EP1731841B1 - Cooking hob with operating device - Google Patents

Cooking hob with operating device Download PDF

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Publication number
EP1731841B1
EP1731841B1 EP06010577A EP06010577A EP1731841B1 EP 1731841 B1 EP1731841 B1 EP 1731841B1 EP 06010577 A EP06010577 A EP 06010577A EP 06010577 A EP06010577 A EP 06010577A EP 1731841 B1 EP1731841 B1 EP 1731841B1
Authority
EP
European Patent Office
Prior art keywords
cooking hob
support
sensor element
work surface
element device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Not-in-force
Application number
EP06010577A
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German (de)
French (fr)
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EP1731841A1 (en
Inventor
Martin Baier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EGO Elektro Geratebau GmbH
Original Assignee
EGO Elektro Geratebau GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EGO Elektro Geratebau GmbH filed Critical EGO Elektro Geratebau GmbH
Publication of EP1731841A1 publication Critical patent/EP1731841A1/en
Application granted granted Critical
Publication of EP1731841B1 publication Critical patent/EP1731841B1/en
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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24HEATING; RANGES; VENTILATING
    • F24CDOMESTIC STOVES OR RANGESĀ ; DETAILS OF DOMESTIC STOVES OR RANGES, OF GENERAL APPLICATION
    • F24C7/00Stoves or ranges heated by electric energy
    • F24C7/08Arrangement or mounting of control or safety devices
    • F24C7/082Arrangement or mounting of control or safety devices on ranges, e.g. control panels, illumination
    • F24C7/083Arrangement or mounting of control or safety devices on ranges, e.g. control panels, illumination on tops, hot plates
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24HEATING; RANGES; VENTILATING
    • F24CDOMESTIC STOVES OR RANGESĀ ; DETAILS OF DOMESTIC STOVES OR RANGES, OF GENERAL APPLICATION
    • F24C15/00Details
    • F24C15/10Tops, e.g. hot plates; Rings
    • F24C15/102Tops, e.g. hot plates; Rings electrically heated

Definitions

  • the invention relates to a hob and the arrangement of a corresponding hob with operating device and sensor element device in or on a countertop.
  • the invention has for its object to provide a hob and the arrangement of a hob, with which problems of the prior art can be solved and it is particularly possible, a hob with a hob plate, an operating device arranged thereon and a sensor element device or an operating device spabagern on the hob at the lowest possible cost and great flexibility laterally or outwards or to make laterally offset.
  • a carrier is provided as a thin and flat sheet material, wherein the carrier is not part of the cooking field plate or a separate part thereof.
  • the carrier forms a control surface with touch switches to which, in particular, a finger can be placed for operation.
  • sensor elements are provided on the back of the carrier, which form the aforementioned contact switch. From each sensor element there is a contact with contact devices on the carrier.
  • the sensor elements or the entire sensor element device can be electrically connected to the carrier to the operating device of the hob.
  • the sensor element device works together with the operating device and is inevitably needed. However, it does not have to form a unit with this, it is advantageous even separate units.
  • the sensor element device or the carrier it is possible for the sensor element device or the carrier to connect, so to speak, flatly to the hob plate or to continue its areal expansion. Due to the fact that this sensor element device or the carrier, however, is separate from the cooktop plate or is a separate structural unit, at least until the assembly of the cooktop, both parts can be made simpler and therefore optimized in each case. Furthermore, a much greater variety in material choice, material appearance and material thickness of the carrier or the sensor element device is possible. Even with a defect in the sensor element device, an exchange of only this sensor element device and thus less repair effort is possible.
  • the sensor element device forms only a part of the operating device, in particular the sensory part, then a modular structure with greater variability can be created.
  • the sensor elements respond to pressure as well as a thereby generated during operation at least small or minimal operating path. Although this does not close the electrical contact of the switching operation desired with the operation, a certain mechanical operation is present. Examples of such sensor elements are piezo sensors as well as so-called FSR sensors. Such pressure-sensitive sensor elements are advantageously attached to the underside of the carrier. These sensor elements are also understood as touch switches, even if more pressure is necessary for their operation.
  • flat and capacitive sensor elements can be used. These capacitive sensor elements may be provided as frame-like sensor surfaces or full sensor surfaces on the back or underside of the carrier, advantageously attached thereto. Alternatively, the sensor elements can be applied directly to an additional sensor element carrier, which in turn is attached to the carrier. So a modular design with easier production of the individual parts is possible.
  • the sensor elements are formed relatively thin, regardless of their basic operation, for example, in about 1 mm thin. They may be printed on the carrier or on a sensor element carrier by screen printing or by a similar method. Preferably, several or all sensor elements are mounted on a single carrier or sensor element carrier. This in turn can be designed to be simple Can be attached manner, for example, can be glued by an applied adhesive layer.
  • the aforementioned contacts can be applied to the back of the carrier in the manner of printed conductors in one embodiment of the invention. This is especially useful if they are connected directly and electrically contacting with the sensor elements on the back of the carrier. These contacts can run to contacting devices on the carrier, which are designed in the manner of contact fields. These contact pads are advantageously on the edge region of the carrier and are used for electrical contacting either via pressing of contact springs or pins or by applying to the contact pads on the carrier mating connectors. However, this is generally well known from, for example, the contacting of printed circuit boards, so that further embodiments can be omitted. Alternatively, solder joints between the contact fields and the operating device or the hob can be provided.
  • the sensor element device or the carrier together with the contacts in the hob or under the hob plate enough and thus leads relatively close to the control directly.
  • the carrier may be a flex circuit board carrying contact tracks.
  • the sensor elements are also provided or applied thereto. Are additional contact fields or the like. provided for pressed contacts to the hob, many functions can be advantageously integrated into the carrier. From a larger area for the sensor elements from an elongated area can protrude with the contacts in the hob inside.
  • the sensor element device it is possible to place the sensor element device laterally on or even on the cooktop panel or, above all, not to let it pass under the cooktop panel.
  • outgoing contacts be provided, for example, as a flat multiple cables or printed with corresponding tracks, flexible and thin films as well as the aforementioned flex circuit boards. Again, this is well known to those skilled in electrical connections in printed circuit boards in electrical equipment.
  • the carrier is to say that it is advantageous at least partially electrically isolated on its back. In particular, this applies to the areas where sensor elements and contacts are attached. In particular, it is electrically insulated on essentially the entire backside, for example by means of coatings or insulating films. So it is also possible to use a metallic carrier, for example, a thin stainless steel or aluminum sheet. In this case, deviating embodiments are also possible from planar formations, for example arched profile-like or with depressions on the upper side to rest a finger.
  • a carrier made of metal it can be made of electrically insulating material.
  • both material is similar to glass ceramic, so mechanically very resistant.
  • other glasses or plastics can be used.
  • By at least partially translucent support both interesting optical designs can be created as well as displays are arranged underneath.
  • the carrier may be formed, in particular when it is pushed under the hob plate, that it is very shallow, especially in comparison to the hob plate.
  • a carrier or the entire sensor element device may for example be provided with a thickness of 1 mm, so for example be a sheet.
  • the sensor element device can be placed on an edge region of the hob plate itself. In particular, it is a kind of elongated strip.
  • Such a carrier may be a kind of one-piece angle profile, in particular an angle plate.
  • a pollution-prone and visually clean lateral seal can be created.
  • including the aforementioned contacts can run underneath and are therefore also not visible and protected against damage.
  • the sensor elements In the above-described embodiment with a sensor element device which is placed on the hob plate, it may be provided that the sensor elements ultimately lie in the edge region of the hob plate or in an area above the worktop and not above the cut in the worktop.
  • the sensor elements may be provided, in particular, at a region of the hob where the heating during operation is relatively low. It can also be provided to fasten the sensor element device or the carrier on the hob plate by gluing. Alternatively, in the case of a resting of the sensor element device or of the carrier on the worktop, an adhesive bond may also be provided here.
  • a lateral connection of the sensor element device to the cooking field plate projecting beyond the cutout in the worktop and resting at least in strips on the worktop has the advantage that the sensor element device appears to be fully associated with the hob.
  • the absence of transitions or equal thicknesses facilitates cleaning of the surfaces.
  • Fig. 1 an arrangement 11 is shown in which in a corresponding section of a worktop 12, a hob 13 is inserted in a known per se manner.
  • a hob plate or glass ceramic plate 15 circumferentially overlaps the worktop 12 a piece and is usually on her.
  • the hob 13 has on the underside of the glass ceramic plate 15 still a control housing 16. In this is what will be discussed in more detail, especially a control or power supply of the hob 13 included. It is also possible to provide parts of the operating device, in particular evaluation and control electronics, which are not provided on the sensor element device.
  • a certain gap between top of the worktop 12 and the glass ceramic plate 15 is given. It can also be formed in or by a circumferential elastic seal under the edge of the hob.
  • an operating device 18 with a sensor element device 19 is inserted. In essence, it consists of a flat support 20, which will be discussed in more detail below.
  • it is an operating device 18 or sensor element device 19 according to FIG Fig. 4 , wherein on the underside of the carrier 20, the sensor elements 22 may be provided in various forms. The electrical contact to the sensor elements 22 via contact fields 24, which point downwards.
  • control board 25 In the control housing 16.
  • control board 25 On the control board 25 are control devices of the hob 13, in particular microcontroller and possibly a signal evaluation or processing. This is how the electrical connection is made the control device 18 or sensor element device 19 to the control board 25th
  • control board 25 In the control housing 16, among other things, the control board 25 is arranged. It also carries displays 26 to indicate operating conditions or other information through the glass ceramic plate 15 upwards.
  • the carrier 20 according to Fig. 1 can be permanently fixed in an embodiment of the invention on the countertop 12, for example by gluing. Alternatively, it can be releasably secured, for example by screwing. Furthermore, it can either rest on the otherwise flat worktop 12 and thus survive upwards. This forms a kind of gradation of the transition from the top of the worktop 12 to the glass ceramic plate 15. At the other areas of the support of the glass ceramic plate 15 on the top of the worktop 12 spacers can be provided with the thickness of the support 20 for a uniform support. Alternatively, one of the thickness of the carrier 20 corresponding flat depression in the worktop 12 may be provided.
  • the carrier 20 may also be graduated in a certain way or be formed with stepped thickness, so that it extends with a thin area under the glass ceramic plate 15 and the rest, however, with a greater thickness, for example according to the glass ceramic plate 15, the course continues , It is also possible with such a solution, in the area of the sensor element device or its electrical contact with the control board, to make the cutout in the work surface 12 larger, in particular beyond the edge of the glass ceramic plate 15. This enlargement of the cutout is subsequently concealed by the operating device again, whereby the considerably enlarged gap allows a simple way of doing so and way cable or the like. can be performed for electrical connection of the control device to the control board.
  • the hob 113 in turn in a section in a worktop 112.
  • the glass ceramic plate 115 is more or less directly on the surface of the work surface 112 or there is only a very small gap.
  • the operating device 118 is applied or glued to a support 120 for the sensor element device 119 on its underside.
  • the carrier 120 is sheet-like and much narrower, and it may be made longer to accommodate the sensor elements of the sensor element device 119.
  • the carrier 120 projects beyond the glass ceramic plate 115 laterally a piece.
  • the gap formed thereby to the work surface 112 is closed by the bend 130 in the manner of an angled profile.
  • it could also consist of two parts which are at an angle to each other.
  • the electrical contacting of the sensor element device 119 to the control board 125 is effected here by flexible conductors 127 or an aforementioned flex circuit board or so-called flex connector, in particular in the manner of very thin flat cables or film conductors. This is especially good Fig. 3 to recognize.
  • Fig. 1 to 3 is also to say that the thickness ratios are not drawn to scale, especially not what the thickness of the operating device or the carrier in relation to worktop and glass ceramic plate relates.
  • a support is very flat, for example, with a thickness of about or less than less than 1 millimeter.
  • the arrangement or attachment of the sensor elements on the underside of the carrier should not significantly increase the total thickness. However, this is easily possible with many different sensor elements.
  • Fig. 4 is an example of an operating device 18 according to Fig. 1 a field with a plurality of sensor elements 22 one above the other and shown side by side. These sensor elements 22 are applied in a corresponding manner to the underside of the carrier 20 or of the additional sensor element carrier as sensor element device 19. This in turn may be similar to the bottom of a carrier Fig. 1 or 2 be upset.
  • printed piezo sensors may be different than those of the DE 198 11 372 A1 in which relatively thick and individual piezosensors are provided. Alternatively, it may be capacitive sensor elements, such as those from the EP 950 860 A1 are known.
  • the sensor element device 19 or the underside is covered with a cover film 23. This leaves only the area of the contact pads 24 free for electrical contacting accordingly Fig. 1 , Furthermore, an adhesive layer may be provided under the cover film, so that the sensor element carrier can be easily adhered.
  • a dashed line is shown for a sensor element 22 at the top right as the electrical contact leads from the sensor element to the contact fields 24. From the contact fields can also protrude a longer section with a continuation of the electrical contacts or contact tracks in turn contact fields. This section can then serve as a supply line in a hob and separate parts and other contacts can be saved.
  • Fig. 5 an arrangement 11 is shown in which on a cooktop 13 two different types of arrangements of controls are shown, although in practice usually only one is present.
  • an operating device 18 is on the right side accordingly Fig. 1 provided so laterally to the glass ceramic plate 15 then or partially inserted underneath.
  • Sensor elements are arranged both side by side and one above the other.
  • An alternative operating device 118 is provided at the front. It lies essentially on the glass ceramic plate 15 and is very narrow, but elongated. It is advantageously glued. Here, the sensor elements 22 are only provided side by side. Such an operating device 118 essentially corresponds to the FIGS. 2 and 3 ,
  • Fig. 6 is shown a further possibility, in which a nearly square and relatively large-scale control device 18 connects to the front of the glass ceramic plate 15 and the hob 13.
  • the carrier may be, for example, a thin metal sheet, in particular of stainless steel or aluminum. Furthermore, it can also be made of glass or plastic. At the top, it is possible to provide markings for an operator just above the sensor elements, for example by imprints or engraving or indentations with symbols or the like. It is important in any case that the sensor element device or the carrier as separate at least before sticking or fastening Building unit are formed and possibly also consist of a different material from the hob. Another advantage here is also that in the case of a defect in the sensor element device or operating device, this can be relatively easily replaced as a single part, without having to carry out work on the entire hob.

