EP1814447A2 - Procede permettant d'etablir un contact traversant dans une matiere de support electriquement isolante - Google Patents

Procede permettant d'etablir un contact traversant dans une matiere de support electriquement isolante

Info

Publication number
EP1814447A2
EP1814447A2 EP05804654A EP05804654A EP1814447A2 EP 1814447 A2 EP1814447 A2 EP 1814447A2 EP 05804654 A EP05804654 A EP 05804654A EP 05804654 A EP05804654 A EP 05804654A EP 1814447 A2 EP1814447 A2 EP 1814447A2
Authority
EP
European Patent Office
Prior art keywords
carrier material
contact
hole
galvanic
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP05804654A
Other languages
German (de)
English (en)
Inventor
Bernhard Nessler
Stephan Erbse
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NESSLER MEDIZINTECHNIK GmbH
Original Assignee
NESSLER MEDIZINTECHNIK GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from AT19722004A external-priority patent/AT501429B1/de
Application filed by NESSLER MEDIZINTECHNIK GmbH filed Critical NESSLER MEDIZINTECHNIK GmbH
Publication of EP1814447A2 publication Critical patent/EP1814447A2/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/24—Detecting, measuring or recording bioelectric or biomagnetic signals of the body or parts thereof
    • A61B5/25—Bioelectric electrodes therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
    • A61B2562/12—Manufacturing methods specially adapted for producing sensors for in-vivo measurements
    • A61B2562/125—Manufacturing methods specially adapted for producing sensors for in-vivo measurements characterised by the manufacture of electrodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09981—Metallised walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides

Definitions

  • the invention relates to a method of through-contacting an electrically insulating substrate, e.g. a carrier foil for a medical electrode.
  • an electrically insulating substrate e.g. a carrier foil for a medical electrode.
  • Another form of via provides the attachment of contact rivets e.g. in the manufacture of medical off-center electrodes, but in many cases, insulation problems with it, since the lower part of the rivet must be performed as well as the top electrically conductive and this can have a negative impact on the measurement result.
  • the object of the invention is to simplify the füriervorgang of one side of a carrier film to another and to reduce the production cost.
  • connection paths can be used to cause the electrical conduction between the two sides of the carrier material.
  • the galvanic contact can be produced in an edge region of the carrier material by excess printing of the carrier material or mutual spraying of an electrically conductive material.
  • the electrically conductive material comes through excess application, whether printing or spraying, over the edge region of the one side of the substrate to the other in connection and this compound remains permanently after the drying or curing process of the electrically conductive material.
  • the galvanic contact can be produced by excess printing of the carrier material or mutual spraying of an electrically conductive material in the region of a through-hole, a perforation or a perforation of the carrier material.
  • the excess application establishes the connection between the two sides of the carrier material through the respectively existing or formed holes.
  • the galvanic contact by excess printing of the carrier material or mutual spraying of an electrically conductive material in the region of pores or openings of the Carrier material can be produced.
  • the pores or openings can be generated artificially in the carrier material or already be present in this, so that the conductive material can penetrate during printing or spraying the substrate for the purpose of producing the galvanic contact.
  • the printing process can be designed so that the carrier material is first printed on one side and then on the other side or on both sides at the same time with the electrically conductive material, so that the printed material on one side of the printed material on the other side in the area touches the executed galvanic contact.
  • the invention relates to a medical electrode having a carrier material, which has a galvanic plated-through from a first side to a second side of the carrier material.
  • the commercially available electrodes today consist of one or more layers of materials. Usually, the lowermost layer is a foam or paving material that is glued directly to the skin. On it is again a carrier material which contains the actual skin contact element, e.g. from Ag / AgCl.
  • a principal problem in the design of an electrode based on a substrate is that the actual skin contact element lies on the skin-facing side of the substrate, whereas the cable termination must be applied on the side facing away from the skin. So it must be made a galvanic contact between the two sides of the substrate.
  • the object of the invention is therefore to provide a medical electrode in which the via can be performed by simple technical means.
  • the galvanic via is formed by on both sides of the substrate made of an electrically conductive material from excessively applied printing or spraying in the region of at least one through hole or an edge region of the carrier material.
  • the invention further relates to a medical electrode for attachment to the skin surface, e.g. an ECG electrode, with a skin contact element and a cable contact point, which are arranged on a carrier material spaced from each other and are electrically connected to each other via a galvanic via in the substrate.
  • a medical electrode for attachment to the skin surface e.g. an ECG electrode
  • a skin contact element and a cable contact point which are arranged on a carrier material spaced from each other and are electrically connected to each other via a galvanic via in the substrate.
  • Medical electrodes according to the invention can serve both the signal detection on the human skin and the signal input into the skin.
  • ECG electrodes are described by way of example in the context of this application, but the invention relates to all medical electrodes for attachment to the skin.
  • Electrodes of the type mentioned are, for example, off-center electrodes, so named because the cable contact point not centrally above the skin contact element, eg consists of a printed Ag / AgCl contact surface. Off center electrodes have certain advantages over centered electrodes in terms of operation and measurement reliability, and are therefore widely used.
  • a contact rivet is provided for these types of electrodes for the purpose of the through-connection from the side of the carrier material on which the cable contact point is present to the patient-facing side on which the skin contact element is mounted an electrically conductive rivet shell and a likewise conductive rivet base is composed.
  • the object of the invention is therefore to avoid the difficulties mentioned and to specify a production technology easily feasible and reliable type of plated through hole for an aforementioned electrode.
  • this is achieved in that the galvanic plated through by on both sides of the carrier material of a electrically conductive material applied overshadowing printing or spraying in the region of at least one through hole or an edge region of the carrier material is formed.
  • This type of plated through-hole by means of coating on both sides of the carrier material can be done simultaneously with the printing or spraying of the carrier material for the formation of contact paths on the surface of the carrier material and is therefore feasible without much effort. It can be dispensed with a completely continuous conductive design of the contact rivets, which insulation problems with respect to the patient's skin can be avoided.
  • the base layer can be provided with a recess, through which the riveting can be made subsequently, after the double-sided printed or spattered carrier material has been glued. This makes it possible to use devices that are used for the production of centered electrodes.
  • the at least one through hole which is printed or sprayed according to the invention from both sides, can be formed by an opening, by a porous region, a perforation or a perforation or the like of the carrier material.
  • a first contact area may be formed on the first side of the carrier material and a second contact area may be formed on the second side of the carrier material, which are interconnected via the galvanic via, and the skin contact element may be formed as a circular area on the second side of the carrier material and with the second contact area to be electrically connected via a connecting path.
  • the first and the second contact region in each case extend annularly around the boundary of the through hole on the first and on the second side of the carrier material.
  • a further feature of the invention may in this context be that the rivet base is formed electrically insulating.
  • the electrically conductive upper part is electrically insulated from the skin of the patient by the electrically insulating lower part and no further measures have to be taken to avoid a falsification of the measurement result.
  • FIG. 1 shows a partial cross section through a carrier material with one after one
  • FIG. 2 shows a partial cross-section through a carrier material with a through-hole produced according to another embodiment of the method according to the invention
  • FIG. 3 shows a partial cross section through an embodiment of the electrode according to the invention
  • FIG. 6 shows a schematic cross section through a further embodiment of the electrode according to the invention.
  • Fig. 1 shows a portion of an electrically insulating substrate 1, e.g. made of a flexible plastic, e.g. PE or PET is formed, for example in the form of a flexible carrier film for a medical electrode.
  • a through-hole 5 is provided which can be removed by a suitable process, e.g. Punching, punching, Nadelperforation od. Like. Is formed.
