EP1650867B1 - Piezoelectric resonator element, piezoelectric device and gyro sensor - Google Patents
Piezoelectric resonator element, piezoelectric device and gyro sensor Download PDFInfo
- Publication number
- EP1650867B1 EP1650867B1 EP20050022868 EP05022868A EP1650867B1 EP 1650867 B1 EP1650867 B1 EP 1650867B1 EP 20050022868 EP20050022868 EP 20050022868 EP 05022868 A EP05022868 A EP 05022868A EP 1650867 B1 EP1650867 B1 EP 1650867B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- resonating
- resonator element
- piezoelectric resonator
- base
- resonating arms
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Not-in-force
Links
- 238000005530 etching Methods 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 10
- 230000005284 excitation Effects 0.000 description 17
- 239000013078 crystal Substances 0.000 description 11
- 238000006073 displacement reaction Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 9
- 238000004088 simulation Methods 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 238000001514 detection method Methods 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 238000001039 wet etching Methods 0.000 description 6
- 238000000605 extraction Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000010453 quartz Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229940024548 aluminum oxide Drugs 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000011224 oxide ceramic Substances 0.000 description 1
- 229910052574 oxide ceramic Inorganic materials 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000005368 silicate glass Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
- G01C19/5607—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using vibrating tuning forks
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/21—Crystal tuning forks
- H03H9/215—Crystal tuning forks consisting of quartz
Definitions
- the present invention relates to a piezoelectric resonator element to be housed in a package or case, a piezoelectric device in which the piezoelectric resonator element is housed in a package or a case, and a gyro sensor.
- Piezoelectric devices including a piezoelectric resonator and a piezoelectric oscillator housing a piezoelectric resonator element in a package, have been widely used for small information equipment, such as hard disc drives (HDD), mobile computers and integrated circuit (IC) cards, for mobile communications equipment, such as cellular phones, car phones and paging systems, and for measuring instruments such as gyro sensors.
- small information equipment such as hard disc drives (HDD), mobile computers and integrated circuit (IC) cards
- IC integrated circuit
- Fig. 13 is a plan view schematically showing a publicly known structure example of a piezoelectric resonator element that is used for such a piezoelectric device.
- JP-A-2002-76806 is an example of related art.
- this piezoelectric resonator element 1 is made of single-crystal quartz, for example, and includes a base 2 having an extra width and two resonating arms 3, 4 extending in parallel with each other from the base 2 in one direction.
- Fig. 14 is a sectional view along line A-A of Fig. 13 .
- Long grooves 5, 6 are provided to the front and back surfaces of the resonating arms 3, 4, respectively, along their longitudinal direction.
- an excitation electrode (not shown) is provided as a driving electrode.
- a driving voltage applied to the excitation electrode from outside effectively produces an electric field in the resonating arms 3, 4. Consequently, the resonating arms 3, 4 perform flexural vibration in a way that their end parts move closer to and away from each other as shown in Fig. 13 .
- a vibration frequency based on this vibration is output to be used for a reference signal, such as a controlling clock signal.
- the resonating arms 3, 4 included in the piezoelectric resonator element 1 and the long grooves 5, 6 of the resonating arms 3; 4 are formed by etching a substrate made of a piezoelectric wafer material. In general, a wafer substrate is etched to provide the outer shape of a tuning fork as shown in Fig. 13 . Then the long grooves 5, 6 as shown in Fig. 14 are formed by half etching.
- This piezoelectric resonator element 1 involves the following problem.
- wet etching for forming the outer shape etching progresses at different rates in the electrical axis X, the mechanical axis Y and the optical axis Z shown in Figs. 13 and 14 . Due to this etching anisotropy, the long grooves 5, 6 are not provided with a flat base.
- the right and left side walls of the resonating arm 3, for example, that sandwich the long groove 5 are different in thickness. Therefore, the side walls of the resonating arm 3 on the right and left of the virtual central line CE shown in Fig. 13 have different hardness. Specifically, the left side wall is harder than the right side wall.
- JP 2004-236 008 A discloses a piezoelectric resonator element according to the preamble of claim 1.
- the object of the invention is to provide a piezoelectric resonator element, a piezoelectric device and a gyro sensor in which vibration balance is improved so as to keep CI low.
- a piezoelectric resonator element according to the invention includes the features of claim 1.
- the resonating arms include a structure to adjust hardness balance between right and left structures with respect to the virtual central line extending in their longitudinal direction, thereby eliminating or reducing displacement components in unnecessary directions. Accordingly, vibration balance during flexural vibration becomes stable, and thus CI can be kept low.
- a right constricted portion and a left constricted portion with respect to the virtual central line are provided to a base portion of each of the resonating arms so as to make the width of the resonating arms large on the base side and make the width sharply reduce toward each end portion, and the right constricted portion is made larger than the left constricted portion as the structure to adjust.
- This structure deals with the thickness difference between right and left walls of the long groove of each resonating arm due to etching anisotropy in wet-etching the long groove.
- the right constricted portion large at the base portion, which has the largest distortion when each arm is performing flexural vibration, hardness imbalance due to the thin wall on the right of the long groove can be reduced.
- the invention deals with the thickness difference between right and left walls of the long groove of each resonating arm due to etching anisotropy in wet-etching the long groove.
- the wall on the right of the long groove thicker than the wall on the left at the base portion, which has the largest distortion when each arm is performing flexural vibration, hardness imbalance due to the thin right wall can be reduced regarding the long groove as a whole.
- the structure to adjust is provided to an end portion of each of the resonating arms, and a left portion with respect to the virtual central line is made larger than a right portion at the end portion of each resonating arm as the structure to adjust.
- This structure deals with the thickness difference between right and left walls of the long groove of each resonating arm due to etching anisotropy in wet-etching the long groove.
- the invention also provides the piezoelectric device according to claim 4.
- vibration balance becomes stable while the resonating arms included in the piezoelectric resonator element mounted in the piezoelectric device are performing flexural vibration, thereby CI of the device can be kept low.
- the invention also provides the gyro sensor according to claim 5..
- This structure of the invention also improves vibration balance, thereby CI of the gyro sensor can be kept low.
- Fig. 1 is a schematic plan view showing a piezoelectric device according to one embodiment of the invention.
- Fig. 2 is a schematic sectional view of the piezoelectric device along line B-B of Fig. 1 .
- Fig. 3 is a schematic plan view of a piezoelectric resonator element according to the first embodiment used in the piezoelectric device shown in Fig. 1 .
- Fig. 4 is a sectional view of the piezoelectric resonator element along line C-C of Fig. 3 .
- Fig. 5 is an enlarged view showing a major part of the piezoelectric resonator element shown in Fig. 3 .
- Fig. 6 is a vector diagram showing a simulation of vibration displacement while the resonating arms included in a piezoelectric resonator element of a reference example, which is not included in the invention, is performing flexural vibration.
