WO2020011667A1

WO2020011667A1 - Printed circuit board component and method for connecting the printed support component to a printed circuit board in a fluid-tight manner

Info

Publication number: WO2020011667A1
Application number: PCT/EP2019/068109
Authority: WO
Inventors: Stefan Christmann
Original assignee: Elektrobit Automotive Gmbh
Priority date: 2018-07-13
Filing date: 2019-07-05
Publication date: 2020-01-16
Also published as: DE102018211753A1; DE102018211753B4

Abstract

The invention relates to a printed circuit board component (10) for delimiting a fluid volume (42) on a printed circuit board (30). The printed circuit board component comprises a housing (12) with an opening (14) which is placed on the printed circuit board (30), said opening (14) being defined by a peripheral border (20) of the housing. The housing (12) comprises a molded interconnect device (MID) at least in a region of the peripheral border, said device having a metal coating (24) along the peripheral border (20). The invention also relates to an assembly (40) which comprises a printed circuit board component (10), to a display assembly (60) which comprises an assembly (40), and to a method for connecting a printed circuit board component to a printed circuit board in a fluid-tight manner and for producing a printed circuit board component using molded interconnect device (MID) technology.

Description

Title of the invention

Printed circuit board component and method for fluid-tight connection of the printed circuit board component to a printed circuit board

Technical field

The present disclosure relates generally to the field of circuit board components. Specifically, a circuit board component for limiting a fluid volume on a circuit board, a circuit board assembly, a display assembly, a method for fluid-tight connection of the circuit board component to the circuit board and a method for producing the circuit board component are presented.

background

A large part of electronic circuits today is realized in the form of printed circuit boards. However, the use of such printed circuit boards is not limited to the processing of electrical signals. For some applications it is also necessary to limit fluids on the circuit board. As part of component cooling, it may be necessary, for example, to surround the component with a heat-conducting fluid. Provision can also be made for a fluid to be guided to a sensor system on the printed circuit board in order to record properties of the fluid, such as its temperature, pressure or composition.

The skilled person is faced with many problems when handling fluids on a printed circuit board. The fluid volume must be by means of a suitable circuit board component be limited in a fluid-tight manner in order to protect other components and / or to minimize measurement errors in a fluid sensor system. Seals with O-rings can, however, take up a lot of space and are susceptible to the effects of heat, for example due to soldering and curing processes. In addition, these seals include many components that require complex assembly. The circuit board components that define the fluid volume also usually require complex component structures that lead to complex manufacturing processes.

Short outline

The object of the present disclosure is to provide a printed circuit board component which ensures reliable fluid limitation on a printed circuit board. Furthermore, a method for producing such a printed circuit board component, a method for fluid-tight connection of the printed circuit board component to a printed circuit board and an assembly with this printed circuit board component and a display assembly are to be specified.

According to a first aspect, a circuit board component for limiting a fluid volume on a circuit board is specified. The printed circuit board component comprises a housing with an opening which is to be placed on the printed circuit board, the opening being defined by a circumferential border of the housing. The housing comprises at least in one area of the peripheral border a molded interconnect device (MID) which has a metal coating along the peripheral border.

The printed circuit board can be a printed circuit board for receiving components of the surface mounted device (SMD) type, a multilayer printed circuit board and / or a flexible printed circuit board. The MID can be an injection molded component. The MID can be produced by means of two-component injection molding, hot stamping, laser MID process, mask exposure process, film back-spraying or direct conductor writing or a combination thereof. The area of the housing which has the metal coating can have been defined by means of a laser direct structuring.

The housing can have at least one fluid passage. The housing can have multiple fluid passages. The at least one fluid passage can differ from the opening of the housing to be placed on the circuit board.

The housing can comprise at least one connecting piece which opens into the fluid passage. For several fluid passages, the housing can each comprise a connecting piece which opens into the respective fluid passage.

The metal coating can extend at least partially over at least one of an end face of the border, an inner surface of the housing adjoining the end face and an outer surface of the housing adjoining the end face. The metal coating can extend over the entire end face.

