EP1648652A2 - Procede d'assemblage au moyen de feuilles multicouches reactives a regulation amelioree de matieres d'assemblage fondus - Google Patents

Procede d'assemblage au moyen de feuilles multicouches reactives a regulation amelioree de matieres d'assemblage fondus

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Publication number
EP1648652A2
EP1648652A2 EP04817733A EP04817733A EP1648652A2 EP 1648652 A2 EP1648652 A2 EP 1648652A2 EP 04817733 A EP04817733 A EP 04817733A EP 04817733 A EP04817733 A EP 04817733A EP 1648652 A2 EP1648652 A2 EP 1648652A2
Authority
EP
European Patent Office
Prior art keywords
joining
pressure
bodies
foil
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP04817733A
Other languages
German (de)
English (en)
Other versions
EP1648652A4 (fr
Inventor
Omar Knio
Timothy P. Weihs
Jiaping Wang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Johns Hopkins University
Original Assignee
Johns Hopkins University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Johns Hopkins University filed Critical Johns Hopkins University
Publication of EP1648652A2 publication Critical patent/EP1648652A2/fr
Publication of EP1648652A4 publication Critical patent/EP1648652A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/16—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating with interposition of special material to facilitate connection of the parts, e.g. material for absorbing or producing gas
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0006—Exothermic brazing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
    • B23K20/023—Thermo-compression bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/16—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating with interposition of special material to facilitate connection of the parts, e.g. material for absorbing or producing gas
    • B23K20/165—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating with interposition of special material to facilitate connection of the parts, e.g. material for absorbing or producing gas involving an exothermic reaction of the interposed material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0233—Sheets, foils
    • B23K35/0238—Sheets, foils layered

