CN110071701A - Vibrating elements and its manufacturing method, physical quantity transducer, inertia measuring device - Google Patents
Vibrating elements and its manufacturing method, physical quantity transducer, inertia measuring device Download PDFInfo
- Publication number
- CN110071701A CN110071701A CN201910052463.5A CN201910052463A CN110071701A CN 110071701 A CN110071701 A CN 110071701A CN 201910052463 A CN201910052463 A CN 201910052463A CN 110071701 A CN110071701 A CN 110071701A
- Authority
- CN
- China
- Prior art keywords
- arm
- vibrating elements
- film
- weight portion
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 24
- 230000005484 gravity Effects 0.000 claims abstract description 51
- 238000001514 detection method Methods 0.000 claims description 102
- 238000000034 method Methods 0.000 claims description 65
- 238000005538 encapsulation Methods 0.000 claims description 14
- 239000010408 film Substances 0.000 description 212
- 235000014676 Phragmites communis Nutrition 0.000 description 53
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 31
- 230000015572 biosynthetic process Effects 0.000 description 28
- 239000010453 quartz Substances 0.000 description 25
- 239000000463 material Substances 0.000 description 19
- 238000005452 bending Methods 0.000 description 18
- 229910052751 metal Inorganic materials 0.000 description 16
- 239000002184 metal Substances 0.000 description 16
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 13
- 239000000758 substrate Substances 0.000 description 13
- 239000010931 gold Substances 0.000 description 12
- 238000005530 etching Methods 0.000 description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 10
- 239000011651 chromium Substances 0.000 description 10
- 239000013256 coordination polymer Substances 0.000 description 9
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 9
- 230000003321 amplification Effects 0.000 description 8
- 229910052737 gold Inorganic materials 0.000 description 8
- 238000003199 nucleic acid amplification method Methods 0.000 description 8
- 239000007767 bonding agent Substances 0.000 description 7
- 239000000470 constituent Substances 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 7
- 238000005259 measurement Methods 0.000 description 7
- 230000001133 acceleration Effects 0.000 description 6
- 229910052804 chromium Inorganic materials 0.000 description 6
- 150000002484 inorganic compounds Chemical class 0.000 description 6
- 229910010272 inorganic material Inorganic materials 0.000 description 6
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- -1 billon Substances 0.000 description 5
- 230000006870 function Effects 0.000 description 5
- 238000003860 storage Methods 0.000 description 5
- 239000010936 titanium Substances 0.000 description 5
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 239000010955 niobium Substances 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 150000002902 organometallic compounds Chemical class 0.000 description 4
- 229910052697 platinum Inorganic materials 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000010884 ion-beam technique Methods 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 3
- 229910052721 tungsten Inorganic materials 0.000 description 3
- 239000010937 tungsten Substances 0.000 description 3
- 229910001316 Ag alloy Inorganic materials 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Chemical group 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 2
- 229910002113 barium titanate Inorganic materials 0.000 description 2
- 229910017052 cobalt Inorganic materials 0.000 description 2
- 239000010941 cobalt Substances 0.000 description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 2
- 239000013039 cover film Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 229910052758 niobium Inorganic materials 0.000 description 2
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001721 polyimide Chemical group 0.000 description 2
- 229920001296 polysiloxane Chemical group 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- VSZWPYCFIRKVQL-UHFFFAOYSA-N selanylidenegallium;selenium Chemical compound [Se].[Se]=[Ga].[Se]=[Ga] VSZWPYCFIRKVQL-UHFFFAOYSA-N 0.000 description 2
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 2
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 1
- 241000251468 Actinopterygii Species 0.000 description 1
- 229910017083 AlN Inorganic materials 0.000 description 1
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000006399 behavior Effects 0.000 description 1
- 239000001506 calcium phosphate Substances 0.000 description 1
- 229910000389 calcium phosphate Inorganic materials 0.000 description 1
- 235000011010 calcium phosphates Nutrition 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 150000001722 carbon compounds Chemical class 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000007519 figuring Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000008103 glucose Substances 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052574 oxide ceramic Inorganic materials 0.000 description 1
- 239000011224 oxide ceramic Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- QORWJWZARLRLPR-UHFFFAOYSA-H tricalcium bis(phosphate) Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O QORWJWZARLRLPR-UHFFFAOYSA-H 0.000 description 1
- RIUWBIIVUYSTCN-UHFFFAOYSA-N trilithium borate Chemical compound [Li+].[Li+].[Li+].[O-]B([O-])[O-] RIUWBIIVUYSTCN-UHFFFAOYSA-N 0.000 description 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/21—Crystal tuning forks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
- G01C19/5607—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using vibrating tuning forks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
- G01C19/5607—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using vibrating tuning forks
- G01C19/5621—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using vibrating tuning forks the devices involving a micromechanical structure
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
- G01C19/5607—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using vibrating tuning forks
- G01C19/5628—Manufacturing; Trimming; Mounting; Housings
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
- G01C19/5642—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using vibrating bars or beams
- G01C19/5656—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using vibrating bars or beams the devices involving a micromechanical structure
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
- G01C19/5642—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using vibrating bars or beams
- G01C19/5663—Manufacturing; Trimming; Mounting; Housings
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
- H03H3/04—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks for obtaining desired frequency or temperature coefficient
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0504—Holders; Supports for bulk acoustic wave devices
- H03H9/0533—Holders; Supports for bulk acoustic wave devices consisting of wire
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0595—Holders; Supports the holder support and resonator being formed in one body
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
- H03H9/13—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials
- H03H9/132—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials characterized by a particular shape
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
- H03H2003/022—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks the resonators or networks being of the cantilever type
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
- H03H2003/026—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks the resonators or networks being of the tuning fork type
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
- H03H3/04—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks for obtaining desired frequency or temperature coefficient
- H03H2003/0414—Resonance frequency
- H03H2003/0492—Resonance frequency during the manufacture of a tuning-fork
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- General Physics & Mathematics (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Gyroscopes (AREA)
Abstract
Vibrating elements and its manufacturing method, physical quantity transducer, inertia measuring device are provided.The vibrating elements is characterized in that, comprising: base portion;Shaker arm, the shaker arm extend from the base portion, have arm and the portion Shi Chong;And apply weight film, it is described apply weight film configuration applied in weight portion described, the weight portion that applies has the 1st interarea and the 2nd interarea in positive inverse relation, the center of gravity for applying weight portion is located at the position that the 1st main surface side is leaned on than the median plane of the thickness direction of the arm, and the center of gravity for applying weight film is located at the position that the 2nd main surface side is leaned on than the median plane.
Description
Technical field
The present invention relates to vibrating elements, the manufacturing method of vibrating elements, physical quantity transducer, inertia measuring devices, electronics
Equipment and moving body.
Background technique
Conventionally, there is known the vibrating elements for devices such as quartz vibrator, oscillation gyro sensors.As such
The tuning-fork-type piezoelectric vibrator recorded in the patent document 1 of an example of vibrating elements has base portion and is divided into two from base portion
A pair of of shaker arm that branch extends parallel to.Here, thicker than the arm of shaker arm with thickness is processed into the end of shaker arm
Spend it is thin apply weight portion, the metal film of the frequency for adjusting tuning-fork-type piezoelectric vibrator is provided on applying weight portion.In addition, patent
The tuning-fork type piezoelectric vibrating pieces recorded in document 2 have base portion and are divided into two a pair of of vibrations extended parallel to from base portion
Swing arm is formed with the thickness part thinner than specific thickness in applying for the width end bigger than the arm width of shaker arm in weight portion.
The metal film for adjusting frequency is provided on the upper and lower surface for applying weight portion.
Patent document 1: Japanese Unexamined Patent Publication 2006-311444 bulletin
Patent document 2: Japanese Unexamined Patent Publication 2010-213262 bulletin
But in the tuning-fork-type piezoelectric vibrator documented by patent document 1 and patent document 2, by applying weight portion and metal
The center of gravity for the tectosome that film is constituted generates deviation relative to the median plane of the thickness direction of the arm of shaker arm in a thickness direction,
Therefore, making a pair of of shaker arm, when vibrating on direction (direction in face) that is closer to each other or separating, shaker arm can generate packet
The vibration of direction ingredient containing thickness direction (face outside direction), as a result, the vibration component there are thickness direction is let out via base portion
Drain to vibrating elements it is outer and the problem of become the noise and vibration source for vibrating elements outside.
Summary of the invention
The vibration of the noise and vibration for vibrating elements outside can be reduced the purpose of the present invention is to provide one kind
Element and its manufacturing method, and a kind of physical quantity transducer with the vibrating elements, inertia measuring device, electronics are provided and set
Standby and moving body.
The present invention precisely in order to solve the above subject at least part and complete, can be used as following application examples or side
Formula is realized.
The vibrating elements of the application example includes base portion;Shaker arm, the shaker arm extend from the base portion, have position
Weight portion is applied by the position of end side in the arm of the base portion side and positioned at than the arm;And weight film is applied, it is described to apply weight
Film configuration is applied in weight portion described, which is characterized in that, the weight portion that applies is with the thickness in the vibrating elements
The 1st interarea and the 2nd interarea of positive inverse relation are on direction, the center of gravity for applying weight portion is located at the thickness direction than the arm
Median plane lean on the 1st main surface side position, it is described apply weight film center of gravity be located at than the arm thickness direction center
The position of the 2nd main surface side is leaned in face.
According to such vibrating elements, the center of gravity for applying weight portion leans on the 1st interarea positioned at the median plane of the thickness direction than arm
The position of side, in contrast, the center of gravity for applying weight film lean on the position of the 2nd main surface side positioned at the median plane of the thickness direction than arm,
Therefore, can make by applying weight portion and applying the center of gravity of tectosome that weight film is constituted close to the median plane (on the thickness direction of shaker arm
Center).Therefore, the useless vibration (vibration on thickness direction) that can reduce shaker arm, as a result, it is possible to reduce for vibration
Noise and vibration for dynamic element-external.
In the vibrating elements of the application example, it is preferred that the weight portion that applies is with described in part 1 and thickness ratio
The thin part 2 of part 1, the 2nd interarea have stairstepping using the part 1 and the part 2.
Thereby, it is possible to the median planes for making the center of gravity for applying weight portion be located at the thickness direction than arm with fairly simple structure to lean on
The position of 1st main surface side.
In the vibrating elements of the application example, it is preferred that carrying out planar observation from the thickness direction for applying weight portion
When, the part applying weight portion and being gradually reduced between the part 1 and the part 2 with thickness.
Weight film is applied thereby, it is possible to continuously easy to form in a manner of across part 1 and part 2.Furthermore it is possible to subtract
Cause to apply due to the ladder between part 1 and part 2 less and be cracked on weight film.
In the vibrating elements of the application example, it is preferred that described to apply when carrying out planar observation from the thickness direction
The width in weight portion is greater than the width of the arm.
Thus, it is possible to increase the area for applying weight portion for being capable of forming and applying weight film.
In the vibrating elements of the application example, it is preferred that the part 2 is configured relative to the part 1 in institute
State the two sides in the width direction of shaker arm.
Thereby, it is possible to reduce the torsional moment of shaker arm.
In the vibrating elements of the application example, it is preferred that the part 2 relative to the part 1 be configured at
The opposite side of the base portion.
Thereby, it is possible to the areas of part 2 when reducing planar observation.In addition, there is also in the width direction for applying weight portion
Quality the advantages of being not easy disequilibrium.
In the vibrating elements of the application example, it is preferred that carrying out planar observation from the thickness direction for applying weight portion
When, the part 1 is arranged to surround the part 2.
The design of part 2 becomes easy as a result,.
In the vibrating elements of the application example, it is preferred that the 1st interarea is flat surface.
The 1st main surface side in weight portion is applied without processing as a result, part 1 and part 2, knot to be arranged on applying weight portion
Fruit can simplify the manufacturing process of vibrating elements.
In the vibrating elements of the application example, it is preferred that described to apply the configuration of weight film in the part 1 and described the
On 2 parts.
Thereby, it is possible to increase the quality for applying weight film.Furthermore it is possible to simplify the formation for applying weight film.
In the vibrating elements of the application example, it is preferred that the arm has the thickness direction about the arm
Median plane is the symmetrical shape in face.
Thereby, it is possible to reduce the vibration on the thickness direction due to caused by the shape of shaker arm.
In the vibrating elements of the application example, it is preferred that the vibrating elements includes the 1st vibration as the shaker arm
Swing arm, the 1st shaker arm extend from the base portion, have as the 1st arm of the arm and apply weight portion as described
The 1st apply weight portion;2nd shaker arm, the 2nd shaker arm extend from the base portion, have the 2nd arm positioned at the base portion side
Portion and the 2nd weight portion is applied by end side than the 2nd arm;As it is described apply the 1st of weight film apply weight film, the described 1st apply weight film
Configuration is applied in weight portion the described 1st;And the 2nd apply weight film, and the described 2nd applies the configuration of weight film applies in weight portion the described 2nd, and described the
2 apply weight portion centers of gravity be located at than the 2nd arm thickness direction median plane lean on the 1st main surface side position, the described 2nd
The center of gravity for applying weight film leans on the position of the 2nd main surface side positioned at the median plane of the thickness direction than the 2nd arm.