The circuit board component can comprise a cooling structure which is in thermal contact with the housing or an interior of the housing. The cooling structure and the housing can be two separate components, wherein the cooling structure can be partially embedded in the housing. The cooling structure can include cooling fins. According to a second aspect, a printed circuit board assembly is specified. The assembly includes a circuit board component as described herein. Furthermore, the assembly comprises a printed circuit board with a solderable circuit board area, which allows a front face of the edge of the housing to be placed in an area of the circuit board area. The assembly also includes a solder joint that connects the metal coating to the circuit board area in a fluid-tight manner.

The circuit board assembly can comprise a pressure sensor arranged within the housing. The pressure sensor can be arranged on the circuit board and contacted by it.

The circuit board assembly can comprise a component to be cooled, which is arranged within the housing. The component to be cooled can be arranged on the circuit board and contacted by it. The component to be cooled can be a semiconductor component, such as a processor.

The circuit board can have at least one fluid passage, which is designed to provide a fluid connection to an interior of the housing. The fluid passage of the circuit board can be in the area of the housing opening.

The circuit board assembly may include a thermal fluid received in the housing. In addition to this, the assembly can comprise two fluid passages which are designed to allow a flow of the thermal fluid from one of the fluid passages to another of the fluid passages in the housing. The two fluid passages can be arranged on two opposite walls of the housing. The thermal fluid may include a gas or a liquid (such as water, oil, or alcohol). According to a third aspect, a display assembly is specified. The display assembly comprises an assembly with a pressure sensor as described above. Furthermore, the assembly comprises a display and a storage, which comprises a container filled with a fluid. The bearing is designed to support at least a part of the display in such a way that a force acting on the display leads to a change in the pressure of the fluid. The housing of the assembly is in communication with the fluid.

According to a fourth aspect, a method for the fluid-tight connection of a circuit board component to a circuit board is specified. The method comprises providing a printed circuit board component comprising a housing with an opening that is to be placed on the printed circuit board, the opening being defined by a circumferential border of the housing and the housing at least in a region of the circumferential border a molded interconnect device (MID), which has a metal coating along the circumferential border. Furthermore, the method comprises providing a printed circuit board with a solderable printed circuit board area, which allows an end face of the border of the housing to be placed in an area of the printed circuit board area. The method further comprises arranging the circuit board component on the circuit board, the end face of the housing resting in the region of the circuit board area. The method also includes a fluid-tight connection of the metal coating of the housing to the circuit board area by means of a solder.

The fluid-tight connection can include applying and melting a solder.

The steps of arranging and / or of the fluid-tight connection can take place within the scope of a surface mounting in which the PCB (e.g. using a placement robot) with components. The components can be SMDs.

According to a fifth aspect, a method for producing a printed circuit board component using a molecular interconnect device (MID) technology is specified. The Lei terplattenbauteil includes a housing with an opening to be placed on a circuit board, the opening being defined by a peripheral border of the housing. The method includes injection molding at least a portion of the circumferential border of the housing. The method further includes defining a metallizable area on at least part of the injection molded area. The method also includes applying a metallization to the metallizable area.

Brief description of the drawings

Further advantages, details and features of the present disclosure result from the following description of exemplary embodiments and from the figures. Show it:

1A shows a sectional view of a first exemplary embodiment of a printed circuit board component;

Fig. 1B is a bottom view of an end face of an order edging of the first embodiment of Fig. 1A;

FIGS. 2A-C show a sectional view of a second, third and fourth exemplary embodiment of a circuit board component; FIGS. 3A-E show a sectional view of a fifth, sixth, seventh, eighth and ninth exemplary embodiment of a printed circuit board component;

4 shows a flowchart for a method for the fluid-tight connection of a circuit board component to a circuit board;

FIGS. 5A-D is a sectional view of a first embodiment of a circuit board assembly during various manufacturing steps;

FIGS. 6A-D is a sectional view of a second embodiment of a circuit board assembly during various manufacturing steps;

FIGS. 7A-B are sectional views of third and fourth

Embodiment of a circuit board assembly;

Fig. 8 is a schematic representation of an embodiment example of a display assembly; and

FIGS. 9A-B are sectional views of fifth and sixth

Embodiment of a circuit board assembly.

Detailed description

In the exemplary embodiments, the same reference numerals refer to corresponding elements of the exemplary embodiments.

