51 and the cooling structure 29 emotional. This embodiment therefore does not require a pump and requires little maintenance.

Claims (16)

Printed circuit board component (10) for limiting a fluid volume (42) on a printed circuit board, the printed circuit board component (10) comprising: a housing (12) with an opening (14) to be placed on the printed circuit board (30), the opening (14 ) is defined by a circumferential border (20) of the housing (12) and wherein the housing (12) comprises at least in a region of the circumferential border (20) a molded interconnect device (MID) which runs along the circumferential border (20 ) has a metal coating (24). Printed circuit board component (10) Claim 1 The area of the housing (12) which has the metal coating (24) has been defined by means of a laser direct structuring. Printed circuit board component (10) according to one of the preceding claims, wherein the housing (12) has at least one fluid passage (26). Printed circuit board component (10) Claim 3 , wherein the housing (12) further comprises at least one connecting piece (28) which opens into the fluid passage (26). Printed circuit board component (10) according to one of the preceding claims, wherein the metal coating (24) extends at least partially over at least one of an end face (22) of the border (20), an inner face (18) of the housing (18) adjoining the end face (22). 12) and an outer surface (16) of the housing (12) adjoining the end face (22). Printed circuit board component (10) according to one of the preceding claims, comprising a cooling structure (29) which is in thermal contact with the housing (12) or an interior of the housing (12). A circuit board assembly (40) comprising a printed circuit board component (10) according to one of the preceding claims; a printed circuit board (30) with a solderable printed circuit board area (32), which allows an end face (22) of the border (20) of the housing (12) to be placed in an area of the printed circuit board area (32); a solder connection that connects the metal coating (24) to the circuit board area (32) in a fluid-tight manner. Assembly (40) after Claim 7 comprising a sensor arranged within the housing (12), in particular a pressure sensor (50). Assembly (40) after Claim 7 or 8th comprising a component (51) to be cooled, which is arranged within the housing (12). Assembly (40) according to one of the Claims 7 to 9 , wherein the printed circuit board (30) has at least one fluid passage (44), which is designed to provide a fluid connection to an interior of the housing (12). Assembly (40) according to one of the Claims 7 to 10 comprising a heat conducting fluid which is received in the housing (12). Assembly (40) after Claim 11 , comprising two fluid passages (26, 27) which are designed to allow a flow of the thermal fluid from one of the fluid passages (26) to another of the fluid passages (27) in the housing (12). A display assembly (60) comprising: an assembly (40) after Claim 8 or one of the Claims 9 - 12 as far as this on Claim 8 are related; a display (62); and a bearing (64) comprising a container (46) filled with a fluid, the bearing (64) being designed to support at least a part of the display (62) in such a way that a force is exerted on the display (62) leads to a change in pressure of the fluid, the housing (12) of the circuit board component (10) being in communication with the fluid. Method (100) for the fluid-tight connection of a circuit board component (10) to a circuit board (30), the method comprising: providing (102) a circuit board component (10) comprising a housing (12) with an opening (14) which is on the circuit board ( 30) is to be placed, the opening (14) being defined by a circumferential border (20) of the housing (12) and the housing (12) at least in a region of the circumferential border (20) being a molded interconnect device ( MID), which has a metal coating (24) along the circumferential border (20); Providing (104) a printed circuit board (30) with a solderable printed circuit board area (32), which allows an end face (22) of the border (20) of the housing (12) to be placed in an area of the printed circuit board area (32); Arranging (106) the printed circuit board component (10) on the printed circuit board, the end face (22) of the housing (12) abutting in the area of the printed circuit board area (32); and fluid-tight connection (108) of the metal coating (24) of the housing (12) to the printed circuit area (32) by means of a solder (34). Procedure according to Claim 14 , wherein the steps of arranging and / or of the fluid-tight connection take place within the scope of a surface assembly in which the printed circuit board (30) is equipped with components. Method for producing a printed circuit board component (10) by means of a molded interconnect device (MID) technique, the printed circuit board component (10) comprising a housing (12) with an opening (14) which is on a printed circuit board (30) is placed, the opening (14) being defined by a circumferential border (20) of the housing (12), the method comprising: Injection molding at least a portion of the circumferential border (20) of the housing (12); Defining a metallizable area on at least part of the injection molded area; and Apply a metallization to the metallizable area.

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