Thereby, it is possible to reduce the useless vibration (vibration on thickness direction) of the 1st shaker arm and the 2nd shaker arm both sides.This
Outside, the 1st apply weight portion and the 2nd center of gravity for applying weight portion is respectively positioned on the 1st main surface side (mutually the same side), also, the 1st apply weight film and
2nd center of gravity for applying weight film is respectively positioned on the 2nd main surface side (mutually the same side), and therefore, easy to form these apply weight portion and Shi Chong
Film.
In the vibrating elements of the application example, it is preferred that the vibrating elements includes: actuating arm, the actuating arm carry out
Driving vibration;And detection arm, the detection arm accordingly deforms with inertia force, the base portion with base body, with
And from the base body extension linking part, the actuating arm is the shaker arm, from the linking part extend, it is described
Detection arm extends from the base body.
Thereby, it is possible to improve its characteristic in so-called double-T shaped vibrating elements.
In the vibrating elements of the application example, it is preferred that the vibrating elements includes: actuating arm, the actuating arm is from institute
It states base portion and rises and extend, carry out driving vibration;And detection arm, the detection arm is from the base portion opposite with the actuating arm
Side upwardly extend, accordingly deform with inertia force, the actuating arm is the shaker arm.
Thereby, it is possible to improve its characteristic in the vibrating elements of so-called H-type.
In the vibrating elements of the application example, it is preferred that it is described apply weight film with the 1st apply weight film and thickness compare institute
State the 1st apply weight film it is thin the 2nd apply weight film.
Thereby, it is possible in the resonance frequency tune for removing a part for applying weight film using laser Isoenergetical line and carrying out shaker arm
When whole, it is easy to carry out fine tuning and coarse adjustment.
The manufacturing method of the vibrating elements of the application example is characterized in that, comprising the following steps: form base portion and shaker arm,
The shaker arm extends from the base portion, has the 1st interarea and the 2nd interarea for being in positive inverse relation in a thickness direction, institute
The center of gravity for stating shaker arm leans on the 1st main surface side than the median plane on the thickness direction of the shaker arm;In the vibration
It is formed on arm and applies weight film, the center of gravity for applying weight film leans on the 2nd interarea than the median plane on the thickness direction of the shaker arm
Side;And the resonance frequency of the shaker arm is adjusted by adjusting the quality for applying weight film.
According to the manufacturing method of such vibrating elements, the characteristic for the vibrating elements that can be improved.In addition, weight will be applied
Therefore film, which is only configured, can simplify the manufacture work of vibrating elements in the single-face side (specifically, the 2nd main surface side) for applying weight portion
Sequence, and can also be removed using laser Isoenergetical line and apply a part of weight film and reduce in the resonance frequency tune for carrying out shaker arm
The droplet (dregs) generated when whole.
The physical quantity transducer of the application example is characterized in that, comprising: the vibrating elements of the application example;And storage is
State the encapsulation of vibrating elements.
According to such physical quantity transducer, physical quantity transducer can be improved using the excellent characteristics of vibrating elements
Sensor characteristics (for example, detection accuracy).
The inertia measuring device of the application example is characterized in that, comprising: the physical quantity transducer of the application example;And with institute
State the circuit of physical quantity transducer electrical connection.
According to such inertia measuring device, inertia can be improved using the excellent sensor characteristics of physical quantity transducer
The characteristic (for example, measurement precision) of measuring device.
The electronic equipment of the application example is characterized in that the electronic equipment has the vibrating elements of the application example.
According to such electronic equipment, the characteristic (example of electronic equipment can be improved using the excellent characteristics of vibrating elements
Such as, reliability).
The moving body of the application example is characterized in that the moving body has the vibrating elements of the application example.
According to such moving body, the characteristic of moving body can be improved using the excellent characteristics of vibrating elements (for example, can
By property).
Detailed description of the invention
Fig. 1 is the plan view for showing the vibrating elements of first embodiment of the present invention.
Fig. 2 is the cross-sectional view of the line A-A in Fig. 1.
Fig. 3 is the plan view of the shaker arm (actuating arm) that amplification shows vibrating elements applied weight portion and apply weight film.
Fig. 4 is the cross-sectional view of the line B-B in Fig. 3.
Fig. 5 is the cross-sectional view of the line C-C in Fig. 3.
Fig. 6 is the flow chart for showing an example of manufacturing method of vibrating elements.
Fig. 7 is the cross-sectional view for showing the process of prepared substrate in vibrating reed formation process.
Fig. 8 is the cross-sectional view for showing the process that corrosion-resisting film and resist film are formed in vibrating reed formation process.
Fig. 9 is the cross-sectional view for showing the process for the shape that vibrating reed is formed in vibrating reed formation process.
Figure 10 is the cross-sectional view for showing the process of a part that corrosion-resisting film is removed in vibrating reed formation process.
Figure 11 is the cross-sectional view for showing the process formed a groove in vibrating reed formation process.
Figure 12 is the cross-sectional view for showing the process that corrosion-resisting film and resist film are removed in vibrating reed formation process.
Figure 13 is the cross-sectional view for showing electrode forming process.
Figure 14 is to show the cross-sectional view for applying weight film formation process.
Figure 15 is the cross-sectional view for showing frequency adjustment process.
Figure 16 is applying weight portion and applying for the shaker arm (actuating arm) for the vibrating elements that amplification shows second embodiment of the present invention
The plan view of weight film.
Figure 17 is the cross-sectional view of the line C-C in Figure 16.
Figure 18 is applying weight portion and applying for the shaker arm (actuating arm) for the vibrating elements that amplification shows third embodiment of the present invention
The plan view of weight film.
Figure 19 is applying weight portion and applying for the shaker arm (actuating arm) for the vibrating elements that amplification shows fourth embodiment of the present invention
The plan view of weight film.
Figure 20 is the cross-sectional view of the line B-B in Figure 19.
Figure 21 is the plan view for showing the vibrating elements of fifth embodiment of the present invention.
Figure 22 is the plan view for showing the vibrating elements of sixth embodiment of the present invention.
Figure 23 is the cross-sectional view for showing the physical quantity transducer of embodiment of the present invention.
Figure 24 is the exploded perspective view for showing the embodiment of inertia measuring device of the present invention.
Figure 25 is the perspective view for the substrate that inertia measuring device has shown in Figure 24.
Figure 26 is the embodiment (personal computer of mobile model (or notebook type)) for showing electronic equipment of the present invention
Perspective view.
Figure 27 is the plan view for showing the embodiment (mobile phone) of electronic equipment of the present invention.
Figure 28 is the perspective view for showing the embodiment (digital still camera) of electronic equipment of the present invention.
Figure 29 is the perspective view for showing the embodiment (automobile) of moving body of the present invention.
Label declaration
1: vibrating elements;1A: vibrating elements;1B: vibrating elements;1C: vibrating elements;1D: vibrating elements;1E: vibration member
Part;2: vibrating reed;2D: vibrating reed;2E: vibrating reed;2a: the 1 interarea;2b: the 2 interarea;3: applying weight film;3D: weight film is applied;4: electricity
Pole film;10: physical quantity transducer;11: encapsulation;12: bearing part;13: circuit element;14: connection terminal;15: connection terminal;
16: terminal;17: conductive adhesive;19: bonding agent;20: quartz base plate;20A: quartz base plate;21: base portion;21D: base portion;
21E: base portion;22: detection arm;22D: detection arm;23: detection arm;23D: detection arm;24: actuating arm;24A: actuating arm;24B:
Actuating arm;24C: actuating arm;24D: actuating arm;24E: shaker arm;25: actuating arm;25D: actuating arm;25E: shaker arm;26: driving
Swing arm;27: actuating arm;31: applying weight film;31D: weight film is applied;32: applying weight film;32D: weight film is applied;33: applying weight film;33D: Shi Chong
Film;33E: weight film is applied;34: applying weight film;34D: weight film is applied;34E: weight film is applied;35: applying weight film;36: applying weight film;41: driving signal
Electrode;42: driving grounding electrode;43: detection signal electrode;44: detection grounding electrode;51: corrosion-resisting film;52: corrosion-resisting film;
52A: corrosion-resisting film;53: resist film;54: resist film;111: pedestal;112: lid;113: joint element;121: bearing base
Plate;122: wiring pattern;123: convex block;211: base body;212: link arm;213: link arm;214: the 1 base portions;215:
Linking part;216: the 2 base portions;221: arm;222: applying weight portion;223: slot;231: arm;232: applying weight portion;233: slot;241:
Arm;242: applying weight portion;242A: weight portion is applied;242B: weight portion is applied;242C: weight portion is applied;242a: part 1;242b: the 2
Point;242c: part 2;242d: part 1;242e: part 2;242f: part 1;242g: part 2;242h: the 2
Part;242i: part 1;243: slot;244: ladder;245: ladder;247: recess portion;251: arm;252: applying weight portion;253:
Slot;261: arm;262: applying weight portion;263: slot;271: arm;272: applying weight portion;273: slot;1100: personal computer;
1102: keyboard;1104: main part;1106: display unit;1108: display unit;1200: mobile phone;1202: operation is pressed
Button;1204: answering mouth;1206: call mouth;1208: display unit;1300: digital still camera;1302: shell;1304: by
Light unit;1306: shutter release button;1308: memory;1310: display unit;1500: automobile;1501: car body;1502: car body appearance
Gesture control device;1503: wheel;2000: inertia measuring device;2100: shell;2110: threaded hole;2200: joint element;
2300: sensor module;2310: inner casing;2311: recess portion;2312: opening portion;2320: substrate;2330: connector;2340X:
Angular-rate sensor;2340Y: angular-rate sensor;2340Z: angular-rate sensor;2350: acceleration transducer;2360: control
IC processed;A1: arrow;A2: arrow;B1: arrow;B2: arrow;C: center;C1: arrow;C2: arrow;G: center of gravity;G1: center of gravity;
G2: center of gravity;LL: energy line;S10: vibrating reed formation process;S20: electrode forming process;S30: weight film formation process is applied;S40:
Frequency adjusts process;A: arrow;B: arrow;C: arrow;ω: angular speed.
Specific embodiment
In the following, embodiment shown in reference to the accompanying drawings, manufacturing method, object to vibrating elements of the invention, vibrating elements
Reason quantity sensor, inertia measuring device, electronic equipment and moving body are described in detail.
1. vibrating elements and its manufacturing method
<the 1st embodiment>
Firstly, being illustrated to vibrating elements and its manufacturing method.
(vibrating elements)
Fig. 1 is the plan view for showing the vibrating elements of first embodiment of the present invention.Fig. 2 is cuing open for the line A-A in Fig. 1
View.Fig. 3 is the plan view of the shaker arm (actuating arm) that amplification shows vibrating elements applied weight portion and apply weight film.Fig. 4 is along Fig. 3
In line B-B cross-sectional view.Fig. 5 is the cross-sectional view of the line C-C in Fig. 3.In the various figures, it is suitably greatly exaggerated to show as needed
The size of each component, also, the size of each component is than not necessarily with actual size than consistent.Each component described below
Position, direction and size etc. also include the range (for example, difference is within ± 1%) of error in manufacture etc., as long as can be realized
The necessary function of each component is then not limited to the position recorded in this specification, direction and size etc..
In addition, in the following, for ease of description, being suitably illustrated using orthogonal 3 axis, that is, x-axis, y-axis and z-axis.
In the following, the direction parallel with x-axis is referred to as " x-axis direction ", the direction parallel with y-axis referred to as " y-axis direction ", parallel with z-axis
Direction is referred to as " z-axis direction ", and the end side for setting the arrow of each axis of expression x-axis, y-axis and z-axis in the figure is as "+", base end side
"-".In addition, also general+z-axis direction side is referred to as "upper" ,-z-axis direction side is referred to as "lower" ,+x-axis direction side is referred to as " right side " ,-x-axis side
It is referred to as " left side " to side.In addition, " planar observation " will be referred to as from z-axis direction.In Fig. 1, for convenience of explanation, after being omitted
The diagram for the electrode film 4 stated.
Vibrating elements 1 shown in FIG. 1 is the sensor element for detecting the angular speed around z-axis.The vibrating elements 1 includes vibration
Movable plate 2 (referring to Fig.1);Configure the electrode film 4 on vibrating reed 2 (referring to Fig. 2);And configuration applies weight film 3 on electrode film 4
(referring to Fig.1).
As shown in Figure 1, vibrating reed 2 has so-called double-T shaped construction.Illustrate, vibrating reed 2 have base portion 21, from
Base portion 21 plays a pair of of detection arm 22,23 (the 1st, the 2nd detection arm) of extension, a pair of of actuating arm 24,25 (the 1st actuating arm) and one
To actuating arm 26,27 (the 2nd actuating arm).
Here, base portion 21 includes base body 211, is supported on aftermentioned encapsulation 11 (referring to Figure 23);Link arm
212, along+x-axis direction extension from base body 211;Link arm 213, from base body 211 along with link arm
212 extending direction opposite direction-x-axis direction extension.Moreover, detection arm 22 (the 1st detection arm) edge from base body 211
With the extending direction of link arm 212,213 intersect+y-axis direction extends, in contrast, detection arm 23 (the 2nd detection arm) from
Base body 211 rise along with detection arm 22 extending direction opposite direction-y-axis direction extend.(the 1st driving of actuating arm 24
Arm) extend from the terminal region of link arm 212 along+y-axis direction, in contrast, actuating arm 25 (the 1st actuating arm) is from connection
The terminal region of arm 212 rise along the extending direction opposite direction with actuating arm 24-y-axis direction extend.Equally, actuating arm 26
(the 2nd actuating arm) extends from the terminal region of link arm 213 along+y-axis direction, and in contrast, actuating arm 27 is from link arm
213 terminal region rise along the extending direction opposite direction with actuating arm 26-y-axis direction extend.