Fig. 1A shows a sectional view of a first embodiment example of a circuit board component 10. The circuit board component 10 comprises a housing 12 with an opening 14, which is a component on a circuit board (not shown) place is. The housing 12 has an outer surface 16 and an inner surface 18.

The outer surface 16 and inner surface 18 shown in FIG. 1A essentially have the shape of a semi-ellipsoid. This flat shape is space-saving and has no edges, in which 18 pressure peaks or, in the case of a flow through the housing 12, areas with low flow can arise on the inner surface. The housing 12 is rotationally symmetrical. The housing 12 can also have other shapes. The housing 12 can, for example, have the shape of a cuboid, a pyramid, a cone, a truncated cone, a cylinder, a spherical segment or similar structures.

The opening 14 defines a circumferential border 20. The border 20 has an end face 22 which is to be placed on a printed circuit board (not shown). The end face 22 is adjacent to the outer surface 16 and the inner surface 16. The end face shown in Fig. 1A is flat. Since most printed circuit boards are also flat, the end face 22 can lie flat against a flat printed circuit board. As an alternative to this, the end face 22 can have a different shape. For example, the end face can be curved and / or have a step if the printed circuit board or components arranged thereon have a corresponding shape.

The border 20 has a circular course (see FIG. 1B). This avoids edges, as described above. Alternatively, the border 20 can also have a different course. The border can have an elliptical, rectangular or polygonal course.

The in Figs. 1A and 1B housing 12 is an injection molded plastic component. Furthermore, the housing 12 along the circumferential border 20 on a metal coating 24. Specifically, the housing 12 is a molten interconnect device (MID). With MID technology, a metal coating is applied to an injection molded plastic component using various manufacturing processes.

One of these manufacturing processes is laser direct structuring. Here, the plastic component, namely the housing 12 described above, is injection molded from a plastic-based material that has a laser-activatable metal compound. The metal compound can be an inorganic metal compound of metals of the d and f groups of the periodic table. The injection molded plastic component is then irradiated by means of a laser in such a way that an area (namely the end face 22) is defined in which the laser-activatable metal compound is activated. Activation can include breaking the metal link. The surface of the defined area then has metal nuclei. When the plastic component is metallized, the metal nuclei have a catalytic effect, so that a metal coating forms on the area with the metal nuclei. The in Fig. 1A and 1B, metal coating 24 is only applied to the end face 22. This enables an uncomplicated production of the metal coating 24, since the laser beam only has to define a flat surface.

As an alternative to laser direct structuring, the metal coating can also be carried out using other MID manufacturing processes. For example, the metal coating can be produced using two-component injection molding, hot stamping, a mask exposure process, film back-printing and direct conductor writing. MID components are characterized, among other things, by the great freedom of design of the component shape. Since the component can be injection molded, more complex shapes can be produced than with metal stamping. Furthermore, MID components have a lower weight than corresponding metal components due to the lower density of plastic. The housing 12 embraces all of these advantages.

The metal coating 24 defines an area on the surface of the housing 12 on which a flat solder connection can be achieved. Since the metal coating 24 is formed along the border of the opening 14, the solder can be applied along the entire circumference of the border of the opening 14. As a result, the printed circuit board component 10 can be soldered to a printed circuit board such that the border 22 is connected to the printed circuit board in a fluid-tight manner.

Fig. 2A shows a sectional view of a second embodiment example of a circuit board component 10. In contrast to the first embodiment, only a part of the housing 12 is designed as an MID. In the example shown, the housing 12 comprises an annular MID section 23 (with the border 20) and a dome section 25 adjoining the MID section 23. An adhesive 21 is provided for fastening the MID section 23 to the dome section 25. If only a part of the housing 12 is designed as a MID component, the volume of necessary plastic with a laser-activatable metal connection is reduced. Furthermore, a basic housing body (for example in the form of the dome section 25) can be produced, to which differently shaped (for example different heights) MID sections 23 can be attached.

