WO2016116499A1 - Feuille composite présentant une fonctionnalité électrique et mise en contact électrique permettant la mise en contact d'un conducteur électrique - Google Patents

Feuille composite présentant une fonctionnalité électrique et mise en contact électrique permettant la mise en contact d'un conducteur électrique Download PDF

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Publication number
WO2016116499A1
WO2016116499A1 PCT/EP2016/051130 EP2016051130W WO2016116499A1 WO 2016116499 A1 WO2016116499 A1 WO 2016116499A1 EP 2016051130 W EP2016051130 W EP 2016051130W WO 2016116499 A1 WO2016116499 A1 WO 2016116499A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
film composite
conductive structure
electrically conductive
compressible
Prior art date
Application number
PCT/EP2016/051130
Other languages
German (de)
English (en)
Inventor
Oliver Wiesener
Wolfram Fischer
Original Assignee
Schreiner Group Gmbh & Co. Kg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schreiner Group Gmbh & Co. Kg filed Critical Schreiner Group Gmbh & Co. Kg
Publication of WO2016116499A1 publication Critical patent/WO2016116499A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/77—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/79—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/82—Coupling devices connected with low or zero insertion force
    • H01R12/85—Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures
    • H01R12/87—Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures acting automatically by insertion of rigid printed or like structures