In addition, detection arm 22 includes arm 221 (detection arm), extend from base body 211;Apply weight portion 222
(weight portion is applied in detection), is set to the end side of arm 221, and width is bigger than arm 221;And slot 223, they are separately positioned on
In the upper and lower surface of arm 221.Equally, detection arm 23 has arm 231 (detection arm), applies weight portion 232 (weight portion is applied in detection)
With a pair of of slot 233.In addition, actuating arm 24 includes arm 241 (driving arm), extend from link arm 212;Apply weight portion 242
(weight portion is applied in driving), is set to the end side of arm 241, and width is wider than arm 241;And a pair of of slot 243, they are arranged
In the upper and lower surface of arm 241.Equally, actuating arm 25 has arm 251 (driving arm), applies weight portion 252 (weight portion is applied in driving)
With a pair of of slot 253.In addition, actuating arm 26 includes arm 261 (driving arm), extend from link arm 213;Apply weight portion 262
(weight portion is applied in driving), is set to the end side of arm 261, and width is bigger than arm 261;And a pair of of slot 263, they are arranged
In the upper and lower surface of arm 261.Equally, actuating arm 27 has arm 271 (driving arm), applies weight portion 272 (weight portion is applied in driving)
With a pair of of slot 273.
In addition, slot 223,233,243,253,263,273 can also omit at least one party of a upper and lower centering respectively.This
Outside, a pair up and down of slot 223,233,243,253,263,273 can be interconnected respectively.That is, can also arm 221,
231, the through hole being open towards upper and lower surface is set on 241,251,261,271.In addition, apply weight portion 222,232,242,252,
262,272 width can be the width of arm 221,231,241,251,261,271 or less.
Here, arm 221 is the part of the bending (deformation) (when detection vibration) when detecting the vibration of arm 22, and is inspection
It surveys and (is provided with aftermentioned detection signal electrode 43 with the part of the charge for detecting vibration and generating of detection arm 22 and detection connects
The part of ground electrode 44).Equally, arm 231 is the part of the bending (deformation) (when detection vibration) when detecting the vibration of arm 23,
It and is that the part of charge that detection is generated with the detection vibration of detection arm 23 (is provided with aftermentioned detection signal electrode 43
With the part of detection grounding electrode 44).In addition, arm 241 is that bending (becomes (when driving vibration) in the vibration of actuating arm 24
Shape) part, and be to be applied the part of the electric field of the driving for actuating arm 24 (to be provided with aftermentioned driving signal electrode
41 and driving grounding electrode 42 part).Equally, arm 251,261,271 is in the vibration of actuating arm 25,26,27 respectively
The part of (when driving vibration) bending (deformation), and be the part for being applied the electric field of the driving for actuating arm 25,26,27
(part for being provided with aftermentioned driving signal electrode 41 and driving grounding electrode 42).In addition, applying weight portion 222 is than arm 221
By the part of end side.Equally, applying weight portion 232,242,252,262,272 is than arm 231,241,251,261,271 respectively
By the part of end side.
As shown in figure 3, applying weight portion 242 includes part 1 242a, it is located on the extended line of arm 241;And it is a pair of
Part 2 242b, 242c, they are located at the two sides in the width direction of part 1 242a.Moreover, as shown in figure 4, each 2nd
Divide the thickness t2 of 242b, 242c thinner than the thickness t1 of part 1 242a.Here, the 1st interarea 2a is flat, in contrast, the
2 interarea 2b are provided with the ladder 244,245 formed by part 1 242a and part 2 242b, 242c.The ladder 244,245 structures
As comprising inclined surface, the thickness for applying weight portion 242 gradually thickens from part 2 242b, 242c side towards the side part 1 242a.
As described later, such part 2 242b, 242c can be by being etched (respectively to different the 2nd interarea 2b for applying weight portion 242
Property etching) and formed.
As shown in figure 4, such center of gravity G1 for applying weight portion 242 is relative to center C on the thickness direction of actuating arm 24
In the 1st interarea 2a in the 1st interarea 2a (lower surface) of positive inverse relation and the 2nd interarea 2b (upper surface) for applying weight portion 242
Side.That is, the center of gravity G1 for applying weight portion 242,252,262,272 is located at the center of the thickness direction than arm 241,251,261,271
Face CP leans on the position of the 1st side interarea 2a, in contrast, apply weight film 33,34,35,36 center of gravity G2 be located at than arm 241,251,
261, the median plane CP of 271 thickness direction leans on the position of the 2nd side interarea 2b.By make in this way center of gravity G1 relative to
Center C is deviated in a thickness direction, as described later, can obtain and apply the balance of weight film 33, this apply weight film 33 have be located at
Apply the center of gravity G2 of the opposite side of the center of gravity G1 in weight portion 242.It is same as such weight portion 242 that applies, apply the weight in weight portion 252,262,272
The center C that heart G1 is respectively relative on the thickness direction of actuating arm 25,26,27, which is located at, applies being in just for weight portion 252,262,272
The 1st side interarea 2a in 1st interarea 2a (lower surface) of inverse relation and the 2nd interarea 2b (upper surface).In addition, apply weight portion 222,
232 center of gravity be located at also relative to the center on the thickness direction of detection arm 22,23 apply weight portion 222,232 in positive inverse relation
The 1st interarea (lower surface) and the 2nd interarea (upper surface) in the 1st main surface side.
Here, " the median plane CP of the thickness direction of arm 241 " is vertical with the thickness direction of arm 241 (z-axis direction)
Face, and be between the position on the thickness direction of the 1st side interarea 2a near outside of arm 241 at a distance from and with
The face equal near the distance between the position in outside on the thickness direction of 2 sides interarea 2b.In addition, about arm 251,261,
The median plane of 271 thickness direction, it is also same as the median plane CP of the thickness direction of arm 241 respectively to define." applying weight film 33 "
Indicate that the quality of per unit area is greater than (driving for electrode film 4 (driving signal electrode 41 and the driving grounding electrode 42) of arm 241
On swing arm 24) laminated body.In addition, about weight film 34,35,36 is applied, also respectively with apply weight film 33 and equally define.
In addition, the depth d1 of the ladder 244,245 of the 2nd above-mentioned interarea 2b, i.e., the thickness t1 and the 2nd of part 1 242a
The difference of the thickness t2 of part 242b, 242c are not particularly limited, but preferably equal with the above-mentioned depth d2 of slot 243 (referring to figure
5).Thereby, it is possible to form above-mentioned ladder 244,245 together with slot 243 by etching.The depth d1 of ladder preferably applies weight portion
0.5 times of 0.1 times or more of 242 thickness t1 is hereinafter, more preferably 0.15 times or more 0.4 times or less.
In addition, width Wb, Wc of part 2 242b, 242c can be equal to each other or unequal, but preferably the 2nd
The width Wb for dividing the width Wc of 242c to be greater than part 2 242b.Vibrating reed is formed in the anisotropic etching for cutting quartz plate by Z
In the case where 2, the average thickness of part 2 242b is average thicker than part 2 242c due to the anisotropy of the vibrating reed 2
Degree is thick.Therefore, by making the width Wc of part 2 242c be greater than the width Wb of part 2 242b, part 2 242b can be made
Quality it is equal with the quality of part 2 242c.
In addition, width Wb, Wc of specific part 2 242b, 242c respectively according to the aftermentioned thickness for applying weight film 33 and
Area etc. determines, is not particularly limited, but 0.3 times or more 0.8 times or less Zuo You of the width Wa for part 1 242a.In addition,
The area when planar observation of part 2 242b, 242c is not particularly limited respectively, but the plane of for example, part 1 242a
0.1 times or more 2 times or less Zuo You of area when observation.
Vibrating reed 2 is cut quartz plate by Z and is constituted.By constituting vibrating reed 2 by quartzy (Z cuts quartz plate), vibrating reed 2 can be made
Vibration characteristics (in particular, frequency-temperature characteristic) it is excellent.Further, it is possible to form vibrating reed 2 by etching with high dimensional accuracy.
Quartz belongs to trigonal system, as crystallographic axis, has orthogonal X-axis, Y-axis and Z axis.X-axis, Y-axis, Z axis be referred to as electric axis,
Mechanical axis, optical axis.It is following quartz base plate that Z, which cuts quartz plate: it is plate-like, what is limited by Y-axis (mechanical axis) and X-axis (electric axis)
It is extended on X/Y plane, there is thickness on Z axis (optical axis) direction.Here, the X-axis for constituting the quartz of vibrating reed 2 is parallel with x-axis, Y
Axis is parallel with y-axis, and Z axis is parallel with z-axis.
In addition, vibrating reed 2 can also be made of the piezoelectrics material other than quartz.As the pressure other than quartz
Electric body material, such as lithium tantalate, lithium niobate, lithium borate, barium titanate can be enumerated etc..In addition, not according to the structure of vibrating reed 2
Together, vibrating reed 2 can also be constituted by the quartz plate of the corner cut other than Z is cut.In addition, vibrating reed 2 can be by addition to piezoelectrics
Material (material without piezoelectricity) other than material, the composition such as silicon in detection arm 22,23 and drive in this case
Configured on each arm of swing arm 24,25,26,27 piezoelectric element (piezoelectric body film being made of PZT etc. is sandwiched between a pair of electrodes and
The element of composition).
Electrode film 4 is provided on the surface of the vibrating reed 2 constituted in this way.As shown in Fig. 2, the electrode film 4 has driving
Signal electrode 41, detection signal electrode 43, detects grounding electrode 44 and is electrically connected with these electrodes driving grounding electrode 42
Multiple terminals (not shown).
Driving signal electrode 41 is the electrode for motivating the driving vibration of actuating arm 24,25,26,27.As shown in Fig. 2,
Driving signal electrode 41 is separately positioned on the two sides of the upper and lower surface of the arm 241 of actuating arm 24 and the arm 261 of actuating arm 26
On face.Equally, although it is not shown, but driving signal electrode 41 be separately positioned on the arm 251 of actuating arm 25 upper and lower surface and
On the two sides of the arm 271 of actuating arm 27.
On the other hand, driving grounding electrode 42 have relative to driving signal electrode 41 as benchmark current potential (for example, ground
Current potential).As shown in Fig. 2, driving grounding electrode 42 is separately positioned on two sides and the actuating arm 26 of the arm 241 of actuating arm 24
In the upper and lower surface of arm 261.Equally, although it is not shown, but grounding electrode 42 is driven to be separately positioned on the arm of actuating arm 25
In the upper and lower surface of the arm 271 of 251 two sides and actuating arm 27.
Detection signal electrode 43 is that detection is generated since the detection is vibrated in the detection vibration for motivating detection arm 22
Charge electrode.As shown in Fig. 2, detection signal electrode 43 is arranged in the upper and lower surface of the arm 221 of detection arm 22.
On the other hand, detection grounding electrode 44 have relative to detection signal electrode 43 as benchmark current potential (for example, ground
Current potential).As shown in Fig. 2, detection grounding electrode 44 is arranged on the two sides of the arm 221 of detection arm 22.
In addition, although it is not shown, but in the detection vibration for motivating detection arm 23 for detecting since the detection is vibrated
And the detection signal electrode of the charge generated is arranged in the upper and lower surface of the arm 231 of detection arm 23.Equally, arm 23 is detected
Detect the current potential (for example, ground potential) that grounding electrode has the detection signal electrode relative to detection arm 23 as benchmark, setting
On the two sides of the arm 231 of detection arm 23.Furthermore, it is also possible to utilize the detection signal electrode 43 and detection arm of detection arm 22
The differential wave of 23 detection signal electrode carries out vibration detection.
The constituent material of electrode film 4 is not particularly limited respectively, such as is able to use gold (Au), billon, platinum (Pt), aluminium
(Al), aluminium alloy, silver (Ag), silver alloy, chromium (Cr), evanohm, copper (Cu), molybdenum (Mo), niobium (Nb), tungsten (W), iron (Fe), titanium
(Ti), the transparent electrode materials such as metal materials or ITO, ZnO such as cobalt (Co), zinc (Zn), zirconium (Zr), it is in these materials, also excellent
Choosing uses the metal (gold, billon) or platinum using gold as main material.Alternatively, it is also possible to be set between electrode film 4 and vibrating reed 2
The layers such as Ti, Cr are equipped with, as the basal layer for having the function of preventing electrode film 4 from removing from vibrating reed 2.
Such electrode film 4 has configuration applying in weight portion 222,232,242,252,262,272 in above-mentioned vibrating reed 2
Part.Moreover, being configured with across the part on applying weight portion 222,232,242,252,262,272 and applying weight film 3.In addition,
Electrode film 4 can not also be configured in the underface for applying weight film 3.