Fig. 2B shows a sectional view of a third embodiment example of a circuit board component 10. While the first and the second exemplary embodiment, the metal coating 24 is provided on the end face 22 of the border 20, in the third exemplary embodiment the border 20 has the metal coating 24 on a part of the outer surface 16 which adjoins the printed circuit board (not shown). As explained below, the solder can be applied laterally to the housing 12 after the housing 12 has been placed on the circuit board. Since the printed circuit board covers the end face 22 of the border 20 in this case, the solder is difficult to apply. However, as shown in FIG. 2B, if the border 20 has a metal coating on the outer surface 16, the solder can be applied to the outer surface 16 instead.

2C shows a sectional view of a fourth exemplary embodiment of a circuit board component 10. The fourth exemplary embodiment differs from the first exemplary embodiment essentially by a fluid passage 26 in the housing 12. The fluid passage 26 is designed to enable fluid communication with the interior of the housing 12 , For example, the fluid passage 26 may be provided to fill a volume limited by the housing 12 with a fluid (such as a thermal fluid). The fluid passage 26 can also be provided to conduct a fluid to a sensor system (not shown) in the housing 12. For example, a gas such as air can be passed through the fluid passage 26 to the sensor system in the housing 12. The sensor system can then record parameters of the gas, such as pressure, temperature or composition. The composition can be detected by means of an optical sensor system. For example, a light sensor system can be provided that enables conclusions to be drawn about its composition by means of a detected light absorption behavior of the fluid. In general, the housing 12 can have a connecting piece (not shown) on which one Fluid line, such as a hose, is attached. The fluid passage 26 (or the connecting piece) can be formed ver closable.

3A shows a sectional view of a fifth exemplary embodiment of a printed circuit board component 10. The fifth exemplary embodiment differs from the fourth exemplary embodiment essentially by the surfaces which have a metal coating 24. The border 20 has a metal coating 24 on the end face 22, part of the outer surface 16 and part of the inner surface 18. Due to the larger-area metal coating 24, a larger amount of solder can be used for improved fluid tightness. Furthermore, when the solder flows, the risk is reduced that the solder wets an area of the housing 12 that has no metal coating 24.

The metal coating 24 can be applied in various combinations to surfaces of the border 20. Thus, only a part of the outer surface 16 and the end face 20 can have a metal coating 24. It can also have only a part of the inner surface 18 and the end face 20 have a metal coating 24. The metal coating 24 can also cover a large part or the entire outside and / or inside 16, 18. Such configurations improve protection of the housing 12 against electrostatic discharge (ESD) and the electromagnetic shielding.

3B shows a sectional view of a sixth exemplary embodiment of a printed circuit board component 10. The sixth exemplary embodiment differs from the fifth exemplary embodiment essentially in that the housing 12 has a connecting piece 28. The connection piece 28 opens into the fluid passage 26. The connection piece 28 extends from away from the outer surface 16 of the housing 12 and allows a fluid-tight connection of a fluid line (eg a hose, not shown) to the fluid passage 26. The connecting piece 28 also extends as an option into the volume delimited by the housing 12. As a result, the fluid can be directed to a component (not shown) provided near the inner end of the connecting piece 28. As an alternative to this, the connecting piece cannot extend further from the fluid passage 26 into the volume delimited by the housing 12.

3C shows a sectional view of a seventh embodiment of a printed circuit board component 10. The seventh embodiment differs from the fifth embodiment essentially in that the housing 12 has a second fluid passage 27 in addition to the first fluid passage 26. The second fluid passage 27 can be used to vent the housing 12 while a fluid is filled into the housing 12 through the first fluid passage 26. Furthermore, the provision of two fluid passages 26, 27 enables a fluid to pass through (eg a circulation) through the housing 12. For example, a fluid can be supplied to the housing 12 by means of the first fluid passage 26, while the second fluid passage 27 discharges the fluid again , Such a fluid passage allows heat and / or contaminants to be continuously removed from the housing.

FIG. 3D shows a sectional view of an eighth embodiment of a printed circuit board component 10. The eighth embodiment differs from the seventh embodiment essentially by an arrangement of the two fluid passages 26, 27. The fluid passages 26, 27 are on two opposite regions of the housing 12 arranged. As a result, the fluid passages 26, 27 are formed during operation of a fluid passage between the two as described above Fluid passages 26, 27 exchange the fluid in an efficient manner. Furthermore, a component (not shown), which is arranged between the two fluid passages 26, 27, is specifically flowed around, so that an improved removal of heat, impurities, etc. can take place.