Definitions

  • soldered or brazed products are made by sandwiching a braze or solder between mating surfaces of the respective components and heating the sandwiched structure in a furnace or with a torch.
  • these conventional approaches often expose both the components and the joint areas to deleterious heat.
  • temperature-sensitive components can be damaged, and thermal damage to the joint may necessitate costly and time consuming anneals.
  • Large coefficient of thermal expansion mismatches (CTE mismatches) can cause delamination or other damage.
  • the alternative of law temperature joining typically produces weaker joints.
  • Reactive multilayer foils described in United States Patent No. 6,736,942 issued to T. Weihs et al. on May 18, 2004, can be used as heat sources to effect joining with highly localized heating.
  • the reactive foil is made up of alternating layers selected from materials that will react with one another in an exothermic and self-propagating reaction. Upon reacting the foil supplies highly localized heat energy that may be applied to joining layers. If a joining material (braze or solder) is used, the foil reaction can supply enough heat to melt the joining material, which upon cooling will form a strong bond joining bulk bodies of material.
  • Joining bodies using reactive multilayer foils typically involves disposing between the bodies a reactive multilayer foil and one or more layers or coating of meltable joining material, pressing the bodies together at a high applied pressure against the foil and the joining material and initiating a self-propagating chemical reaction through the foil to melt the joining material.
  • the present inventors have determined that, in the joining of bodies of material by reactive multilayer foils, there exists a critical applied pressure that will provide near maximal joint strength as compared to the strength produced by substantially higher pressures. Moreover they have further discovered that, within limits, the critical applied pressures can be reduced by increasing the volume of melting material and/or the duration of the melting.
  • bodies of materials are joined by disposing between them a reactive multilayer foil and one or more layers of meltable joining material such as braze or solder. The bodies are pressed together against the foil and joining material, and the foil is ignited to melt the joining material.
  • the pressing is near the critical pressure and typically produces a joint having a strength of at least 70 - 85% the maximum strength producible at practical maximum pressures.
  • reactively formed stainless steel soldered joints that were heretofore made at an applied pressure of about 100 MPa can be made with substantially the same strength at a critical applied pressure of about 10 kPa.
  • Advantages of the process include minimization of braze or solder extrusion and reduced equipment and processing costs, especially in the joining of large bodies.
  • Fig. 1 is a schematic drawing of a self-propagating reaction in a multiplayer foil, showing a cross-sectional view of the atomic and thermal diffusion;
  • Fig. 2 is a schematic drawing showing the reactive joining of two components using a reactive multiplayer foil and two solder or braze layers with an applied pressure;
  • Fig. 3 is a schematic drawing illustrating reactive joining of Au-coated stainless steel components using Incusil coated Al/Ni foils and two AuSn or AgSn solder layers;
  • Fig. 4 a through 4 b are images of SEM micrographs of stainless steel components joined using reactive Al/Ni foil (100 /m thick) and two free-standing AuSn solder (25 ⁇ m thick) layers under applied joining pressure of (a) 10 kPa. Here the thickness of the solder layer remains constant at 25 ⁇ m before and after soldering. (b) 60 MPa. Note that most of the AuSn solder flows out of the joint and the thickness of the solder layer is only about 5 ⁇ m;
  • Fig. 5 is a diagram of shear strength of stainless steel joints made with reactive Al/Ni foils (100 ⁇ m) and AuSn solder (25 ⁇ m thick), shown as open circles, or Al/Ni foils (40 ⁇ m) and AgSn solder (25 ⁇ m), shown as solid circles, as a function of applied joining pressure.
  • Figs. 6a through 6c are images of fracture surfaces of the stainless steel joints made with reactive Al/Ni foils (100 ⁇ m thick) and AuSn solder layers (25 ⁇ m thick), obtained by optical stereomicroscopy;
  • Fig. 6a depicts a joint that was formed under applied pressure of 2 kPa and shows partial wetting of the Au-coated stainless steel specimens and shear strength of 8MPa. All the solder material remained in the joining area;
  • Fig. 6b is a joint was formed under applied pressure of 10 kPa and shows full wetting of the Au-coated stainless steel specimens and shear strength of 50 MPa. All the solder material remained in the joining area;
  • Fig. 6c is a joint was formed under applied pressure of 30 MPa and shows full wetting of the Au-coated stainless steel specimens and shear strength of 50 MPa. There was a large amount of solder that flowed out of the joining area;
  • Fig. 7a is a drawing of an experimental setup for interface thermal resistance measurement, one reactive foil and two free-standing solder layers were put between Ti and SiC blocks;
  • Fig. 7b is a schematic drawing showing the calculation of interface thermal resistance using the temperature gradients within each component and the temperature difference at the interface;
  • Fig. 8 is a drawing of temperatures at the surface of Ti and SiC blocks clamped at different pressures. Interfacial thermal resistance can be calculated from the temperature difference at the interface, temperature gradient in one component, and the thermal conductivity of this component;
  • Fig. 9 schematically shows reactive joining of Au-coated stainless steel and Al components using Incusil coated Al/Ni foils and two AuSn solder layers;
  • Fig. 10 is a diagram of shear strength of stainless steel joints and Al alloy joints as a function of applied joining pressure
