WO2018206594A1 - Composant doté d'une protection cem et destiné à une platine électronique - Google Patents

Composant doté d'une protection cem et destiné à une platine électronique Download PDF

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Publication number
WO2018206594A1
WO2018206594A1 PCT/EP2018/061904 EP2018061904W WO2018206594A1 WO 2018206594 A1 WO2018206594 A1 WO 2018206594A1 EP 2018061904 W EP2018061904 W EP 2018061904W WO 2018206594 A1 WO2018206594 A1 WO 2018206594A1
Authority
WO
WIPO (PCT)
Prior art keywords
plastic layer
shield
slots
surface
structures
Prior art date
Application number
PCT/EP2018/061904
Other languages
German (de)
English (en)
Inventor
Christian Achathaler
Dennis Christian Knospe
Martin RESCHER
Daniel Schleicher
Christoph Sigmund
Original Assignee
Magna Powertrain Bad Homburg GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to DE102017208075.2A priority Critical patent/DE102017208075A1/de
Priority to DE102017208075.2 priority
Application filed by Magna Powertrain Bad Homburg GmbH filed Critical Magna Powertrain Bad Homburg GmbH
Publication of WO2018206594A1 publication Critical patent/WO2018206594A1/fr

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073Shielding materials
    • H05K9/0081Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0086Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single discontinuous metallic layer on an electrically insulating supporting structure, e.g. metal grid, perforated metal foil, film, aggregated flakes, sintering
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224Patterned shielding planes, ground planes or power planes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224Patterned shielding planes, ground planes or power planes
    • H05K1/0225Single or multiple openings in a shielding, ground or power plane
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1258Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/284Applying non-metallic protective coatings for encapsulating mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007Casings
    • H05K9/0047Casings being rigid plastic containers having conductive particles, fibres or mesh embedded therein

Abstract

L'invention concerne un élément structural comprenant des composants électroniques et/ou électriques, qui sont montés sur une ou plusieurs platines ou sont reliés à elle(s), les composants et la platine étant enrobés par injection d'une première et d'une deuxième couche plastique, et au moins un blindage contre le rayonnement électromagnétique étant présent, le blindage étant constitué d'une structure quadrillée (6) et les structures (5) étant constituées d'emplacements exposés dans le blindage (13). La présente invention concerne également un procédé de production d'un tel élément structural.
PCT/EP2018/061904 2017-05-12 2018-05-08 Composant doté d'une protection cem et destiné à une platine électronique WO2018206594A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE102017208075.2A DE102017208075A1 (de) 2017-05-12 2017-05-12 Bauteil mit EMV Schutz für elektronische Platine
DE102017208075.2 2017-05-12

Publications (1)

Publication Number Publication Date
WO2018206594A1 true WO2018206594A1 (fr) 2018-11-15

Family

ID=62148372

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2018/061904 WO2018206594A1 (fr) 2017-05-12 2018-05-08 Composant doté d'une protection cem et destiné à une platine électronique

Country Status (2)

Country Link
DE (1) DE102017208075A1 (fr)
WO (1) WO2018206594A1 (fr)

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6219746U (fr) 1985-07-18 1987-02-05
DE4016953A1 (de) 1990-05-25 1991-11-28 Itt Ind Gmbh Deutsche Elektronisches bauelement mit abschirmung gegen elektromagnetische stoerstrahlung und verfahren zur herstellung
US5166772A (en) 1991-02-22 1992-11-24 Motorola, Inc. Transfer molded semiconductor device package with integral shield
US5355016A (en) 1993-05-03 1994-10-11 Motorola, Inc. Shielded EPROM package
WO1998037742A1 (fr) * 1997-02-18 1998-08-27 Koninklijke Philips Electronics N.V. Procede pour realiser une couche d'encapsulation en resine synthetique sur un circuit imprime
DE19812880A1 (de) * 1998-03-24 1999-09-30 Bayer Ag Formteil und flexible Folie mit geschützter Leiterbahn und Verfahren zu ihrer Herstellung
US20030042045A1 (en) 2001-08-28 2003-03-06 Koskenmaki David C. Embedded electrical traces and method for making
US20060047053A1 (en) * 2004-08-27 2006-03-02 Ivan Pawlenko Thermoconductive composition for RF shielding
US20070220744A1 (en) * 2005-03-22 2007-09-27 Cluster Technology Co., Ltd. Wiring Circuit Board Producing Method and Wiring Circuit Board
DE102007020656A1 (de) * 2007-04-30 2008-11-06 Infineon Technologies Ag Werkstück mit Halbleiterchips, Halbleiterbauteil und Verfahren zur Herstellung eines Werkstücks mit Halbleiterchips
EP2955789A1 (fr) 2014-06-12 2015-12-16 BAE Systems PLC Fenêtres électro-optiques

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101468531A (zh) * 2007-12-26 2009-07-01 深圳富泰宏精密工业有限公司 模制品
KR101622586B1 (ko) * 2010-03-31 2016-05-19 후지필름 가부시키가이샤 도전성 필름

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6219746U (fr) 1985-07-18 1987-02-05
DE4016953A1 (de) 1990-05-25 1991-11-28 Itt Ind Gmbh Deutsche Elektronisches bauelement mit abschirmung gegen elektromagnetische stoerstrahlung und verfahren zur herstellung
US5166772A (en) 1991-02-22 1992-11-24 Motorola, Inc. Transfer molded semiconductor device package with integral shield
US5355016A (en) 1993-05-03 1994-10-11 Motorola, Inc. Shielded EPROM package
WO1998037742A1 (fr) * 1997-02-18 1998-08-27 Koninklijke Philips Electronics N.V. Procede pour realiser une couche d'encapsulation en resine synthetique sur un circuit imprime
DE19812880A1 (de) * 1998-03-24 1999-09-30 Bayer Ag Formteil und flexible Folie mit geschützter Leiterbahn und Verfahren zu ihrer Herstellung
US20030042045A1 (en) 2001-08-28 2003-03-06 Koskenmaki David C. Embedded electrical traces and method for making
US20060047053A1 (en) * 2004-08-27 2006-03-02 Ivan Pawlenko Thermoconductive composition for RF shielding
US20070220744A1 (en) * 2005-03-22 2007-09-27 Cluster Technology Co., Ltd. Wiring Circuit Board Producing Method and Wiring Circuit Board
DE102007020656A1 (de) * 2007-04-30 2008-11-06 Infineon Technologies Ag Werkstück mit Halbleiterchips, Halbleiterbauteil und Verfahren zur Herstellung eines Werkstücks mit Halbleiterchips
US9293423B2 (en) 2007-04-30 2016-03-22 Intel Deutschland Gmbh Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips
EP2955789A1 (fr) 2014-06-12 2015-12-16 BAE Systems PLC Fenêtres électro-optiques

Also Published As

Publication number Publication date
DE102017208075A1 (de) 2018-11-15

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