- Fig. 7 is a vector diagram showing a simulation of vibration displacement while the resonating arms included in the piezoelectric resonator element according to the first embodiment is performing flexural vibration.
- Fig. 8 is an enlarged view showing a major part of a piezoelectric resonator element according to a second embodiment.
- Fig. 9 is a vector diagram showing a simulation of vibration displacement while the resonating arms included in the piezoelectric resonator element according to the second embodiment is performing flexural vibration.
- Fig. 10 is an enlarged view showing a major part of a piezoelectric resonator element according to a third embodiment.
- Fig. 11 is a vector diagram showing a simulation of vibration displacement while the resonating arms included in the piezoelectric resonator element according to the third embodiment is performing flexural vibration.
- Fig. 12 is a schematic plan view of a gyro sensor according to a fourth embodiment.
- Fig. 13 is a schematic plan view of a related art piezoelectric resonator element.
- Fig. 14 is a sectional view along line A-A of Fig. 13 .
- Figs. 1 and 2 show a piezoelectric device according to a first embodiment of the invention.
- Fig. 1 is a schematic plan view thereof.
- Fig. 2 is a schematic sectional view along line B-B of Fig. 1 .
- this piezoelectric device 30 is an example including a crystal resonator.
- the piezoelectric device 30 houses a piezoelectric resonator element 32 in a package 36 as a container.
- the package 36 is formed, for example, by multilayering a plurality of substrates made of aluminum-oxide ceramic green sheets as an insulating material and then firing the substrates to form a sintered body.
- the plurality of substrates are provided with a predetermined hole to form an inner space S2 inside when they are multilayered.
- This inner space S2 is a space for housing the piezoelectric resonator element 32.
- the piezoelectric resonator element 32 is mounted inside the package 36, and a lid 39 is used for airtight sealing.
- the lid 39 is made of a material, such as ceramic, metal or glass, can be used.
- the lid 39 made of metal generally has an advantage in terms of strength over lids made of other materials.
- the material whose coefficient of thermal expansion approximates that of the package 36 is preferably used, e.g. Kovar.
- the lid 39 is made of a light transmissive material, e.g: glass.
- a plate of boron silicate glass can be used, for example.
- electrode parts 31, 31 that are tungsten metallized and plated thereon with nickel and gold are provided on a multilayered substrate that is an inner bottom exposed to the inner space S2.
- the electrode parts 31, 31 are coupled to the outside to provide a driving voltage.
- conductive adhesives 43, 43 are applied on the electrode parts 31, 31, conductive adhesives 43, 43 are applied.
- a base 51 of the piezoelectric resonator element 32 is disposed on each of the conductive adhesives 43, 43, which are to be cured.
- the conductive adhesives 43, 43 may include a synthetic resin agent as a bonding adhesive containing conductive particles, such as silver fine particles. Silicone, epoxy and polyimide conductive adhesives can be used.
- the piezoelectric resonator element 32 is formed by etching quartz, for example, as a piezoelectric material. According to the present embodiment, the piezoelectric resonator element 32 has the structure schematically shown in Fig. 3 and Fig. 4 , which is a sectional view along the line C-C of Fig. 3 , in particular to provide required performance with a compact form.
- the piezoelectric resonator element 32 includes the base 51 and a pair of resonating arms 34, 35.
- the base 51 is fixed to the package 36 side.
- the resonating arms 34, 35 extend upward in the drawing in parallel with each other from the base 51.
- This is a fork piezoelectric resonator element, whose shape is like a tuning fork.
- the resonating arms 34, 35 included in the piezoelectric resonator element 32 are provided with long, bottomed grooves 56, 57, respectively, extending along their longitudinal direction. These long grooves 56, 57 are provided on the front and back surfaces of the resonating arms 34, 35, respectively, as shown in Fig. 4 , which is a sectional view along line C-C of Fig. 3 .
- extraction electrodes 52, 53 are also provided on the back surface (not shown) of the base 51 included in the piezoelectric resonator element 32 in the same manner.
- each of the extraction electrodes 52, 53 is a portion coupled to the electrode parts 31, 31 on the package side with the conductive adhesives 43, 43 shown in Fig. 1 as described above.
- each of the extraction electrodes 52, 53 is also coupled in a unified manner to excitation electrodes 54, 55, respectively, provided in the long grooves 56, 57 of the resonating arms 34, 35.
- the excitation electrodes 54, 55 are also provided on the both sides of the resonating arms 34, 35 as shown in Fig. 4 .
- the excitation electrode 54 provided in the long groove 56 and the excitation electrode 55 on the side have opposite polarity.
- the excitation electrode 55 provided in the long groove 57 and the excitation electrode 54 on the side have opposite polarity.
- a cutout or constricted part may be provided by reducing the width of the base 51.
- This structure can prevent the vibration of the piezoelectric resonator element 32 from passing through the base 51 side, thereby reducing the CI.
- the piezoelectric resonator element 32 is extremely compact as a whole.
- the overall length of its structure shown in Fig. 3 is about 1300 ⁇ m.
- the resonating arms are about 1040 ⁇ m long and about 40 ⁇ m to 55 ⁇ m wide.
- constricted portions 61, 62 are provided near a base portion of the resonating arms 34, 35, that is, near a front end 51a of the base 51.
- the width of the resonating arms 34, 35 is larger on the base 51 side and becomes sharply smaller toward their end sides.
- the constricted portions 61, 62 are fin-like portions extending toward the base portion of the arms.
- the constricted portion 61 is a fin-like unified part of a nearly right triangle whose one side is along the front end of the base 51 and another adjacent side is along the left edge of the base portion (base end portion) of the resonating arm.
- the constricted portion 62 is also a fin-like unified part of a nearly right triangle whose one side is along the front end of the base 51 and another adjacent side is along the right edge of the base portion (base end portion) of the resonating arm.
- a thickness D1 of a left wall 34a and a thickness D2 of a right wall 34b sandwiching the long groove 56 differ largely.
- the left wall 34a is thicker than the right wall 34b.
- This difference in wall thickness is due to different etching rates depending on crystal orientation, since the long groove 56 is formed by wet-etching a quartz material that involves etching anisotropy.
- the constricted portions 61, 62 are used to adjust the hardness balance between the right and left side of the resonating arm 34 due to the etching anisotropy.
- the constricted portion 62 on one side of the long groove 56 in the width direction is made large, while the constricted portion 61 on the other side of the long groove 56 in the width direction has a normal size.
- the constricted portion 62 on the right is made large, while the constricted portion 61 on the left is made smaller to have a normal size as shown in Figs. 3 and 4 .
- the sizes of the right and left constricted portions can differ by making the shape of a mask for the wet etching different for the both sides.
- the hardness can be increased on the right of the resonating arms 34, 35, while the resonating arms 34, 35 are performing flexural vibration.