  • Fig. 1 la is an image of a stainless steel joint, showing full wetting and
  • Fig. lib is an image of an Al alloy joints, showing partial wetting, both made with reactive Al/Ni foils (100 ⁇ m thick) and AuSn solder layers (25 ⁇ m thick) under applied pressure of 10 kPa, obtained by optical stereomicroscopy;
  • Fig. 12 schematically illustrates reactive joining of Au-coated stainless steel components using Incusil coated Al/Ni foils. The Incusil coating serves as the braze material and there is no free-standing solder or braze layer; Fig.
  • FIG. 13 is a diagram of shear strength of stainless steel joints made with Al/Ni foils and AuSn or AgSn solder (25 ⁇ m thick) or Incusil braze (1 ⁇ m) as a function of applied joining pressure, suggesting that the value of critical applied pressure is dependent on the properties and geometries of the solder or braze materials;
  • Figs 14a and b are images of fracture surfaces of the stainless steel joints made with reactive Al/Ni foils (150 ⁇ m thick) and Incusil braze (1 ⁇ m thick), obtained by optical stereomicroscopy;
  • Fig. 14a is an image of a joint which was formed under pressure of 10 kPa and shows almost no wetting of the Au-coated stainless steel specimens and an almost 0 MPa shear strength;
  • Fig. 14b is an image of a joint was formed under applied pressure of 6 MPa and shows full wetting of the Au-coated stainless steel specimens and a high shear strength of 80 MPa;
  • Fig. 15 schematically depicts an Au plated stainless steel component joined onto an Au plated PC board using a reactive foil and solder layers
  • Fig. 16 is a graphical plot of shear strengths versus applied pressure for the joined structure of Fig. 15.
  • Part I describes and illustrates reactive foil joining
  • Part II describes control of molten joining material in the joining process. References indicated by bracketed numbers are fully cited in an attached list.
  • Fig. 1 schematically illustrates a multilayer reactive foil 14 made up of alternating layers 16 and 18 of materials A and B, respectively.
  • These alternating layers 16 and 18 may be any materials amenable to mixing of neighboring atoms (or having changes in chemical bonding) in response to a stimulus.
  • the pairs A/B of elements are chosen based on the way they react to form stable compounds with large negative heats of formation and high adiabatic reaction temperatures. A wide variety of such combinations are set forth in the above referenced U.S. Patent Application Serial No. 09/846,486 incorporated herein by reference.
  • the bond exchange generates heat very rapidly. Thermal diffusion occurs parallel to the layering and heat is conducted down the foil and facilitates more atomic mixing and compound formation, thereby establishing a self-propagating reaction along the foil. The speeds of these self-propagating exothermic reactions are dependent on layer thickness and can rise as high as 30 m/s, with maximum reaction temperatures above 1200 °C t 5 l.
  • Reactive multilayer foils provide a unique opportunity to dramatically improve conventional soldering and brazing technologies by using the foils as local heat sources to melt solder or braze layers and thereby join components. Reactive foil soldering or brazing can be performed at room temperature and in air, argon or vacuum.
  • Fig. 2 schematically shows the use of multilayer reactive foil 14 to join together two components 20A and 20B.
  • the reactive foil 14 is sandwiched between the mating surfaces 21 A and 21B of the components and adjacent one or more layers or coatings 22 A, 22B of braze or solder.
  • the reactive foil 14 is preferably a freestanding reactive foil as described in the aforementioned application Serial Number 09/846,486 but can be a coating on one or more of the components 20 A, 20B.
  • the braze or solder 22A, 22B can be freestanding or coatings on the components.
  • This new reactive joining process eliminates the need for furnaces or other external heat sources. Moreover reactive joining provides very localized heating so that temperature sensitive components or materials can be joined without thermal damage.
  • the localized heating offered by the reactive foils is also advantageous for joining materials with very different coefficients of thermal expansion, e.g. joining metal and ceramics.
  • joining metal and ceramics typically when metals are soldered or brazed to ceramics, significant thermal stresses arise on cooling from the high soldering or brazing temperatures, because of the thermal expansion coefficient mismatch between metals and ceramics. These thermal stresses limit the size of the metal/ceramic joint area.
  • the metallic and ceramics components absorb little heat and have a very limited rise in temperature. Only the solder or braze layers and the surfaces of the components are heated substantially. Thus CTE problems on joining and delamination problems on joining are avoided.
  • Applied pressure also plays an important role in reactive multilayer welding processes. For example, when Zr-based bulk metallic glass samples were joined using reactive Al/Ni foils, the shear strength of the joints increased from 100 to 500 MPa as the joining pressure increased from 20 to 160 MPa t 11 !. It was suggested that increasing the applied pressure during joining raises the driving force for the softened glass to flow into the cracks in the reactive foils. In this case, no solder or braze material is used and joints are formed by softening the components themselves. However, in a large variety of applications of reactive joining methods, solder or braze materials are used and joints are formed by melting the solder or braze materials and wetting onto components. The effect of applied pressure on reactive joining for these geometries has not been addressed in previous research and the nature of its effect is hard to predict.
  • This invention describes the methodology of controlling flow of molten solder or braze in reactive multilayer joining to improve the joining performance.