Definitions

  • the invention relates to a film composite with electrical functionality and a contact for contacting an electrical conductor. Furthermore, the invention relates to an electrical connector component with such a composite film.
  • terminal contacts or spring contacts in which the conductors to be connected are inserted, can be used.
  • Clamping contacts have, for example, wire hoops in which the electrical conductors are held by squeezing the wire hoops together and electrically connected to one another.
  • Spring contacts have a spring mechanism by which an electrical conductor is pressed against another conductor so that the conductors to be connected are held in the spring contact and at the same time electrically connected to each other.
  • Such contacting devices are used in particular when the conductors to be connected are designed as electrical wires.
  • electrical conductors can also be designed as flexible conductive structures, for example as flexible conductor tracks, which are applied to a flexible carrier layer, for example a carrier foil.
  • a further electrical conductor for example a wire
  • the above-mentioned contacting devices may likewise be used.
  • the clamping or spring contacts can be arranged on a circuit board.
  • the contacting of an electrical conductor with a flexible conductive structure by means of clamping or spring contacts is complex and connected by the relatively large Klemmoder spring contact with a lot of space.
  • a concern of the present invention is to provide a film composite with electrical
  • Another object of the present invention is to provide an electrical connector component, with which an electrical conductor with an electrically conductive structure of the film composite can be electrically connected in a simple and space-saving manner, yet reliable.
  • the film composite comprises a carrier layer, which is detachably formed by the film composite, a compressible layer which is arranged on a portion of the carrier layer, a bonding layer with an adhesive effect and an electrically conductive structure, which is arranged above the carrier layer.
  • the bonding layer is disposed between the compressible layer and the portion of the backing layer.
  • the tie layer is formed such that the compressible layer adheres to the portion of the carrier layer and the compressible layer is peelable from the portion of the carrier layer, wherein the tie layer detaches from the portion of the carrier layer and adheres to the compressible layer when the carrier layer detached from the film composite.
  • a portion of the electrically conductive structure is disposed over the compressible layer.
  • the compressible layer is formed such that the compressible layer is compressed upon the application of a force on the compressible layer and sets the acting force against a restoring force.
  • the electrically conductive structure may be a flexible printed circuit or conductive surface, which is arranged on the carrier layer by printing, stamping, laser or etching. To produce the actual contact device, the section of the conductive structure to be contacted is guided over the compressible layer. As a result, a flexible spring contact integrated into the film composite is created in this area, which is spatially adapted to the end application and, for example, in rounded corners of a housing of an electrical connector component can be arranged.
  • An embodiment of an electrical connector component for contacting an electrical conductor with an electrically conductive structure of a composite film is specified in claim 15.
  • the electrical plug component comprises a film composite according to the above-mentioned embodiment, wherein the carrier layer is detached from the film composite.
  • the plug component furthermore has a housing with an opening for inserting an electrical conductor into the housing.
  • the film composite is arranged in the housing such that the compressible layer of the film composite is compressed during insertion of the electrical conductor into the opening of the housing and the electrical conductor is clamped by the restoring force of the compressible layer between the housing and the portion of the electrically conductive structure.
  • the film composite is placed, for example, on a substrate of the plug component in the vicinity of the opening of the housing, so that the electrical conductor, when inserted into the opening of the housing, contacts the section of the electrically conductive structure arranged above the compressible layer. Since the compressible material of the film composite is compressed by the insertion of the electrical conductor into the opening of the housing and generates a restoring force, the electrical conductor is clamped between the portion of the electrically conductive structure on the compressible layer and the housing. As a result, the electrical conductor is fixed in the plug component and at the same time an electrical contact is formed between the electrically conductive structure and the electrical conductor.
  • FIG. 2 shows a further embodiment of a film composite with electrical functionality and contacting for contacting with an electrical conductor
  • FIG. 3 shows a further embodiment of a film composite with electrical functionality and contacting for contacting with an electrical conductor
  • FIG. 4 shows an embodiment of an electrical plug component with a foil composite with electrical functionality and contacting for contacting with an electrical conductor
  • Figure 5 shows a further embodiment of an electrical connector component
  • Figure 6 shows another embodiment of a composite film with electrical functionality and contacting for contacting with an electrical conductor.
  • Figures 1, 2 and 3 show various embodiments of a film composite 100 with an electrically conductive structure 140 for contacting with an electrical conductor.
  • the film composite 100 in each case comprises a carrier layer 110 which is removable from the film composite 100.
  • the carrier layer may be formed as a film of a non-conductive material.
  • the film composite 100 has a compressible layer 120 which is arranged on a section 111 of the carrier layer 110.