- the size of the large constricted portion 62 in comparison with the normally sized constricted portion 61 can be determined depending on the difference between the thickness D1 of the left wall and the thickness D2 of the right wall shown in Fig. 4 .
- Fig. 6 is a vector diagram showing a simulation of vibration displacement while each resonating arm included in the piezoelectric resonator element 32 having the structure as shown in Fig. 5 is performing flexural vibration.
- distortion is small around lower portions of the base, that is, portions corresponding to the extraction electrodes 52, 53 shown in Fig. 3 with this piezoelectric resonator element 32 according to the present embodiment by adjusting and striking the stress balance between the right and left side of each resonating arm.
- Fig. 7 is a vector diagram showing a simulation of vibration displacement while resonating arms included in a piezoelectric resonator element having constricted portions that have the same width are performing flexural vibration, which differs from the example of the resonating arm 34 shown in Fig. 5 having the normally sized constricted portion 61 on the left and the large constricted portion 62 on the right.
- the structure of Fig. 7 shows larger distortion around lower portions of the base.
- Fig. 8 is an enlarged view showing a major part of a piezoelectric resonator element according to a second embodiment.
- This drawing corresponds to Fig. 5 .
- Parts according to the present embodiment not shown in this drawing are common to the first embodiment shown in Figs. 1 through 5 , and the description thereof will be omitted and differences between the two embodiments will be highlighted here.
- a structure to adjust hardness on the right and left is provided near the front end 51 a.
- part of the right wall 66 has a wider part 66a that is thicker than the left wall 65.
- Fig. 9 is a vector diagram showing a simulation of vibration displacement while each resonating arm is performing flexural vibration in the second embodiment.
- the structure of Fig. 9 shows smaller distortion around lower portions of the base than the structure of Fig. 7 .
- Fig. 10 is an enlarged view showing a major part of a piezoelectric resonator element according to a third embodiment.
- the drawing shows part of the piezoelectric resonator element near the ends of the resonating arms 34, 35. Parts according to the present embodiment not shown in this drawing are common to the first embodiment shown in Figs. 1 through 5 , and the description thereof will be omitted and differences between the two embodiments will be highlighted here.
- each resonating arm acting as plummets while the resonating arm is performing flexural vibration are set to have different weights. This means that corrective weight is applied to deal with the hardness imbalance due to the thickness difference between the right and left walls of the long groove.
- the left end portion is made larger than the right end portion of the resonating arm 34 as shown in Fig. 10 .
- a cutout part 71 is formed to diagonally remove the material on the right side of the end portion of the resonating arm 34, thereby reducing the weight on the right of the virtual central line C 1 in comparison with the weight on the left.
- a convex part 72 is formed in a unified manner to increase the material on the left of the virtual central line C1 at the end portion of the resonating arm 34, thereby increasing the weight on the left in comparison with the weight on the right.
- the present embodiment can also reduce the hardness imbalance between the right and left sides of the resonating arm 34 due to the thin right wall 66 regarding the long groove 56 as a whole.
- Fig. 11 is a vector diagram showing a simulation of vibration displacement while each resonating arm is performing flexural vibration in the third embodiment.
- the structure of Fig. 11 shows smaller distortion around lower portions of the base than the structure of Fig. 7 .
- Fig. 12 is a plan view schematically showing a structure of a gyro sensor that is a crystal resonator element as a fourth embodiment of the invention.
- the X direction is the electric axis of crystal
- the Y' direction is the mechanical axis of crystal
- the Z' direction is the optical (growth) axis of crystal.
- this gyro sensor 80 includes a sensor body 81 housed in a package 98.
- the package 98 has an inside structure that is almost the same as the package 36 described in the first embodiment and is like a box in which the sensor body 81 can be housed.
- a driving means such as an excitation circuit, that excites the sensor body 81, and a circuit etc. that detects vibration from the censor body 81 (these circuits are not shown).
- the censor body 81 is formed by etching crystal and in the same process that manufactures the piezoelectric resonator element according to the first embodiment. This means that while the shape of the censor body 81 differs from that of the piezoelectric resonator element of the first embodiment, the outer shape and groove of the body that will be described below can be achieved by the same manufacturing process.
- a base 82 that is long in the right-left direction of the censor body 81 is fixed to the package 98.
- excitation resonating arms 84, 84 extend orthogonally to the direction in which the base 82 extends, arid upward in Fig. 12 in parallel with each other.
- detection resonating arms 85, 85 extend orthogonally to the direction in which the base 82 extends, and downward in Fig. 12 in parallel with each other.
- the long groove 56 is provided to the front surface of each of the excitation resonating arms 84, 84 along its longitudinal direction.
- an excitation electrode (not shown) is provided in the same manner as the first embodiment.
- a groove is also provided to the front and back surfaces of each of the detection resonating arms 85, 85.
- a detection electrode (not shown) is provided.
- the excitation resonating arms 84, 84 included in the gyro sensor 80 vibrate in a way that their end parts move closer to and away from each other as shown by the arrows E in response to a driving voltage applied from the excitation circuit (not shown) as a driving means.
- the excitation resonating arms 84, 84 are subject to the Coriolis force Fc based on the velocity V of the resonating arms in the X axis direction and the rotation angular velocity ⁇ , and the arms vibrate along the Z' axis (alternatively in the positive Z' direction and the negative Z' direction) in accordance with the formula below (walk vibration). This vibration is transmitted to the detection resonating arms 85, 85 via the base 82.
- An electric field based on the vibration of the detection resonating arm 85 is output as a signal by the detection electrode (not shown), thereby detecting the rotation angular velocity ⁇ .
- constricted portions 61, 62 at the base portion of the resonating arms 84 are used to adjust the hardness balance between the right and left sides of each resonating arm 84 due to the etching anisotropy in providing the long groove 56.
- the constricted portion 62 on one side of the long groove 56 in the width direction is made large, while the constricted portion 61 on the other side of the long groove 56 in the width direction has a normal size.
- each of the resonating arms 84, 84 is provided to extend upward from the base 51, the constricted portion 62 on the right is made large, while the constricted portion 61 on the left is made smaller to have a normal size as shown in the enlarged view.
- a long groove is also provided to each of the resonating arms 85, 85 extending downward from the base 82 in Fig. 13 and constricted portions are also provided in the same manner as mentioned above.
- the hardness can be increased on the right of the resonating arms while the resonating arms are performing flexural vibration.
- the resonating arms included in the gyro sensor 80 may have the structure described in Fig. 8 or Fig. 10 instead of or in addition to the structure that adjusts the balance that has been described referring to Fig. 13 .
- the invention is applicable to any piezoelectric resonator elements and any piezoelectric devices using such piezoelectric resonator elements as long as these elements are housed in a package.
- Examples of such elements may include crystal resonator elements, crystal oscillators, gyroscopes and angle sensors.
- the invention is not limited to this.
- the invention is applicable to any packages and cases including containers that are equivalent to the packages as long as they house a piezoelectric resonator element, e.g. a metal cylinder case.