Fig. 3E shows a sectional view of a ninth embodiment example of a circuit board component 10. The circuit board component 10 has a fluid passage 26 for filling the housing 12 with a fluid. As an alternative to this, the printed circuit board component 10 can also have a plurality of fluid passages 26, for example for venting the housing 12. Furthermore, the housing 12 has a cooling structure 29 in the form of cooling fins. The cooling structure 29 is in thermal contact with the housing 12 and / or a fluid accommodated in the housing 12. The fluid passage 26 is closable. The heat removal by means of the fluid and the cooling structure 29 is explained in more detail below (see FIG. 9B). The cooling structure 29 can contain a different material than the housing 12. The cooling structure 29 may include materials with a high thermal conductivity, such as a metal (e.g. silver, copper, gold, aluminum or alloys thereof).

The circuit board components 10 presented here are each designed to limit a fluid volume on a circuit board. For this purpose, the circuit board component is connected to the circuit board in a fluid-tight manner by means of a solder. FIG. 4 shows a flow diagram 100 for a method for the fluid-tight connection of a circuit board component to a circuit board. The figures 5A-D and 6A-D each show different exemplary embodiments of the method 100, which essentially differ in the solder application. As will be shown in these exemplary embodiments, the sequence of the method steps can vary. The flowchart 100 shown in FIG. 4 therefore only shows a possible sequence of the method steps.

According to step 102, the method comprises providing a printed circuit board component 10. The printed circuit board component 10 comprises a housing 12 with an opening 14 which is to be placed on the printed circuit board, the opening 14 being defined by a circumferential border 20 of the housing 12 and the housing 12 comprises, at least in a region of the peripheral border 20, a molded interconnect device (MID) which has a metal coating 24 along the peripheral border 20.

According to step 104, the method comprises providing a printed circuit board 30 with a solderable printed circuit board region 32, which allows an end face of the border 20 of the housing 12 to be placed in a region of the printed circuit board region 32. An exemplary circuit board 30 is shown in FIGS. 5A and 6A. The circuit board 30 comprises a solderable Lei terplattenbereich 32, which is formed, for example, sunk into the circuit board 30. The circuit board area 32 can be defined by a recess in a solder resist of the circuit board 30. As an alternative to this, the printed circuit board area 32 can be raised. Furthermore, the circuit board area 32 has a circumferential shape, which has at least a similar course as the border 20 of the circuit board component 10. If the border 20 is, for example, of an annular shape, the printed circuit board area 32 also has an annular shape. As an alternative to this, the circuit board area 32 can have a different shape than the border 20, provided that the circuit board area 32 allows the end face 22 of the border 20 to be placed against the circuit board area 32. The in Fig. 5A and 6A, the printed circuit board area 32 has a larger area than the end face 22 of the printed circuit board component 10. As a result, a larger amount of solder can be used for a more stable connection. Furthermore, it is possible to place the printed circuit board component 10 on the printed circuit board 30 with a higher fault tolerance. As an alternative to this, the circuit board area 32 and the end face 22 can have essentially the same shape. In this case, the space requirement of the printed circuit board area 32 on the printed circuit board 30 is less.

The provision of the printed circuit board 30 can be carried out during a robot-based assembly process (for example on a treadmill). The circuit board 30 can be arranged mechanically or by hand on a treadmill, whereupon the subsequent production steps are carried out.