  • FIGS. 4(a) and 4(b) show stainless steel specimens that were joined using one Al/Ni reactive foil (100 ⁇ m thick) and two free-standing AuSn solder (25 ⁇ m thick) layers under different pressures: 10 kPa and 60 MPa. When joined under low applied pressure (10 kPa), the thickness of the solder layer remains constant at 25 ⁇ m before and after soldering ( Figure 4(a)).
  • the joint in Figure 4(b) also showed a high shear strength of about 50 MPa due to the full wetting of the sample even though the AuSn solder layer is significantly thinner compared with the joint formed under an applied pressure of 10 kPa.
  • SEM micrographs of the cross section of the reactive joints and optical stereomicroscope pictures of the fracture surfaces, together with the shear strengths of these joints suggest that as the applied joining pressure increases, the flow of the molten AuSn solder is enhanced, resulting in better wetting and thus stronger joints. Meanwhile the AuSn solder extrusion out of the joining area also increases with increasing applied joining pressure, resulting in thinner solder layers more subject to thermal fatigue.
  • This approach can be generalized to a variety of other material systems, where other materials or components are joined using different kinds of reactive foils and solder or braze material.
  • the applied pressure needs to approach a critical applied pressure to optimize the flow of the molten solder or braze material, so as to fully wet the specimens, thus forming strong joints.
  • the applied pressure should not go much above the critical pressure so that solder or braze extrusion is kept minimal and the solder or braze layer thickness is kept maximal. In this way the performance of the resulting joints can be optimized.
  • Applied joining pressure also affects the interfacial thermal resistance within the joint. Higher applied joining pressure can decrease the interfacial thermal resistance and enhance the flow of molten solder or braze, thus improving the joining performance.
  • This is illustrated based on thermal measurement of one Ti block and one SiC block clamped between a hot plate and a cooling plate.
  • One reactive foil 14 and two solder layers 22A, 22B were put between Ti and SiC blocks 20A, 20B, as shown in Figure 7.
  • Temperatures in the SiC and Ti blocks at equilibrium state were measured using an infrared camera and plotted in Figure 8.
  • the interface thermal resistance, R can be expressed as,
  • Duration of melting of solder or braze also affects the solder or braze flow and thus the reactive joining performance.
  • the critical applied pressure required to enable enough solder or braze flow and thus form a strong joint depends on the duration of melting of solder or braze material. Generally longer duration of melting of solder or braze material can enhance the wetting of the components and the flow of the molten solder or braze, resulting in a lower critical applied joining pressure.
  • the duration of melting of the AuSn solder in an Al alloy joint is only 1 ms compared to 5 ms in stainless steel joints, at the condition that the stainless steel and Al alloy specimens were joined using reactive Al/Ni foils (100 ⁇ m) and AuSn solder layers (25 ⁇ m).
  • the shear strength of the Al alloy joints gradually increases with increasing joining pressure.
  • the value of the critical applied pressure is dependent on the duration of melting of the AuSn solder. Longer duration of melting of the AuSn solder can enhance the flow of the molten solder, thus result in lower critical applied pressures. It should be evident for someone skilled in the art to generalize this principle to a variety of other material systems.
  • the duration of the melting of the solder or braze material is determined by several factors, such as geometries and properties of reactive foils, components and solder or braze materials. Therefore the flow of the molten solder or braze in reactive joining can be controlled by varying these factors and the applied joining pressure so as to maximize the performance of the reactive joints.
  • Some stainless steel joints were made by putting one Incusil coated reactive foil between two stainless steel samples, as shown schematically in Figure 12.
  • the 1 ⁇ m thick incusil coating on the reactive foils serves as the braze material and no free-standing solder or braze layer is used.
  • These samples were joined under applied pressure ranging from 10 kPa to 100 MPa and the appropriate thickness of foil was used to melt the AgSn and AuSn solders and the Incusil braze.
  • Experimental results show that when 25 ⁇ m thick AuSn or AgSn solder materials are used, the critical applied pressure to form a strong joint is 10 kPa. While when 1 ⁇ m thick Incusil braze is used, the applied pressure needs to be as high as 6 MPa to form a strong joint, as shown in Figure 13.
  • the critical applied pressure for a given application can be determined from shear strength versus applied joining pressure plots of the type shown in Figs. 16. It should be noted that the pressure is plotted on a logarithmic scale. Applicants have observed that the data points in such plots can be divided into two groups. In one group 160 corresponding to lower applied pressures, the joint strength dramatically increases with high slope as applied pressure increases. In the other group 161 corresponding to higher applied joining pressures, the joint strength increases only slightly with flat or very small slope as pressure increases.
  • the critical applied joining pressure is the pressure at the knee of the curve between the high slope group and the low slope group. It can be more precisely determined by curve fitting, e.g. as the pressure at the point P where a fitted line 162 through the high slope group 160 intersects a fitted line 163 through the low slope group.