Abstract

The device has a thin laminar flat material provided as a carrier (20), where the material is different from a stove top plate and forms an operating area for contact switch for operation. Sensor units are provided on a rear side of the carrier, and include a contacting running from the sensor units to contacting devices at the carrier for electrically contacting at an operating device (18) of a stove top (13). Independent claims are also included for the following: (1) a stove top with a control device and sensor device (2) an arrangement of a stove top in a cutout of a worktop.

Description

Anwendungsgebiet und Stand der TechnikField of application and state of the art

Die Erfindung betrifft ein Kochfeld und die Anordnung eines entsprechenden Kochfeldes mit Bedieneinrichtung und Sensorelementvorrichtung in oder an einer Arbeitsplatte.The invention relates to a hob and the arrangement of a corresponding hob with operating device and sensor element device in or on a countertop.

Es ist aus der EP 950 860 A1 bekannt, bei einem Kochfeld die Kochfeldplatte selber an einer Seite derart weit Ć¼ber den Ć¼blichen Rahmen hinauszuziehen, dass die Kochfeldplatte beim Einbau in eine Arbeitsplatte einige Zentimeter Ć¼ber diese Ć¼berragt. In diesem Ć¼berragenden Bereich sind an der Unterseite der Kochfeldplatte Sensorelemente einer Bedieneinrichtung vorgesehen. So kann bei im wesentlichen gleichbleibendem Platzbedarf hinsichtlich des Ausschnittes in der Arbeitsplatte eine VergrĆ¶ĆŸerung der Kochfeldplatte vor allem fĆ¼r eine grĆ¶ĆŸere bzw. groƟflƤchigere Bedieneinrichtung bereitgestellt werden. Des weiteren kann im wesentlichen die gesamte GrĆ¶ĆŸe des Ausschnittes fĆ¼r entsprechend viele oder groƟe Kochstellen genutzt werden. Die seitlich ausgelagerte Bedieneinrichtung wird fĆ¼r eine komfortablere Bedienung auch nicht Ć¼ber seitliche ErwƤrmung der Kochfeldplatte unzulƤssig warm. Allerdings ist der Aufwand vergrĆ¶ĆŸert ausgebildeter Kochfeldplatten, insbesondere wenn sie wie Ć¼blich aus Glaskeramikmaterial bestehen, betrƤchtlich. Des weiteren ist es in der Regel notwendig, an der Kochfeldplatte selber Bedienelemente odgl. anzubringen, was einen groƟen Aufwand darstellt.It is from the EP 950 860 A1 it is known to pull the hob plate itself on one side so far beyond the usual frame in a hob, that the hob plate projects over a few inches above this when installed in a countertop. In this projecting area sensor elements of an operating device are provided on the underside of the hob plate. Thus, with a substantially constant space requirement with regard to the cutout in the worktop, an enlargement of the cooktop panel can be provided, above all, for a larger or larger operating device. Furthermore, essentially the entire size of the cutout can be correspondingly many or large hobs are used. The laterally outsourced control device is not allowed to warm in excessively for a more convenient operation via lateral heating of the hob plate. However, the cost of enlarged trained cooktop panels, especially if they consist as usual of glass ceramic material, considerably. Furthermore, it is usually necessary to the hob plate itself controls or the like. to install, which is a big effort.