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Acoustics & Sound (AREA)
- Gyroscopes (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
- The present invention relates to a piezoelectric resonator element to be housed in a package or case, a piezoelectric device in which the piezoelectric resonator element is housed in a package or a case, and a gyro sensor.
- Piezoelectric devices, including a piezoelectric resonator and a piezoelectric oscillator housing a piezoelectric resonator element in a package, have been widely used for small information equipment, such as hard disc drives (HDD), mobile computers and integrated circuit (IC) cards, for mobile communications equipment, such as cellular phones, car phones and paging systems, and for measuring instruments such as gyro sensors.
-
Fig. 13 is a plan view schematically showing a publicly known structure example of a piezoelectric resonator element that is used for such a piezoelectric device.JP-A-2002-76806 - Referring to the drawing, this
piezoelectric resonator element 1 is made of single-crystal quartz, for example, and includes abase 2 having an extra width and tworesonating arms base 2 in one direction.Fig. 14 is a sectional view along line A-A ofFig. 13 .Long grooves resonating arms long grooves - A driving voltage applied to the excitation electrode from outside effectively produces an electric field in the
resonating arms resonating arms Fig. 13 . A vibration frequency based on this vibration is output to be used for a reference signal, such as a controlling clock signal. - The
resonating arms piezoelectric resonator element 1 and thelong grooves resonating arms 3; 4 are formed by etching a substrate made of a piezoelectric wafer material. In general, a wafer substrate is etched to provide the outer shape of a tuning fork as shown inFig. 13 . Then thelong grooves Fig. 14 are formed by half etching. - This
piezoelectric resonator element 1, however, involves the following problem. In wet etching for forming the outer shape, etching progresses at different rates in the electrical axis X, the mechanical axis Y and the optical axis Z shown inFigs. 13 and 14 . Due to this etching anisotropy, thelong grooves - As a result, the right and left side walls of the
resonating arm 3, for example, that sandwich thelong groove 5 are different in thickness. Therefore, the side walls of theresonating arm 3 on the right and left of the virtual central line CE shown inFig. 13 have different hardness. Specifically, the left side wall is harder than the right side wall. - Under the state where the
resonating arms Fig. 13 , the degree of flexure deformation different between right and left in the respective horizontal directions. Consequently, flexure of the right and leftresonating arms base 2 because of the deformation of theresonating arms -
JP 2004-236 008 A claim 1. - The object of the invention is to provide a piezoelectric resonator element, a piezoelectric device and a gyro sensor in which vibration balance is improved so as to keep CI low.
- A piezoelectric resonator element according to the invention includes the features of
claim 1. - With this structure of the invention, the resonating arms include a structure to adjust hardness balance between right and left structures with respect to the virtual central line extending in their longitudinal direction, thereby eliminating or reducing displacement components in unnecessary directions. Accordingly, vibration balance during flexural vibration becomes stable, and thus CI can be kept low.
- In a preferred embodiment, a right constricted portion and a left constricted portion with respect to the virtual central line are provided to a base portion of each of the resonating arms so as to make the width of the resonating arms large on the base side and make the width sharply reduce toward each end portion, and the right constricted portion is made larger than the left constricted portion as the structure to adjust.
- This structure deals with the thickness difference between right and left walls of the long groove of each resonating arm due to etching anisotropy in wet-etching the long groove. In particular, by making the right constricted portion large at the base portion, which has the largest distortion when each arm is performing flexural vibration, hardness imbalance due to the thin wall on the right of the long groove can be reduced.
- The invention deals with the thickness difference between right and left walls of the long groove of each resonating arm due to etching anisotropy in wet-etching the long groove. In particular, by intentionally making the wall on the right of the long groove thicker than the wall on the left at the base portion, which has the largest distortion when each arm is performing flexural vibration, hardness imbalance due to the thin right wall can be reduced regarding the long groove as a whole.
- In another preferred embodiment, the structure to adjust is provided to an end portion of each of the resonating arms, and a left portion with respect to the virtual central line is made larger than a right portion at the end portion of each resonating arm as the structure to adjust.
- This structure deals with the thickness difference between right and left walls of the long groove of each resonating arm due to etching anisotropy in wet-etching the long groove. By making one portion on the left of the virtual central line larger than another portion on the right at the base portion of each resonating arm, hardness imbalance due to the right thin wall can be reduced regarding the long groove as a whole.
- The invention also provides the piezoelectric device according to
claim 4. - With this structure in the same principle of the first aspect of the invention, vibration balance becomes stable while the resonating arms included in the piezoelectric resonator element mounted in the piezoelectric device are performing flexural vibration, thereby CI of the device can be kept low.
- The invention also provides the gyro sensor according to
claim 5.. - This structure of the invention also improves vibration balance, thereby CI of the gyro sensor can be kept low.
- The invention will be described with reference to the accompanying drawings, wherein like numbers reference like elements.