  • Adhesive action is disposed between the compressible layer 120 and the portion 111 of the carrier layer 110.
  • the bonding layer 131 may be, for example, a primer or an adhesive layer.
  • the connection layer 131 is configured in this way. forms that the compressible layer 120 adheres to the portion 111 of the support layer 110 and the compressible layer 120 is detachable from the portion 111 of the support layer 110.
  • the connecting layer 131 separates from the section 11 of the carrier layer 110 and continues to adhere to the underside of the compressible layer 120.
  • the electrically conductive structure 140 of the film composite 100 may be formed as a conductor or guide surface, which is arranged above the carrier layer 110. A portion 141 of the electrically conductive structure 140 is disposed over the compressible layer 120.
  • the compressible layer 120 is formed such that the compressible layer 120 is compressed upon application of a force and the acting force opposes a restoring force.
  • the compressible layer 120 may be thicker than the carrier layer 110 and may be formed as the electrically conductive structure 140.
  • the compressible layer 120 may, for example, have a thickness between 0.3 mm and 5 mm.
  • the compressible layer 120 may comprise a material of a foam, for example a foam adhesive, or a liquid material, for example a material of a resin, in particular a synthetic resin.
  • the compressible materials can be used as required. Depending on their nature, they can for example be punched out and applied to the carrier layer or the electrically conductive structure.
  • the flexible material may be cast on the carrier layer 110 and the electrically conductive structure 140, respectively.
  • the material of the compressible layer 120 may according to one embodiment be electrically inactive, that is not electrically conductive nor piezoelectric.
  • the composite film 100 of the embodiments shown in FIGS. 1 to 3 has opposite terminal sides 101 and 102, between which the carrier layer 110 extends.
  • the compressible layer 120 extends between the terminal side 101 of the film composite and a position 113 of the carrier layer 110, which lies between the two terminal sides 101 and 102 of the film composite.
  • the embodiments of the film composite shown in FIGS. 1 to 3 may include a cover layer 150 for protecting the electrically conductive structure 140 from mechanical damage.
  • the cover layer 150 is disposed over the electrically conductive structure 140.
  • a protective lacquer, a film, an adhesive or, depending on the application, another material can be used as the cover layer.
  • the covering layer 150 may have a hole or a recess 151 in the material of the covering layer at a region above the section 141 of the electrically conductive structure.
  • the various embodiments of the film composite 100 shown in FIGS. 1 to 3 may further include a corrosion protection layer 160 for protecting the electrically conductive structure 140 from corrosion.
  • the corrosion protection layer 160 is arranged between the electrically conductive structure 140 and the covering layer 150.
  • the corrosion protection layer 160 is arranged only above the section 141 of the electrically conductive structure 140.
  • the corrosion protection layer can also be arranged over the entire electrically conductive structure 140 according to a further embodiment.
  • an electrically conductive layer may first be applied over the entire surface of the carrier layer 110 or the compressible layer 120.
  • the conductive structure 140 can be made by stamping and removing the residual grid of the conductive layer.
  • the anticorrosive layer can be produced by printing the conductive layer over the entire surface before punching out the conductive structure. Another possibility is to print the individual strip conductors after punching or lasering with the material of the corrosion protection layer 160. With sufficient amount of printing ink or paste for the anticorrosive layer and thin Leit harshen, preferably with heights between 5 ⁇ and 30 ⁇ , when printing the conductive structures and their edges can be wetted and thereby protected.
  • a non-conductive material for example a variety of coatings based on solvents or UV-reactive or based on any other drying / curing processes, such as the electron beam hardening, can be used. It is likewise possible to use, as the material for the corrosion protection layer 160, conductive pastes, for example silver conductive paste or carbon conductive paste, likewise based on different drying methods.
  • conductive pastes for example silver conductive paste or carbon conductive paste, likewise based on different drying methods.
  • a further possibility for the production of a corrosion protection layer consists of steaming the conductive layer with suitable materials after the full-area application of the electrically conductive layer to the carrier layer 110 or the compressible layer 120.
  • suitable materials In the case of vapor deposition with aluminum, for example, an oxide layer forms over the electrically conductive layer, which prevents further corrosion.
  • a corrosion protection layer it is also possible to use a vapor deposition of the conductive layer with gold or a vaporization of an organic or inorganic nature.
  • Another possibility for producing a corrosion protection is to laminate over the electrically conductive structure 140 a self-adhesive film or a film structure with sufficient elasticity and adhesive thickness.
  • a PE film which is coated on the underside with adhesive, or a H redesignlaminierierfolie can be used.
  • the overlaminated film structure may have an opening in the contacting region above the electrically conductive structure 140, upon which contact with the electrically conductive structure 140 may take place after the application of the corrosion protection.
  • the sealing of the electrically conductive structure can be carried out by a vacuum process, in order to possibly suck air inclusions out of the composite. As a result, air bubbles or air pockets, which could cause corrosion, are completely sucked out.
  • the electrically conductive structure 140 can also be protected against corrosion in particular by using a non-corrosive material, for example tinned copper or gold, as the material for the electrically conductive structure 140.