  • an Au plated stainless steel component 150 was joined onto an Au plated Rodgers PC board 151 using reactive Al/Ni foils 152 (100 ⁇ m) and AuSn solder layers 153 (25 ⁇ m).
  • the dimension of the stainless steel component 150 is 0.5 mm x 6 mm x 25 mm and the dimension of Rodgers PC board 151 is 1 mm x 15 mm x 25 mm.
  • the joining areas ranged between 18 to 30 mm 2 .
  • the joining process was performed at room temperature in air by igniting the reactive foils under pressure ranging from 2 kPa to 100 MPa.
  • the critical applied pressure achieves a joint strength of at least 70% of the maximum obtainable by the practical maximum pressure that will not damage the materials being joined.
  • optimal pressures should not greatly exceed the critical pressure to avoid extrusion of braze and solder and consequent reduction in their thickness.
  • pressures should approach the critical pressure in order to obtain optimal wetting of the components being joined.
  • applied pressures are advantageously near the critical pressure, typically within ⁇ 5% of the critical pressure in a range producing about 70% to 85% of the maximum joint strength.
  • the desirable critical pressure is less than about 10% maximum practical applied pressure.
  • the joint strength at the maximum practical pressure can be approximated by the joint strength at an applied pressure of about 100 MPa.
  • the lower applied pressures facilitate the formation of large area joints with areas greater than 10 in 2 .
  • the flow of molten solder or braze material in reactive multilayer joints can be controlled by varying applied joining pressure, duration of melting of the solder or braze material, and the volumes of the molten solder or braze material available within the joints.
  • Higher applied joining pressure enhances the flow of solder or braze material, improves the wetting condition, and thereby forms stronger joints.
  • the applied joining pressure needs to approximately a critical value to enable enough flow of the molten solder or braze material and to form a good joint. Once the applied pressure reaches a critical value, the shear strength of the joints remains nearly constant.
  • the thickness of the solder or braze layer in reactive joints decreases with increasing applied joining pressure.
  • Duration of melting of the solder or braze material and the volumes of the molten solder or braze material available within the joint also affect the flow of the molten solder or braze in reactive joining. Longer duration and larger volumes of the molten solder or braze can enhance the flow of the solder or braze and result in a lower critical applied pressure.
  • the duration of the melting of the solder or braze is determined by properties and geometries of the reactive foils, solder or braze materials, and components. Therefore the flow of the molten solder or braze in reactive joining can be controlled by varying the applied joining pressure, and properties and geometries of the reactive foil, solder or braze materials, and components, in order to maximize the performance of the resulting joints.
  • the invention can be seen to include a method of joining first and second bodies of material using a reactive multiplayer foil and one or more layers or coatings of meltable joining material. It comprises disposing the reactive foil and meltable joining material between the bodies, pressing the bodies together against the foil and joining material, and initiating a self-propagating reaction through the foil to melt the joining material.
  • the bodies are pressed together at or near a pressure in the knee region of the plot of joint strength (shear strength) versus the logarithm of applied pressure.
  • the plot is characterized by a lower pressure region with a relatively high slope, a higher pressure region with a relatively low slope and a knee region between the high slope region and the low slope region.
  • the bodies should be pressed at an applied pressure in this knee region to obtain an optimal combination of near maximum joint strength, minimal solder flow, good wetting of the joining surfaces and high retention of joining material thickness with minimal extrusion of the material laterally through the joint.
  • Another way of specifying the desirable pressure used in the joining process is in terms of the joint strength that can be obtained at the maximum practical pressure that can be applied without damaging the bodies.
  • the desirable pressure is substantially less than the maximum pressure but produces a joint having a shear strength equal to at least 70% of the shear strength at the maximum pressure.
  • the desirable pressure is typically less than 20% of the maximum pressure and usually less than 10%.
  • the shear strength produced by an applied pressure of 100 MPa is a reasonable approximation of the shear strength at maximum practical pressure. So the desirable applied pressure is one substantially below 100 MPa that produces a joint having a shear strength equal to at least 70% of the shear strength at 100 MPa.
  • the shear strength at maximum practical pressure can be approximated by the shear strength at about 1.0 MPa.
  • the desirable pressure used in the process is in terms of the critical applied pressure separating the region of low strength-to- pressure slope from the region of low strength-to-pressure slope.
  • the desirable applied pressure is advantageously within ⁇ 5% of this critical pressure.
  • Advantageous additional features of the above process are that the applied pressure be less than about 30 kPa and preferably less than about 20 kPa.
  • the joining material has a thickness greater than about 0.5 micrometers, and the applied pressure is sufficiently low that the thickness is reduced by no more than 20% by the joining process.
  • the melting of the joining materials has a duration greater than about 0.5 ms, and the bodies are joined over an area exceeding about 0.03 cm 2 .
  • the process is particularly advantageous in the formation of large area joints in excess of about 10 in 2 .