-
Fig. 1 is a schematic plan view showing a piezoelectric device according to one embodiment of the invention. -
Fig. 2 is a schematic sectional view of the piezoelectric device along line B-B ofFig. 1 . -
Fig. 3 is a schematic plan view of a piezoelectric resonator element according to the first embodiment used in the piezoelectric device shown inFig. 1 . -
Fig. 4 is a sectional view of the piezoelectric resonator element along line C-C ofFig. 3 . -
Fig. 5 is an enlarged view showing a major part of the piezoelectric resonator element shown inFig. 3 . -
Fig. 6 is a vector diagram showing a simulation of vibration displacement while the resonating arms included in a piezoelectric resonator element of a reference example, which is not included in the invention, is performing flexural vibration. -
Fig. 7 is a vector diagram showing a simulation of vibration displacement while the resonating arms included in the piezoelectric resonator element according to the first embodiment is performing flexural vibration. -
Fig. 8 is an enlarged view showing a major part of a piezoelectric resonator element according to a second embodiment. -
Fig. 9 is a vector diagram showing a simulation of vibration displacement while the resonating arms included in the piezoelectric resonator element according to the second embodiment is performing flexural vibration. -
Fig. 10 is an enlarged view showing a major part of a piezoelectric resonator element according to a third embodiment. -
Fig. 11 is a vector diagram showing a simulation of vibration displacement while the resonating arms included in the piezoelectric resonator element according to the third embodiment is performing flexural vibration. -
Fig. 12 is a schematic plan view of a gyro sensor according to a fourth embodiment. -
Fig. 13 is a schematic plan view of a related art piezoelectric resonator element. -
Fig. 14 is a sectional view along line A-A ofFig. 13 . -
Figs. 1 and 2 show a piezoelectric device according to a first embodiment of the invention.Fig. 1 is a schematic plan view thereof.Fig. 2 is a schematic sectional view along line B-B ofFig. 1 . - Referring to the drawings, this
piezoelectric device 30 is an example including a crystal resonator. Thepiezoelectric device 30 houses apiezoelectric resonator element 32 in apackage 36 as a container. Thepackage 36 is formed, for example, by multilayering a plurality of substrates made of aluminum-oxide ceramic green sheets as an insulating material and then firing the substrates to form a sintered body. The plurality of substrates are provided with a predetermined hole to form an inner space S2 inside when they are multilayered. This inner space S2 is a space for housing thepiezoelectric resonator element 32. - The
piezoelectric resonator element 32 is mounted inside thepackage 36, and alid 39 is used for airtight sealing. Here, thelid 39 is made of a material, such as ceramic, metal or glass, can be used. - The
lid 39 made of metal generally has an advantage in terms of strength over lids made of other materials. The material whose coefficient of thermal expansion approximates that of thepackage 36 is preferably used, e.g. Kovar. - Also, to adjust a frequency after sealing with the lid, the
lid 39 is made of a light transmissive material, e.g: glass. A plate of boron silicate glass can be used, for example. - Near the left end portion in the drawing of the inner space S2 of the
package 36,electrode parts electrode parts electrode parts conductive adhesives base 51 of thepiezoelectric resonator element 32 is disposed on each of theconductive adhesives conductive adhesives - The
piezoelectric resonator element 32 is formed by etching quartz, for example, as a piezoelectric material. According to the present embodiment, thepiezoelectric resonator element 32 has the structure schematically shown inFig. 3 andFig. 4 , which is a sectional view along the line C-C ofFig. 3 , in particular to provide required performance with a compact form. - Specifically, the
piezoelectric resonator element 32 includes thebase 51 and a pair of resonatingarms base 51 is fixed to thepackage 36 side. The resonatingarms base 51. This is a fork piezoelectric resonator element, whose shape is like a tuning fork. - Referring to
Figs. 3 ,4 , the resonatingarms piezoelectric resonator element 32 are provided with long, bottomedgrooves long grooves arms Fig. 4 , which is a sectional view along line C-C ofFig. 3 . - Also as shown in
Fig. 3 , provided near the both ends in the width direction of the end portion (lower end portion inFig. 3 ) of the base 51 included in thepiezoelectric resonator element 32 areextraction electrodes extraction electrodes piezoelectric resonator element 32 in the same manner. - Each of the
extraction electrodes electrode parts conductive adhesives Fig. 1 as described above. Referring toFigs. 3 ,4 , each of theextraction electrodes excitation electrodes long grooves arms excitation electrodes arms Fig. 4 . Regarding the resonatingarm 34, for example, theexcitation electrode 54 provided in thelong groove 56 and theexcitation electrode 55 on the side have opposite polarity. Regarding the resonatingarm 35, theexcitation electrode 55 provided in thelong groove 57 and theexcitation electrode 54 on the side have opposite polarity. - Between the
base 51 and the resonatingarms piezoelectric resonator element 32, a cutout or constricted part (not shown) may be provided by reducing the width of thebase 51. - This structure can prevent the vibration of the
piezoelectric resonator element 32 from passing through the base 51 side, thereby reducing the CI. - Furthermore, the
piezoelectric resonator element 32 is extremely compact as a whole. For example, the overall length of its structure shown inFig. 3 is about 1300 µm. The resonating arms are about 1040 µm long and about 40 µm to 55 µm wide. - As shown in the partially enlarged view
Fig. 5 , constrictedportions arms front end 51a of thebase 51. In the constrictedportions arms portions constricted portion 61 is a fin-like unified part of a nearly right triangle whose one side is along the front end of thebase 51 and another adjacent side is along the left edge of the base portion (base end portion) of the resonating arm. Theconstricted portion 62 is also a fin-like unified part of a nearly right triangle whose one side is along the front end of thebase 51 and another adjacent side is along the right edge of the base portion (base end portion) of the resonating arm. - These portions have the same structure with both the resonating
arms arm 34 will now be described. - Referring to
Fig. 4 , as a result of forming thelong groove 56 to the resonatingarm 34, a thickness D1 of aleft wall 34a and a thickness D2 of aright wall 34b sandwiching thelong groove 56 differ largely. Theleft wall 34a is thicker than theright wall 34b. - This difference in wall thickness is due to different etching rates depending on crystal orientation, since the
long groove 56 is formed by wet-etching a quartz material that involves etching anisotropy. - According to the present embodiment, the constricted
portions arm 34 due to the etching anisotropy. Theconstricted portion 62 on one side of thelong groove 56 in the width direction is made large, while theconstricted portion 61 on the other side of thelong groove 56 in the width direction has a normal size. In other words, when thebase 51 is provided in a lower position ofFig. 3 and the resonatingarms constricted portion 62 on the right is made large, while theconstricted portion 61 on the left is made smaller to have a normal size as shown inFigs. 3 and4 . - The sizes of the right and left constricted portions can differ by making the shape of a mask for the wet etching different for the both sides.
- Accordingly, by providing the large
constricted portion 62 on the right of the resonatingarms arms arms - Here, the size of the large
constricted portion 62 in comparison with the normally sizedconstricted portion 61 can be determined depending on the difference between the thickness D1 of the left wall and the thickness D2 of the right wall shown inFig. 4 . -
Fig. 6 is a vector diagram showing a simulation of vibration displacement while each resonating arm included in thepiezoelectric resonator element 32 having the structure as shown inFig. 5 is performing flexural vibration. Referring to the diagram, distortion is small around lower portions of the base, that is, portions corresponding to theextraction electrodes Fig. 3 with thispiezoelectric resonator element 32 according to the present embodiment by adjusting and striking the stress balance between the right and left side of each resonating arm. -
Fig. 7 is a vector diagram showing a simulation of vibration displacement while resonating arms included in a piezoelectric resonator element having constricted portions that have the same width are performing flexural vibration, which differs from the example of the resonatingarm 34 shown inFig. 5 having the normally sizedconstricted portion 61 on the left and the largeconstricted portion 62 on the right. In comparison with the example ofFig. 6 , the structure ofFig. 7 shows larger distortion around lower portions of the base. -
Fig. 8 is an enlarged view showing a major part of a piezoelectric resonator element according to a second embodiment. This drawing corresponds toFig. 5 . Parts according to the present embodiment not shown in this drawing are common to the first embodiment shown inFigs. 1 through 5 , and the description thereof will be omitted and differences between the two embodiments will be highlighted here. - Also, since the resonating
arms arm 34 only. - According to the present embodiment, a structure to adjust hardness on the right and left is provided near the
front end 51 a. - Specifically, in the
long groove 56 extending in the longitudinal direction of the resonatingarm 34 and sandwiched by aleft wall 65 and aright wall 66, part of theright wall 66 has awider part 66a that is thicker than theleft wall 65. - Thus regarding the
long groove 56 as a whole, the hardness imbalance between the right and left sides of the resonatingarm 34 due to the thin right wall can be reduced. -
Fig. 9 is a vector diagram showing a simulation of vibration displacement while each resonating arm is performing flexural vibration in the second embodiment. The structure ofFig. 9 shows smaller distortion around lower portions of the base than the structure ofFig. 7 . -
Fig. 10 is an enlarged view showing a major part of a piezoelectric resonator element according to a third embodiment. The drawing shows part of the piezoelectric resonator element near the ends of the resonatingarms Figs. 1 through 5 , and the description thereof will be omitted and differences between the two embodiments will be highlighted here. - Also, since the resonating
arms arm 34 only. - According to the present embodiment, the right and left ends of each resonating arm acting as plummets while the resonating arm is performing flexural vibration are set to have different weights. This means that corrective weight is applied to deal with the hardness imbalance due to the thickness difference between the right and left walls of the long groove.