  • the electrically conductive structure 140 has a further section 142, adjoining the section 141, of the electrically conductive structure.
  • the carrier layer 110 has a further section 112 of the carrier layer adjoining the section 111 of the carrier layer.
  • the film composite can have a further bonding layer 132 with an adhesive effect.
  • the further bonding layer 132 may be formed as a primer or adhesive layer.
  • the connection layer 132 is arranged between the further section 142 of the electrically conductive structure 140 and the further section 112 of the carrier layer 110.
  • the section 142 of the conductive structure 140 is arranged directly on the carrier layer 110, that is to say without the compressible layer 120 being arranged between the section 142 of the conductive structure 140 and the section 112 of the carrier layer 110.
  • the further connection layer 132 is formed such that the further section 142 of the electrically conductive structure 140 adheres through the connection layer 132 to the further section 112 of the carrier layer 110.
  • the further connection layer 132 is furthermore designed in such a way that the further section 142 of the electrically conductive structure 140 can be detached from the further section 112 of the carrier layer 110.
  • the further connection layer 132 is designed in such a way that when the carrier layer 110 is detached from the film composite, the connection layer 132 detaches from the section 112 of the carrier layer 110 and adheres to the section 142 of the electrically conductive structure 140.
  • a thickness compensation in areas without electrically conductive structures or with structures having little conductivity can be applied.
  • a thickness compensation can be arranged between the actual contacting region, on which the compressible layer 120 is arranged on the carrier layer 110 is produced, and other areas of the film composite.
  • the uniform height of the film composite facilitates or enables the ability to wind of the film composite on a roll.
  • the stackability of the sheet goods can be ensured by the thickness compensation.
  • an intermediate layer 170 may be provided at the locations outside the contacting region.
  • FIGS. 2 and 3 each show an embodiment of the film composite 100 with an intermediate layer 170 for filling in a region of the film composite between the section 142 of the electrically conductive structure 140 and the section 112 of the carrier layer 110.
  • the intermediate layer 170 is arranged between the position 113 of the carrier layer 110 and the terminal side 102 of the film composite 100 and adjoins the compressible layer 120.
  • the film composite 100 shown in FIG. 2 can have a bonding layer 133 with an adhesive effect, for example a bonding agent or adhesive layer.
  • the connection layer 133 is disposed between the intermediate layer 170 and the portion 142 of the conductive structure 140.
  • the bonding layer 133 is formed such that the intermediate layer 170 adheres to the portion 142 of the conductive pattern 140.
  • the portion 142 of the conductive structure 140 is detachable from the intermediate layer 170.
  • the bonding layer 133 is formed such that the bonding layer 133 peels away from the intermediate layer 170 and adheres to the portion 142 of the conductive structure 140 when the backing layer 110 is peeled off from the film composite 100.
  • the intermediate layer 170 adheres to the section 112 of the carrier layer 110 through a connecting layer 132, which may be formed as a primer or adhesive layer.
  • a connecting layer 132 which may be formed as a primer or adhesive layer.
  • the bonding layer 132 may be formed as a primer or adhesive coating.
  • the bonding layer 132 is between the intermediate layer 170 and the further portion 112 of the carrier layer 110 is arranged.
  • the connecting layer 132 is formed such that the intermediate layer 170 adheres to the portion 112 of the carrier layer 110 and the intermediate layer 170 is detachable from the further portion 112 of the carrier layer 110.
  • the connecting layer 132 is in particular designed such that the connecting layer 132 separates from the further section 112 of the carrier layer 110 and adheres to the intermediate layer 170 when the carrier layer 110 is detached from the film composite 100.
  • the intermediate layer 170 thus remains on the underside of the section 142 of the conductive structure 140 after the carrier layer 110 has detached.
  • the compressible layer 120 and the intermediate layer 170 can be made of the same material.
  • the compressible layer 120 and the intermediate layer 170 may have the same thickness.
  • the compressible layer 120 and the intermediate layer 170 may be separated from each other by a cutting line S.
  • the compressible layer 120 is applied to the section 111 of the carrier layer 110.
  • the connection layer 131 is arranged between the section 111 of the carrier layer 110 and the compressible layer 120.
  • the connection layer 132 is applied.
  • a conductive coating can subsequently be applied over the entire surface to the compressible layer 120 and to the bonding layer 132 over the section 112 of the carrier layer 110.
  • the conductive coating is applied over the complete area over the compressible layer 120 as well as over the intermediate layer 170.
  • the bonding layer 133 is applied over the intermediate layer 170.
  • the conductive structure 140 for example in the form of a conductor track or a guide surface, the corresponding areas of the conductive coating are punched or etched.
  • the conductive structure 140 can also be printed directly on the respective substrate, lasered or vapor-deposited.
  • the compressible layer 120, the electrically conductive structure 140 and optionally the intermediate layer 170 can also be applied to the carrier layer 110 in the reverse order.
  • the electrically conductive structure 140 lying on top of a temporarily used substrate, for example the carrier layer 110 after the application in a component, for example a plug component, will be applied later in the application, for example when arranging in FIG a plug component, transferred to the final underground.