Weight film 31 is applied as shown in Figure 1, applying weight film 3 and including, is configured on applying weight portion 222;Weight film 32 is applied, configuration exists
It applies in weight portion 232;Weight film 33 is applied, is configured on applying weight portion 242;Weight film 34 is applied, is configured on applying weight portion 252;Apply weight film
35, it configures on applying weight portion 262;And weight film 36 is applied, it configures on applying weight portion 272.Applying weight film 31,32 is that can pass through
The film of the resonance frequency of detection arm 22,23 is removed using laser Isoenergetical line and is used to adjust in right amount.In addition, apply weight film 33,34,
35,36 be the resonance frequency that can be used to adjust actuating arm 24,25,26,27 in right amount using laser Isoenergetical line and removing
Film.
The configuration of weight film 33 is applied in the 1st interarea 2a (lower surface) and the 2nd interarea 2b in positive inverse relation for applying weight portion 242
On the 2nd interarea 2b in (upper surface), do not configure on the 1st interarea 2a.Weight portion 242 is being applied in addition, applying weight film 33 and being also not configured
Side (left and right side and terminal surface) on.In the present embodiment, weight film 33 is applied to remove the one of the base end side for applying weight portion 242
Partial mode, entire scope in the width direction (x-axis direction) for applying weight portion 242 and be arranged.Therefore, apply weight film 33 across
More configuration is on the part 1 242a for apply weight portion 242 and in part 2 242b, 242c.
As shown in figure 4, such center of gravity G2 for applying weight film 33 is located at relative to the center C on the thickness direction of actuating arm 24
Apply the 2nd side interarea 2b in the 1st interarea 2a (lower surface) of positive inverse relation and the 2nd interarea 2b (upper surface) in weight portion 242.
By deviating center of gravity G2 in a thickness direction relative to center C, as previously mentioned, weight portion can be obtained and be applied
242 balance, this, which applies weight portion 242, has the center of gravity G1 being located at the center of gravity G2 opposite side for applying weight film 33.Weight film is applied with such
33 is same, applies the center C that weight film 34,35,36 is respectively relative on the thickness direction of actuating arm 25,26,27 and is located at and applies weight portion
252,262,272 the 2nd interarea 2b in the 1st interarea 2a (lower surface) of positive inverse relation and the 2nd interarea 2b (upper surface)
Side.Weight portion 222,232 is applied in addition, applying the center that weight film 31,32 is respectively relative on the thickness direction of detection arm 22,23 and being located at
The 2nd main surface side in the 1st interarea (lower surface) in positive inverse relation and the 2nd interarea (upper surface).
In addition, applying position, size and range etc. that the position of weight film 31~36, size and range etc. are not limited to diagram.
For example, applying weight film 3 also can be only fitted on the 1st interarea 2a and side for applying weight portion 222,232,242,252,262,272.At this
In the case of, the thickness for applying weight film 33,34,35,36 and the configuration etc. in addition to applying weight film 31,32 are adjusted, so that their center of gravity
G2 is located at the 2nd side interarea 2b.It can also be throughout the length for applying weight portion 222,232,242,252,262,272 in addition, applying weight film 3
Degree direction (y-axis direction) on entire scope and be arranged.
As such constituent material for applying weight film 3, be not particularly limited, for example, can be used metal, inorganic compound,
Resin etc., but it is preferable to use metal or inorganic compounds.Metal or inorganic compound can be simple by gas phase membrane formation process
And it accurately forms a film.In addition, the weight film 31~36 of applying being made of metal or inorganic compound can be by energy beam
Irradiation is efficient and accurately removes.It is aftermentioned as a result, by applying weight film 3 by metal or inorganic compound film forming to be formed
Frequency adjustment becomes more efficient and high-precision.
As the metal, for example, nickel (Ni), gold (Au), billon, platinum (Pt), aluminium (Al), aluminium alloy, silver can be enumerated
(Ag), silver alloy, chromium (Cr), evanohm, nickel (Ni), copper (Cu), molybdenum (Mo), niobium (Nb), tungsten (W), iron (Fe), titanium (Ti), cobalt
(Co), zinc (Zn), zirconium (Zr) etc. one kind or two or more in them can be applied in combination.In these materials, based on can be with
Formed using device identical with electrode film 4 and apply the viewpoint of weight film 3, as the metal, further preferably using Al, Cr, Fe, Ni, Cu,
Ag, Au, Pt include at least one kind of alloy in these.More specifically, weight film 3 is applied for example preferably by Cr (chromium)
Structure obtained from the upper layer being made of Au (gold) is laminated on the basal layer of composition.As a result, with use quartz and formed vibration
The close property of movable plate 2 or electrode film 4 is excellent, further, it is possible to high-precision and the efficiently adjustment of progress resonance frequency.
In addition, as the inorganic compound, can enumerate aluminium oxide, silica (silica), titanium dioxide (titanium oxide),
The oxide ceramics such as zirconium oxide, yttrium oxide, calcium phosphate, silicon nitride, aluminium nitride, the nitride ceramics such as titanium nitride, boron nitride, stone
The carbon compounds such as ink, tungsten carbide ceramics and the ferroelectric such as barium titanate, strontium titanates, PZT, PLZT, PLLZT in addition to this
Material etc. further preferably uses and silica (SiO in these materials2), titanium oxide (TiO2), aluminium oxide (Al2O3) etc. insulation
Material.
In addition, the thickness (average thickness) for applying weight film 3 is not particularly limited, but for example, 10nm or more 10000nm or less
Left and right.
As above the vibrating elements 1 constituted in this way detects the angular velocity omega around z-axis as described below.Firstly, by believing driving
Apply voltage (driving signal) between number electrode 41 and driving grounding electrode 42, in Fig. 1 on the direction shown in arrow a, makes
Actuating arm 24 and actuating arm 26 carry out bending vibration (driving is vibrated) in a manner of mutually approaching and separate repeatedly, also, make to drive
Swing arm 25 is carried out in a manner of mutually approaching and separating repeatedly on direction identical with above-mentioned bending vibration curved with actuating arm 27
Qu Zhendong (driving vibration).At this point, when not applying angular speed to vibrating elements 1, actuating arm 24,25 and actuating arm 26,27
Carry out about being that face symmetrically vibrates by the yz plane of central point (center of gravity G), therefore, base body 211, link arm 212,
213 and detection arm 22,23 almost without vibration.In addition, at this point, as described above, applying the center of gravity in weight portion 242,252,262,272
The center of gravity G2 of G1 and Shi Chong film 33,34,35,36 is located at side opposite each other about the center C of actuating arm 24,25,26,27, therefore,
Vibration of the actuating arm 24,25,26,27 in the outside direction of face can be reduced.
Under the state (drive mode) for making actuating arm 24~27 carry out driving vibration in this way, to vibrating elements
When 1 application is around the angular velocity omega for the normal (i.e. around z-axis) for passing through its center of gravity G, Coriolis is acted on to actuating arm 24~27 respectively
Power.Link arm 2212,213 carries out bending vibration in Fig. 1 as a result, on direction shown in arrow b, at the same time, in order to offset
The bending vibration, bending vibration (detection vibration) of the excitation detection arm 22,23 in Fig. 1 on direction shown in arrow c.Moreover,
In this way detection arm 22,23 detection vibrate (detection pattern), detection signal electrode 43 and detection grounding electrode 44 it
Between generate charge.The angular velocity omega for being applied to vibrating elements 1 can be found out according to such charge.
As described above, vibrating elements 1 includes base portion 21;As the actuating arm 24,25,26,27 of shaker arm, they are from base
Extension is played in portion 21, has positioned at the arm 241,251,261,271 of 21 side of base portion and positioned at than arm 241,251,261,271
Weight portion 242,252,262,272 is applied by the position of end side;And weight film 33,34,35,36 is applied, they configure and are applying weight portion
242, on 252,262,272.Here, applying weight portion 242,252,262,272 has the 1st interarea 2a and the 2nd in positive inverse relation
Interarea 2b.Moreover, the center of gravity G1 for applying weight portion 242,252,262,272 is located at the thickness direction than arm 241,251,261,271
Median plane CP (by the center C on the thickness direction of actuating arm 24,25,26,27 and plane vertical with z-axis) it is main by the 1st
The position of the face side 2a.In contrast, the center of gravity G2 of weight film 33,34,35,36 is applied positioned at thicker than arm 241,251,261,271
The median plane CP for spending direction leans on the position of the 2nd side interarea 2b.
According to such vibrating elements 1, apply weight portion 242,252,262,272 center of gravity G1 be located at than arm 241,251,
261, the median plane CP of 271 thickness direction applies the weight of weight film 33,34,35,36 in contrast by the position of the 1st side interarea 2a
The median plane CP that heart G2 is located at the thickness direction than arm 241,251,261,271 leans on the position of the 2nd side interarea 2b, therefore, energy
Enough make center of gravity by applying the tectosome entirety that weight portion 242,252,262,272 and Shi Chong film 33,34,35,36 is constituted close to center
Face CP (the center C of actuating arm 24,25,26,27).Therefore, the useless vibration (thickness of actuating arm 24,25,26,27 can be reduced
Vibration on direction), as a result, it is possible to reduce the noise and vibration for 1 outside of vibrating elements.In addition, narration is made later
Method is made, but weight film 33,34,35,36 will be applied and be only configured at the single-face side for applying weight portion 242,252,262,272 (specifically,
2 sides interarea 2b), therefore, the manufacturing process of vibrating elements 1 can be simplified, and can also remove using laser Isoenergetical line
It applies a part of weight film 33,34,35,36 and reduces the droplet (dregs) generated in the resonance frequency adjustment for carrying out shaker arm.
In addition, the center of gravity G1 for applying weight portion 242,252,262,272 is respectively positioned on the 1st side interarea 2a (mutually the same side),
Also, the center of gravity G2 for applying weight film 33,34,35,36 is respectively positioned on the 2nd side interarea 2b (mutually the same side), therefore, easy to form
These apply weight portion 242,252,262,272 and Shi Chong film 33,34,35,36.In addition, a phase in actuating arm 24,25,26,27
When in " the 1st shaker arm ", another is equivalent to " the 2nd shaker arm ".Moreover, the 1st shaker arm have arm 241,251,261,
Any one in 271 has as the 1st arm and applies connecting with the 1st arm in weight portion 242,252,262,272
Weight portion is applied as the 1st and applies weight portion.2nd shaker arm has applying in arm 241,251,261,271 from the 1st, and weight portion is different to apply again
Portion as the 2nd arm, and have apply in weight portion 242,252,262,272 connect with the 2nd arm apply weight portion as the 2nd and apply
Weight portion.Weight film is applied as the 1st configured with any one applied in weight film 33,34,35,36 in weight portion in addition, applying the 1st, the 2nd
It applies and applies weight film as the 2nd configured with any one applied in weight film 33,34,35,36 in weight portion.
Here, it is that face is symmetrical that arm 241,251,261,271, which is preferably respectively provided with about the median plane CP of thickness direction,
Shape.Thereby, it is possible to reduce the vibration on the thickness direction due to caused by the shape of actuating arm 24,25,26,27.
The vibrating elements 1 of present embodiment includes actuating arm 24,25,26,27, they carry out driving vibration;And detection
Arm 22,23, they accordingly deform with inertia force, and base portion 21 has base body 211 and from base body 211
The link arm 212,213 as linking part of extension.Moreover, actuating arm 24,25,26,27 is shaker arm, from link arm 212,
213 extensions, detection arm 22,23 extend from base body 211.Thereby, it is possible in so-called double-T shaped vibrating elements 1,
Improve its characteristic.
When carrying out planar observation from the thickness direction for applying weight portion 242, the width W for applying weight portion 242,252,262,272 is big
In the width W0 of arm 241,251,261,271.Thus, it is possible to increase be capable of forming apply weight film 33,34,35,36 apply weight portion
242,252,262,272 area.Furthermore it is possible to shorten the length of actuating arm 24,25,26,27, as a result, can also realize
The miniaturization of vibrating elements 1.
In addition, apply weight portion 242 with the part 1 242a and thickness part 2 242b thinner than part 1 242a,
242c.Moreover, the 2nd interarea 2b using part 1 242a and part 2 242b, 242c and the ladder 244 with stairstepping,
245.Thereby, it is possible to make the center of gravity G1 for applying weight portion 242 positioned at the center of the thickness direction than arm 241 with fairly simple structure
Face CP leans on the position of the 1st side interarea 2a.In addition, apply weight portion 252,262,272 also with apply weight portion 242 and equally constitute, realize identical
Effect.Here, " ladder 244 " is the median plane from the thickness direction for applying weight portion 242 in part 1 242a to the 2nd interarea
The average distance of 2b is greater than being averaged to the 2nd interarea 2b of the median plane from the thickness direction for applying weight portion 242 in part 2 242b
The shape of distance." median plane for applying the thickness direction in weight portion 242 " is the face vertical with the thickness direction for applying weight portion 242, and is
At a distance between the position on the thickness direction of the 1st side interarea 2a near outside for applying weight portion 242 and in the 2nd interarea 2b
Near the face that the distance between the position in outside is equal on the thickness direction of side.Apply the thickness direction and arm 241 in weight portion 242
Thickness direction is identical.In the example shown, the median plane of the median plane of the thickness direction in weight portion 242 and the thickness direction of arm 241 is applied
CP is located on same surface.In addition, ladder 245 is also equally defined with ladder 244.