Ein weiteres Kochfeld mit Bedieneinrichtung ist in der DE 19811 372 C2 gezeigt.Another hob with control panel is in the DE 19811 372 C2 shown.

Aufgabe und LƶsungTask and solution

Der Erfindung liegt die Aufgabe zugrunde, ein Kochfeld und die Anordnung eines Kochfeldes zu schaffen, mit denen Probleme des Standes der Technik gelƶst werden kƶnnen und es insbesondere mƶglich ist, ein Kochfeld mit einer Kochfeldplatte, einer daran angeordneten Bedienvorrichtung und einer Sensorelementvorrichtung bzw. einer Bedieneinrichtung an dem Kochfeld bei mƶglichst geringem Aufwand und groƟer FlexibilitƤt seitlich bzw. nach auƟen auszulagern bzw. seitlich versetzt zu gestalten.The invention has for its object to provide a hob and the arrangement of a hob, with which problems of the prior art can be solved and it is particularly possible, a hob with a hob plate, an operating device arranged thereon and a sensor element device or an operating device auszubagern on the hob at the lowest possible cost and great flexibility laterally or outwards or to make laterally offset.

Gelƶst wird diese Aufgabe durch ein Kochfeld mit den Merkmalen des Anspruchs 1 sowie eine Anordnung mit den Merkmalen des Anspruchs 11. Vorteilhafte sowie bevorzugte Ausgestaltungen der Erfindung sind Gegenstand der weiteren AnsprĆ¼che und werden im folgenden nƤher erlƤutert. Der Wortlaut der AnsprĆ¼che wird durch ausdrĆ¼ckliche Bezugnahme zum Inhalt der Beschreibung gemacht. Im folgenden werden Merkmale, die fĆ¼r das Kochfeld oder die Anordnung gelten kƶnnen, teilweise nur einmal beschrieben. Sie sollen dennoch unabhƤngig voneinander jeweils fĆ¼r alle Ausbildungen der Erfindung angewendet werden kƶnnen.This object is achieved by a hob with the features of claim 1 and an arrangement with the features of claim 11. Advantageous and preferred embodiments of the invention are the subject of further claims and are explained in more detail below. The wording of the claims is incorporated herein by express reference. In the following, features that may apply to the cooktop or arrangement are described in part only once. Nevertheless, they should be able to be used independently of each other for all embodiments of the invention.

Es ist vorgesehen, dass das hier behandelte Kochfeld in eine Arbeitsplatte bzw. in einen Ausschnitt in einer Arbeitsplatte eingesetzt ist. ErfindungsgemƤƟ ist ein TrƤger als dĆ¼nnes und flƤchiges Flachmaterial vorgesehen, wobei der TrƤger nicht Bestandteil der Kochfeldplatte ist bzw. ein davon separates Teil. Der TrƤger bildet als Teil der Sensorelementvorrichtung eine BedienflƤche mit BerĆ¼hrschaltern, auf die insbesondere ein Finger aufgelegt werden kann zur Bedienung. Dazu sind auf der RĆ¼ckseite des TrƤgers Sensorelemente vorgesehen, welche die vorgenannten BerĆ¼hrschalter bilden. Von jedem Sensorelement verlƤuft eine Kontaktierung zu Kontakteinrichtungen an dem TrƤger. Damit kƶnnen die Sensorelemente bzw. die gesamte Sensorelementvorrichtung an dem TrƤger an die Bedieneinrichtung des Kochfeldes elektrisch angeschlossen werden. Die Sensorelementvorrichtung arbeitet zwar mit der Bedieneinrichtung zusammen und wird zwangslƤufig benƶtigt. Sie muƟ jedoch nicht eine Baueinheit mit dieser bilden, vorteilhaft sind es sogar getrennte Baueinheiten.It is envisaged that the hob treated here is inserted into a worktop or in a cutout in a worktop. According to the invention a carrier is provided as a thin and flat sheet material, wherein the carrier is not part of the cooking field plate or a separate part thereof. As a part of the sensor element device, the carrier forms a control surface with touch switches to which, in particular, a finger can be placed for operation. For this purpose, sensor elements are provided on the back of the carrier, which form the aforementioned contact switch. From each sensor element there is a contact with contact devices on the carrier. Thus, the sensor elements or the entire sensor element device can be electrically connected to the carrier to the operating device of the hob. Although the sensor element device works together with the operating device and is inevitably needed. However, it does not have to form a unit with this, it is advantageous even separate units.

Somit ist es im Rahmen einer Ausbildung der Erfindung mƶglich, dass die Sensorelementvorrichtung bzw. der TrƤger zwar flƤchig sozusagen an die Kochfeldplatte anschlieƟen bzw. deren flƤchige Ausdehnung weiterfĆ¼hren. Dadurch, dass diese Sensorelementvorrichtung bzw. der TrƤger jedoch von der Kochfeldplatte separat ist bzw. eine eigene Baueinheit ist, zumindest bis zur Montage des Kochfeldes, kƶnnen beide Teile einfacher und somit jeweils optimiert hergestellt werden. Des weiteren ist eine weitaus grĆ¶ĆŸere Vielfalt bei Materialwahl, Materialaussehen und Materialdicke des TrƤgers bzw. der Sensorelementvorrichtung mƶglich.
Auch bei einem Defekt an der Sensorelementvorrichtung ist ein Austausch lediglich dieser Sensorelementvorrichtung und somit geringerer Reparaturaufwand mƶglich.
Thus, within the scope of an embodiment of the invention, it is possible for the sensor element device or the carrier to connect, so to speak, flatly to the hob plate or to continue its areal expansion. Due to the fact that this sensor element device or the carrier, however, is separate from the cooktop plate or is a separate structural unit, at least until the assembly of the cooktop, both parts can be made simpler and therefore optimized in each case. Furthermore, a much greater variety in material choice, material appearance and material thickness of the carrier or the sensor element device is possible.
Even with a defect in the sensor element device, an exchange of only this sensor element device and thus less repair effort is possible.

Bildet die Sensorelementvorrichtung nur einen Teil der Bedieneinrichtung, insbesondere den sensorischen Teil, so kann ein modulartiger Aufbau mit grĆ¶ĆŸerer VariabilitƤt geschaffen werden.If the sensor element device forms only a part of the operating device, in particular the sensory part, then a modular structure with greater variability can be created.

GemƤƟ einer Ausgestaltung der Erfindung ist es mƶglich, dass die Sensorelemente auf Druck ansprechen sowie einen dadurch bei der Bedienung erzeugten zumindest kleinen oder minimalen Bedienweg. Dadurch wird zwar nicht ein elektrischer Kontakt des mit der Bedienung gewĆ¼nschten Schaltvorganges geschlossen, aber eine gewisse mechanische Bedienung liegt vor. Beispiele fĆ¼r solche Sensorelemente sind Piezosensoren sowie sogenannte FSR-Sensoren. Solche druckempfindlichen Sensorelemente sind vorteilhaft an der Unterseite des TrƤgers befestigt. Auch diese Sensorelemente werden als BerĆ¼hrschalter verstanden, selbst wenn zu ihrer Bedienung mehr Druck notwendig ist.According to one embodiment of the invention, it is possible that the sensor elements respond to pressure as well as a thereby generated during operation at least small or minimal operating path. Although this does not close the electrical contact of the switching operation desired with the operation, a certain mechanical operation is present. Examples of such sensor elements are piezo sensors as well as so-called FSR sensors. Such pressure-sensitive sensor elements are advantageously attached to the underside of the carrier. These sensor elements are also understood as touch switches, even if more pressure is necessary for their operation.

Vorteilhaft kƶnnen flache und kapazitiv arbeitende Sensorelemente verwendet werden. Diese kapazitiven Sensorelemente kƶnnen als rahmenartige SensorflƤchen oder volle SensorflƤchen an der RĆ¼ckseite bzw. Unterseite des TrƤgers vorgesehen sein, vorteilhaft daran befestigt sein. Alternativ kƶnnen die Sensorelement direkt auf einen zusƤtzlichen Sensorelement-TrƤger aufgebracht werden, der wiederum an dem TrƤger befestigt wird. So ist ein modulartiger Aufbau mit leichterer Fertigung der einzelnen Teile mƶglich.Advantageously, flat and capacitive sensor elements can be used. These capacitive sensor elements may be provided as frame-like sensor surfaces or full sensor surfaces on the back or underside of the carrier, advantageously attached thereto. Alternatively, the sensor elements can be applied directly to an additional sensor element carrier, which in turn is attached to the carrier. So a modular design with easier production of the individual parts is possible.