- In other words, the left end portion is made larger than the right end portion of the resonating
arm 34 as shown inFig. 10 . - Specifically; as shown in
Fig. 10A for example, acutout part 71 is formed to diagonally remove the material on the right side of the end portion of the resonatingarm 34, thereby reducing the weight on the right of the virtualcentral line C 1 in comparison with the weight on the left. - Also, as shown in
Fig. 10B for example, aconvex part 72 is formed in a unified manner to increase the material on the left of the virtual central line C1 at the end portion of the resonatingarm 34, thereby increasing the weight on the left in comparison with the weight on the right. - The present embodiment can also reduce the hardness imbalance between the right and left sides of the resonating
arm 34 due to the thinright wall 66 regarding thelong groove 56 as a whole. -
Fig. 11 is a vector diagram showing a simulation of vibration displacement while each resonating arm is performing flexural vibration in the third embodiment. The structure ofFig. 11 shows smaller distortion around lower portions of the base than the structure ofFig. 7 . -
Fig. 12 is a plan view schematically showing a structure of a gyro sensor that is a crystal resonator element as a fourth embodiment of the invention. - In
Fig. 12 , the X direction is the electric axis of crystal, the Y' direction is the mechanical axis of crystal, and the Z' direction is the optical (growth) axis of crystal. - Referring to
Fig. 12 , thisgyro sensor 80 includes asensor body 81 housed in apackage 98. Thepackage 98 has an inside structure that is almost the same as thepackage 36 described in the first embodiment and is like a box in which thesensor body 81 can be housed. Provided inside this package are a driving means, such as an excitation circuit, that excites thesensor body 81, and a circuit etc. that detects vibration from the censor body 81 (these circuits are not shown). - The
censor body 81 is formed by etching crystal and in the same process that manufactures the piezoelectric resonator element according to the first embodiment. This means that while the shape of thecensor body 81 differs from that of the piezoelectric resonator element of the first embodiment, the outer shape and groove of the body that will be described below can be achieved by the same manufacturing process. - Referring to
Fig. 12 , a base 82 that is long in the right-left direction of thecensor body 81 is fixed to thepackage 98. - From around the right and left end portions of the
base 82,excitation resonating arms base 82 extends, arid upward inFig. 12 in parallel with each other. Also from around the right and left end portions of thebase 82,detection resonating arms base 82 extends, and downward inFig. 12 in parallel with each other. - The
long groove 56 is provided to the front surface of each of theexcitation resonating arms detection resonating arms - Referring to
Fig. 12 , theexcitation resonating arms gyro sensor 80 vibrate in a way that their end parts move closer to and away from each other as shown by the arrows E in response to a driving voltage applied from the excitation circuit (not shown) as a driving means. When a rotation angular velocity ω around the Y' axis as shown inFig. 12 is applied, theexcitation resonating arms detection resonating arms base 82. - Fc = 2mV·ω (m = mass of vibrating parts of the
excitation resonating arms excitation resonating arms 84, 84) -- Formula (1) - An electric field based on the vibration of the
detection resonating arm 85 is output as a signal by the detection electrode (not shown), thereby detecting the rotation angular velocity ω. - Moreover, also in the present embodiment, the constricted
portions arms 84 are used to adjust the hardness balance between the right and left sides of each resonatingarm 84 due to the etching anisotropy in providing thelong groove 56. Theconstricted portion 62 on one side of thelong groove 56 in the width direction is made large, while theconstricted portion 61 on the other side of thelong groove 56 in the width direction has a normal size. In other words, when each of the resonatingarms base 51, theconstricted portion 62 on the right is made large, while theconstricted portion 61 on the left is made smaller to have a normal size as shown in the enlarged view. Although detailed description is omitted here, a long groove is also provided to each of the resonatingarms Fig. 13 and constricted portions are also provided in the same manner as mentioned above. - Accordingly, by providing the large
constricted portion 62 on the right of the resonating arms at the base portion of the arms, which has the largest distortion, the hardness can be increased on the right of the resonating arms while the resonating arms are performing flexural vibration. - Note that the resonating arms included in the
gyro sensor 80 may have the structure described inFig. 8 orFig. 10 instead of or in addition to the structure that adjusts the balance that has been described referring toFig. 13 . - It should be understood that the invention is not limited to the above-described embodiments. The structure of each embodiment can be appropriately combined or omitted, and an additional structure not shown can also be combined therewith.
- Furthermore, the invention is applicable to any piezoelectric resonator elements and any piezoelectric devices using such piezoelectric resonator elements as long as these elements are housed in a package. Examples of such elements may include crystal resonator elements, crystal oscillators, gyroscopes and angle sensors.
- While the packages used in the above-described embodiments are like boxes made of ceramic, the invention is not limited to this. The invention is applicable to any packages and cases including containers that are equivalent to the packages as long as they house a piezoelectric resonator element, e.g. a metal cylinder case.
Claims (5)
- A piezoelectric resonator element (32; 80) comprising:a base (51; 82) made of a piezoelectric material;at least a pair of resonating arms (34, 35; 84) provided in a unified manner with the base (51; 82) and extending in parallel with each other from the base (51; 82);a long groove (56, 57) provided to each of the resonating arms (34, 35; 84) along a longitudinal direction thereof; anda driving electrode (54, 55) provided to each of the long grooves (56, 57);characterized in thatin each of the resonating arms (34, 35; 84), a left wall (34a) of the resonating arm (34, 35; 84) on the left side of the long groove (56, 57) is thicker than a right wall (34b) thereof on the right side of the groove (56, 57) due to etching anisotropy; andeach of the resonating arms (34, 35; 84) includes a structure (61, 62) for adjusting the hardness balance between the right side and the left side of the respective resonating arm (34, 35; 84) due to the etching anisotropy with respect to a virtual central line (C1) of said resonating arm (34, 35; 84) which extends in the longitudinal direction thereof.
- The piezoelectric resonator element (32) according to claim 1, in which a right constricted portion (62) and a left constricted portion (61) with respect to the virtual central line (C1) are provided to a base portion of each of the resonating arms (34, 35) so as to make a width of the resonating arms (34, 35) large on the base side and make the width sharply reduce toward each end portion, and said structure (61, 62) for adjusting the hardness balance structure is provided by making the right constricted portion (62) larger than the left constricted portion (61).