In addition, the ladder 244,245 being arranged on the 2nd above-mentioned interarea 2b is configured to comprising inclined surface, from applying weight portion
When 242 thickness direction carries out planar observation, apply weight portion 242 has between part 1 242a and part 2 242b, 242c
The part that thickness is gradually reduced.Thereby, it is possible to continuously hold in a manner of across part 1 242a and part 2 242b, 242c
It is easily formed and applies weight film 33.Furthermore it is possible to reduce due between part 1 242a and part 2 242b, 242c ladder 244,
245 and cause to apply and cracked on weight film 33.In addition, apply weight portion 252,262,272 also with apply weight portion 242 and equally constitute, realize
Identical effect.
In the present embodiment, part 2 242b, 242c is configured at the (vibration of actuating arm 24 relative to part 1 242a
Arm) width direction on two sides.Thereby, it is possible to reduce the quality at the both ends in the width direction for applying weight portion 242, reduces and drive
The torsional moment of swing arm 24.In addition, apply weight portion 252,262,272 also with apply weight portion 242 and equally constitute, realize identical effect.
In addition, the 1st interarea 2a for applying weight portion 242 is flat surface.The 1st side interarea 2a in weight portion 242 is applied without processing as a result,
Part 1 242a and part 2 242b, 242c to be arranged on applying weight portion 242, as a result, it is possible to simplify the system of vibrating elements 1
Make process.In addition, apply weight portion 252,262,272 also with apply weight portion 242 and equally constitute, realize identical effect.In addition, the 1st is main
Face 2a can have ladder, but the position due to being set as center of gravity G1 as described above as the 2nd interarea 2b, the 1st interarea
Ladder depth as shallow of the ladder depth of 2a preferably than the 2nd interarea 2b.
The configuration of weight film 33 is applied on part 1 242a and in part 2 242b, 242c.Thereby, it is possible to increase to apply weight film 33
Quality.Furthermore it is possible to simplify the formation for applying weight film 33.In addition, apply weight film 34,35,36 also with apply weight film 33 and equally constitute, it is real
Existing identical effect.In addition, if become center of gravity G2 as described above position, can also only on part 1 242a and
Weight film 33 is applied in either side setting during part 2 242b, 242c is upper.Here, be only provided on part 1 242a apply weight
In the case where film 33, it is easy to obtain drive with only compared with being provided with the case where applying weight film 33 in part 2 242b, 242c, existing
The advantages of mass balance in the direction of the width of swing arm 24.
In addition, the thickness for applying weight film 33 is uniform in the example shown, but it also can have the mutually different multiple portions of thickness
Point.That is, apply weight film 33 also and can have the 1st apply weight film and thickness applied than the 1st weight film it is thin the 2nd apply weight film.In the situation
Under, it can be in the adjustment for removing a part for applying weight film 33 using laser Isoenergetical line and carrying out the resonance frequency of actuating arm 24
When, it is easy to carry out fine tuning and coarse adjustment.Here, the quality of the 1st thicker per unit area for applying weight film of thickness is larger, is suitble to drive
The coarse adjustment (coarse regulation) of the resonance frequency of swing arm 24.On the other hand, the quality of the per unit area of weight film is applied in the 2nd of thinner thickness
It is smaller, it is suitble to the fine tuning (micro-adjustment) of the resonance frequency of actuating arm 24.In addition, apply weight film 34,35,36 also with to apply weight film 33 same
It constitutes, is achieved in identical effect.
In addition, in the present embodiment, about actuating arm 24,25,26,27, to making by applying weight portion 242,252,262,272
With apply weight film 33,34,35,36 composition tectosome entirety center of gravity close to actuating arm 24,25,26,27 center C the case where into
It has gone explanation, but about detection arm 22,23, can also have been equally constituted with actuating arm 24,25,26,27.In this case, arm
221, the median plane of 231 thickness direction is same as the median plane of the thickness direction of arm 241 respectively defines.Apply weight film 31,32
Respectively with apply weight film 33 equally define.
(manufacturing method of vibrating elements)
Hereinafter, being carried out in case where manufacturing above-mentioned vibrating elements 1 to the manufacturing method of vibrating elements of the invention
Explanation.
Fig. 6 is the flow chart for showing an example of manufacturing method of vibrating elements.As shown in fig. 6, the manufacturer of vibrating elements 1
Method has vibrating reed formation process S10, electrode forming process S20, applies weight film formation process S30 and frequency adjustment process S40.With
Under, successively illustrate each process.
Vibrating reed formation process S10-
Fig. 7 is the cross-sectional view for showing the process of prepared substrate in vibrating reed formation process.Fig. 8 is shown in vibrating reed shape
At the cross-sectional view for the process for forming corrosion-resisting film and resist film in process.Fig. 9 is to show to be formed in vibrating reed formation process
The cross-sectional view of the process of the shape of vibrating reed.Figure 10 is to show a part that corrosion-resisting film is removed in vibrating reed formation process
The cross-sectional view of process.Figure 11 is the cross-sectional view for showing the process formed a groove in vibrating reed formation process.Figure 12 is to show
The cross-sectional view of the process of corrosion-resisting film and resist film is removed in vibrating reed formation process.In addition, Fig. 7 to Figure 12 shows correspondence
In the section of Fig. 5.
Firstly, forming vibrating reed 2.Specifically, for example firstly, as shown in fig. 7, preparing quartz base plate 20, the quartz base
Plate 20 has the 1st interarea 2a and the 2nd interarea 2b.Then, as shown in figure 8, sequentially forming corrosion resistant on the two sides of quartz base plate 20
Lose film 51,52 and resist film 53,54.Here, corrosion-resisting film 51,52 e.g. passes through vapour deposition method, sputtering method etc. successively respectively
Stacked film obtained from chromium, gold is laminated, for the etching solution used in aftermentioned shape forming process and groove formation process
It is accordingly patterned with the flat shape (shape) of vibrating reed 2 with tolerance.In addition, resist film 53,54 is by resisting respectively
The film that agent material is constituted is lost, there is tolerance for the etching solution used in aftermentioned shape forming process and groove formation process
Property, it is also corresponding with the flat shape of slot 243 and part 2 242b, 242c etc. not only with the flat shape of vibrating reed 2 (shape)
Ground is patterned and being exposed and developing.
Then, as shown in figure 9, being come as mask to quartzy base by using corrosion-resisting film 51,52 and resist film 53,54
Plate 20 is etched, and obtains the quartz base plate 20A (shape forming process) with shape identical with vibrating reed 2.Then, as schemed
Shown in 10, by the way that resist film 54 to be etched corrosion-resisting film 52 as mask, corrosion-resisting film 52A is obtained.Moreover, as schemed
Shown in 11, corrosion-resisting film 51,52A and resist film 53,54 is used to be etched as mask to quartz base plate 20A, such as schemed
Shown in 12, by the removal such as etching corrosion-resisting film 51,52A and resist film 53,54, obtaining vibrating reed 2 as a result, (groove portion is formed
Process).
Here, vibrating reed 2 may be with the state of the other parts of quartz base plate 20A connection (hereinafter, also referred to as " brilliant
Piece state ").Under the wafer state, vibrating reed 2 for example links via broken part and with the other parts of quartz base plate 20A, should
At least one party in the width and thickness of broken part is smaller and is frailly formed.Furthermore it is possible under wafer state, in quartzy base
Multiple vibrating elements 1 are formed on plate 20A together.
Electrode forming process S20-
Figure 13 is the cross-sectional view for showing electrode forming process.
As shown in figure 13, electrode film 4 is formed.More specifically, such as by uniform sputtering on the surface of vibrating reed 2
Ground forms metal film.Moreover, after obtaining Etching mask, making being exposed and developing by coating photoresist
The metal film from the part that Etching mask exposes is removed with etching solution.Electrode film 4 is formed as a result,.
Apply weight film formation process S30-
Figure 14 is to show the cross-sectional view for applying weight film formation process.
As shown in figure 14, weight film 3 is applied by formation such as mask evaporations.
Frequency adjusts process S40-
Figure 15 is the cross-sectional view for showing frequency adjustment process.
As shown in figure 15, a part of weight film 3 is applied using energy line LL removal as needed.More specifically, according to need
The a part for applying weight film 33~36 is removed, in a manner of making the resonance frequency of actuating arm 24~27 be equal to each other so as to adjust drive
The frequency (resonance frequency of actuating arm 24~27) of dynamic vibration, in addition, as needed removal apply a part of weight film 31,32, from
And adjust the frequency (resonance frequency of detection arm 22,23) of detection vibration.
As energy line LL, for example, YAG, YVO can be used4, excimer laser isopulse shape laser, carbon dioxide gas
The continuous oscillations such as laser laser, FIB (Focused Ion Beam: focused ion beam), IBF (Ion Beam Figuring: from
Beamlet polishing) etc..
Such frequency adjustment process S40 can be carried out under wafer state, can also be equipped on aftermentioned encapsulation 11
In the state of carry out.In addition, frequency adjustment process S40 can also be divided into multiple progress, for example, can carry out under wafer state
Coarse adjustment adjusts as the 1st time, is finely adjusted in the state of being equipped on encapsulation 11 and adjusts as the 2nd time.
As described above, the manufacturing method of vibrating elements 1 includes the following process: forming base portion 21 and actuating arm 24 (shaker arm)
Process (vibrating reed formation process S10), which extends from base portion 21, has in vibrating elements 1
The 1st interarea 2a and the 2nd interarea 2b of positive inverse relation, the thickness of the center of gravity G1 of actuating arm 24 than actuating arm 24 are on thickness direction
Median plane on direction leans on the 1st side interarea 2a;The process for applying weight film 33 is formed on actuating arm 24 (applies weight film formation process
S30), which leans on the 2nd side interarea 2b than the median plane on the thickness direction of actuating arm 24;And pass through tune
The whole quality for applying weight film 33 adjusts the process (frequency adjust process S40) of the resonance frequency of actuating arm 24.According to such vibration
The manufacturing method of dynamic element 1, the characteristic for the vibrating elements 1 that can be improved.Here, " on the thickness direction of actuating arm 24
Median plane " is the face vertical with the thickness direction of actuating arm 24, and is the thickness direction in the 1st side interarea 2a with actuating arm 24
On near the distance between the position in outside and between the position on the thickness direction of the 2nd side interarea 2b near outside away from
From equal face.In addition, in the present embodiment, by applying a part of weight film 33 using energy line LL removal and to reduce
Apply the quality of weight film 33 mode be adjusted in case where be illustrated, but can also by sputtering etc. membrane formation process apply
It forms a film on weight film 33, is adjusted in a manner of increasing the quality for applying weight film 33 as a result,.In addition, about other actuating arms
25~27 is similarly such with the resonance frequency of detection arm 22,23.
<the 2nd embodiment>
Figure 16 is applying weight portion and applying for the shaker arm (actuating arm) for the vibrating elements that amplification shows second embodiment of the present invention
The plan view of weight film.Figure 17 is the cross-sectional view of the line C-C in Figure 16.
Hereinafter, the 2nd embodiment is illustrated, but said centered on the difference with above embodiment
It is bright, omit the explanation of identical item.In addition, in Figure 16 and Figure 17, it is identical to structure mark identical with above embodiment
Label.In addition, in the following, typically illustrate 1 actuating arm, but it is similarly such about other actuating arms.
Present embodiment is all identical as the 1st above-mentioned embodiment other than the structure (shape) for applying weight portion is different.
As shown in figure 16, the weight portion 242A that applies for the actuating arm 24A that the vibrating elements 1A of present embodiment has includes the 1st
Part 242d is connect with arm 241;And part 2 242e, it is configured at and 241 phase of arm relative to part 1 242d
Anti- side.Moreover, as shown in figure 17, the thickness t2 of part 2 242e is thinner than the thickness t1 of part 1 242d.Here, Shi Chong
Film 33 is across configuration on part 1 242d and on part 2 242e.
It is same as the 1st above-mentioned embodiment according to such present embodiment as above, it also can be improved characteristic.
In addition, in the present embodiment, part 2 242e is configured relative to part 1 242d opposite with base portion 21
Side.Part 2 242e is located at the terminal part of the big actuating arm 24A of mass effect as a result, therefore, can reduce planar observation
When part 2 242e area.In addition, there is also apply the quality of weight portion 242A in the direction of the width be not easy it is unbalanced excellent
Point.
<the 3rd embodiment>
Figure 18 is applying weight portion and applying for the shaker arm (actuating arm) for the vibrating elements that amplification shows third embodiment of the present invention
The plan view of weight film.
Hereinafter, the 3rd embodiment is illustrated, but said centered on the difference with above embodiment
It is bright, omit the explanation of identical item.In addition, in Figure 18, label identical to structure mark identical with above embodiment.And
It is but similarly such about other actuating arms and in the following, typically illustrate 1 actuating arm.
Present embodiment is all identical as the 1st above-mentioned embodiment other than the structure (shape) for applying weight portion is different.
The weight portion 242B that applies for the actuating arm 24B that the vibrating elements 1B of present embodiment has is the 1st above-mentioned implementation of combination
The mode of mode and the 2nd embodiment.That is, as shown in figure 18, applying weight portion 242B and including part 1 242f, with arm 241
Connection;And part 2 242g, two sides and end side in the width direction of part 1 242f.Moreover, part 2
The thickness of 242g is thinner than the thickness of part 1 242f.Here, weight film 33 is applied across configuration on part 1 242f and part 2
On 242g.