Es ist vorteilhaft, wenn die Sensorelemente unabhƤngig von ihrer grundsƤtzlichen Funktionsweise relativ dĆ¼nn ausgebildet sind, beispielsweise in etwa 1 mm dĆ¼nn sind. Sie kƶnnen auf den TrƤger oder einen Sensorelement-TrƤger aufgedruckt sein durch Siebdruck oder durch ein Ƥhnliches Verfahren aufgebracht sein. Vorzugsweise sind mehrere oder alle Sensorelemente auf einem einzigen TrƤger oder Sensorelement-TrƤger aufgebracht. Dieser wiederum kann so ausgebildet sein, dass er auf einfache Art und Weise befestigt werden kann, beispielsweise durch eine aufgebrachte Klebeschicht aufgeklebt werden kann.It is advantageous if the sensor elements are formed relatively thin, regardless of their basic operation, for example, in about 1 mm thin. They may be printed on the carrier or on a sensor element carrier by screen printing or by a similar method. Preferably, several or all sensor elements are mounted on a single carrier or sensor element carrier. This in turn can be designed to be simple Can be attached manner, for example, can be glued by an applied adhesive layer.

Die vorgenannten Kontaktierungen kƶnnen bei einer AusfĆ¼hrung der Erfindung nach Art von Leiterbahnen auf die RĆ¼ckseite des TrƤgers aufgebracht werden. Dies bietet sich vor allem dann an, wenn sie direkt und elektrisch kontaktierend mit den Sensorelementen an der TrƤgerrĆ¼ckseite verbunden sind. Diese Kontaktierungen kƶnnen zu Kontaktiereinrichtungen an dem TrƤger laufen, die nach Art von Kontaktfeldern ausgebildet sind. Diese Kontaktfelder liegen vorteilhaft am Randbereich des TrƤgers und dienen zur elektrischen Kontaktierung entweder Ć¼ber AndrĆ¼cken von Kontaktfedern oder Kontaktstiften oder durch Aufbringen von zu den Kontaktfeldern am TrƤger passenden Steckverbindungen. Dies ist jedoch allgemein von beispielsweise der Kontaktierung an Leiterplatten ausreichend bekannt, so dass weitere AusfĆ¼hrungen entfallen kƶnnen. Alternativ kƶnnen auch Lƶtverbindungen zwischen den Kontaktfeldern und der Bedieneinrichtung bzw. dem Kochfeld vorgesehen sein. Bei dieser Art der Kontaktierung ist es von Vorteil, wenn die Sensorelementvorrichtung bzw. der TrƤger samt den Kontaktierungen in das Kochfeld bzw. unter die Kochfeldplatte reicht und somit relativ nahe an die Bedieneinrichtung direkt hinfĆ¼hrt. Der TrƤger kann eine Flex-Leiterplatte sein, die Kontaktbahnen trƤgt. Vorzugsweise sind daran auch die Sensorelemente vorgesehen bzw. darauf aufgebracht. Sind zusƤtzlich noch Kontaktfelder odgl. fĆ¼r angedrĆ¼ckte Kontakte an das Kochfeld vorgesehen, kƶnnen viele Funktionen vorteilhaft in den TrƤger integriert werden. Von einer grĆ¶ĆŸeren FlƤche fĆ¼r die Sensorelemente aus kann ein lƤnglicher Bereich abstehen mit den Kontaktierungen in das Kochfeld hinein.The aforementioned contacts can be applied to the back of the carrier in the manner of printed conductors in one embodiment of the invention. This is especially useful if they are connected directly and electrically contacting with the sensor elements on the back of the carrier. These contacts can run to contacting devices on the carrier, which are designed in the manner of contact fields. These contact pads are advantageously on the edge region of the carrier and are used for electrical contacting either via pressing of contact springs or pins or by applying to the contact pads on the carrier mating connectors. However, this is generally well known from, for example, the contacting of printed circuit boards, so that further embodiments can be omitted. Alternatively, solder joints between the contact fields and the operating device or the hob can be provided. In this type of contacting, it is advantageous if the sensor element device or the carrier together with the contacts in the hob or under the hob plate enough and thus leads relatively close to the control directly. The carrier may be a flex circuit board carrying contact tracks. Preferably, the sensor elements are also provided or applied thereto. Are additional contact fields or the like. provided for pressed contacts to the hob, many functions can be advantageously integrated into the carrier. From a larger area for the sensor elements from an elongated area can protrude with the contacts in the hob inside.

Alternativ ist es mƶglich, die Sensorelementvorrichtung seitlich an oder sogar auf die Kochfeldplatte zu legen bzw. vor allem nicht unter die Kochfeldplatte reichen zu lassen. Hier kƶnnen von der Sensorelementvorrichtung abgehende Kontaktierungen vorgesehen sein, beispielsweise als flache Mehrfachkabel oder mit entsprechenden Leiterbahnen bedruckte, flexible und dĆ¼nne Folien ebenso wie die vorgenannten Flex-Leiterplatten. Auch dies ist dem Fachmann von elektrischen Verbindungen bei Leiterplatten in elektrischen GerƤten ausreichend bekannt.Alternatively, it is possible to place the sensor element device laterally on or even on the cooktop panel or, above all, not to let it pass under the cooktop panel. Here can of the sensor element device outgoing contacts be provided, for example, as a flat multiple cables or printed with corresponding tracks, flexible and thin films as well as the aforementioned flex circuit boards. Again, this is well known to those skilled in electrical connections in printed circuit boards in electrical equipment.

Zur Ausbildung des TrƤgers ist zu sagen, dass er vorteilhaft auf seiner RĆ¼ckseite zumindest bereichsweise elektrisch isoliert ist. Insbesondere gilt dies fĆ¼r die Bereiche, an denen Sensorelemente sowie Kontaktierungen angebracht sind. Insbesondere ist er auf im wesentlichen der gesamten RĆ¼ckseite elektrisch isoliert, beispielsweise durch Beschichtungen oder lsolierfolien. So ist es auch mƶglich, einen metallischen TrƤger zu verwenden, beispielsweise ein dĆ¼nnes Edelstahl- oder Aluminiumblech. Dabei sind auch von ebenen Ausbildungen abweichende Ausgestaltungen mƶglich, beispielsweise profilartig gewƶlbt oder mit Vertiefungen an der Oberseite zur Anlage eines Fingers.To form the carrier is to say that it is advantageous at least partially electrically isolated on its back. In particular, this applies to the areas where sensor elements and contacts are attached. In particular, it is electrically insulated on essentially the entire backside, for example by means of coatings or insulating films. So it is also possible to use a metallic carrier, for example, a thin stainless steel or aluminum sheet. In this case, deviating embodiments are also possible from planar formations, for example arched profile-like or with depressions on the upper side to rest a finger.

Alternativ zu einem TrƤger aus Metall kann er aus elektrisch isolierendem Material gefertigt sein. Hierzu eignet sich sowohl Material, das Ƥhnlich wie Glaskeramik ist, also mechanisch sehr widerstandsfƤhig. Alternativ kƶnnen sonstige GlƤser oder auch Kunststoffe verwendet werden. Durch zumindest bereichsweise lichtdurchlƤssige TrƤger kƶnnen sowohl interessante optische Gestaltungen geschaffen werden als auch Anzeigen darunter angeordnet werden.As an alternative to a carrier made of metal, it can be made of electrically insulating material. For this purpose, both material is similar to glass ceramic, so mechanically very resistant. Alternatively, other glasses or plastics can be used. By at least partially translucent support both interesting optical designs can be created as well as displays are arranged underneath.

Des weiteren kann der TrƤger so ausgebildet sein, insbesondere wenn er unter die Kochfeldplatte geschoben ist, dass er sehr flach ist, insbesondere im Vergleich auch zu der Kochfeldplatte. So kann ein TrƤger bzw. die gesamte Sensorelementvorrichtung beispielsweise mit einer Dicke von 1 mm vorgesehen sein, also beispielsweise ein Blech sein. Er hebt sich also somit deutlich von der Dicke der Kochfeldplatte ab und steht gleichzeitig ein StĆ¼ck Ć¼ber die Arbeitsplatte Ć¼ber. Mƶglich ist auch ein bĆ¼ndiges Einlassen in die Arbeitsplatte. GemƤƟ einer weiteren AusfĆ¼hrung kann die Sensorelementvorrichtung auf einen Randbereich der Kochfeldplatte selber aufgelegt werden. Dabei ist sie insbesondere eine Art lƤnglicher Streifen. Mit einem vom Randbereich abgewinkelt abstehenden Abschnitt Ć¼bergreift sie die AuƟenkante der Kochfeldplatte, wobei vorzugsweise der Ć¼bergreifende Abschnitt bis auf eine darunter liegende Arbeitsplatte reichen und so die Kochfeldplatte seitlich vollstƤndig abdecken kann. Ein solcher TrƤger kann eine Art einteiliges Winkelprofil sein, insbesondere ein Winkelblech. So kann zum einen ein hinsichtlich Verschmutzungen gĆ¼nstiger und optisch sauberer seitlicher Abschluss entstehen. Des weiteren kƶnnen darunter die vorgenannten Kontaktierungen verlaufen und sind somit ebenfalls nicht sichtbar sowie gegen BeschƤdigung geschĆ¼tzt.Furthermore, the carrier may be formed, in particular when it is pushed under the hob plate, that it is very shallow, especially in comparison to the hob plate. Thus, a carrier or the entire sensor element device may for example be provided with a thickness of 1 mm, so for example be a sheet. Thus, it stands out clearly from the thickness of the hob plate and is at the same time a piece on the worktop over. It is also possible a flush in the worktop. According to a further embodiment, the sensor element device can be placed on an edge region of the hob plate itself. In particular, it is a kind of elongated strip. With a protruding from the edge region protruding portion it overlaps the outer edge of the hob plate, wherein preferably the cross-section extend to an underlying worktop and so can cover the hob completely laterally. Such a carrier may be a kind of one-piece angle profile, in particular an angle plate. Thus, on the one hand, a pollution-prone and visually clean lateral seal can be created. Furthermore, including the aforementioned contacts can run underneath and are therefore also not visible and protected against damage.