- The piezoelectric resonator element (32) according to any of claims 1 and 2, wherein said structure (61, 62) for adjusting the hardness balance is provided to an end portion of each of the resonating arms (34, 35), and said structure (61, 62) for adjusting the hardness balance is provided by making a left portion with respect to the virtual central line (C1) larger than a right portion at the end portion of each resonating arm (34, 35).
- A piezoelectric device (30) comprising a container (36) and a piezoelectric resonator element (32) housed in the container (36), the piezoelectric resonator element (32) including the features of any one of claims 1 to 3.
- A gyro sensor (80) comprising the piezoelectric resonator element of claim 1.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004306888 | 2004-10-21 | ||
JP2005118400A JP4214412B2 (en) | 2004-10-21 | 2005-04-15 | Piezoelectric vibrating piece, piezoelectric device and gyro sensor |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1650867A1 EP1650867A1 (en) | 2006-04-26 |
EP1650867B1 true EP1650867B1 (en) | 2009-09-09 |
Family
ID=35613660
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP20050022868 Not-in-force EP1650867B1 (en) | 2004-10-21 | 2005-10-20 | Piezoelectric resonator element, piezoelectric device and gyro sensor |
Country Status (4)
Country | Link |
---|---|
US (1) | US7397172B2 (en) |
EP (1) | EP1650867B1 (en) |
JP (1) | JP4214412B2 (en) |
DE (1) | DE602005016509D1 (en) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6018673A (en) | 1996-10-10 | 2000-01-25 | Nellcor Puritan Bennett Incorporated | Motion compatible sensor for non-invasive optical blood analysis |
JP4409979B2 (en) * | 2004-02-10 | 2010-02-03 | シチズンホールディングス株式会社 | Vibrator |
WO2007017992A1 (en) * | 2005-08-10 | 2007-02-15 | Daishinku Corporation | Piezoelectric vibration device and method for manufacturing same |
JP4552916B2 (en) * | 2005-12-21 | 2010-09-29 | 株式会社大真空 | Piezoelectric vibration device |
JP4935244B2 (en) * | 2006-08-29 | 2012-05-23 | 株式会社大真空 | Tuning fork type piezoelectric vibrating piece and tuning fork type piezoelectric vibrating device |
JP4990047B2 (en) * | 2007-07-02 | 2012-08-01 | 日本電波工業株式会社 | Piezoelectric vibrating piece and piezoelectric device |
US8446079B2 (en) * | 2008-05-23 | 2013-05-21 | Statek Corporation | Piezoelectric resonator with vibration isolation |
JP4879963B2 (en) | 2008-12-25 | 2012-02-22 | 日本電波工業株式会社 | Piezoelectric vibrating piece, piezoelectric vibrator and piezoelectric oscillator |
JP2010193133A (en) | 2009-02-18 | 2010-09-02 | Epson Toyocom Corp | Bending vibrator piece and bending vibrator |
JP5786303B2 (en) * | 2009-12-10 | 2015-09-30 | セイコーエプソン株式会社 | Vibrating piece, vibrator, physical quantity sensor, and electronic device |
JP2011155629A (en) * | 2009-12-29 | 2011-08-11 | Seiko Epson Corp | Vibrating reed, vibrator, oscillator, electronic device, and frequency adjustment method |
JP5581887B2 (en) * | 2009-12-29 | 2014-09-03 | セイコーエプソン株式会社 | Vibrating piece, vibrator, oscillator, electronic device, and frequency adjustment method |
JP2011199333A (en) * | 2010-03-17 | 2011-10-06 | Seiko Epson Corp | Piezoelectric vibration piece and piezoelectric device |
JP5384406B2 (en) * | 2010-03-30 | 2014-01-08 | 日本電波工業株式会社 | Manufacturing method of tuning-fork type crystal vibrating piece, crystal device |
JP5057122B2 (en) * | 2010-06-25 | 2012-10-24 | セイコーエプソン株式会社 | Piezoelectric vibrating piece and piezoelectric vibrator |
JP5796280B2 (en) * | 2010-07-21 | 2015-10-21 | セイコーエプソン株式会社 | Vibrating piece, vibrator and oscillator |
JP2012120014A (en) * | 2010-12-02 | 2012-06-21 | Seiko Epson Corp | Piezoelectric vibration element, method for manufacturing the same, piezoelectric vibrator, and piezoelectric oscillator |
JP5765087B2 (en) * | 2011-06-27 | 2015-08-19 | セイコーエプソン株式会社 | Bending vibration piece, method for manufacturing the same, and electronic device |
JP6080449B2 (en) * | 2012-09-18 | 2017-02-15 | エスアイアイ・クリスタルテクノロジー株式会社 | Piezoelectric vibrating piece, piezoelectric vibrator, oscillator, electronic device and radio clock |
JP6150433B2 (en) * | 2013-12-11 | 2017-06-21 | 京セラ株式会社 | Quartz vibrating element and method for manufacturing the same |
JP5839083B2 (en) * | 2014-05-26 | 2016-01-06 | セイコーエプソン株式会社 | Vibrating piece, vibrator and oscillator |
JP6137277B2 (en) * | 2015-11-12 | 2017-05-31 | セイコーエプソン株式会社 | Vibrating piece, vibrator and oscillator |
KR20220022945A (en) * | 2020-08-19 | 2022-03-02 | 삼성전자주식회사 | Directional acoustic sensor |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5760718A (en) | 1980-09-27 | 1982-04-12 | Citizen Watch Co Ltd | Quartz oscillator |
JPS57199314A (en) | 1981-06-01 | 1982-12-07 | Seiko Instr & Electronics Ltd | Tuning fork type quartz oscillator |
JP3811226B2 (en) | 1996-07-26 | 2006-08-16 | トヨタ自動車株式会社 | Quartz crystal resonator and manufacturing method thereof |
JP3729249B2 (en) | 2000-09-01 | 2005-12-21 | セイコーエプソン株式会社 | Vibrating piece manufacturing method, vibrating piece, vibrator having vibrating piece, oscillator, and mobile phone device |
JP2003207338A (en) | 2002-01-15 | 2003-07-25 | Ngk Insulators Ltd | Vibrator for vibration-type gyroscope and vibration-type gyroscope |
JP4001029B2 (en) * | 2002-03-25 | 2007-10-31 | セイコーエプソン株式会社 | Tuning fork type piezoelectric vibrating piece, method for manufacturing the same, and piezoelectric device |
JP3975927B2 (en) | 2003-01-30 | 2007-09-12 | セイコーエプソン株式会社 | Piezoelectric vibrating piece, piezoelectric device using the piezoelectric vibrating piece, mobile phone device using the piezoelectric device, and electronic equipment using the piezoelectric device |
JP4305625B2 (en) | 2003-02-10 | 2009-07-29 | セイコーエプソン株式会社 | Oscillator and signal generator for physical quantity measurement |
DE602005020725D1 (en) * | 2004-09-24 | 2010-06-02 | Seiko Epson Corp | Piezoelectric resonator element and piezoelectric component |
-
2005
- 2005-04-15 JP JP2005118400A patent/JP4214412B2/en not_active Expired - Fee Related
- 2005-10-18 US US11/252,704 patent/US7397172B2/en not_active Expired - Fee Related
- 2005-10-20 EP EP20050022868 patent/EP1650867B1/en not_active Not-in-force
- 2005-10-20 DE DE200560016509 patent/DE602005016509D1/en active Active
Also Published As
Publication number | Publication date |
---|---|