  • the carrier layer 110 lying as the lowest layer can be used after application of the film composite as a protective top cover layer on the electrically conductive structure.
  • the carrier layer may have at a region above the section 141 of the conductive structure to be contacted a hole or a recess through which the external contacting to the electrically conductive structure can take place.
  • the film composite can have an elastic substructure, for example an additional elastic film, which is provided directly above the carrier layer 110.
  • an elastic base for example, a foamed material having, for example, a thickness between 0.3 mm and 5 mm can be used.
  • a thickness compensation can be made possible between the region of the film composite intended for contacting and the adjacent regions, for example in the case of dimensional tolerances of housed components.
  • a multiplicity of the embodiments of the film composite 100 shown in FIGS. 1 to 3 can be produced as rolled goods or as individual part / sheet goods. The production as a roll product is particularly recommended when using flexible carrier layers, which can simplify the processing in many cases clearly lend.
  • a flexible film for example of PET (polyethylene terephthalate), PP (polypropylene), PE (polyethylene) or PI (poly- mid), are used. It is also possible to use papers which are optionally impregnated in media which protect against environmental influences, for example against moisture.
  • the production as Einzel- / Bogenware comes in particular in question when the film composite has a non-flexible support layer as a substrate layer. Hard materials such as hard papers or typical circuit board materials can be used for this.
  • asymmetrical film structures can optionally be interlocked, rotated or pushed.
  • Each film composite may contain a plurality of electrically conductive structures, for example a plurality of conductor tracks, with associated contacting areas, which are electrically insulated from one another.
  • the individual conductive structures can be arranged spaced apart on the carrier layer. For this purpose, a first still arranged between the conductive structures grid can be removed.
  • the conductive structures can also be arranged on the carrier layer without detaching a grid if, for example by means of laser production, it is possible to produce a sufficiently wide gap between the conductive structures. For example, in laser fabrication, conductive material may be burned between the conductive structures to avoid short circuits between the conductive structures.
  • FIG. 4 shows a first embodiment of an electrical connector component 10 with a housing 200, in which a film structure 100 is arranged, the carrier substrate or the carrier layer 110 being detached from the film composite.
  • the film structure 100 may have the embodiment shown in FIGS. 1 and 2.
  • the film structure has at least the compressible layer 120, the connecting layers 131, 132 and the electrically conductive structure 140.
  • the plug component shown in FIG. 4 has the film composite 100 according to one of the embodiments shown in FIGS. 1 and 2, the carrier substrate or the carrier layer 110 detached from the film composite and the cover layer 150 not shown in FIG. 4 for reasons of simplified illustration is.
  • the film composite is applied to a substrate 300 of the plug component, for example glued.
  • the film composite is surrounded by the housing 200 of the electrical connector component.
  • the housing 200 has an opening 210 for inserting an electrical conductor 20, for example a wire, into the housing 200 of the plug component.
  • the film composite 100 is arranged in the housing 200 such that the compressible layer 120 of the film composite 100 is disposed close to the opening 210 of the housing and is compressed when inserting the electrical conductor 20 into the opening 210 of the housing 200.
  • a restoring force is generated by the compressible layer 120, by which the electrical conductor 20 is clamped between the housing 200 and the section 141 of the electrically conductive structure 140 and between the electrical conductor 20 and the conductive structure 140 electrical contact is created.
  • FIG. 5 shows a second embodiment of the electrical plug component 10.
  • the electrical plug component has the film composite 100 according to the embodiment shown in FIG.
  • the carrier layer 110 has been detached from the film composite and the cover layer 150 is not drawn for reasons of simplified illustration.
  • the intermediate layer 170 adheres to the section 142 of the electrically conductive structure 140.
  • the film composite is arranged close to the opening 210 of the housing 200 in the connector component of Figure 5 as in the embodiment shown in Figure 4.
  • the compressible layer 120 is compressed during insertion of the electrical conductor 20 into the opening 210 of the housing 200.
  • the electrical conductor 20 is replaced by the restoring force the compressible layer 120 is clamped between the housing 200 and the portion 141 of the electrically conductive structure 140, whereby an electrical connection between the electrical contact 20 and the electrically conductive structure 140 is made.
  • FIG. 6 shows a further embodiment of the film composite with a plurality of electrically separated conductive structures 140a, 140b.
  • the compressible layer arranged on the carrier layer 110 has various regions 120a and 120b, which are arranged at different heights on the section 111 of the carrier layer 110. On each of the different regions 120a, 120b of the compressible layer 120, one of the conductive structures 140a or 140b is arranged in each case.
  • the packing density of conductive structures within the film composite can be increased without increasing the risk of short circuits.
  • the electrically conductive structures can even be arranged impact-to-joint, that is to say without being horizontally spaced apart on the carrier layer.
  • the necessary distance to isolate the conductive structures 140a, 140b from each other is achieved by the vertical distance between the conductive structures.
  • contacting regions with different mechanical pressure resistances can be realized.