It is same as the 1st above-mentioned embodiment according to such present embodiment as above, it also can be improved characteristic.
<the 4th embodiment>
Figure 19 is applying weight portion and applying for the shaker arm (actuating arm) for the vibrating elements that amplification shows fourth embodiment of the present invention
The plan view of weight film.Figure 20 is the cross-sectional view of the line B-B in Figure 19.
Hereinafter, the 4th embodiment is illustrated, but said centered on the difference with above embodiment
It is bright, omit the explanation of identical item.In addition, in Figure 19 and Figure 20, it is identical to structure mark identical with above embodiment
Label.And in the following, typically illustrating 1 actuating arm, but similarly such about other actuating arms.
Present embodiment is all identical as the 1st above-mentioned embodiment other than the structure (shape) for applying weight portion is different.
As shown in figure 19, the weight portion 242C that applies for the actuating arm 24C that the vibrating elements 1C of present embodiment has includes frame-shaped
Part 1 242i, connect with arm 241;And part 2 242h, it is located at the inside of part 1 242i.Moreover, such as
Shown in Figure 20, the thickness t2 of part 2 242h is thinner than the thickness t1 of part 1 242i.Here, it applies weight film 33 and is applying weight portion 242C
Width direction on across configuration on part 1 242i and part 2 242h on.
It is same as the 1st above-mentioned embodiment according to such present embodiment as above, it also can be improved characteristic.
In addition, in the present embodiment, when carrying out planar observation from the thickness direction for applying weight portion 242C, part 1
242i is arranged to surround part 2 242h.Such part 2 242h is arranged and forming recess portion 247.With above-mentioned slot
243 is same, and recess portion 247 can also be formed by etching.Therefore, the design of part 2 242h becomes easy.
<the 5th embodiment>
Figure 21 is the plan view for showing the vibrating elements of fifth embodiment of the present invention.
Hereinafter, the 5th embodiment is illustrated, but said centered on the difference with above embodiment
It is bright, omit the explanation of identical item.
Present embodiment is all implemented with the above-mentioned the 1st other than applying the present invention to the vibrating elements of so-called H-type
Mode is identical.
Vibrating elements 1D shown in Figure 21 is the sensor element for detecting the angular speed around y-axis.Vibrating elements 1D has
The vibrating reed 2D and electrode film being arranged on vibrating reed 2D (not shown) He Shichong film 3D.
Vibrating reed 2D has base portion 21D, a pair of actuating arm 24D, 25D and a pair of of detection arm 22D, 23D.They are configured to one
Body is cut quartz plate using Z and is formed.In addition, the crystallographic axis of quartz and the corresponding relationship of x-axis, y-axis and z-axis and the above-mentioned the 1st are implemented
Mode is identical.
Base portion 21D is supported in aftermentioned encapsulation 11.
Actuating arm 24D, 25D extend on y-axis direction (direction+y) from base portion 21D respectively.Actuating arm 24D, 25D with it is upper
The actuating arm of any one in the 1st~4 embodiment stated equally constitutes.Although it is not shown, but and the first embodiment described above
Actuating arm 24~27 it is same, a pair of of driving electrodes (driving signal electrode and drive are respectively arranged on the actuating arm 24D, 25D
Dynamic grounding electrode), which makes actuating arm 24B, 26B carry out bending vibration in the direction of the x axis by being powered.This one
Driving electrodes are electrically connected through not shown wiring with the terminal (not shown) on base portion 21D.
Detection arm 22D, 23D extend on y-axis direction (direction-y) from base portion 21D respectively.Although it is not shown, but at this
A pair of of detecting electrode (detection signal electrode and detection grounding electrode), a pair of detecting electrode are provided on detection arm 22D, 23D
The charge that detection is generated with detection arm 22D, 23D bending vibration in the z-axis direction.A pair of detecting electrode is not via scheming
The wiring shown and be electrically connected with the terminal (not shown) on base portion 21D.
Apply weight film 3D include apply weight film 31D, 32D, they configure detection arm 22D, 23D terminal part (applying weight portion) on;
And weight film 33D, 34D are applied, they are configured on the terminal part (applying weight portion) of actuating arm 24D, 25D.
In the vibrating elements 1D constituted in this way, by applying driving signal to a pair of of driving electrodes, in Figure 21
Shown in arrow A1, A2, actuating arm 24D and actuating arm 25D carry out bending vibration (driving in a manner of mutually approaching and separate repeatedly
Vibration).
In the state of having carried out driving vibration to actuating arm 24D, 25D in this way, vibrating elements 1D is applied around the angle of y-axis
When speed omega, actuating arm 24D, 25D are by Coriolis force, as shown in arrow B1, B2 in Figure 21, in the z-axis direction mutually
Bending vibration is carried out towards opposite side.At the same time, as shown in arrow C1, C2 in Figure 21, arm 22D, 23D are detected in z-axis direction
On mutually carry out bending vibration (detection vibration) towards opposite side.
Then, the bending vibration of detection arm 22D, 23D in this way are exported from a pair of of detecting electrode and is detected in a pair
The charge generated between electrode.The angular velocity omega for being applied to vibrating elements 1D can be found out according to such charge.
It is same as the 1st above-mentioned embodiment according to such present embodiment as above, it also can be improved characteristic.
Here, the vibrating elements 1D of present embodiment includes actuating arm 24D, 25D, they extend from base portion 21D, into
Row driving vibration;And detection arm 22D, 23D, they prolong on the direction opposite with actuating arm 24D, 25D from base portion 21D
It stretches, accordingly deforms with inertia force, actuating arm 24D, 25D are shaker arms.Thereby, it is possible to the vibration members in so-called H-type
In part 1D, its characteristic is improved.
<the 6th embodiment>
Figure 22 is the plan view for showing the vibrating elements of sixth embodiment of the present invention.
Hereinafter, the 6th embodiment is illustrated, but said centered on the difference with above embodiment
It is bright, omit the explanation of identical item.
Present embodiment other than applying the present invention to the vibrating elements of so-called bipod tuning-fork-type, all with it is above-mentioned
1st embodiment is identical.
Vibrating elements 1E shown in Figure 22 is the sensor element for detecting the angular speed around y-axis.Vibrating elements 1E has
Vibrating reed 2E and the electrode film being arranged on vibrating reed 2E (not shown) He Shichong film 33E, 34E.
Vibrating reed 2E has base portion 21E and a pair of of shaker arm 24E, 25E, they are integrally constituted, cut quartz plate using Z and
It is formed.In addition, the crystallographic axis of quartz and the corresponding relationship of x-axis, y-axis and z-axis are identical as the 1st above-mentioned embodiment.
Base portion 21E includes: the 1st base portion 214 is connect with shaker arm 24E, 25E;2nd base portion 216, relative to the 1st base
Portion 214 is configured at the opposite side with shaker arm 24E, 25E;And linking part 215, the 1st base portion 214 is connected with the 2nd base portion 216
Knot gets up.Linking part 215 is between the 1st base portion 214 and the 2nd base portion 216, and width (length in x-axis direction) is less than the 1st base
Portion 214.Thereby, it is possible to reduce the length along the y-axis direction of base portion 21E and reduce leakage of vibration.Here, the 2nd base portion 216
It is such as supported in aftermentioned encapsulation 11.
Shaker arm 24E, 25E extend on y-axis direction (direction+y) from base portion 21E respectively.Shaker arm 24E, 25E with it is upper
The actuating arm of any one in the 1st~4 embodiment stated equally constitutes.Although it is not shown, but with the 1st above-mentioned embodiment party
The actuating arm 24~27 of formula is same, be respectively arranged on the shaker arm 24E, 25E a pair of of driving electrodes (driving signal electrode and
Drive grounding electrode), which makes actuating arm 24E, 25E carry out bending vibration in the direction of the x axis by being powered.It should
A pair of of driving electrodes are electrically connected through not shown wiring with the terminal (not shown) on base portion 21E.
In addition, although it is not shown, but being also set up other than above-mentioned a pair of of driving electrodes on shaker arm 24E, 25E
Have a pair of of detecting electrode (detection signal electrode and detection grounding electrode), the adjoint shaker arm 24E of a pair of detecting electrode detection,
25E bending vibration in the z-axis direction and the charge generated.A pair of detecting electrode is through not shown wiring and base portion 21E
On terminal it is (not shown) electrical connection.
Weight film 33E, 34E configuration is applied on the terminal part (applying weight portion) of shaker arm 24E, 25E.
In the vibrating elements 1E constituted in this way, by between applying driving signal a pair of of driving electrodes, shaker arm 24E with
Shaker arm 25E carries out bending vibration (driving vibration) in a manner of mutually approaching and separate repeatedly.
In the state of making shaker arm 24E, 25E carry out driving vibration in this way, vibrating elements 1E is applied around the angle of y-axis speed
When spending ω, is motivated by Coriolis force in shaker arm 24E, 25E and mutually carry out curved vibration towards opposite side in the z-axis direction
It is dynamic.Then, the charge generated between a pair of of detecting electrode from the vibration that the output of a pair of of detecting electrode motivates in this way.Energy
Enough according to such charge, the angular velocity omega for being applied to vibrating elements 1E is found out.
It is same as the 1st above-mentioned embodiment according to such present embodiment as above, it also can be improved characteristic.
2. physical quantity transducer
Figure 23 is the cross-sectional view for showing the physical quantity transducer of embodiment of the present invention.
Physical quantity transducer 10 shown in Figure 23 is the vibratory gyroscope biography detected around the angular speed of x-axis, y-axis or z-axis
Sensor.The physical quantity transducer 10 has vibrating elements 1 (or 1A, 1B, 1C, 1D, 1E), bearing part 12, circuit element 13
(IC chip) and the encapsulation 11 for storing them.
Encapsulation 11 includes the pedestal 111 of box-like, has the recess portion of storage vibrating elements 1;And the lid 112 of plate,
Recess portion to seal pedestal 111 is engaged via joint element 113 with pedestal 111 in a manner of being open.It can become in encapsulation 11 and subtract
(vacuum) state of pressure, can also enclose the inert gases such as nitrogen, helium, argon.
The recess portion of pedestal 111 includes upper section face, is located at open side;Lower section face is located at bottom side;And middle section face,
It is located between the upper section face and lower section face.It as the constituent material of the pedestal 111, is not particularly limited, but oxidation can be used
The various ceramics such as aluminium, various glass materials.It in addition, the constituent material as lid 112, is not particularly limited, but is line expansion system
Several approximate components of constituent material with pedestal 111.For example, the constituent material of pedestal 111 has been set as above-mentioned such
Ceramics in the case where, the constituent material of lid 112 is preferably set as the alloys such as teleoseal.In addition, in the present embodiment,
Use endless loop as joint element 113, but the structure such as also can be used low-melting glass, bonding agent of joint element 113
At.
Multiple connection terminals 14,15 are respectively arranged on the upper section face and middle section face of the recess portion of pedestal 111.It is arranged in
A part in multiple connection terminals 15 on section face exists via the wiring layer (not shown) being arranged on pedestal 111 with setting
Terminal 16 on the bottom surface of pedestal 111 is electrically connected, remainder via wiring (not shown) and with multiple companies for being set to upper section
Connecting terminal 14 is electrically connected.As long as these connection terminals 14,15 are conductive, it is not particularly limited, such as can be by metal
Cover film constitute, the metal covering film be laminated in the metalization layer (basal layer) of Cr (chromium), W (tungsten) etc. Ni (nickel), Au (gold),
Each cover film of Ag (silver), Cu (copper) etc. and formed.
Circuit element 13 is fixed on the lower section face of the recess portion of pedestal 111 using bonding agent 19 etc..As bonding agent 19, such as
Epoxies, silicone, polyimide bonding agent can be used.Circuit element 13 has multiple terminals (not shown), each terminal
It is electrically connected by electric conductivity line with each connection terminal 15 being arranged on above-mentioned middle section face.The circuit element 13 has for making
Vibrating elements 1 carries out the driving circuit of driving vibration and detects the detection vibration generated on vibrating elements 1 when applying angular speed
Dynamic detection circuit.
In addition, bearing part 12 is via more on the upper section face of conductive adhesive 17 and the recess portion that pedestal 111 is arranged in
A connection terminal 14 connects.Bearing part 12 includes wiring pattern 122, connect with conductive adhesive 17;And bearing base
Plate 121, supporting wiring pattern 122.As conductive adhesive 17, such as it can be used and be mixed with the electric conductivity such as metal filler
The conductive adhesives such as epoxies, silicone, the polyimide of substance.
Supporting substrates 121 have opening in central portion, and the lead for multiple strips that wiring pattern 122 has is in the opening
Interior extension.Vibrating elements 1 is connect via the convex block 123 of electric conductivity with the terminal part of these leads.
In addition, in the present embodiment, circuit element 13 is set to the inside of encapsulation 11, but circuit element 13 can also be set
It is placed in the outside of encapsulation 11.