Bei der vorbeschriebenen AusfĆ¼hrung mit einer Sensorelementvorrichtung, die auf die Kochfeldplatte aufgesetzt ist, kann es vorgesehen sein, dass die Sensorelemente letztendlich im Randbereich der Kochfeldplatte liegen bzw. in einem Bereich oberhalb der Arbeitsplatte und nicht mehr oberhalb des Ausschnittes in der Arbeitsplatte. So kƶnnen die Sensorelemente insbesondere an einem Bereich des Kochfeldes vorgesehen sein, an dem die ErwƤrmung wƤhrend des Betriebes relativ gering ist. Dabei kann auch vorgesehen sein, die Sensorelementvorrichtung bzw. den TrƤger auf der Kochfeldplatte durch Verkleben zu befestigen. Alternativ kann bei einem Aufliegen der Sensorelementvorrichtung bzw. des TrƤgers auf der Arbeitsplatte auch hier eine Verklebung vorgesehen sein.In the above-described embodiment with a sensor element device which is placed on the hob plate, it may be provided that the sensor elements ultimately lie in the edge region of the hob plate or in an area above the worktop and not above the cut in the worktop. Thus, the sensor elements may be provided, in particular, at a region of the hob where the heating during operation is relatively low. It can also be provided to fasten the sensor element device or the carrier on the hob plate by gluing. Alternatively, in the case of a resting of the sensor element device or of the carrier on the worktop, an adhesive bond may also be provided here.

Ein seitlicher Anschluss der Sensorelementvorrichtung an die Ć¼ber den Ausschnitt in der Arbeitsplatte Ć¼berragende und zumindest streifenartig auf der Arbeitsplatte aufliegende Kochfeldplatte weist den Vorteil auf, dass die Sensorelementvorrichtung als voll dem Kochfeld zugehƶrig erscheint. Das Fehlen von ƜbergƤngen bzw. AbsƤtzen bei gleicher Dicke erleichtert ein Reinigen der OberflƤchen.A lateral connection of the sensor element device to the cooking field plate projecting beyond the cutout in the worktop and resting at least in strips on the worktop has the advantage that the sensor element device appears to be fully associated with the hob. The absence of transitions or equal thicknesses facilitates cleaning of the surfaces.

Diese und weitere Merkmale gehen auƟer aus den AnsprĆ¼chen auch aus der Beschreibung und den Zeichnungen hervor, wobei die einzelnen Merkmale jeweils fĆ¼r sich allein oder zu mehreren in Form von Unterkombinationen bei einer AusfĆ¼hrungsform der Erfindung und auf anderen Gebieten verwirklicht sein und vorteilhafte sowie fĆ¼r sich schutzfƤhige AusfĆ¼hrungen darstellen kƶnnen, fĆ¼r die hier Schutz beansprucht wird. Die Unterteilung der Anmeldung in einzelne Abschnitte sowie Zwischen-Ɯberschriften beschrƤnken die unter diesen gemachten Aussagen nicht in ihrer AllgemeingĆ¼ltigkeit.These and other features will become apparent from the claims but also from the description and drawings, wherein the individual features each alone or more in the form of sub-combinations in an embodiment of the invention and in other fields be realized and advantageous and protectable Represent embodiments for which protection is claimed here. The subdivision of the application into individual sections as well as intermediate headings does not restrict the general validity of the statements made thereunder.

Kurzbeschreibung der ZeichnungenBrief description of the drawings

AusfĆ¼hrungsbeispiele der Erfindung sind in den Zeichnungen schematisch dargestellt und werden im folgenden nƤher erlƤutert. In den Zeichnungen zeigt:

Fig. 1
eine seitliche Schnittdarstellung einer Anordnung eines Kochfeldes in einer Arbeitsplatte mit zwischen Kochfeldplatte und Arbeitsplatte eingeschobener Bedieneinrichtung,
Fig. 2
eine Anordnung Ƥhnlich Fig. 1, wobei die Bedieneinrichtung auf der Kochfeldplatte aufliegt,
Fig. 3
eine VergrĆ¶ĆŸerung der Darstellung aus Fig. 2,
Fig. 4
eine Ansicht der Bedieneinrichtung nach Fig. 1 von unten und
Fig. 5 und 6
verschiedene Anordnungen einer Bedieneinrichtung an einem Kochfeld entsprechend den Fig. 1 und 2.
Embodiments of the invention are shown schematically in the drawings and will be explained in more detail below. In the drawings shows:
Fig. 1
a side sectional view of an arrangement of a hob in a worktop with inserted between cooktop plate and worktop control device,
Fig. 2
an arrangement similar Fig. 1 , wherein the operating device rests on the hob plate,
Fig. 3
an enlargement of the representation Fig. 2 .
Fig. 4
a view of the control device after Fig. 1 from below and
FIGS. 5 and 6
various arrangements of a control device on a hob according to the Fig. 1 and 2 ,

Detaillierte Beschreibung der AusfĆ¼hrungsbeispieleDetailed description of the embodiments

In Fig. 1 ist eine Anordnung 11 dargestellt, bei der in einen entsprechenden Ausschnitt einer Arbeitsplatte 12 ein Kochfeld 13 eingesetzt ist auf an sich bekannte Art und Weise. Dabei Ć¼berlappt eine Kochfeldplatte bzw. Glaskeramikplatte 15 umlaufend die Arbeitsplatte 12 ein StĆ¼ck und liegt Ć¼blicherweise auf ihr auf.In Fig. 1 an arrangement 11 is shown in which in a corresponding section of a worktop 12, a hob 13 is inserted in a known per se manner. In this case, a hob plate or glass ceramic plate 15 circumferentially overlaps the worktop 12 a piece and is usually on her.

Das Kochfeld 13 weist an der Unterseite der Glaskeramikplatte 15 noch ein SteuergehƤuse 16 auf. In diesem ist, worauf noch nƤher eingegangen wird, vor allem eine Steuerung bzw. Leistungsversorgung des Kochfeldes 13 enthalten. Es kƶnnen auch Teile der Bedieneinrichtung vorgesehen sein, insbesondere Auswerte- und Steuerelektronik, die nicht an der Sensorelementvorrichtung vorgesehen sind.The hob 13 has on the underside of the glass ceramic plate 15 still a control housing 16. In this is what will be discussed in more detail, especially a control or power supply of the hob 13 included. It is also possible to provide parts of the operating device, in particular evaluation and control electronics, which are not provided on the sensor element device.