According to step 106, the method comprises arranging the printed circuit board component 10 on the printed circuit board 30, the end face of the housing 12 lying planar in the area of the printed circuit board area 32. The arrangement of the circuit board component 10 is shown, for example, in FIGS. 5C and 6B. 5C shows an arrangement of the circuit board component 10 on a solder 34, which was previously applied to the circuit board area 32 of the circuit board 30. In this embodiment, the printed circuit board component 10 (for example due to a low weight of the printed circuit board component 10) can float on the solder 34 when it is melted, so that the end face 22 of the printed circuit board component 10 does not touch the printed circuit board area 32. This effect can be used for self-centering of the printed circuit board component 10 over the printed circuit board area 32. Alternatively, as shown in FIG. 6B, the circuit board component 10 can be arranged on the circuit board area 32 before a solder 34 is applied. According to step 108, the method comprises a fluid-tight connection of the metal coating of the housing to the printed circuit board area by means of a solder 34. The fluid-tight connection comprises application and melting of the solder 34. As shown in FIG. 5B, the solder 34 can be applied to the circuit board area 32 before the circuit board component 10 is arranged on the circuit board 30. The solder 34 can be applied, for example, by means of screen printing. For this purpose, the solder 34 can comprise solder paste. The application of the solder by means of screen printing is a common process for surface mounting, which enables automatic assembly of a circuit board with surface-mounted components (SMDs). Within the scope of this surface assembly, the printed circuit board component 10 can also be assembled, which enables an efficient manufacturing process.

5C, the circuit board component 10 is then arranged on the solder 34. This can be done using an SMD pick and place machine. The fluid-tight connection further comprises heating the solder 34. Here, the solder 34 is melted so that the solder 34 wets the surfaces of the metal coating 24 and the circuit board area 32. The solder 34 wets the metal coating 24 and the circuit board area 32 along the entire circumference of the border 20. The solder 34 can be melted, for example, in an SMD furnace. The solder 34 is then cooled, causing it to solidify again. The solder 34 is now mechanically firmly connected to the metal coating 24 and the circuit board area 32. Since the solder 34 lies along the entire circumference of the border 20, the solder forms a fluid-tight connection between the metal coating 24 and the circuit board region 32.

As an alternative to applying the solder 34 before arranging the circuit board component 10 on the circuit board 30 (as in FIG. 5B ), the solder 34 can also be applied after the printed circuit board component 10 has been arranged on the printed circuit board 30. This is exemplified in FIGS. 6A and 6B. The circuit board component 10 is first arranged on the circuit board area 32. Here, the metal coating 24 of the end face 22 touches the circuit board area 32. A solder 34 is then applied to the circuit board area 32 and the metal coating 24 of the outer surface 16. The solder 34 is then melted, wetting the circuit board area 32 and the metal coating 24 of the outer surface 16. By choosing an appropriate solder 34 and / or shaping the border 20 (for example with grooves or other structures on the end face 22), the liquid solder 34 can flow at least partially between the end face 22 and the circuit board area 32. As a result, a contact area of the solder 34 on the metal coating 24 and the circuit board area 32 is enlarged. After curing, the solder 34 forms a fluid-tight connection between the metal coating 24 and the circuit board area 32, as described above.

The components of the circuit board 30 and the circuit board component 10 which are connected to one another by means of the soldered connection 34 are parts of a circuit board assembly 40. The first and second exemplary embodiments of circuit board assemblies 40 shown in FIGS. 5D and 6D each limit a fluid volume 42. The fluid volume 42 can be a gas (such as air, nitrogen or argon) or a liquid (such as water, oil or alcohol). The in Fig. 5D and 6D Darge presented assemblies 40 have no fluid passages. Due to the fluid-tight connection between the metal coating 24 and the circuit board area 32, the fluid cannot escape from the assembly 40. The first and second exemplary embodiments are therefore low-maintenance. The printed circuit board component 10 can be designed to change the volume of the Balance fluids. For this purpose, the housing 12 can have an elastic region (not shown). The housing 12 can be at least partially filled with a (compressible) gas which compresses or expands within the housing 12 when there are pressure changes. In this way, changes in the volume of the fluid, which can damage the soldered connection 34 between the housing 12 and the printed circuit board, can be avoided.

However, in order to be able to conduct a fluid into and / or out of the fluid volume within the housing 12, the assembly 40 can - as explained above - have at least one fluid passage. 7A shows a sectional view of a third exemplary embodiment of an assembly 40. The circuit board 30 has a fluid passage 44. The fluid passage 44 is arranged within the printed circuit board area 32 and thus opens into the fluid volume 42 delimited by the printed circuit board component 10. The fluid passage 44 can be designed to be closable by means of a solder (not shown) applied to it.