As described above, physical quantity transducer 10 has vibrating elements 1 (or 1A, 1B, 1C, 1D, 1E) and storage vibration
The encapsulation 11 of element 1 (or 1A, 1B, 1C, 1D, 1E).According to such physical quantity transducer 10, vibrating elements 1 can be utilized
The excellent characteristics of (or 1A, 1B, 1C, 1D, 1E) come improve physical quantity transducer 10 sensor characteristics (for example, detection essence
Degree).
3. inertia measuring device
Figure 24 is the exploded perspective view for showing the embodiment of inertia measuring device of the present invention.Figure 25 is used to shown in Figure 24
The perspective view for the substrate that property measuring device has.
Inertia measuring device shown in Figure 24 (IMU:Inertial Measurement Unit) 2000 is so-called 6 axis
Motion sensor detects the moving body for example, being installed on the moving bodys such as automobile, robot (measurement object object) and using
Posture and behavior (inertia motion amount).
The inertia measuring device 2000 has shell 2100, joint element 2200 and sensor module 2300, sensor die
Block 2300 is fitted into (insertion) in shell 2100 in the state of across joint element 2200.
Shell 2100 is formed as box-like, and being located on two diagonal corners for the shell 2100 is provided with threaded hole
2110, the threaded hole 2110 is for being screwed to measurement object object.
Sensor module 2300 has inner casing 2310 and substrate 2320, and inner casing 2310 is in the state of carry substrate 2320
It is incorporated in the inside of above-mentioned shell 2100.Here, inner casing 2310 is via joint element 2200 (for example, gasket of rubber system),
It is engaged using bonding agent etc. with shell 2100.In addition, inner casing 2310 includes recess portion 2311, it is used as and is mounted on substrate 2320
The storage space of component function;And opening portion 2312, it is used to make to be arranged in the connector 2330 on substrate 2320
Expose towards the outside.Substrate 2320 is, for example, multi-layer wire substrate, is engaged using bonding agent etc. with inner casing 2310.
As shown in figure 25, be equipped on substrate 2320 connector 2330, angular-rate sensor 2340X, 2340Y,
2340Z, acceleration transducer 2350 and control IC 2360.
Connector 2330 with external device (ED) (not shown) for being electrically connected, in the external device (ED) and inertia measuring device 2000
Between carry out the transmitting-receiving of electric power, the measurement electric signals such as data.
Angular-rate sensor 2340X detects the angular speed around X-axis, and angular-rate sensor 2340Y is detected around the angle of Y-axis speed
Degree, the angular speed of angular-rate sensor 2340Z detection about the z axis.Here, angular-rate sensor 2340X, 2340Y, 2340Z distinguishes
For above-mentioned physical quantity transducer 10.In addition, acceleration transducer 2350 is, for example, the acceleration for using MEMS technology and being formed
Sensor detects the acceleration in each axis direction of X-axis, Y-axis and Z axis.
Controlling IC 2360 is MCU (Micro Controller Unit: micro controller unit), is built-in with comprising non-volatile
Storage unit, the A/D converter etc. of property memory, control the various pieces of inertia measuring device 2000.Here, it is storing
It is stored in portion and defines the program of sequence and content for detecting acceleration and angular speed, detection data is digitized
Program, the attached data etc. being assembled into packet data afterwards.
As described above, inertia measuring device 2000 have physical quantity transducer 10 and as with physical quantity transducer 10
The control IC 2360 of the circuit of electrical connection.According to such inertia measuring device 2000, physical quantity transducer 10 can be utilized
Excellent sensor characteristics improves the characteristic (for example, measurement precision) of inertia measuring device 2000.
4. electronic equipment
Figure 26 is the embodiment (personal computer of mobile model (or notebook type)) for showing electronic equipment of the present invention
Perspective view.
In the figure, personal computer 1100 is by the main part 1104 with keyboard 1102 and with display unit 1108
Display unit 1106 is constituted, and display unit 1106 is rotatably supported on main part 1104 by hinge structure portion
On.It is built-in in such personal computer 1100 used comprising above-mentioned vibrating elements 1 (or 1A, 1B, 1C, 1D, 1E)
Property measuring device 2000.
Figure 27 is the plan view for showing the embodiment (mobile phone) of electronic equipment of the present invention.
In the figure, mobile phone 1200 has antenna (not shown), multiple operation buttons 1202, answers 1204 and of mouth
Call mouth 1206 in operation button 1202 and is answered between mouth 1204 configured with display unit 1208.Such mobile phone
The inertia measuring device 2000 comprising above-mentioned vibrating elements 1 (or 1A, 1B, 1C, 1D, 1E) is built-in in 1200.
Figure 28 is the perspective view for showing the embodiment (digital still camera) of electronic equipment of the present invention.
The back side of shell 1302 in digital still camera 1300 is provided with display unit 1310, is configured to according to CCD
Image pickup signal shown that display unit 1310 plays a role as the view finder that subject is shown as electronic image.Also,
The face side (back side in figure) of shell 1302 is provided with the light list comprising optical lens (imaging optical system) and CCD etc.
Member 1304.Moreover, when cameraman confirms the shot object image shown in display unit 1310 and presses shutter release button 1306, by this
The image pickup signal of the CCD at moment is transferred in memory 1308 and is stored.It is built-in in such digital still camera 1300
There are the inertia measuring device 2000 comprising above-mentioned vibrating elements 1 (or 1A, 1B, 1C, 1D, 1E), the inertia measuring device
2000 measurement result is for example for jitter correction.
As above such electronic equipment has vibrating elements 1 (or 1A, 1B, 1C, 1D, 1E).It is set according to such electronics
It is standby, can be improved using the excellent characteristics of vibrating elements 1 (or 1A, 1B, 1C, 1D, 1E) electronic equipment characteristic (for example,
Reliability).
In addition, the number of electronic equipment of the invention in addition to the personal computer of Figure 26, the mobile phone of Figure 27, Figure 28
Other than still camera, such as smart phone, tablet terminal, clock and watch (including smartwatch), ink jet type row can also be applied to
Out the wearable terminal such as device (such as ink-jet printer), HMD (head-mounted display), laptop PC, TV, take the photograph
Camera, video recorder, on-vehicle navigation apparatus, pager, electronic notebook (also comprising with communication function), e-dictionary, calculating
Device, electronic game station, word processor, work station, visual telephone, anti-theft televimonitor, electronics binocular, POS are whole
End, Medical Devices are (such as in electronic thermometer, sphygmomanometer, blood-glucose meter, electrocardiogram measuring device, diagnostic ultrasound equipment, electronics
Sight glass), fish finder, various measuring devices, metrical instrument class (for example, metrical instrument class of vehicle, aircraft, ship), just
Take base station, the flight simulator etc. of terminal.
5. moving body
Figure 29 is the perspective view for showing the embodiment (automobile) of moving body of the present invention.
The inertia measuring device comprising above-mentioned vibrating elements 1 (or 1A, 1B, 1C, 1D, 1E) is built-in in automobile 1500
2000, for example, the posture of car body 1501 can be detected by inertia measuring device 2000.The detection signal of inertia measuring device 2000
It is supplied to vehicle attitude controller 1502, vehicle attitude controller 1502 can be according to the appearance of the signal detection car body 1501
Gesture accordingly controls the soft or hard of suspension with testing result and controls the braking of each wheel 1503.
In addition, such ability of posture control can be used in bipod walking robot or helicopter drone (comprising nobody
Machine).As described above, assembling inertia measuring device 2000 when realizing the ability of posture control of various moving bodys.
As described above, the automobile 1500 as moving body has vibrating elements 1 (or 1A, 1B, 1C, 1D, 1E).According to this
The automobile 1500 of sample can improve automobile 1500 using the excellent characteristics of vibrating elements 1 (or 1A, 1B, 1C, 1D, 1E)
Characteristic (for example, reliability).
More than, it is passed according to manufacturing method, physical quantity of the embodiment illustrated to vibrating elements of the invention, vibrating elements
Sensor, inertia measuring device, electronic equipment and moving body are illustrated, and still, the invention is not limited thereto, the knot of various pieces
Replaceable structure is arbitrary structures with the same function.Furthermore, it is possible to add other arbitrary works in the present invention.
In addition, in the above-described embodiment, vibrating elements is formed as so-called double-T shaped, H-type or double-legged tuning-fork-type
Shape, but as long as being this to be not limited to, for example, can also with the element of the shaker arm vibrated in the in-plane direction
To be in a manner of three foot tuning forks, orthogonal type, prismatic etc. are various.
It is special that it is clearly incorporated by reference the 2018-009173 Japan proposed on January 23rd, 2018 herein
The complete disclosure of benefit application.
Claims (19)
1. a kind of vibrating elements, includes
Base portion;
Shaker arm, the shaker arm extend from the base portion, have the arm for being located at the base portion side and lean on than the arm
End side applies weight portion;And
Apply weight film, it is described apply weight film configuration applied in weight portion described,
The vibrating elements is characterized in that,
The weight portion that applies has the 1st interarea and the 2nd interarea that positive inverse relation is on the thickness direction of the vibrating elements,
The center of gravity for applying weight portion is located at the position that the 1st main surface side is leaned on than the median plane of the thickness direction of the arm,
The center of gravity for applying weight film is located at the position that the 2nd main surface side is leaned on than the median plane of the thickness direction of the arm.
2. vibrating elements according to claim 1, wherein
It is described to apply the weight portion part 2 thinner than the part 1 with part 1 and thickness,
2nd interarea has stairstepping using the part 1 and the part 2.
3. vibrating elements according to claim 2, wherein
When carrying out planar observation from the thickness direction for applying weight portion, the weight portion that applies is in the part 1 and described 2nd
/ the part being gradually reduced with thickness.
4. vibrating elements according to claim 2, wherein
When carrying out planar observation from the thickness direction, the width for applying weight portion is greater than the width of the arm.
5. vibrating elements according to claim 2, wherein
The part 2 configures the two sides in the width direction of the shaker arm relative to the part 1.
6. vibrating elements according to claim 2, wherein
The part 2 is configured at the side opposite with the base portion relative to the part 1.
7. vibrating elements according to claim 2, wherein
When carrying out planar observation from the thickness direction for applying weight portion, the part 1 is arranged to surround described 2nd
Point.
8. vibrating elements according to claim 2, wherein
1st interarea is flat surface.
9. vibrating elements according to claim 2, wherein
It is described to apply weight film configuration in the part 1 and in the part 2.
10. vibrating elements according to claim 1, wherein
It is the symmetrical shape in face that the arm, which has the median plane of the thickness direction about the arm,.
11. vibrating elements according to claim 1, wherein the vibrating elements includes
As the 1st shaker arm of the shaker arm, the 1st shaker arm extends from the base portion, has and is used as the arm
The 1st arm and apply the 1st of weight portion as described and apply weight portion;
2nd shaker arm, the 2nd shaker arm extend from the base portion, have the 2nd arm for being located at the base portion side and compare institute
Stating the 2nd arm leans on the 2nd of end side to apply weight portion;
As it is described apply the 1st of weight film apply weight film, the described 1st apply weight film configuration is applied in weight portion the described 1st;And
2nd applies weight film, and the described 2nd applies the configuration of weight film applies in weight portion the described 2nd,
The median plane that described 2nd center of gravity for applying weight portion is located at the thickness direction than the 2nd arm leans on the position of the 1st main surface side
It sets,
The median plane that described 2nd center of gravity for applying weight film is located at the thickness direction than the 2nd arm leans on the position of the 2nd main surface side
It sets.
12. vibrating elements according to claim 1, wherein the vibrating elements includes
Actuating arm, the actuating arm carry out driving vibration;And
Arm is detected, the detection arm accordingly deforms with inertia force,
The linking part of base portion extension with base body and from the base body,
The actuating arm is the shaker arm, is extended from the linking part,
The detection arm extends from the base body.
13. vibrating elements according to claim 1, wherein the vibrating elements includes
Actuating arm, the actuating arm extend from the base portion, carry out driving vibration;And
Arm is detected, the detection arm is upwardly extended from the base portion in the side opposite with the actuating arm, corresponding with inertia force
Ground deforms,
The actuating arm is the shaker arm.
14. vibrating elements described in any one according to claim 1~13, wherein
It is described apply weight film with the 1st apply weight film and thickness applied than the described 1st weight film it is thin the 2nd apply weight film.
15. a kind of manufacturing method of vibrating elements, which is characterized in that the manufacturing method of the vibrating elements includes the following process:
It forms base portion and shaker arm, the shaker arm extends from the base portion, have and be in positive inverse relation in a thickness direction
The 1st interarea and the 2nd interarea, the center of gravity of the shaker arm is than the median plane on the thickness direction of the shaker arm by described
1st main surface side;
It is formed on the shaker arm and applies weight film, the center of gravity for applying weight film is than the median plane on the thickness direction of the shaker arm
By the 2nd main surface side;And
The resonance frequency of the shaker arm is adjusted by adjusting the quality for applying weight film.
16. a kind of physical quantity transducer, which is characterized in that the physical quantity transducer includes
Vibrating elements described in any one in claim 1~14;And
It is accommodated with the encapsulation of the vibrating elements.
17. a kind of inertia measuring device, which is characterized in that the inertia measuring device includes
Physical quantity transducer described in claim 16;And
The circuit being electrically connected with the physical quantity transducer.
18. a kind of electronic equipment, which is characterized in that the electronic equipment has described in any one in claim 1~14
Vibrating elements.