Zumindest an der dargestellten Stelle ist ein gewisser Spalt zwischen Oberseite der Arbeitsplatte 12 und der Glaskeramikplatte 15 gegeben. Er kann auch in oder durch eine umlaufende elastische Dichtung unter dem Rand des Kochfeldes gebildet sein. In diesen Spalt ist, auf der Oberseite der Arbeitsplatte 12 aufliegend, eine Bedieneinrichtung 18 mit einer Sensorelementvorrichtung 19 eingeschoben. Im wesentlichen besteht sie aus einem flachen TrƤger 20, auf den nachfolgend jedoch noch nƤher eingegangen wird. Insbesondere ist es eine Bedieneinrichtung 18 bzw. Sensorelementvorrichtung 19 gemƤƟ Fig. 4, wobei an der Unterseite des TrƤgers 20 die Sensorelemente 22 in verschiedener Form vorgesehen sein kƶnnen. Die elektrische Kontaktierung an die Sensorelemente 22 erfolgt Ć¼ber Kontaktfelder 24, welche nach unten weisen. Im eingeschobenen Zustand gemƤƟ Fig. 1 kommen diese Kontaktfelder 24 in Kontakt mit Federkontakten 27 auf einer Steuerplatine 25 in dem SteuergehƤuse 16. Auf der Steuerplatine 25 befinden sich Steuereinrichtungen des Kochfeldes 13, insbesondere Mikrocontroller und eventuell eine Signalauswertung bzw. -verarbeitung. So erfolgt der elektrische Anschluss der Bedieneinrichtung 18 bzw. Sensorelementvorrichtung 19 an die Steuerplatine 25.At least at the position shown, a certain gap between top of the worktop 12 and the glass ceramic plate 15 is given. It can also be formed in or by a circumferential elastic seal under the edge of the hob. In this gap, resting on the top of the worktop 12, an operating device 18 with a sensor element device 19 is inserted. In essence, it consists of a flat support 20, which will be discussed in more detail below. In particular, it is an operating device 18 or sensor element device 19 according to FIG Fig. 4 , wherein on the underside of the carrier 20, the sensor elements 22 may be provided in various forms. The electrical contact to the sensor elements 22 via contact fields 24, which point downwards. In the inserted state according to Fig. 1 These contact pads 24 come into contact with spring contacts 27 on a control board 25 in the control housing 16. On the control board 25 are control devices of the hob 13, in particular microcontroller and possibly a signal evaluation or processing. This is how the electrical connection is made the control device 18 or sensor element device 19 to the control board 25th

In dem SteuergehƤuse 16 ist unter anderem die Steuerplatine 25 angeordnet. Sie trƤgt auch Anzeigen 26, um BetriebszustƤnde oder sonstige Informationen durch die Glaskeramikplatte 15 nach oben anzuzeigen.In the control housing 16, among other things, the control board 25 is arranged. It also carries displays 26 to indicate operating conditions or other information through the glass ceramic plate 15 upwards.

Der TrƤger 20 gemƤƟ Fig. 1 kann bei einer AusfĆ¼hrung der Erfindung auf der Arbeitsplatte 12 unlƶsbar fixiert werden, beispielsweise durch Verkleben. Alternativ kann er lƶsbar befestigt sein, beispielsweise durch Verschrauben. Des weiteren kann er entweder auf der ansonsten ebenen Arbeitsplatte 12 aufliegen und somit nach oben Ć¼berstehen. Damit bildet sich eine Art Abstufung des Ɯbergangs von der Oberseite der Arbeitsplatte 12 bis zu der Glaskeramikplatte 15. An den sonstigen Bereichen der Auflage der Glaskeramikplatte 15 auf der Oberseite der Arbeitsplatte 12 kƶnnen Distanzelemente mit der Dicke des TrƤgers 20 vorgesehen sein fĆ¼r eine gleichmƤƟige Auflage. Alternativ kann eine der Dicke des TrƤgers 20 entsprechende flƤchige Vertiefung in der Arbeitsplatte 12 vorgesehen sein.The carrier 20 according to Fig. 1 can be permanently fixed in an embodiment of the invention on the countertop 12, for example by gluing. Alternatively, it can be releasably secured, for example by screwing. Furthermore, it can either rest on the otherwise flat worktop 12 and thus survive upwards. This forms a kind of gradation of the transition from the top of the worktop 12 to the glass ceramic plate 15. At the other areas of the support of the glass ceramic plate 15 on the top of the worktop 12 spacers can be provided with the thickness of the support 20 for a uniform support. Alternatively, one of the thickness of the carrier 20 corresponding flat depression in the worktop 12 may be provided.

Entsprechend einer weiteren Alternative kann der TrƤger 20 auch in gewisser Weise abgestuft bzw. mit abgestufter Dicke ausgebildet sein, so dass er mit einem dĆ¼nnen Bereich unter die Glaskeramikplatte 15 reicht und im Ć¼brigen jedoch mit grĆ¶ĆŸerer Dicke, beispielsweise entsprechend der Glaskeramikplatte 15, deren Verlauf fortsetzt. Es ist bei einer derartigen Lƶsung auch mƶglich, im Bereich der Sensorelementvorrichtung bzw. ihrer elektrischen Kontaktierung an die Steuerplatine den Ausschnitt in der Arbeitsplatte 12 vergrĆ¶ĆŸert auszufĆ¼hren, insbesondere Ć¼ber den Rand der Glaskeramikplatte 15 hinaus. Diese VergrĆ¶ĆŸerung des Ausschnittes wird anschlieƟend durch die Bedieneinrichtung wiederum verdeckt, wobei durch den erheblich vergrĆ¶ĆŸerten Spalt auf einfache Art und Weise Kabel odgl. zum elektrischen Anschluss der Bedieneinrichtung an die Steuerplatine gefĆ¼hrt sein kƶnnen.According to a further alternative, the carrier 20 may also be graduated in a certain way or be formed with stepped thickness, so that it extends with a thin area under the glass ceramic plate 15 and the rest, however, with a greater thickness, for example according to the glass ceramic plate 15, the course continues , It is also possible with such a solution, in the area of the sensor element device or its electrical contact with the control board, to make the cutout in the work surface 12 larger, in particular beyond the edge of the glass ceramic plate 15. This enlargement of the cutout is subsequently concealed by the operating device again, whereby the considerably enlarged gap allows a simple way of doing so and way cable or the like. can be performed for electrical connection of the control device to the control board.

Bei einer alternativen Anordnung 111 gemƤƟ Fig. 2 und 3 befindet sich das Kochfeld 113 wiederum in einem Ausschnitt in einer Arbeitsplatte 112. Hier allerdings liegt die Glaskeramikplatte 115 mehr oder weniger direkt auf der OberflƤche der Arbeitsplatte 112 auf bzw. es ist lediglich ein sehr geringer Spalt gegeben. Im Randbereich der Glaskeramikplatte 115 ist die Bedieneinrichtung 118 mit einem TrƤger 120 fĆ¼r die Sensorelementvorrichtung 119 an seiner Unterseite aufgebracht bzw. aufgeklebt. Im Vergleich zu Fig. 1 ist der TrƤger 120 blechartig und sehr viel schmaler, wobei er entsprechend lƤnger ausgebildet sein kann zur Unterbringung der Sensorelemente der Sensorelementvorrichtung 119.In an alternative arrangement 111 according to FIGS. 2 and 3 is the hob 113 in turn in a section in a worktop 112. Here, however, the glass ceramic plate 115 is more or less directly on the surface of the work surface 112 or there is only a very small gap. In the edge region of the glass ceramic plate 115, the operating device 118 is applied or glued to a support 120 for the sensor element device 119 on its underside. Compared to Fig. 1 For example, the carrier 120 is sheet-like and much narrower, and it may be made longer to accommodate the sensor elements of the sensor element device 119.

Der TrƤger 120 Ć¼berragt die Glaskeramikplatte 115 seitlich ein StĆ¼ck. Der dadurch gebildete Spalt zur Arbeitsplatte 112 hin wird durch die Abwinkelung 130 nach Art eines winkligen Profils geschlossen. Alternativ kƶnnte er auch aus zwei Teilen bestehen, die in einem Winkel zueinander stehen.The carrier 120 projects beyond the glass ceramic plate 115 laterally a piece. The gap formed thereby to the work surface 112 is closed by the bend 130 in the manner of an angled profile. Alternatively, it could also consist of two parts which are at an angle to each other.

Die elektrische Kontaktierung der Sensorelementvorrichtung 119 an die Steuerplatine 125 erfolgt hier durch flexible Leiter 127 bzw. eine vorgenannte Flex-Leiterplatte oder sogenannte Flex-Verbinder, insbesondere nach Art von sehr dĆ¼nnen Flachkabeln oder Folienleitern. Dies ist besonders gut aus Fig. 3 zu erkennen.The electrical contacting of the sensor element device 119 to the control board 125 is effected here by flexible conductors 127 or an aforementioned flex circuit board or so-called flex connector, in particular in the manner of very thin flat cables or film conductors. This is especially good Fig. 3 to recognize.

Es ist auch in Fig. 3 zu erkennen, dass hier Ć¼ber die Breite des TrƤgers 120 nur ein einziges Sensorelement 122 vorgesehen ist. DafĆ¼r sind mehrere Sensorelemente nebeneinander vorgesehen, wie anhand von Fig. 5 noch nƤher erlƤutert wird.It is also in Fig. 3 to recognize that here only a single sensor element 122 is provided over the width of the carrier 120. For several sensor elements are provided side by side, as based on Fig. 5 will be explained in more detail.