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Abstract

L'invention concerne une feuille composite (100) présentant une fonctionnalité électrique et une mise en contact électrique permettant la mise en contact d'un conducteur électrique (20), ladite feuille comprenant une couche de support (110) qui peut être détachée de la feuille composite (100) et une couche compressible (120) qui est agencée sur une section (111) de la couche de support (110). La feuille composite (100) comprend en outre une structure électro-conductrice (140), qui est agencée au-dessus de la couche de support (110) et de la couche compressible (120). La couche compressible (120) est conçue de telle manière que la couche compressible (120) est comprimée lorsqu'une force est exercée sur la couche compressible (120) et une force de rappel s'oppose à la force en action. Lorsque la feuille composite est agencée dans un boîtier (200) d'un composant connecteur électrique (10), le conducteur électrique (20) peut être serré entre la structure (140) électro-conductrice et le boîtier (200).
PCT/EP2016/051130 2015-01-22 2016-01-20 Feuille composite présentant une fonctionnalité électrique et mise en contact électrique permettant la mise en contact d'un conducteur électrique WO2016116499A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102015100919.6 2015-01-22
DE102015100919.6A DE102015100919A1 (de) 2015-01-22 2015-01-22 Folienverbund mit elektrischer Funktionalität und Kontaktierung zum Kontaktieren eines elektrischen Leiters

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WO2016116499A1 true WO2016116499A1 (fr) 2016-07-28

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WO (1) WO2016116499A1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10437243B2 (en) 2017-06-19 2019-10-08 Deere & Company Combine harvester control interface for operator and/or remote user
US10694668B2 (en) 2017-06-19 2020-06-30 Deere & Company Locally controlling settings on a combine harvester based on a remote settings adjustment
US10782672B2 (en) 2018-05-15 2020-09-22 Deere & Company Machine control system using performance score based setting adjustment
US11589507B2 (en) 2017-06-19 2023-02-28 Deere & Company Combine harvester control interface for operator and/or remote user
US11789413B2 (en) 2017-06-19 2023-10-17 Deere & Company Self-learning control system for a mobile machine

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Publication number Priority date Publication date Assignee Title
DE2424419A1 (de) * 1974-05-20 1975-12-04 Hartmann & Braun Ag Kontaktanordnung zur herstellung einer loesbaren elektrischen verbindung zwischen einem leiterband und mindestens einer steckkarte
FR2497610A1 (fr) * 1981-01-06 1982-07-09 Socapex Dispositif de connexion pour carte de circuit imprime, et chassis pour cartes comprenant un tel dispositif
DE3621064A1 (de) * 1986-06-24 1988-01-14 Telefunken Electronic Gmbh Verfahren zum kontaktieren einer zuleitung mit mehreren nebeneinander liegenden adern
DE19643783A1 (de) * 1995-10-31 1997-05-07 Whitaker Corp Elektrischer Verbinder

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2424419A1 (de) * 1974-05-20 1975-12-04 Hartmann & Braun Ag Kontaktanordnung zur herstellung einer loesbaren elektrischen verbindung zwischen einem leiterband und mindestens einer steckkarte
FR2497610A1 (fr) * 1981-01-06 1982-07-09 Socapex Dispositif de connexion pour carte de circuit imprime, et chassis pour cartes comprenant un tel dispositif
DE3621064A1 (de) * 1986-06-24 1988-01-14 Telefunken Electronic Gmbh Verfahren zum kontaktieren einer zuleitung mit mehreren nebeneinander liegenden adern
DE19643783A1 (de) * 1995-10-31 1997-05-07 Whitaker Corp Elektrischer Verbinder

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10437243B2 (en) 2017-06-19 2019-10-08 Deere & Company Combine harvester control interface for operator and/or remote user
US10694668B2 (en) 2017-06-19 2020-06-30 Deere & Company Locally controlling settings on a combine harvester based on a remote settings adjustment
US11589507B2 (en) 2017-06-19 2023-02-28 Deere & Company Combine harvester control interface for operator and/or remote user
US11789413B2 (en) 2017-06-19 2023-10-17 Deere & Company Self-learning control system for a mobile machine
US12096716B2 (en) 2017-06-19 2024-09-24 Deere & Company Combine harvester control interface for operator and/or remote user
US10782672B2 (en) 2018-05-15 2020-09-22 Deere & Company Machine control system using performance score based setting adjustment

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