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Ceramic Products (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Laminated Bodies (AREA)

Abstract

Selon cette invention, des corps de matières sont assemblés par disposition d'une feuille multicouches réactive entre eux et d'au moins une couche de matière d'assemblage fusible, telle qu'une brasure ou une soudure. Lesdits corps sont comprimés ensemble contre la feuille et la matière d'assemblage, et ladite feuille est enflammée afin de faire fondre la matière d'assemblage. La pression se situe à proximité du niveau de la pression critique et produit généralement un joint possédant une résistance comprise entre au minimum 70 % et au maximum 85 % de la résistance maximale, pouvant être obtenue aux pressions maximales appliquées. Ainsi, par exemple, des joints brasés en acier inoxydable formés de manière réactive fabriqués à une pression appliquée d'environ 100 MPa peuvent être réalisés avec pratiquement la même résistance à une certaine pression critique appliquée d'environ 10 kPa. Les avantages de ce processus englobent la minimisation de l'extrusion de la brasure ou de la soudure, ainsi que la réduction de l'équipement et des coûts de traitement, notamment, lors de l'assemblage de corps gros.
EP04817733A 2003-07-23 2004-07-23 Procede d'assemblage au moyen de feuilles multicouches reactives a regulation amelioree de matieres d'assemblage fondus Withdrawn EP1648652A4 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US48937803P 2003-07-23 2003-07-23
PCT/US2004/023838 WO2005051815A2 (fr) 2003-07-23 2004-07-23 Procede d'assemblage au moyen de feuilles multicouches reactives a regulation amelioree de matieres d'assemblage fondus