BezĆ¼glich der Fig. 1 bis 3 ist auch noch zu sagen, dass die DickenverhƤltnisse nicht maƟstabsgetreu dargestellt sind, insbesondere nicht was die Dicke der Bedieneinrichtung bzw. des TrƤgers im VerhƤltnis zu Arbeitsplatte und Glaskeramikplatte betrifft. Insbesondere ist ein solcher TrƤger sehr flach, beispielsweise mit einer Dicke von etwa oder weniger als weniger als 1 Millimeter. Auch die Anordnung bzw. Anbringung der Sensorelemente an der Unterseite des TrƤgers sollte die gesamte Dicke nicht wesentlich erhƶhen. Dies ist jedoch bei vielen verschiedenen Sensorelementen problemlos mƶglich.Regarding the Fig. 1 to 3 is also to say that the thickness ratios are not drawn to scale, especially not what the thickness of the operating device or the carrier in relation to worktop and glass ceramic plate relates. In particular, such a support is very flat, for example, with a thickness of about or less than less than 1 millimeter. The arrangement or attachment of the sensor elements on the underside of the carrier should not significantly increase the total thickness. However, this is easily possible with many different sensor elements.

In Fig. 4 ist beispielhaft an einer Bedieneinrichtung 18 gemƤƟ Fig. 1 ein Feld mit mehreren Sensorelementen 22 Ć¼bereinander und nebeneinander dargestellt. Diese Sensorelemente 22 sind auf entsprechende Art und Weise an die Unterseite des TrƤgers 20 bzw. des zusƤtzlichen Sensorelement-TrƤgers als Sensorelementvorrichtung 19 aufgebracht. Diese kann wiederum an der Unterseite eines TrƤgers Ƥhnlich Fig. 1 oder 2 aufgebracht sein. Beispielsweise kƶnnen es aufgedruckte Piezosensoren sein anders als bei der DE 198 11 372 A1 , bei der relativ dicke und einzelne Piezosensoren vorgesehen sind. Alternativ kƶnnen es kapazitiv arbeitende Sensorelemente sein, wie sie beispielsweise aus der EP 950 860 A1 bekannt sind.In Fig. 4 is an example of an operating device 18 according to Fig. 1 a field with a plurality of sensor elements 22 one above the other and shown side by side. These sensor elements 22 are applied in a corresponding manner to the underside of the carrier 20 or of the additional sensor element carrier as sensor element device 19. This in turn may be similar to the bottom of a carrier Fig. 1 or 2 be upset. For example, printed piezo sensors may be different than those of the DE 198 11 372 A1 in which relatively thick and individual piezosensors are provided. Alternatively, it may be capacitive sensor elements, such as those from the EP 950 860 A1 are known.

Des weiteren ist die Sensorelementvorrichtung 19 bzw. die Unterseite mit einer Abdeckfolie 23 abgedeckt. Diese lƤsst lediglich den Bereich der Kontaktfelder 24 frei zur elektrischen Kontaktierung entsprechend Fig. 1. Des weiteren kann unter der Abdeckfolie eine Klebeschicht vorgesehen sein, damit der Sensorelement-TrƤger einfach aufgeklebt werden kann. Dabei ist fĆ¼r ein Sensorelement 22 rechts oben beispielhaft gestrichelt dargestellt, wie die elektrische Kontaktierung von dem Sensorelement zu den Kontaktfeldern 24 fĆ¼hrt. Von den Kontaktfeldern kann auch ein lƤngerer Abschnitt abstehen mit einer WeiterfĆ¼hrung der elektrischen Kontaktierungen bzw. Kontaktbahnen zu wiederum Kontaktfeldern. Dieser Abschnitt kann dann als Zuleitung in ein Kochfeld dienen und separate Teile sowie weitere Kontaktierungen kƶnnen eingespart werden.Furthermore, the sensor element device 19 or the underside is covered with a cover film 23. This leaves only the area of the contact pads 24 free for electrical contacting accordingly Fig. 1 , Furthermore, an adhesive layer may be provided under the cover film, so that the sensor element carrier can be easily adhered. In this case, a dashed line is shown for a sensor element 22 at the top right as the electrical contact leads from the sensor element to the contact fields 24. From the contact fields can also protrude a longer section with a continuation of the electrical contacts or contact tracks in turn contact fields. This section can then serve as a supply line in a hob and separate parts and other contacts can be saved.

In Fig. 5 ist eine Anordnung 11 dargestellt, bei der an einem Kochfeld 13 zwei verschiedene Arten von Anordnungen von Bedieneinrichtungen dargestellt sind, obwohl in der Praxis Ć¼blicherweise nur eine vorhanden ist. Einmal ist an der rechten Seite eine Bedieneinrichtung 18 entsprechend Fig. 1 vorgesehen, also seitlich an die Glaskeramikplatte 15 anschlieƟend bzw. zum Teil daruntergesteckt. Sensorelemente sind dabei sowohl nebeneinander als auch Ć¼bereinander angeordnet.In Fig. 5 an arrangement 11 is shown in which on a cooktop 13 two different types of arrangements of controls are shown, although in practice usually only one is present. Once an operating device 18 is on the right side accordingly Fig. 1 provided so laterally to the glass ceramic plate 15 then or partially inserted underneath. Sensor elements are arranged both side by side and one above the other.

Eine alternative Bedieneinrichtung 118 ist an der Vorderseite vorgesehen. Sie liegt im wesentlichen auf der Glaskeramikplatte 15 auf und ist sehr schmal, dafĆ¼r langgestreckt. Sie ist vorteilhaft aufgeklebt. Hier sind die Sensorelemente 22 lediglich nebeneinander vorgesehen. Eine solche Bedieneinrichtung 118 entspricht im wesentlichen den Fig. 2 und 3.An alternative operating device 118 is provided at the front. It lies essentially on the glass ceramic plate 15 and is very narrow, but elongated. It is advantageously glued. Here, the sensor elements 22 are only provided side by side. Such an operating device 118 essentially corresponds to the FIGS. 2 and 3 ,

In Fig. 6 ist eine weitere Mƶglichkeit dargestellt, bei der eine nahezu quadratische und relativ groƟflƤchige Bedieneinrichtung 18 an die Vorderseite der Glaskeramikplatte 15 bzw. des Kochfeldes 13 anschlieƟt.In Fig. 6 is shown a further possibility, in which a nearly square and relatively large-scale control device 18 connects to the front of the glass ceramic plate 15 and the hob 13.

In weiterer Ausgestaltung der Erfindung ist es noch mƶglich, bei auf der Glaskeramikplatte aufliegenden Bedieneinrichtungen bzw. TrƤgern diese zumindest bereichsweise lichtdurchlƤssig oder durchsichtig auszugestalten. Somit kann durch darunter bzw. unter der Glaskeramikplatte angeordnete Anzeigeelemente odgl. durch die Bedieneinrichtung hindurch eine Anzeige erfolgen. Somit kann der Anschein erweckt werden, selbst eine sehr dĆ¼nne Bedieneinrichtung, beispielsweise Ƥhnlich Fig. 2, wĆ¼rde eine Anzeige beinhalten.In a further embodiment of the invention, it is still possible, at least partially opaque or transparent to design in resting on the glass ceramic panels controls or carriers. Thus, by means of or below the glass ceramic plate arranged display elements or the like. through the operating device through a display. Thus, the appearance can be awakened, even a very thin operating device, for example similar Fig. 2 , would include an ad.

Der TrƤger kann beispielsweise ein dĆ¼nnes Metallblech sein, insbesondere aus Edelstahl oder Aluminium. Des weiteren kann er jedoch auch aus Glas oder Kunststoff bestehen. An der Oberseite ist es mƶglich, genau Ć¼ber den Sensorelementen Markierungen fĆ¼r eine Bedienperson vorzusehen, beispielsweise durch Aufdrucke oder Eingravieren oder Vertiefungen mit Symbolen odgl.. Bedeutsam ist auf alle FƤlle, dass die Sensorelementvorrichtung bzw. der TrƤger als zumindest vor einem Festkleben oder Befestigen separate Baueinheit ausgebildet sind und eventuell auch aus einem von dem Kochfeld unterschiedlichen Material bestehen. Ein weiterer Vorteil liegt hier auch darin, dass bei einem Defekt an der Sensorelementvorrichtung bzw. Bedieneinrichtung diese als Einzelteil relativ leicht ausgetauscht werden kann, ohne an dem gesamten Kochfeld Arbeiten durchfĆ¼hren zu mĆ¼ssen.The carrier may be, for example, a thin metal sheet, in particular of stainless steel or aluminum. Furthermore, it can also be made of glass or plastic. At the top, it is possible to provide markings for an operator just above the sensor elements, for example by imprints or engraving or indentations with symbols or the like. It is important in any case that the sensor element device or the carrier as separate at least before sticking or fastening Building unit are formed and possibly also consist of a different material from the hob. Another advantage here is also that in the case of a defect in the sensor element device or operating device, this can be relatively easily replaced as a single part, without having to carry out work on the entire hob.