Alternatively or additionally, the housing 12 can have a fluid passage. 7B shows a sectional view of a fourth exemplary embodiment of an assembly 40. The housing 12 comprises a fluid passage 26 and a connection piece 28 which opens into the fluid passage 26. The connecting piece 28 allows a hose 46 to be attached, which connects the fluid volume 42 in fluid communication with a pressure source 48. A pressure sensor 50 is provided on the circuit board 30 within the fluid volume 42. The pressure sensor 50 is designed to detect the pressure within the fluid volume 42 and thus also the pressure of the pressure source 48 connected to the fluid volume 42 via the hose 46. The circuit board component 10 thus enables a reliable limitation of fluids on a circuit board 30 for the purpose of Pressure measurement. The pressure source 50 may be a room, a cabin, the atmosphere, a vehicle tire, an engine cylinder, or the like.

The pressure source 50 can also be part of an input device. In this context, FIG. 8 shows a perspective view of a display module 60. The display module 60 comprises a module 40 with a pressure sensor 50, such as, for example, according to the fourth exemplary embodiment from FIG. 7B. The display assembly 60 further includes a display 62. The display 62 is, for example, a liquid crystal panel. Furthermore, the display assembly 60 comprises an elastic mounting 64, which is designed to movably support the display 62 with respect to a backlight 66 or another substrate. The storage 64 comprises the hose 64 guided between the display 62 and the backlight 66, which is indicated in FIG. 8 by dashed lines between the assembly 40 and the display 62. Both the hose 64 and the assembly 40 contain air as a fluid for pressure measurement.

A user can operate the display assembly 60 by exerting a force on the display assembly 60, specifically on the display 62 comprising the liquid crystal panel. When the force is applied, the elastic bearing 64 and thus also the air in the hose 64 is compressed. This leads to a change in pressure in the hose 64. Since the hose 64 is in fluid communication with the air volume 42 delimited by the assembly 40, the air volume 42 also experiences a pressure change. This pressure change can be detected by the pressure sensor 50. The pressure sensor 50 can thus send a pressure signal to a processor (not shown) of the display module 50. The processor is designed to evaluate this pressure signal as an input from the user and can be arranged on the same printed circuit board 30 as the pressure sensor 50. The limitation of fluids on a printed circuit board is not limited to the measurement of air pressure. With the circuit board component 10 presented here, heat dissipation of a component on a circuit board can also be realized. FIGS. 9A and 9B show a sectional view of assemblies 40 with a component 51 to be cooled.

Fig. 9A shows a sectional view of a fifth embodiment example of an assembly 40, wherein the housing 12 comprises two fluid passages 26, 27 with connecting pieces. The circuit board component 10 has essentially the same features as that of the eighth exemplary embodiment in FIG. 3D. A pump (not shown) conveys a fluid through the first fluid passage 26 into the housing 12. The direction of fluid flow is indicated by an arrow. The fluid flows out of the housing 12 again from the second fluid passage 27. The fluid flows around the component 51 to be cooled and transports the heat generated by the component 51 away.

9B shows a sectional view of a sixth exemplary embodiment of an assembly 40 with a housing 12 which has a cooling structure 29 in the form of cooling fins. The circuit board component 10 has essentially the same features as that of the ninth exemplary embodiment in FIG. 3E. The housing 12 also has a fluid passage 26, which allows the fluid volume 42 to be filled and / or emptied. For this purpose, several fluid passages 26 can also be provided. The housing 12 has a closure 31, which is designed to close the fluid volume 42 in a fluid-tight manner. The closure 31 can comprise, for example, a screw closure, a lid fastened with adhesive or a closure which can be deformed when heat is applied. In operation, component 51 generates waste heat that is released to the fluid. The fluid is there in contact with the cooling structure 29, which emits the heat of the fluid to the ambient air. The temperature gradient between the cooling structure 29 and the component 51 generates a convection current that moves the fluid between the component 51 and the cooling structure 29. This embodiment therefore does not require a pump and requires little maintenance.

In the examples presented, different features and functions of the present disclosure have been described separately from one another and in certain combinations. It goes without saying, however, that many of these features and functions, where this is not explicitly excluded, can be freely combined with one another.