Publications (2)

Publication Number Publication Date
EP1648652A2 true EP1648652A2 (fr) 2006-04-26
EP1648652A4 EP1648652A4 (fr) 2008-01-09

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EP (1) EP1648652A4 (fr)
JP (1) JP2006528556A (fr)
CN (1) CN100471611C (fr)
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102039708B (zh) * 2009-10-22 2013-12-11 清华大学 一种粘合两基体的方法

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006035765A1 (de) * 2006-07-20 2008-01-24 Technische Universität Ilmenau Verfahren und Anordnung zum Erzeugen einer Löt- oder Diffusionsverbindung von Bauteilen aus gleichen oder unterschiedlichen Werkstoffen
DE102007048299A1 (de) 2007-10-08 2009-04-09 Behr Gmbh & Co. Kg Mehrschichtlot
DE102009006822B4 (de) * 2009-01-29 2011-09-01 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Mikrostruktur, Verfahren zu deren Herstellung, Vorrichtung zum Bonden einer Mikrostruktur und Mikrosystem
US8967453B2 (en) * 2012-03-21 2015-03-03 GM Global Technology Operations LLC Methods of bonding components for fabricating electronic assemblies and electronic assemblies including bonded components
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JP2015172159A (ja) * 2014-03-12 2015-10-01 国立研究開発法人科学技術振興機構 自己伝播発熱粒体およびその製造方法並びにハンダ接合方法並びにハンダペースト
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4715526A (en) * 1986-11-20 1987-12-29 General Dynamics, Pomona Division Floating seal and method of its use
US5038996A (en) * 1988-10-12 1991-08-13 International Business Machines Corporation Bonding of metallic surfaces
WO2001030528A1 (fr) * 1999-10-25 2001-05-03 Alliedsignal Inc. Procede de fabrication de structures brasees a plusieurs canaux
US20020182436A1 (en) * 2000-05-02 2002-12-05 Weihs Timothy P. Freestanding reactive multilayer foils

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3729046A (en) * 1971-09-10 1973-04-24 Airco Inc Process for manufacturing foil
US4889745A (en) * 1986-11-28 1989-12-26 Japan As Represented By Director General Of Agency Of Industrial Science And Technology Method for reactive preparation of a shaped body of inorganic compound of metal
IL152517A0 (en) * 2000-05-02 2003-05-29 Univ Johns Hopkins Method of making reactive multilayer foil and resulting product

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4715526A (en) * 1986-11-20 1987-12-29 General Dynamics, Pomona Division Floating seal and method of its use
US5038996A (en) * 1988-10-12 1991-08-13 International Business Machines Corporation Bonding of metallic surfaces
WO2001030528A1 (fr) * 1999-10-25 2001-05-03 Alliedsignal Inc. Procede de fabrication de structures brasees a plusieurs canaux
US20020182436A1 (en) * 2000-05-02 2002-12-05 Weihs Timothy P. Freestanding reactive multilayer foils
US6736942B2 (en) * 2000-05-02 2004-05-18 Johns Hopkins University Freestanding reactive multilayer foils

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
See also references of WO2005051815A2 *
SWISTON, A. J. ET AL: "Joining bulk metallic glass using reactive multilayer foils" SCRIPTA MATERIALIA , 48(12), 1575-1580 CODEN: SCMAF7; ISSN: 1359-6462, 2003, XP002458865 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102039708B (zh) * 2009-10-22 2013-12-11 清华大学 一种粘合两基体的方法

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CN1859997A (zh) 2006-11-08
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EP1648652A4 (fr) 2008-01-09
JP2006528556A (ja) 2006-12-21

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