Claims (18)

  1. Cooking hob (13, 113) having a cooking hob plate (15, 115), an operating device (18, 118) arranged thereon and a sensor element device (19, 119) for the operating device (18, 118), where the cooking hob is inserted in the operating state into a work surface (12, 112) or into a recess of a work surface, characterized in that the sensor element device has a support (20, 120) from a thin and flat material forming a control surface and having sensor elements which form touch switches for operating the cooking hob, where the sensor elements (22, 122) are provided on an underside of the support and where a contact passes from each sensor element to contact devices (24) on the support (20, 120) for electrical contact (27, 127) to the operating device (18, 118).
  2. Cooking hob according to Claim 1, characterized in that the sensor elements (22, 122) are designed such that they react when pressed during operation with at least a short operating travel, where the sensor elements are in particular piezosensors.
  3. Cooking hob according to Claim 1, characterized in that the sensor elements (22, 122) are capacitively operating sensor elements which in particular are provided as frames or surfaces on the underside of the support (20, 120) or of an additional sensor element support (19).
  4. Cooking hob according to one of the preceding claims, characterized in that the sensor elements (22, 122) are thin and pressed onto the support (20, 120) or onto an additional sensor element support (19), preferably several or all sensor elements onto a single support.
  5. Cooking hob according to one of the preceding claims, characterized in that the contacts are applied in the form of printed conductors to the rear of the support (20, 120) or of a sensor element support (19) and pass to contact panels (24) as contact devices which are arranged in particular in the edge area of the support (20, 120) and at a distance from the sensor elements.
  6. Cooking hob according to one of the preceding claims, characterized in that the support (20, 120) or an additional sensor element support (19) on its rear is electrically insulated at least in some areas, where it is preferably made of metal and an insulating layer or insulating film (23) is applied to the rear.
  7. Cooking hob according to one of Claims 1 to 5, characterized in that the support (20, 120) or an additional sensor element support (19) is made from an electrically insulating material.
  8. Cooking hob according to one of the preceding claims, characterized in that the support (20, 120) is translucent at least in some areas, preferably substantially over a large area.
  9. Cooking hob according to one of the preceding claims, characterized in that the support (20, 120) is flat and smooth, in particular with a thickness in the range of a few mm, preferably less than 1 mm.
  10. Cooking hob according to one of Claims 1 to 8, characterized in that an angled section (130) projects from the flat and smooth support (120) at an edge area, corresponding to a projection of the cooking hob plate (115) of the cooking hob (113) beyond the work surface (112) in the installed state, where the support (120) is preferably an angled section.
  11. Arrangement (11, 111) of a cooking hob (13, 113) according to one of the preceding claims inside a recess in a work surface (12, 112).
  12. Arrangement according to Claim 11, characterized in that the sensor element device (19, 119) is a component generally separate from the cooking hob (13, 113) or from the cooking hob plate (15, 115) and in particular the sensor elements (22, 122) of the sensor element device run laterally outside the recess above the surface of the work surface (12, 112).
  13. Arrangement according to Claim 11 or 12, characterized in that the cooking hob plate (15) runs so far above the work surface (12) with a cavity that the support (20) of the sensor element device (19) is inserted into the cavity, where the support is preferably inserted so far into the cavity that the contact devices (24) reach corresponding counter-contact devices (27) in the cooking hob for electrical connection of the sensor element device (19) to an operating device (18) or cooking hob control.
  14. Arrangement according to one of Claims 11 to 13, characterized in that the sensor element device (19) or the support (20) is fastened on the work surface (12), in particular affixed.
  15. Arrangement according to one of Claims 11 to 14, characterized in that the cooking hob plate (15, 115) projects laterally slightly beyond the recess in the work surface (12, 112) and substantially rests directly on the upper side of the work surface, where the sensor element device (19) preferably laterally adjoins the cooking hob plate (15), in particular substantially without a change in thickness.
  16. Arrangement according to one of Claims 11 to 14, characterized in that the sensor element device (119) substantially rests on the edge area of the cooking hob plate (115), where the sensor element device preferably grips round the projecting lateral edge of the cooking hob plate and extends down to the work surface (112), thus covering the lateral outer edge of the cooking hob plate.
  17. Arrangement according to Claim 16, characterized in that the electrical contact device (127) has cables or multiple conductors in printed-on form with foil carrier that are passed around the cooking hob plate (115) and between cooking hob plate and work surface (112) to a cooking hob control as a connection of the sensor element device (119) to the cooking hob control.
  18. Arrangement according to one of Claims 11 to 17, characterized in that the support (20, 120) is thinner than the cooking hob plate (15, 115), preferably substantially thinner, in particular thinner than 1 mm, where it is preferably a metal sheet.
EP06010577A 2005-06-06 2006-05-23 Cooking hob with operating device Not-in-force EP1731841B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102005027192A DE102005027192A1 (en) 2005-06-06 2005-06-06 Sensor device for operating device of stove top, has laminar flat material provided as carrier, and sensor units provided on rear side of carrier and including contacting for electrically contacting at operating device

Publications (2)

Publication Number Publication Date
EP1731841A1 EP1731841A1 (en) 2006-12-13
EP1731841B1 true EP1731841B1 (en) 2010-11-24

Family

ID=37025224

Family Applications (1)

Application Number Title Priority Date Filing Date
EP06010577A Not-in-force EP1731841B1 (en) 2005-06-06 2006-05-23 Cooking hob with operating device

Country Status (4)

Country Link
EP (1) EP1731841B1 (en)
AT (1) ATE489585T1 (en)
DE (2) DE102005027192A1 (en)
ES (1) ES2357040T3 (en)

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DE102006002408A1 (en) * 2006-01-18 2007-07-19 BSH Bosch und Siemens HausgerƤte GmbH hob
DE102007016466B3 (en) * 2007-03-16 2008-08-21 E.G.O. Elektro-GerƤtebau GmbH Operating device for use in hob, has sensor unit e.g. hall-sensor and optical distance sensor, laterally arranged in movement section of signal unit, where operating device is formed without internal energy supply
EP1985930B1 (en) * 2007-04-24 2009-10-21 Electrolux Home Products Corporation N.V. Control panel for an appliance, especially for a domestic appliance
DE102008011659A1 (en) 2008-02-28 2009-09-03 BSH Bosch und Siemens HausgerƤte GmbH hob
DE102008033369A1 (en) 2008-07-08 2010-01-14 E.G.O. Elektro-GerƤtebau GmbH Operating device for an electrical appliance and evaluation method for this operating device
FR2939496B1 (en) * 2008-12-08 2012-10-12 Fagorbrandt Sas ASSEMBLY FORMED BY AN INTEGRATED COOKTOP AND WORKTOP COMPRISING AT LEAST ONE LIGHTING DEVICE
EP2392859B1 (en) * 2010-05-05 2017-03-29 Electrolux Home Products Corporation N.V. Cooktop-interface, cooktop-panel, cooking device and method of operating a cooktop-interface
DE102010043299A1 (en) * 2010-11-03 2012-05-03 E.G.O. Elektro-GerƤtebau GmbH Operating device for an electrical appliance and method for producing such an operating device
ES2929925T3 (en) * 2012-07-23 2022-12-02 Bsh Hausgeraete Gmbh cooking field device
WO2016086963A1 (en) * 2014-12-02 2016-06-09 Arcelik Anonim Sirketi Auxiliary control plate for use with a cooking appliance
DE102015101844A1 (en) * 2015-02-10 2016-08-11 Miele & Cie. Kg Hob and method for operating a hob
DE102020213811A1 (en) 2020-11-03 2022-01-20 E.G.O. Elektro-GerƤtebau GmbH Arrangement of a hob on a worktop

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DE29515421U1 (en) * 1995-09-27 1996-10-24 Aeg Hausgeraete Gmbh Built-in hob with a glass ceramic hob
DE19811372C2 (en) * 1998-03-16 2000-05-18 Bsh Bosch Siemens Hausgeraete Household appliance with an operating unit with a piezo sensor
DE19817195C1 (en) * 1998-04-17 1999-09-09 Bosch Siemens Hausgeraete Ceramic cooking hob with touch-control operation
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DE19959224B4 (en) * 1999-12-08 2010-07-01 E.G.O. Elektro-GerƤtebau GmbH System consisting of an electric cooking appliance and a separate operating unit
DE19961457A1 (en) * 1999-12-20 2001-06-21 Bsh Bosch Siemens Hausgeraete Built-in cooking hob with movable operating control field fitted at end of support arm element extending from hob surface
DE10045655A1 (en) * 2000-09-15 2002-04-18 Aeg Hausgeraete Gmbh Fitted hob

Also Published As

Publication number Publication date
EP1731841A1 (en) 2006-12-13
ATE489585T1 (en) 2010-12-15
DE502006008372D1 (en) 2011-01-05
ES2357040T3 (en) 2011-04-15
DE102005027192A1 (en) 2006-12-07

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