Claims

Patent claims

1. circuit board component (10) for limiting a Fluidvo lumens (42) on a circuit board, the circuit board component (10) comprising: a housing (12) with an opening (14) to be placed on the circuit board (30), the Opening (14) is defined by a circumferential border (20) of the housing (12) and wherein the housing (12) comprises at least in a region of the circumferential border (20) a molded interconnect device (MID) that runs along the circumferential Border (20) has a metal coating (24).

2. The circuit board component (10) according to claim 1, wherein the region of the housing (12) which has the metal coating (24) has been defined by means of a laser direct structuring.

3. Printed circuit board component (10) according to one of the preceding claims, wherein the housing (12) has at least one fluid passage (26).

4. Printed circuit board component (10) according to claim 3, wherein the housing (12) further comprises at least one connecting piece (28) which opens into the fluid passage (26).

5. Printed circuit board component (10) according to one of the preceding claims, wherein the metal coating (24) extends at least partially over at least one of an end face (22) of the border (20), one on the end face (22) adjacent inner surface (18) of the housing (12) and an outer surface (16) of the housing (12) adjoining the end face (22).

6. Printed circuit board component (10) according to one of the preceding claims, comprising a cooling structure (29) which is in thermal contact with the housing (12) or an interior of the housing (12).

7. printed circuit board assembly (40) comprising

a printed circuit board component (10) according to one of the preceding claims;

a printed circuit board (30) with a solderable printed circuit board area (32) which allows a front face (22) of the border (20) of the housing (12) to be placed in an area of the circuit board area (32);

a solder connection that connects the metal coating (24) to the circuit board area (32) in a fluid-tight manner.

8. The assembly (40) according to claim 7, comprising a sensor arranged inside the housing (12), in particular a pressure sensor (50).

9. An assembly (40) according to claim 7 or 8, comprising a component (51) to be cooled, which is inside the housing

(12) is arranged.

10. The assembly (40) according to one of claims 7 to 9, wherein the printed circuit board (30) has at least one fluid passage (44) which is designed to provide a fluid connection to an interior of the housing (12).

11. The assembly (40) according to any one of claims 7 to 10, comprising a heat-conducting fluid which is received in the housing (12).

12. The assembly (40) according to claim 11, comprising two fluid passages (26, 27) which are formed in the

Housing (12) a flow of the thermal fluid from one of the Allow fluid passages (26) to another of the fluid passages (27).

13. Display assembly (60) comprising:

an assembly (40) at least according to claim 8;

a display (62); and

a bearing (64) comprising a container (46) filled with a fluid, the bearing (64) being designed to support at least a part of the display (62) in such a way that a force is exerted on the display (62) Pressure change of the fluid leads, the housing (12) of the circuit board component (10) being in communication with the fluid.

14. A method (100) for the fluid-tight connection of a printed circuit board component (10) to a printed circuit board (30), the method comprising:

Providing (102) a printed circuit board component (10) comprising a housing (12) with an opening (14) to be placed on the printed circuit board (30), the opening (14) being surrounded by a circumferential border (20) of the housing (12 ) is defined and wherein the housing (12) comprises at least in a region of the circumferential border (20) a molded interconnect device (MID) which has a metal coating (24) along the circumferential border (20);

Providing (104) a printed circuit board (30) with a solderable printed circuit board area (32), which allows an end face (22) of the border (20) of the housing (12) to be placed in an area of the printed circuit board area (32);

Arranging (106) the printed circuit board component (10) on the printed circuit board, the end face (22) of the housing (12) abutting in the area of the printed circuit board area (32); and

fluid-tight connection (108) of the metal coating (24) of the housing (12) to the circuit board area (32) by means of a solder (34).

15. The method according to claim 14, wherein the steps of arranging and / or fluid-tight connection within the scope of a surface assembly, in which the circuit board (30) is equipped with components, take place.

16. A method for producing a printed circuit board component (10) by means of a molded interconnect device (MID) technology, the printed circuit board component (10) comprising a housing (12) with an opening (14) which is on a printed circuit board (30 ) is to be placed, the opening (14) being defined by a circumferential border (20) of the housing (12), the method comprising:

Injection molding at least a portion of the circumferential border (20) of the housing (12);

Defining a metallizable area on at least part of the injection molded area; and

Metallization orders on the metallizable area.