EP1832146A1 - Demi-produit et composants supports fondes sur le demi-produit - Google Patents

Demi-produit et composants supports fondes sur le demi-produit

Info

Publication number
EP1832146A1
EP1832146A1 EP05813683A EP05813683A EP1832146A1 EP 1832146 A1 EP1832146 A1 EP 1832146A1 EP 05813683 A EP05813683 A EP 05813683A EP 05813683 A EP05813683 A EP 05813683A EP 1832146 A1 EP1832146 A1 EP 1832146A1
Authority
EP
European Patent Office
Prior art keywords
semifinished product
vias
holes
plated
terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP05813683A
Other languages
German (de)
English (en)
Inventor
Georg Busch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gigaset Communications GmbH
Original Assignee
Gigaset Communications GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gigaset Communications GmbH filed Critical Gigaset Communications GmbH
Publication of EP1832146A1 publication Critical patent/EP1832146A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09609—Via grid, i.e. two-dimensional array of vias or holes in a single plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections

Abstract

L'invention concerne un demi-produit (2) ainsi qu'un composant support (1) ainsi obtenu, destiné à des images de couplage électriques placées dessus, l'objectif de l'invention étant fabriquer de manière peu coûteuse et rapide un prototype ou des petites séries. A cet effet, le demi-produit (2) comprend un matériau support de base, présentant une forme plate, par exemple flexible, des contacts (7) traversants formés par des nanotrous de raccordement, disposés dans la totalité de sa partie plate à une vitesse constante. Ledit composant peut être réalisé avec un seul moule pour l'éclairage, ce qui permet la formation des nanotrous de raccordement. Grâce à ce composant, des images de circuit présentant un aspect souhaité sur leurs surfaces peuvent être réalisées.
EP05813683A 2004-12-28 2005-11-03 Demi-produit et composants supports fondes sur le demi-produit Withdrawn EP1832146A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102004063112 2004-12-28
PCT/EP2005/055725 WO2006069843A1 (fr) 2004-12-28 2005-11-03 Demi-produit et composants supports fondes sur le demi-produit

Publications (1)

Publication Number Publication Date
EP1832146A1 true EP1832146A1 (fr) 2007-09-12

Family

ID=36168525

Family Applications (1)

Application Number Title Priority Date Filing Date
EP05813683A Withdrawn EP1832146A1 (fr) 2004-12-28 2005-11-03 Demi-produit et composants supports fondes sur le demi-produit

Country Status (2)

Country Link
EP (1) EP1832146A1 (fr)
WO (1) WO2006069843A1 (fr)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004098256A1 (fr) * 2003-04-29 2004-11-11 Senseair Ab Procede de traitement d'un substrat mince film

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3408630A1 (de) * 1984-03-09 1985-09-12 Hoechst Ag, 6230 Frankfurt Verfahren und schichtmaterial zur herstellung durchkontaktierter elektrischer leiterplatten
US4720915A (en) * 1986-03-25 1988-01-26 True Grid, Ltd. Printed circuit board and process for its manufacture
FR2612356A1 (fr) * 1987-03-13 1988-09-16 Thomson Csf Carte de circuit imprime pour la realisation de prototypes
US4829404A (en) * 1987-04-27 1989-05-09 Flexmark, Inc. Method of producing a flexible circuit and master grid therefor
DE9401092U1 (de) * 1993-04-21 1995-01-05 Will Werner Schaltungsträger mit Zusatzkontaktierelementen
US6774486B2 (en) * 2001-10-10 2004-08-10 Micron Technology, Inc. Circuit boards containing vias and methods for producing same

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004098256A1 (fr) * 2003-04-29 2004-11-11 Senseair Ab Procede de traitement d'un substrat mince film

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2006069843A1 *

Also Published As

Publication number Publication date
WO2006069843A1 (fr) 2006-07-06

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