19. a kind of moving body, which is characterized in that the moving body has vibration described in any one in claim 1~14
Element.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202310703026.1A CN116707476A (en) | 2018-01-23 | 2019-01-21 | Vibrating element, method for manufacturing the same, physical quantity sensor, and inertial measurement device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018-009173 | 2018-01-23 | ||
JP2018009173A JP7139610B2 (en) | 2018-01-23 | 2018-01-23 | Vibration element, manufacturing method of vibration element, physical quantity sensor, inertial measurement device, electronic device and moving body |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202310703026.1A Division CN116707476A (en) | 2018-01-23 | 2019-01-21 | Vibrating element, method for manufacturing the same, physical quantity sensor, and inertial measurement device |
Publications (2)
Publication Number | Publication Date |
---|---|
CN110071701A true CN110071701A (en) | 2019-07-30 |
CN110071701B CN110071701B (en) | 2023-06-30 |
Family
ID=67298254
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202310703026.1A Pending CN116707476A (en) | 2018-01-23 | 2019-01-21 | Vibrating element, method for manufacturing the same, physical quantity sensor, and inertial measurement device |
CN201910052463.5A Active CN110071701B (en) | 2018-01-23 | 2019-01-21 | Vibrating element, method for manufacturing the same, physical quantity sensor, and inertial measurement device |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202310703026.1A Pending CN116707476A (en) | 2018-01-23 | 2019-01-21 | Vibrating element, method for manufacturing the same, physical quantity sensor, and inertial measurement device |
Country Status (3)
Country | Link |
---|---|
US (4) | US11025222B2 (en) |
JP (1) | JP7139610B2 (en) |
CN (2) | CN116707476A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113206641A (en) * | 2020-01-30 | 2021-08-03 | 精工爱普生株式会社 | Method for manufacturing vibrating device |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11448505B2 (en) * | 2017-07-24 | 2022-09-20 | Kyocera Corporation | Sensor element and angular velocity sensor |
JP7139610B2 (en) * | 2018-01-23 | 2022-09-21 | セイコーエプソン株式会社 | Vibration element, manufacturing method of vibration element, physical quantity sensor, inertial measurement device, electronic device and moving body |
JP7251385B2 (en) | 2019-07-30 | 2023-04-04 | セイコーエプソン株式会社 | Vibration devices, electronic equipment and moving bodies |
JP2021132315A (en) * | 2020-02-20 | 2021-09-09 | セイコーエプソン株式会社 | Vibration element, vibration device, electronic apparatus, movable body, and method for manufacturing vibration element |
JP7528565B2 (en) | 2020-06-30 | 2024-08-06 | セイコーエプソン株式会社 | Method for manufacturing vibration element, vibration element and vibration device |
JP7528566B2 (en) | 2020-06-30 | 2024-08-06 | セイコーエプソン株式会社 | Method for manufacturing vibration element, vibration element and vibration device |
TWI778582B (en) * | 2021-04-15 | 2022-09-21 | 桃苗汽車股份有限公司 | Sensor installation angle inspection device and method |
US12060148B2 (en) | 2022-08-16 | 2024-08-13 | Honeywell International Inc. | Ground resonance detection and warning system and method |
JP2024032561A (en) * | 2022-08-29 | 2024-03-12 | セイコーエプソン株式会社 | Angular velocity detecting element and angular velocity sensor |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008232704A (en) * | 2007-03-19 | 2008-10-02 | Matsushita Electric Ind Co Ltd | Inertia force sensor |
CN102340292A (en) * | 2010-06-08 | 2012-02-01 | 精工爱普生株式会社 | Vibrator element, vibrator, vibration device, electronic apparatus, and frequency adjustment method |
US20140020503A1 (en) * | 2012-07-23 | 2014-01-23 | Seiko Epson Corporation | Vibrator element, method of manufacturing vibrator element, vibrator, electronic device, electronic apparatus and moving body |
US20150188515A1 (en) * | 2013-12-27 | 2015-07-02 | Seiko Epson Corporation | Resonator element, resonator, oscillator, electronic apparatus, physical quantity sensor, mobile object, and frequency adjustment method of resonator element |
JP2017194485A (en) * | 2017-07-24 | 2017-10-26 | セイコーエプソン株式会社 | Manufacturing method for vibration piece |
JP2017207283A (en) * | 2016-05-16 | 2017-11-24 | セイコーエプソン株式会社 | Manufacturing method for vibration element |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4163067B2 (en) * | 2003-07-14 | 2008-10-08 | 日本碍子株式会社 | Physical quantity measuring method and apparatus |
JP2006311444A (en) | 2005-05-02 | 2006-11-09 | Seiko Epson Corp | Piezoelectric vibration chip, its manufacturing method, and piezoelectric device utilizing the piezoelectric vibration chip element |
JP4687993B2 (en) | 2006-03-13 | 2011-05-25 | 株式会社大真空 | Piezoelectric vibrating piece, piezoelectric vibrator, and frequency adjusting method of piezoelectric vibrating piece |
WO2009020015A1 (en) * | 2007-08-06 | 2009-02-12 | Nihon Dempa Kogyo Co., Ltd. | Tuning fork-type crystal oscillator and its frequency adjusting method |
JP4533934B2 (en) * | 2008-01-15 | 2010-09-01 | エプソントヨコム株式会社 | Vibrating piece and method of manufacturing vibrator |
JP4885206B2 (en) | 2008-12-22 | 2012-02-29 | 日本電波工業株式会社 | Tuning fork type piezoelectric vibrating piece and piezoelectric device |
US8203256B2 (en) | 2009-02-10 | 2012-06-19 | Nihon Dempa Kogyo Co., Ltd. | Tuning-fork type piezoelectric vibrating piece, piezoelectric frame, piezoelectric device, and a manufacturing method of tuning-fork type piezoelectric vibrating piece and piezoelectric frame |
JP2011030095A (en) * | 2009-07-28 | 2011-02-10 | Seiko Instruments Inc | Piezoelectric vibrator, method for manufacturing piezoelectric vibrator, oscillator, electronic equipment, and radio wave clock |
US8304968B2 (en) * | 2010-03-17 | 2012-11-06 | Seiko Epson Corporation | Vibrator element, vibrator, oscillator, and electronic apparatus |
JP2012039509A (en) * | 2010-08-10 | 2012-02-23 | Seiko Instruments Inc | Piezoelectric vibrating piece, piezoelectric resonator, oscillator, electronic device, and radio-controlled timepiece |
JP5534448B2 (en) * | 2010-09-29 | 2014-07-02 | エスアイアイ・クリスタルテクノロジー株式会社 | Piezoelectric vibrator, piezoelectric vibrator, oscillator, electronic device and radio clock |
JP2013126104A (en) | 2011-12-14 | 2013-06-24 | Seiko Epson Corp | Manufacturing method of vibration piece, vibration piece, vibrator, oscillator and electronic apparatus |
JP6078968B2 (en) * | 2012-03-29 | 2017-02-15 | セイコーエプソン株式会社 | Manufacturing method of vibrating piece |
JP6435596B2 (en) | 2013-08-09 | 2018-12-12 | セイコーエプソン株式会社 | Vibration element, vibration device, electronic device, and moving object |
JP2015090275A (en) | 2013-11-05 | 2015-05-11 | セイコーエプソン株式会社 | Manufacturing method of vibration element |
JP2015128267A (en) * | 2013-12-27 | 2015-07-09 | セイコーエプソン株式会社 | Vibration piece, vibrator, oscillator, electronic apparatus, sensor and movable body |
JP6552225B2 (en) * | 2015-03-12 | 2019-07-31 | エスアイアイ・クリスタルテクノロジー株式会社 | Piezoelectric vibrating reed and piezoelectric vibrator |
JP2016186479A (en) | 2015-03-27 | 2016-10-27 | セイコーエプソン株式会社 | Physical quantity detection vibration element, physical quantity detection vibrator, electronic apparatus and mobile body |
JP6719178B2 (en) * | 2015-05-22 | 2020-07-08 | エスアイアイ・クリスタルテクノロジー株式会社 | Method of manufacturing piezoelectric vibrating piece and method of manufacturing piezoelectric vibrator |
JP6623682B2 (en) | 2015-10-28 | 2019-12-25 | セイコーエプソン株式会社 | Physical quantity detection vibrating piece, physical quantity detection device, electronic equipment and moving object |
GB2547043A (en) | 2016-02-08 | 2017-08-09 | Atlantic Inertial Systems Ltd | Inertial measurement unit |
JP7139610B2 (en) * | 2018-01-23 | 2022-09-21 | セイコーエプソン株式会社 | Vibration element, manufacturing method of vibration element, physical quantity sensor, inertial measurement device, electronic device and moving body |
-
2018
- 2018-01-23 JP JP2018009173A patent/JP7139610B2/en active Active
-
2019
- 2019-01-21 CN CN202310703026.1A patent/CN116707476A/en active Pending
- 2019-01-21 CN CN201910052463.5A patent/CN110071701B/en active Active
- 2019-01-22 US US16/253,712 patent/US11025222B2/en active Active
-
2021
- 2021-04-29 US US17/243,632 patent/US11595026B2/en active Active
-
2022
- 2022-12-14 US US18/081,084 patent/US11888464B2/en active Active
-
2023
- 2023-08-08 US US18/446,074 patent/US20230387885A1/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008232704A (en) * | 2007-03-19 | 2008-10-02 | Matsushita Electric Ind Co Ltd | Inertia force sensor |
CN102340292A (en) * | 2010-06-08 | 2012-02-01 | 精工爱普生株式会社 | Vibrator element, vibrator, vibration device, electronic apparatus, and frequency adjustment method |
US20140020503A1 (en) * | 2012-07-23 | 2014-01-23 | Seiko Epson Corporation | Vibrator element, method of manufacturing vibrator element, vibrator, electronic device, electronic apparatus and moving body |
US20150188515A1 (en) * | 2013-12-27 | 2015-07-02 | Seiko Epson Corporation | Resonator element, resonator, oscillator, electronic apparatus, physical quantity sensor, mobile object, and frequency adjustment method of resonator element |
JP2017207283A (en) * | 2016-05-16 | 2017-11-24 | セイコーエプソン株式会社 | Manufacturing method for vibration element |
JP2017194485A (en) * | 2017-07-24 | 2017-10-26 | セイコーエプソン株式会社 | Manufacturing method for vibration piece |
Non-Patent Citations (1)
Title |
---|
马洪宇;黄庆安;秦明;: "谐振式MEMS温度传感器设计" * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113206641A (en) * | 2020-01-30 | 2021-08-03 | 精工爱普生株式会社 | Method for manufacturing vibrating device |
CN113206641B (en) * | 2020-01-30 | 2024-03-08 | 精工爱普生株式会社 | Method for manufacturing vibration device |
Also Published As
Publication number | Publication date |
---|---|
CN116707476A (en) | 2023-09-05 |
US20230109944A1 (en) | 2023-04-13 |
CN110071701B (en) | 2023-06-30 |
US20210313959A1 (en) | 2021-10-07 |
US11595026B2 (en) | 2023-02-28 |
JP2019128211A (en) | 2019-08-01 |
US20190229706A1 (en) | 2019-07-25 |
US20230387885A1 (en) | 2023-11-30 |
JP7139610B2 (en) | 2022-09-21 |
US11888464B2 (en) | 2024-01-30 |
US11025222B2 (en) | 2021-06-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN110071701A (en) | Vibrating elements and its manufacturing method, physical quantity transducer, inertia measuring device | |
US8810327B2 (en) | Vibrating member, vibrating device, and electronic apparatus | |
TWI634742B (en) | Resonator blank, resonator, oscillator, electronic apparatus, and mobile object | |
CN104079263B (en) | Vibrating elements, oscillator, oscillator, electronic equipment, sensor and moving body | |
CN111351479B (en) | Vibrating element, method for manufacturing vibrating element, physical quantity sensor, inertial measurement device, electronic device, and moving object | |
CN103363968B (en) | Sensor device, the manufacture method of sensor device and electronic equipment | |
JP2012105044A (en) | Vibration device and electronic apparatus | |
JP2015008353A (en) | Vibration element, vibration device, electronic apparatus, moving body, and method of manufacturing vibration element | |
CN110323328B (en) | Vibration element, method for adjusting frequency of vibration element, method for manufacturing vibration element, physical quantity sensor, inertial measurement device, electronic device, and moving object | |
JP2011199661A (en) | Vibrating device | |
CN110323326A (en) | Vibrating elements, the manufacturing method of vibrating elements, physical quantity transducer, inertial measuring unit, electronic equipment and moving body | |
JP2014200039A (en) | Vibration piece, vibrator, oscillator, electronic apparatus and moving body | |
JP7571833B2 (en) | Vibration element, physical quantity sensor, inertial measurement unit, electronic device and mobile object | |
JP7332007B2 (en) | Vibration elements, physical quantity sensors, inertial measurement devices, electronic devices and mobile objects | |
JP2016178588A (en) | Vibration element, vibrator, electronic apparatus and mobile body | |
JP2015212651A (en) | Functional element, method for manufacturing functional element, electronic device, electronic equipment, and mobile body | |
JP2016197025A (en) | Adjustment method of angular velocity detection element |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |