EP1815187A1 - Four pourvu d'un canal a vapeur dans lequel sont situes un catalyseur et un detecteur de gaz - Google Patents

Four pourvu d'un canal a vapeur dans lequel sont situes un catalyseur et un detecteur de gaz

Info

Publication number
EP1815187A1
EP1815187A1 EP05808136A EP05808136A EP1815187A1 EP 1815187 A1 EP1815187 A1 EP 1815187A1 EP 05808136 A EP05808136 A EP 05808136A EP 05808136 A EP05808136 A EP 05808136A EP 1815187 A1 EP1815187 A1 EP 1815187A1
Authority
EP
European Patent Office
Prior art keywords
catalyst
channel
sensor
oven
semiconductor gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP05808136A
Other languages
German (de)
English (en)
Inventor
Herbert BERKENKÖTTER
Ulrich Sillmen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Miele und Cie KG
Original Assignee
Miele und Cie KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Miele und Cie KG filed Critical Miele und Cie KG
Publication of EP1815187A1 publication Critical patent/EP1815187A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24C—DOMESTIC STOVES OR RANGES ; DETAILS OF DOMESTIC STOVES OR RANGES, OF GENERAL APPLICATION
    • F24C15/00—Details
    • F24C15/20—Removing cooking fumes
    • F24C15/2007—Removing cooking fumes from oven cavities
    • F24C15/2014—Removing cooking fumes from oven cavities with means for oxidation of cooking fumes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/64—Heating using microwaves
    • H05B6/6447—Method of operation or details of the microwave heating apparatus related to the use of detectors or sensors
    • H05B6/6458—Method of operation or details of the microwave heating apparatus related to the use of detectors or sensors using humidity or vapor sensors

Definitions

  • the invention relates to a baking oven of the type mentioned in claim 1, 2 or 7.
  • an oven with a steam channel in which a catalyst is arranged such that generated in the oven and vapor channel through the vapor must flow through the catalyst, and that with a control of the oven signal transmitting connected humidity sensor is arranged in the flow direction downstream of the catalyst.
  • the humidity sensor By means of the humidity sensor, the degree of soiling of the baking muffle of the oven is determined. In this way it should be achieved that the baking muffle for the purpose of pyrolytic cleaning only as long as absolutely necessary to a temperature of 500 0 C is heated.
  • the invention thus presents the problem of providing a baking oven in which a semiconductor gas sensor can be used as a humidity sensor for controlling or regulating the oven and at the same time a high accuracy of the control or regulation can be achieved.
  • semiconductor gas sensors are inexpensive standard components.
  • semiconductor gas sensors are particularly well suited for the operating conditions of a baking oven, in particular for the high temperatures and the steam produced during each roasting and baking process.
  • DE 43 41 410 A1 discloses an oven with a vapor channel, in which a semiconductor gas sensor is used as the moisture sensor.
  • a semiconductor gas sensor is used as the moisture sensor.
  • the exact arrangement of the known semiconductor gas sensor in the vapor channel is not explained in detail.
  • oxidizable gases when using a semiconductor gas sensor as a humidity sensor, the problem generally arises that semiconductor gas sensors generate a comparably large output signal for oxidizable gases in a very low concentration, such as water vapor in a much greater concentration compared to this.
  • oxidizable gases are generated in an oven on the one hand by the cooking process and can be oxidized by means of a catalyst, so that the resulting unwanted effect on the output signal of the semiconductor gas sensor is significantly reduced.
  • oxidizable gases and water vapor are also introduced into the vapor channel via the channel wall of the vapor channel downstream of the catalyst, which also influences the output signal of the semiconductor gas sensor in the manner explained above.
  • the channel wall of the vapor channel in conventional ovens openings for various measuring devices, such as temperature sensors for controlling or regulating roasting and baking operations as well as pyrolysis of ovens with pyrolysis has.
  • the Wrasenkanäle in the conventional ovens are made of sheet metal blanks, which are folded for this purpose and connected by means of screw or rivet joints.
  • the general inventive idea of the oven according to the invention is now to arrange the semiconductor gas sensor in such a way that the vapor passing through the vapor channel, which comes into contact with the semiconductor gas sensor, forcibly passes through a catalyst for the oxidation of the oxidizable gases contained in the vapor.
  • a fresh air-vapor mixture is understood, which has been generated by the mixing of fresh air and vapor. The fresh air gets into it due to openings in the channel wall of the vapor channel.
  • the additional advantage with an oven according to claim 1 is that the number of components is reduced compared to the other two alternatives.
  • the alternative according to claim 7 also has a sensor channel in which the semiconductor gas sensor is arranged.
  • another catalyst is arranged in the sensor channel and upstream of the semiconductor gas sensor. In this way, the o dimensions of the sensor channel and its relative arrangement to the catalyst are largely free of this selectable.
  • An advantageous development of the oven according to the invention according to claim 2 is that the catalyst downstream has a recess into which the sensor channel engages with the inlet opening having region. This ensures that the vapor conducted to the semiconductor gas sensor by means of the sensor channel has flowed through the catalyst.
  • the catalyst is formed of two adjacent disc-like catalyst honeycomb, wherein the downstream arranged catalyst honeycomb is formed as an annular disc and has an opening which corresponds to the outer cross section of the sensor channel in the contact region with the catalyst.
  • the aforementioned solution can be realized in a particularly simple manner.
  • such catalyst honeycomb are inexpensive standard components.
  • an advantageous development of the aforementioned embodiment provides that the inlet facing the catalyst is widened like a funnel in the direction of the catalyst. As a result, the flow velocity in the sensor channel is increased, so that the measurement surface of the semiconductor gas sensor arranged therein is mechanically cleaned. Furthermore, this simplifies the mounting of the sensor channel to the vapor channel or to the rest of the oven according to the invention, since the sensor channel is supported by the catalyst.
  • An advantageous development of the teaching according to the invention provides that the distance between the catalyst or the further catalyst and the semiconductor gas sensor is minimized such that the permissible maximum temperature of the semiconductor gas sensor is not exceeded during operation of the oven. As a result, the length of the portion of the vapor channel or of the sensor channel, which is limited transversely to the vapor channel flow direction or sensor channel flow direction of an airtight channel wall, is minimized.
  • a further advantageous development of the teaching according to the invention provides that the semiconductor gas sensor or a heat sink connected in a heat-transmitting manner to the semiconductor gas sensor is arranged on the oven in such a way that the semiconductor gas sensor is connected through a 11800
  • Fan of the oven is coolable. In this way, the cooling of the semiconductor gas sensor is made possible in a particularly simple manner.
  • An advantageous development of the aforementioned embodiment provides that the fan sucks in fresh air during operation of the oven from the free environment and the semiconductor gas sensor or the heat sink is arranged on the oven so that it is partially in contact with the fresh air sucked. This allows a particularly simple and effective cooling of the semiconductor gas sensor.
  • FIG. 1 shows a first embodiment of a baking oven according to the invention in a partial and sectional view
  • Figure 2 shows a second embodiment of a baking oven according to the invention in a sectional view
  • Figure 3 shows a third embodiment of a baking oven according to the invention in partial and sectional view
  • Figure 4 shows a fourth embodiment of a baking oven according to the invention in partial 5
  • FIG. 6 shows a sixth exemplary embodiment of a baking oven according to the invention in a partial and sectional representation.
  • a first embodiment of a baking oven according to the invention is partially shown.
  • the oven has a vapor channel 2, in which a catalyst 4 is arranged.
  • the catalyst 4 is a so-called catalyst honeycomb.
  • other catalyst forms and types such as a catalyst formed from bulk material conceivable.
  • the vapor channel 2 is connected in a manner known in the art flow-conducting with a baking muffle 3 of the oven.
  • the vapor generated in the baking muffle 3 during a roasting or baking process is discharged via the vapor channel 2 into the free environment. In this case, the vapor flows through the catalyst 4 and the oxidizable gases contained in the vapor are oxidized.
  • a moisture sensor 8 signal-transmitting connected to a controller 6 of the oven is arranged downstream of the catalyst 4 in the direction of the vapor flow direction, wherein the moisture sensor 8 is designed as a semiconductor gas sensor.
  • the Wrasenkanal flow direction is symbolized by an arrow 10.
  • the Wrasenkanal 2 is limited transversely to the Wrasenkanal flow direction 10 through a channel wall 12.
  • a catalyst radiator 14 and a temperature sensor 16 protrude through openings 12.1 in the channel wall 12 into the vapor channel 2.
  • the catalyst radiator 14 and the temperature sensor 16 are also signal-transmitting connected to the controller 6 of the oven, wherein the catalyst heater 14 and the temperature sensor 16 cooperate with the controller 6 in a manner known in the art.
  • the semiconductor gas sensor 8 is made of doped tin oxide in this embodiment. In principle, however, other semiconductor materials, such as doped tungsten oxide or gallium oxide, conceivable.
  • the semiconductor gas sensor used here from doped tin oxide has a permissible temperature range of about 400 0 C to 500 ° C, which must not be exceeded. Therefore, the distance between the catalyst 4, which can reach temperatures of up to about 700 0 C during operation of the oven, and the semiconductor gas sensor 8 is selected to be correspondingly large. The vapor heated by the catalyst 4 may cool down along the flow path to the semiconductor gas sensor 8.
  • semiconductor gas sensors 8 made of doped tungsten oxide When using a semiconductor gas sensor 8 made of gallium oxide, the distance between the catalyst 4 and the semiconductor gas sensor 8 may be dimensioned correspondingly smaller, since gallium oxide sensors for temperatures up to about 700 0 C are suitable.
  • the channel wall 12 is formed in the portion between the catalyst 4 to downstream of the semiconductor gas sensor 8 as an airtight channel wall 12.2.
  • the openings 12.1 required for the catalyst heating element 14 and the temperature sensor 16 are arranged outside this section of the airtight channel wall 12.2, so that a vapor generated in the baking muffle 3 and derived through the vapor channel 2 must flow through the catalyst 4.
  • a supply of fresh air through openings 12.1 in the channel wall 12 which influences the output signal of the semiconductor gas sensor 8 in an undesired manner is thereby avoided.
  • Fig. 2 shows a second embodiment of a baking oven according to the invention.
  • a vapor produced in the baking muffle 3 is led out of the oven through the vapor channel 2.
  • the oven of this embodiment is an oven with a forced purging.
  • a fan 18 designed as a radial fan is arranged in the oven in a manner known to those skilled in the art and is in fluid communication with the vapor channel 2.
  • the essential difference from the first embodiment is now that the portion of the vapor channel 2, in which the Wrasenkanal 2 is transverse to the Wrasen flow direction 10 is limited by an air-tight channel wall 12.2, a side section 2.1, in which the semiconductor gas sensor 8 is arranged.
  • the semiconductor gas sensor 8 thus lies in a section of the vapor channel 2 into which the gases contained in the vapor essentially pass by diffusion. This ensures that the side portion 2.1, and thus the area in which the semiconductor gas sensor 8 is arranged, is less polluted by the vapor.
  • Fig. 3 is a third embodiment of a baking oven according to the invention in a similar representation as shown in Fig. 1.
  • the vapor channel 2 and thus also the channel wall 12 is formed in a conventional manner.
  • the catalyst radiator 14 and the temperature sensor 16 are also guided in a conventional manner through openings 12.1 in the channel wall 12 in the vapor channel 2.
  • a sensor channel 20 is arranged, which is limited transversely to the sensor channel flow direction by an air-tight channel wall 22.
  • the sensor channel flow direction is symbolized by an arrow 24.
  • the sensor channel 20 is connected by an inlet opening 20.1 and an outlet opening 20.2 with the rest of the Wrasenkanals 2 flow-conducting.
  • the sensor channel 20 is inserted into a depression of the catalytic converter 4 in the region of the inlet opening 20.
  • the catalyst 4 is formed from two adjoining disc-like catalyst honeycombs, wherein the downstream arranged catalyst honeycomb 4.1 is formed as an annular disc and has an opening which corresponds to the outer cross section of the sensor channel 20 in its contact region with the catalyst 4.
  • the other catalyst honeycomb 4.2 has no breakthrough, so that in the assembled state of the oven according to the invention a comparison of the third embodiment arrangement of catalyst 4 and sensor channel 20 results.
  • FIG. 5 Another alternative is shown as a fifth embodiment in Fig. 5.
  • the sensor channel 20 is, as in the two aforementioned embodiments, arranged approximately in the middle of the vapor channel 2. In contrast to these two embodiments, the sensor channel 20 does not intervene in the assembled state of the oven in the catalyst 4, but rests on the downstream surface of the catalyst 4. In this embodiment, it is necessary that the two contact surfaces of the catalyst 4 and the sensor channel 20 are machined so that they in 5 011800
  • Fig. 6 shows a sixth embodiment of a baking oven according to the invention.
  • a further catalyst 26 in the region of the inlet opening 20.1 of the sensor channel 20 is arranged therein.
  • the further catalyst 26 fills the free cross section of the sensor channel 20 completely, so that it is ensured that the vapor flowing through the sensor channel 20 must forcibly flow through the further catalyst 26.
  • the further catalyst 26 is likewise designed as a so-called catalyst honeycomb. Analogous to the catalyst 4, the further catalyst 26 can also be selected according to type, material and dimensions within wide suitable limits.
  • the distance between the catalyst 4 or the further catalyst 26 and the semiconductor gas sensor 8 is minimized such that the permissible temperature range of the semiconductor gas sensor 8 is not exceeded during operation of the oven.
  • an additional measure for all the aforementioned embodiments is to cool the semiconductor gas sensor 8.
  • the cooling of the semiconductor gas sensor 8 which is not shown in greater detail in the figures, can be carried out by many means known and suitable to the person skilled in the art.
  • the semiconductor gas sensor 8 or a heat sink connected to the semiconductor gas sensor 8 and not shown in the figures is arranged on the oven such that the semiconductor gas sensor 8 can be cooled by a fan, for example the fan 18 of the oven.
  • a particularly effective cooling can be realized in that the fan draws in fresh air during operation of the oven and the semiconductor gas sensor 8 or the heat sink is arranged such that it is partially in contact with the intake fresh air.

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)

Abstract

Four pourvu d'un canal à vapeur (2) dans lequel est situé un catalyseur (4) de manière telle que la vapeur produite dans le four et évacuée par le canal à vapeur (2) doit traverser le catalyseur (4) et de manière telle qu'un détecteur d'humidité (8) relié de façon à transmettre des signaux avec un dispositif de commande (6) du four est placé dans le sens d'écoulement en aval du catalyseur (4). L'objet de la présente invention est la mise au point d'un four dans lequel un détecteur de gaz à semi-conducteur peut être utilisé en tant que détecteur d'humidité (8), en vue de la commande ou de la régulation du four, et simultanément à l'aide duquel il est possible d'obtenir une haute précision de la commande ou de la régulation. A cet effet, le détecteur de gaz à semi-conducteur (8) est placé de manière telle que la vapeur acheminée dans le canal à vapeur (2), qui parvient au contact du détecteur de gaz à semi-conducteur (8), traverse d'abord obligatoirement un catalyseur (4; 26) en vue de l'oxydation des gaz oxydables contenus dans la vapeur.
EP05808136A 2004-11-25 2005-11-04 Four pourvu d'un canal a vapeur dans lequel sont situes un catalyseur et un detecteur de gaz Withdrawn EP1815187A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102004056839A DE102004056839A1 (de) 2004-11-25 2004-11-25 Backofen mit einem Wrasenkanal, in dem ein Katalysator und ein Gassensor angeordnet sind
PCT/EP2005/011800 WO2006056305A1 (fr) 2004-11-25 2005-11-04 Four pourvu d'un canal a vapeur dans lequel sont situes un catalyseur et un detecteur de gaz

Publications (1)

Publication Number Publication Date
EP1815187A1 true EP1815187A1 (fr) 2007-08-08

Family

ID=35705276

Family Applications (1)

Application Number Title Priority Date Filing Date
EP05808136A Withdrawn EP1815187A1 (fr) 2004-11-25 2005-11-04 Four pourvu d'un canal a vapeur dans lequel sont situes un catalyseur et un detecteur de gaz

Country Status (4)

Country Link
US (1) US8469017B2 (fr)
EP (1) EP1815187A1 (fr)
DE (1) DE102004056839A1 (fr)
WO (1) WO2006056305A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1966543B1 (fr) * 2005-12-30 2011-10-12 Arçelik A.S. Four avec capteur
US10731869B2 (en) 2017-09-12 2020-08-04 Whirlpool Corporation Automatic oven with humidity sensor

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202008010360U1 (de) 2008-08-01 2008-10-02 Rational Ag Fluidführungseinrichtung und Gargerät hiermit
DE102010061472A1 (de) 2010-12-22 2012-06-28 Miele & Cie. Kg Gargerät
DE102011088450A1 (de) * 2011-12-13 2013-06-13 BSH Bosch und Siemens Hausgeräte GmbH Dunstabzugshaube mit Kühlelement
US9182296B2 (en) * 2012-05-16 2015-11-10 General Electric Company Oven air sampling system
DE102014204055A1 (de) * 2014-03-05 2015-03-12 E.G.O. Elektro-Gerätebau GmbH Backofen
EP3412973B1 (fr) 2017-06-07 2024-02-28 Electrolux Appliances Aktiebolag Four comprenant un ensemble de détection des paramètres de fonctionnement à l'intérieur de la cavité du four
DE102021212941A1 (de) 2021-11-17 2023-05-17 BSH Hausgeräte GmbH Backofen mit spezifischem Katalysator, Verfahren

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1966543B1 (fr) * 2005-12-30 2011-10-12 Arçelik A.S. Four avec capteur
US10731869B2 (en) 2017-09-12 2020-08-04 Whirlpool Corporation Automatic oven with humidity sensor

Also Published As

Publication number Publication date
WO2006056305A1 (fr) 2006-06-01
US8469017B2 (en) 2013-06-25
DE102004056839A1 (de) 2006-06-01
US20090165770A1 (en) 2009-07-02

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