JP4214412B2 (en) | 2009-01-28 |
DE602005016509D1 (en) | 2009-10-22 |
JP2006148856A (en) | 2006-06-08 |
EP1650867A1 (en) | 2006-04-26 |
US20060087205A1 (en) | 2006-04-27 |
US7397172B2 (en) | 2008-07-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP1650867B1 (en) | Piezoelectric resonator element, piezoelectric device and gyro sensor | |
US8102103B2 (en) | Tuning-fork resonator with grooves on principal surfaces | |
KR100712758B1 (en) | Piezoelectric resonator element and piezoelectric device | |
JP2004200917A (en) | Piezoelectric vibrating piece, piezoelectric device employing the same, cellular telephone device employing the piezoelectric device, and electronic equipment employing the piezoelectric device | |
JP2004007428A (en) | Tuning fork piezoelectric vibration chip, manufacturing method thereof, and piezoelectric device | |
KR20120098491A (en) | Piezoelectric vibration element, piezoelectric device provided with same and electric apparatus | |
JP2005109741A (en) | Piezoelectric device, cellular phone employing the same, and electronic equipment employing the same | |
JP2007201936A (en) | Piezoelectric vibrating piece and piezoelectric device | |
US9257959B2 (en) | Resonator element, resonator, oscillator, electronic apparatus, sensor, and moving object | |
KR101074975B1 (en) | Flexural vibration piece, flexural vibrator, and electronic device | |
JP2013050321A (en) | Physical quantity detector and electronic apparatus | |
US9354128B2 (en) | Resonator element, resonator, oscillator, electronic apparatus, sensor, and mobile object | |
JP3941736B2 (en) | Quartz vibrating piece, manufacturing method thereof, quartz crystal device using quartz crystal vibrating piece, mobile phone device using quartz crystal device, and electronic apparatus using quartz crystal device | |
CN104753491B (en) | Vibrator, oscillator, electronic apparatus, physical quantity sensor, and moving object | |
CN100578929C (en) | Piezoelectric trembler, piezoelectric device and gyro sensor | |
JP5712755B2 (en) | Acceleration detector, acceleration detection device, and electronic apparatus | |
JP4591035B2 (en) | Piezoelectric vibrating piece and method for manufacturing piezoelectric device | |
CN110323326A (en) | Vibrating elements, the manufacturing method of vibrating elements, physical quantity transducer, inertial measuring unit, electronic equipment and moving body | |
US9287848B2 (en) | Resonator element, resonator, oscillator, electronic apparatus, and moving object having reduced vibration leakage | |
JP2006086726A (en) | Piezoelectric vibration chip, piezoelectric device and method of manufacturing the same | |
JP5838694B2 (en) | Physical quantity detector, physical quantity detection device, and electronic apparatus | |
JP3975927B2 (en) | Piezoelectric vibrating piece, piezoelectric device using the piezoelectric vibrating piece, mobile phone device using the piezoelectric device, and electronic equipment using the piezoelectric device | |
JP2012186586A (en) | Piezoelectric vibration element, piezoelectric vibrator, piezoelectric oscillator, vibration gyro element, vibration gyro sensor, and electronic device | |
JP5867631B2 (en) | Acceleration detector, acceleration detection device, and electronic apparatus | |
JP7571833B2 (en) | Vibration element, physical quantity sensor, inertial measurement unit, electronic device and mobile object |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR |
|
AX | Request for extension of the european patent |
Extension state: AL BA HR MK YU |
|
17P | Request for examination filed |
Effective date: 20060705 |
|
17Q | First examination report despatched |
Effective date: 20060804 |
|
AKX | Designation fees paid |
Designated state(s): CH DE FR GB LI |
|
GRAP | Despatch of communication of intention to grant a patent |
Free format text: ORIGINAL CODE: EPIDOSNIGR1 |
|
GRAS | Grant fee paid |
Free format text: ORIGINAL CODE: EPIDOSNIGR3 |
|
GRAA | (expected) grant |
Free format text: ORIGINAL CODE: 0009210 |
|
AK | Designated contracting states |
Kind code of ref document: B1 Designated state(s): CH DE FR GB LI |
|
REG | Reference to a national code |
Ref country code: GB Ref legal event code: FG4D |
|
REG | Reference to a national code |
Ref country code: CH Ref legal event code: NV Representative=s name: BOVARD AG PATENTANWAELTE Ref country code: CH Ref legal event code: EP |
|
REF | Corresponds to: |
Ref document number: 602005016509 Country of ref document: DE Date of ref document: 20091022 Kind code of ref document: P |
|
PLBE | No opposition filed within time limit |
Free format text: ORIGINAL CODE: 0009261 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT |
|
26N | No opposition filed |
Effective date: 20100610 |
|
REG | Reference to a national code |
Ref country code: CH Ref legal event code: PFA Owner name: SEIKO EPSON CORPORATION Free format text: SEIKO EPSON CORPORATION#4-1, NISHISHINJUKU 2-CHOME#SHINJUKU-KU, TOKYO 163-0811 (JP) -TRANSFER TO- SEIKO EPSON CORPORATION#4-1, NISHISHINJUKU 2-CHOME#SHINJUKU-KU, TOKYO 163-0811 (JP) |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: CH Payment date: 20141014 Year of fee payment: 10 Ref country code: FR Payment date: 20141008 Year of fee payment: 10 Ref country code: DE Payment date: 20141014 Year of fee payment: 10 Ref country code: GB Payment date: 20141015 Year of fee payment: 10 |
|
REG | Reference to a national code |
Ref country code: DE Ref legal event code: R119 Ref document number: 602005016509 Country of ref document: DE |
|
REG | Reference to a national code |
Ref country code: CH Ref legal event code: PL |
|
GBPC | Gb: european patent ceased through non-payment of renewal fee |
Effective date: 20151020 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: CH Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20151031 Ref country code: GB Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20151020 Ref country code: DE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20160503 Ref country code: LI Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20151031 |
|
REG | Reference to a national code |
Ref country code: FR Ref legal event code: ST Effective date: 20160630 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: FR Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20151102 |