  • the galvanic contact has been produced by excess printing of the carrier material of an electrically conductive material 2 in the region of the through hole 5 of the carrier material 1.
  • a printing substance is about a silver conductive paint suitable, but it can also be used other conductive, powdery or pasty materials.
  • the through-hole 5 thus does not have to be filled with the printing substance, but a printing over the opening edge of the through-hole 5 is sufficient.
  • the type of printing process used is also not limited, it can screen printing, flexographic printing, pad printing od. Like. Are used.
  • the inventive method is not limited to the production of electrode substrates but can also be used for other applications.
  • the carrier material is first printed on one side 3 and then on the other side 4 or on both sides 3, 4 at the same time with the electrically conductive material 2, so that the printed material of one side 3, the printed material on the other side 4 im Touched area of the executed galvanic contact.
  • the through hole 5 is chosen so large that while an open channel between the sides 3, 4 remains. This can also be completely closed during the printing process.
  • the conductive print material on one side 3 is to make a conductive connection with the conductive print material on the other side 4.
  • this compound is achieved by coalescing the layers applied on pages 3, 4.
  • a certain excess must be printed beyond the edge of the through-hole 5.
  • the via can also be done by pores in the substrate 1, which are artificially generated at a certain point or already exist.
  • FIG. 2 shows an embodiment of the plated-through hole according to the invention, in which the galvanic contact in an edge region 6 of the carrier material 1 was produced by excess printing of the carrier material 1 of an electrically conductive material 2.
  • the printing extends so far beyond the edge region 6 that, as in the embodiment according to Figure 1, a conductive connection between one side 3 and the other side 4 of the substrate 1 results.
  • the thickness of the printing layer and the forming edge joint can be adapted to the requirements.
  • the electrically conductive material 2 for establishing a galvanic contact between the Both sides 3, 4 of the substrate 1 are applied by spraying, with suitable masks can be provided, which cover the areas of the substrate 1, which are not to be sprayed with conductive material 2.
  • the spraying can, just as in the printing process, take place in the region of a through-hole 5, a perforation, a perforation, pores or the like, or in the edge region 6 of the carrier material 1.
  • a medical electrode having a carrier material 1, which has a galvanic through-connection 7 from a first side 3 to a second side 4 of the carrier material 1, can be produced.
  • the galvanic plated-through hole 7 is formed by printing or spray-on zones applied on both sides 3, 4 of the carrier material 1 of an electrically conductive material in the region of at least one through-hole 5 or edge region 6 of the carrier material 1.
  • FIGS 4 and 5 show a medical electrode, for example a known off-center ECG electrode, in which a skin contact element 40 and a cable pad 16 are spatially separated, i.
  • a support material 1 On a support material 1 are arranged spaced from each other and are electrically connected to each other via a galvanic via.
  • a base layer 35 'facing the patient's body is made of a foam or patch material which, in use, is adhered directly to the patient's skin.
  • the galvanic through-connection from the cable contact point 16 on the first side 3 to the skin contact element 40 on the second side 4 of the carrier material 1 by means of a contact rivet 20 ', the rivet shell 21' forms the connection point for a cable connection to active or passive devices.
  • a coating or suitable Ag / AgCl sponge 60 is applied to the skin contact element 40.
  • FIG 3 shows a galvanic through-connection 7 of an ECG electrode in the region of a cable contact point 16 of an electrically insulating carrier material 1, which has a first contact region 10 on the first side 3 of the carrier material 1 and a second contact region 11 on the second side 4 of the carrier material 1 combines.
  • the galvanic plated-through hole 7 is formed by printing or spray-on zones, which are applied on both sides 3, 4 of the carrier material 1 of an electrically conductive material, in the region of a through-hole 5 of the carrier material 1.
  • the through hole 5 can be made in a simple manner hollow cylindrical, but it can take any other arbitrary shape.
  • the formation of the galvanic via takes place e.g. by overprinting the substrate 1 with an electrically conductive material 2 in the region of the through hole 5.
  • an electrically conductive material 2 is about a silver conductive paint suitable, but it can also be used other conductive, powdery or pasty materials.
  • the type of printing process used is also not limited, it can screen printing, flexographic printing, pad printing od. Like. Are used.
  • the substrate 1 is first printed on the first side 3 and then on the second side 4 or on both sides 3, 4 at the same time with the electrically conductive material 2, so that the printed material of the first page 3, the printed material on the other side. 4 touched in the area of the galvanic contact to be executed.
  • the through hole 5 is chosen so large that in the process an open channel remains between the sides 3, 4, through which a rivet 20 can be inserted, the will be described in more detail below.
  • a filling of the through hole 5 with conductive material is not required - and here also not desirable - it is sufficient surplus material order beyond the Lochberandung addition.
  • the conductive print material on one side 3 is to make a conductive connection with the conductive print material on the other side 4.
  • this compound is achieved by coalescing the layers applied on pages 3, 4.
  • a certain excess must be printed beyond the edge of the through-hole 5.
  • the via can also be done by pores in the substrate 1, which are artificially generated at a certain point or already exist.
  • the through-connection for a medical electrode according to the invention can also be carried out exactly as in the exemplary embodiment according to FIG. 2, in which the galvanic contact in an edge region 6 of the carrier material 1 was produced by overprinting the carrier material 1 with an electrically conductive material 2.
  • the thickness of the printing layer and the forming edge joint can be adapted to the requirements.
  • the electrically conductive material 2 for producing a galvanic contact between the two sides 3, 4 of the carrier material 1 by spraying for example by means of ink jet printing technology, ie with a distance to the surface to be printed, are applied, wherein suitable Masks may be provided which cover the areas of the substrate 1, which are not to be sprayed with conductive material 2.
  • the spraying can just as in the Dmckvorgang in Area of a through hole 5, a perforation, a perforation, od of pores. The like. Or in the edge region 6 of the substrate 1 done.
  • the two-sided printing or spraying of the carrier material 1 ensures that a galvanic contact between the first and the second side 3, 4 of the carrier material 1 is present. This eliminates the need for the via via the conductivity of the contact rivet, which can thus be designed so that the unwanted touching the patient's skin is avoided.
  • the contact rivet 20 shown in Figure 3 which is riveted in the through hole 5, composed of an electrically conductive Nietoberteil 21 and an electrically insulating Nietunterteil 22. Due to this construction, isolation by the film 49 or by the base layer 35 can be dispensed with.
  • FIG. 6 shows an embodiment according to the invention in which a region 51 of the base layer 35 is exposed, so that the riveting of the rivet upper part 21 and the rivet lower part 22 with the carrier material 1 is only after the carrier material 1 printed on both sides has been glued onto the base layer 35 can be carried out.
  • the electrically conductive rivet upper part 21 is inserted from above and the insulating rivet bottom part 21 is inserted from below into the through hole 5.
  • the first and second contact regions 10, 11 each extend annularly around the boundary of the through-hole 5 on the first and on the second side 3, 4 of the carrier material 1.

Abstract

Procédé permettant d'établir un contact traversant dans une matière de support électriquement isolante (1), par exemple une feuille de support pour une électrode médicale, selon lequel l'impression excédentaire des deux faces de la matière de support (1) ou l'application par pulvérisation sur les deux faces d'une matière électro-conductrice (2) permettent de produire un contact galvanique entre les deux faces (3, 4) de la matière de support (1).
EP05804654A 2004-11-23 2005-11-23 Procede permettant d'etablir un contact traversant dans une matiere de support electriquement isolante Withdrawn EP1814447A2 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
AT19722004A AT501429B1 (de) 2004-11-23 2004-11-23 Verfahren zur durchkontaktierung
AT19712004 2004-11-23
PCT/AT2005/000470 WO2006055996A2 (fr) 2004-11-23 2005-11-23 Procede permettant d'etablir un contact traversant dans une matiere de support electriquement isolante

Publications (1)

Publication Number Publication Date
EP1814447A2 true EP1814447A2 (fr) 2007-08-08

Family

ID=35871148

Family Applications (1)

Application Number Title Priority Date Filing Date
EP05804654A Withdrawn EP1814447A2 (fr) 2004-11-23 2005-11-23 Procede permettant d'etablir un contact traversant dans une matiere de support electriquement isolante

Country Status (2)

Country Link
EP (1) EP1814447A2 (fr)
WO (1) WO2006055996A2 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2676602A1 (fr) * 2012-06-20 2013-12-25 King's Metal Fiber Technologies Co., Ltd. Dispositif de détection de signal physiologique

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Publication number Priority date Publication date Assignee Title
FR2505094A1 (fr) * 1981-04-29 1982-11-05 Trt Telecom Radio Electr Procede de realisation des circuits hyperfrequences
DE3527332A1 (de) * 1984-08-08 1987-02-12 Krone Ag Folie mit beidseitig aufgedruckten leiterbahnen
DE3429236A1 (de) * 1984-08-08 1986-02-13 Krone Gmbh, 1000 Berlin Folie mit beidseitig aufgedruckten elektrischen leiterbahnen
JPH0258888A (ja) * 1988-08-25 1990-02-28 Murata Mfg Co Ltd 厚膜配線基板
US5265579A (en) * 1992-09-21 1993-11-30 Ferrari R Keith X-ray transparent monitoring electrode and method for making
AT2929U1 (de) * 1998-04-20 1999-07-26 Nessler Medizintechnik Gmbh & Ekg-elektrode mit abgerundeten ecken
DE19910078A1 (de) * 1999-03-08 2000-09-28 Bosch Gmbh Robert Verfahren zur Erhöung der Fertigungssicherheit von Lötverbindungen
US6504508B2 (en) * 2000-05-04 2003-01-07 Bae Systems Information And Electronic Systems Integration Inc Printed circuit variable impedance transmission line antenna
JP4501464B2 (ja) * 2003-04-25 2010-07-14 株式会社デンソー 厚膜回路基板、その製造方法および集積回路装置

Non-Patent Citations (1)

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Title
See references of WO2006055996A2 *

Also Published As

Publication number Publication date
WO2006055996A3 (fr) 2006-11-30
WO2006055996A2 (fr) 2006-06-01

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